CN217469918U - AC/DC solid relay - Google Patents
AC/DC solid relay Download PDFInfo
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- CN217469918U CN217469918U CN202220230903.9U CN202220230903U CN217469918U CN 217469918 U CN217469918 U CN 217469918U CN 202220230903 U CN202220230903 U CN 202220230903U CN 217469918 U CN217469918 U CN 217469918U
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- slide holder
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- mos tube
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Abstract
The utility model discloses an AC/DC solid-state relay, which comprises a relay body, a pin component and a plastic package body; the relay body comprises a light-emitting chip, a photosensitive chip, a first MOS (metal oxide semiconductor) tube and a second MOS tube; the pin assembly comprises a first pin, a second pin, a third pin and a fourth pin; the positive electrode and the negative electrode of the light-emitting chip are respectively connected with the first pin and the second pin, two ends of the photosensitive chip are respectively connected with the grid electrode of the first MOS tube and the grid electrode of the second MOS tube, the source electrode of the first MOS tube is connected with the source electrode of the second MOS tube, and the drain electrode of the first MOS tube and the drain electrode of the second MOS tube are respectively connected with the third pin and the fourth pin; the plastic package body covers the relay body, and light guide glue for covering the light-emitting chip and the photosensitive chip is arranged in the plastic package body. The utility model discloses can both carry out on-off control to alternating current load and direct current load.
Description
Technical Field
The utility model relates to a relay field especially indicates an alternating current-direct current solid state relay.
Background
Compared with the traditional mechanical relay, the solid-state relay has the advantages of small volume, no contact, high switching speed and no arc ablation during switching, thereby being widely applied to other fields of industry and national economy.
The existing solid-state relay can only control the on-off of one of an alternating current load and a direct current load generally, and has the limitation on use.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an alternating current-direct current solid state relay, it can both carry out on-off control to alternating current load and direct current load.
In order to achieve the above purpose, the solution of the utility model is:
an AC/DC solid-state relay comprises a relay body, a pin assembly and a plastic package body; the relay body comprises a light-emitting chip, a photosensitive chip, a first MOS (metal oxide semiconductor) tube and a second MOS tube; the pin assembly comprises a first pin, a second pin, a third pin and a fourth pin; the positive electrode and the negative electrode of the light-emitting chip are respectively connected with the first pin and the second pin, the photosensitive chip and the light-emitting chip are arranged oppositely, two ends of the photosensitive chip are respectively connected with a grid electrode of the first MOS tube and a grid electrode of the second MOS tube, the first MOS tube and the second MOS tube are provided with body diodes, a source electrode of the first MOS tube is connected with a source electrode of the second MOS tube, and a drain electrode of the first MOS tube and a drain electrode of the second MOS tube are respectively connected with the third pin and the fourth pin; the plastic package body coats the light-emitting chip, the photosensitive chip, the first MOS tube and the second MOS tube of the relay body, and light guide glue for coating the light-emitting chip and the photosensitive chip is arranged in the plastic package body.
The alternating current-direct current solid-state relay further comprises a lead frame; the lead frame comprises a first slide holder, a second slide holder, a third slide holder, a fourth slide holder and a fifth slide holder which are made of conductive materials; the plastic package body wraps a first slide holder, a second slide holder, a third slide holder, a fourth slide holder and a fifth slide holder; the first pin, the second pin, the third pin and the fourth pin are respectively connected with the first slide holder, the second slide holder, the third slide holder and the fourth slide holder; the negative electrode of the light-emitting chip is connected with the second slide holder, and the positive electrode of the light-emitting chip is connected with the first slide holder through a conductive wire; the drain electrode of the first MOS tube is connected with the third slide holder, the drain electrode of the second MOS tube is connected with the fourth slide holder, and the source electrode of the first MOS tube is connected with the source electrode of the second MOS tube through a conductive wire; the photosensitive chip is fixed on the fifth wafer carrying table, and two ends of the photosensitive chip are connected with the grid electrode of the first MOS tube and the grid electrode of the second MOS tube through the conductive wires respectively.
The first pins and the first slide holder are of an integral structure, the second pins and the second slide holder are of an integral structure, the third pins and the third slide holder are of an integral structure, and the fourth pins and the fourth slide holder are of an integral structure.
