CN217468348U

CN217468348U - Tool for separating chip and adhesive film

Info

Publication number: CN217468348U
Application number: CN202221230422.4U
Authority: CN
Inventors: 刘中华; 李颖; 惠利省
Original assignee: Dugen Laser Technology Suzhou Co Ltd
Current assignee: Dugen Laser Technology Suzhou Co Ltd
Priority date: 2022-05-19
Filing date: 2022-05-19
Publication date: 2022-09-20
Anticipated expiration: 2032-05-19

Abstract

The utility model provides a chip and instrument for glued membrane separation relates to chip processing technology field. The tool for separating the chip from the adhesive film comprises an adsorption disc and a vacuumizing device; the adsorption disc is provided with a plurality of convex parts which are used for supporting the adhesive film; a cavity is formed between each two adjacent protruding portions and the adhesive film, air holes are formed in the adsorption disc, the vacuumizing device is communicated with the cavity through the air holes, and the vacuumizing device is used for vacuumizing the cavity. The utility model discloses an instrument is used with glued membrane separation to the cavity evacuation through evacuating device, can be so that the glued membrane of cavity department keeps away from chip above that and towards the adsorption disc sunken to reduce the area of contact between glued membrane and the chip, make the chip easily separate with the glued membrane, and then can absorb the chip with the help of adsorption equipment such as suction pen, effectively prevent the chip fracture.

Description

Tool for separating chip from adhesive film

Technical Field

The utility model belongs to the technical field of the chip processing technique and specifically relates to an instrument is used with glued membrane separation to chip.

Background

In the chip processing process, in order to prevent the chip from dissipating in the cutting process, an adhesive film is generally attached to the back surface of the chip, and then the chip is cut.

After the chip is cut, the adhesive film and the chip are separated. The existing glue film and chip separation mode is that a finger jacks up a chip and then the chip is clamped by tweezers, but the operation risk is higher and the chip is easy to break.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an instrument is used in chip and glued membrane separation to alleviate current glued membrane and the chip separation mode that exist among the prior art and rely on finger jack-up chip, then press from both sides the chip with tweezers clamp, nevertheless this operational risk is higher, leads to the easy cracked technical problem of chip.

In a first aspect, the utility model provides a tool for separating a chip from a glue film, which comprises an adsorption disc and a vacuumizing device;

the adsorption disc is provided with a plurality of protruding parts which are used for supporting the adhesive film;

a cavity is formed between every two adjacent protruding parts and the adhesive film, air holes are formed in the adsorption disc, the vacuumizing device is communicated with the cavity through the air holes, and the vacuumizing device is used for vacuumizing the cavity.

In an optional embodiment, the adsorption disc is made of a heat conducting material;

the tool for separating the adhesive film further comprises a heating device, and the heating device is used for heating the adsorption disc.

In an alternative embodiment, the heating device comprises a supporting seat and a heating element, wherein the supporting seat is installed on one side of the adsorption disc, which is opposite to the protruding part, and a working cavity is formed between the supporting seat and the adsorption disc;

the supporting seat is provided with a through hole, and the vacuumizing device is communicated with the working cavity through the through hole of the supporting seat;

the heating element is arranged on the supporting seat and used for heating the working cavity.

In an alternative embodiment, the heating