The first pin, the second pin, the third pin and the fourth pin are arranged in the same direction.
The first slide holder, the second slide holder, the third slide holder, the fourth slide holder and the fifth slide holder are made of copper materials.
The fifth slide holder is arranged adjacent to the second slide holder.
The third slide holder is provided with a plurality of through holes.
The light-emitting chip, the photosensitive chip, the first MOS tube and the second MOS tube are positioned on the same side of the lead frame.
The areas of the third slide holder and the fourth slide holder are larger than the areas of the first slide holder, the second slide holder and the fifth slide holder.
The photosensitive chip is a photodiode array chip.
After the scheme is adopted, the utility model discloses when first pin and second pin input forward bias signal and make the luminescence chip luminous, photosensitive chip receives after the light that the luminescence chip sent and for the grid of first MOS pipe and the grid input high level signal of second MOS pipe this moment to make first MOS pipe and second MOS pipe switch on and make third pin and fourth pin two-way switch on, alternating current signal and direct current signal can all flow third pin and fourth pin this moment; and the utility model discloses when the luminescence chip is not luminous, photosensitive chip does not input high level signal for the grid of first MOS pipe and the grid of second MOS pipe to make first MOS pipe and second MOS pipe turn-off and make the two-way shutoff of third pin and fourth pin, alternating current signal and direct current signal can not pass through third pin and fourth pin this moment.
Therefore, the utility model discloses can both carry out on-off control to alternating current load and direct current load.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic view of a partial structure of the present invention 1;
fig. 3 is a schematic view of a partial structure of the present invention 2;
fig. 4 is a schematic circuit diagram of the present invention;
description of reference numerals:
the relay comprises a relay body 1, a light-emitting chip 11, a photosensitive chip 12, a first MOS tube 13, a second MOS tube 14 and a conductive wire 15,
a pin assembly 2, a first pin 21, a second pin 22, a third pin 23, a fourth pin 24,
the plastic-sealed body 3 is provided with a plastic-sealed body,
the light-guiding glue 4 is arranged on the upper surface of the base,
the lead frame 5, a first slide holder 51, a second slide holder 52, a third slide holder 53, a through hole 531, a fourth slide holder 54, and a fifth slide holder 55.
Detailed Description
In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following embodiments.
As shown in fig. 1 to 4, the present invention discloses an ac/dc solid-state relay, which includes a relay body 1, a pin assembly 2 and a plastic package body 3; the relay body 1 comprises a light-emitting chip 11, a photosensitive chip 12, a first MOS (metal oxide semiconductor) tube 13 and a second MOS tube 14; the pin assembly 2 comprises a first pin 21, a second pin 22, a third pin 23 and a fourth pin 24; the positive electrode and the negative electrode of the light-emitting chip 11 are respectively connected with a first pin 21 and a second pin 22, the photosensitive chip 12 and the light-emitting chip 11 are arranged oppositely, the photosensitive chip 12 can be a photodiode array chip, two ends of the photosensitive chip 12 are respectively connected with a grid of a first MOS (metal oxide semiconductor) tube 13 and a grid of a second MOS tube 14, the first MOS tube 13 and the second MOS tube 14 are both provided with body diodes, the source of the first MOS tube 13 is connected with the source of the second MOS tube 14, and the drain of the first MOS tube 13 and the drain of the second MOS tube 14 are respectively connected with a third pin 23 and a fourth pin 24; the plastic package body 3 coats the light-emitting chip 11, the photosensitive chip 12, the first MOS tube 13 and the second MOS tube 14 of the relay body 1, light guide glue 4 for coating the light-emitting chip 11 and the photosensitive chip 12 is arranged in the plastic package body 3, and the light guide glue 4 enables a light channel to be formed between the photosensitive chip 12 and the light-emitting chip 11, so that light emitted by the light-emitting chip 11 can be received by the photosensitive chip 12.
The utility model discloses a theory of operation does: the utility model discloses when first pin 21 and second pin 22 input forward offset signal and make light-emitting chip 11 give out light, photosensitive chip 12 receives the light that light-emitting chip 11 sent this moment and inputs high level signal for the grid of first MOS pipe 13 and the grid of second MOS pipe 14 after, so that first MOS pipe 13 and second MOS pipe 14 switch on and make third pin 23 and fourth pin 24 two-way switch on, alternating current signal and direct current signal can all flow third pin 23 and fourth pin 24 at this moment; and the utility model discloses when emitting light chip 11 does not send out light, photosensitive chip 12 does not input high level signal to the grid of first MOS pipe 13 and the grid of second MOS pipe 14 to make first MOS pipe 13 and second MOS pipe 14 turn-off and make third pin 23 and the two-way shutoff of fourth pin 24, alternating current signal and direct current signal can not pass through third pin 23 and fourth pin 24 this moment. Therefore, the utility model discloses can both carry out on-off control to alternating current load and direct current load.
The AC/DC solid-state relay of the utility model also comprises a lead frame 5, wherein the lead frame 5 is used for installing the relay body 1; the lead frame 5 comprises a first slide holder 51, a second slide holder 52, a third slide holder 53, a fourth slide holder 54 and a fifth slide holder 55 which are made of conductive materials; the plastic package body 3 covers a first slide holder 51, a second slide holder 52, a third slide holder 53, a fourth slide holder 54 and a fifth slide holder 55; the first pin 21, the second pin 22, the third pin 23 and the fourth pin 24 are respectively connected with a first slide holder 51, a second slide holder 52, a third slide holder 53 and a fourth slide holder 54; the negative electrode of the light-emitting chip 11 is connected with the second slide holder 52 by welding or conductive adhesive, and the positive electrode of the light-emitting chip 11 is connected with the first slide holder 51 by the conductive wire 15; the drain electrode of the first MOS tube 13 is connected with the third slide holder 53 in a welding or conductive adhesive mode, the drain electrode of the second MOS tube 14 is connected with the fourth slide holder 54 in a welding or conductive adhesive mode, and the source electrode of the first MOS tube 13 is connected with the source electrode of the second MOS tube 14 through the conductive wire 15; the photosensitive chip 12 is fixed on the fifth stage 55, and two ends of the photosensitive chip 12 are respectively connected with the gate of the first MOS transistor 13 and the gate of the second MOS transistor 14 through the conductive wire 15. The conductive wire 15 may be a metal wire.
In the present invention, the light emitting chip 11, the photosensitive chip 12, the first MOS transistor 13 and the second MOS transistor 14 may be located on the same side of the lead frame 5; the utility model is arranged in such a way that the thickness of the AC/DC solid-state relay is reduced, thereby the AC/DC solid-state relay is small; and the utility model discloses so set up still make the utility model discloses can install luminescence chip 11, photosensitive chip 12, first MOS pipe 13 and second MOS pipe 14 through SMT technology, help improving production efficiency.
In the present invention, the first pin 21 and the first slide stage 51 are integrated, the second pin 22 and the second slide stage 52 are integrated, the third pin 23 and the third slide stage 53 are integrated, and the fourth pin 24 and the fourth slide stage 54 are integrated; the utility model discloses so set up, can simplify the utility model discloses a connection structure of alternating current-direct current solid state relay. The utility model discloses in, first pin 21, second pin 22, third pin 23 and the syntropy setting of fourth pin 24, so can be convenient for the utility model discloses an alternating current-direct current solid state relay is connected with external circuit board.
The utility model discloses in, first slide holder 51, second slide holder 52, third slide holder 53, fourth slide holder 54 and fifth slide holder 55 can be the copper product matter, and make first slide holder 51, second slide holder 52, third slide holder 53, fourth slide holder 54 and fifth slide holder 55 heat dispersion good, avoid the utility model discloses an alternating current-direct current solid state relay during operation is overheated. The areas of the third wafer stage 53 and the fourth wafer stage 54 are larger than the areas of the first wafer stage 51, the second wafer stage 52 and the fifth wafer stage 5, so that the heat of the first MOS tube 13 and the heat of the second MOS tube 14 can be led out, and the overheating of the AC/DC solid-state relay during working can be avoided; the third slide stage 53 may be provided with a plurality of through holes 531, so that the plastic package body 3 may form a cylinder penetrating through the through holes 531, thereby enhancing the bonding strength between the plastic package body 3 and the third slide stage 53. The fifth stage 53 is disposed adjacent to the second stage 51, so that the light emitted from the light emitting chip 11 can reach the light sensitive chip 12 as soon as possible.
The above embodiments and drawings are not intended to limit the form and style of the present invention, and any suitable changes or modifications made by those skilled in the art should not be construed as departing from the scope of the present invention.
Claims (10)
1. An alternating current-direct current solid state relay is characterized in that: the relay comprises a relay body, a pin component and a plastic package body;
the relay body comprises a light-emitting chip, a photosensitive chip, a first MOS (metal oxide semiconductor) tube and a second MOS tube; the pin assembly comprises a first pin, a second pin, a third pin and a fourth pin; the positive electrode and the negative electrode of the light-emitting chip are respectively connected with the first pin and the second pin, the photosensitive chip and the light-emitting chip are arranged oppositely, two ends of the photosensitive chip are respectively connected with the grid electrode of the first MOS tube and the grid electrode of the second MOS tube, the first MOS tube and the second MOS tube are provided with diodes, the source electrode of the first MOS tube is connected with the source electrode of the second MOS tube, and the drain electrode of the first MOS tube and the drain electrode of the second MOS tube are respectively connected with the third pin and the fourth pin;
the plastic package body coats the light-emitting chip, the photosensitive chip, the first MOS tube and the second MOS tube of the relay body, and light guide glue for coating the light-emitting chip and the photosensitive chip is arranged in the plastic package body.
2. The ac-dc solid-state relay according to claim 1, wherein: also includes a lead frame; the lead frame comprises a first slide holder, a second slide holder, a third slide holder, a fourth slide holder and a fifth slide holder which are made of conductive materials;
the plastic package body wraps the first slide holder, the second slide holder, the third slide holder, the fourth slide holder and the fifth slide holder;
the first pin, the second pin, the third pin and the fourth pin are respectively connected with the first slide holder, the second slide holder, the third slide holder and the fourth slide holder;
the negative electrode of the light-emitting chip is connected with the second slide holder, and the positive electrode of the light-emitting chip is connected with the first slide holder through a conductive wire;
the drain electrode of the first MOS tube is connected with the third slide holder, the drain electrode of the second MOS tube is connected with the fourth slide holder, and the source electrode of the first MOS tube is connected with the source electrode of the second MOS tube through a conductive wire;
the photosensitive chip is fixed on the fifth wafer carrying table, and two ends of the photosensitive chip are connected with the grid electrode of the first MOS tube and the grid electrode of the second MOS tube through the conductive wires respectively.
3. The ac-dc solid-state relay of claim 2, wherein: the first pins and the first slide holder are of an integral structure, the second pins and the second slide holder are of an integral structure, the third pins and the third slide holder are of an integral structure, and the fourth pins and the fourth slide holder are of an integral structure.
4. An ac-dc solid-state relay according to claim 1 or 3, wherein: the first pin, the second pin, the third pin and the fourth pin are arranged in the same direction.
5. The ac-dc solid-state relay according to claim 2 or 3, wherein: the first slide holder, the second slide holder, the third slide holder, the fourth slide holder and the fifth slide holder are made of copper materials.
6. The ac-dc solid-state relay of claim 2, wherein: the fifth slide holder is arranged adjacent to the second slide holder.
7. The ac-dc solid-state relay of claim 2, wherein: the third slide holder is provided with a plurality of through holes.
8. The ac-dc solid-state relay of claim 2, wherein: the light-emitting chip, the photosensitive chip, the first MOS tube and the second MOS tube are positioned on the same side of the lead frame.
9. The ac-dc solid-state relay of claim 2, wherein: the areas of the third slide holder and the fourth slide holder are larger than the areas of the first slide holder, the second slide holder and the fifth slide holder.
10. The ac-dc solid-state relay according to claim 1, wherein: the photosensitive chip is a photodiode array chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220230903.9U CN217469918U (en) | 2022-01-27 | 2022-01-27 | AC/DC solid relay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220230903.9U CN217469918U (en) | 2022-01-27 | 2022-01-27 | AC/DC solid relay |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217469918U true CN217469918U (en) | 2022-09-20 |
Family
ID=83264538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220230903.9U Active CN217469918U (en) | 2022-01-27 | 2022-01-27 | AC/DC solid relay |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217469918U (en) |
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2022
- 2022-01-27 CN CN202220230903.9U patent/CN217469918U/en active Active
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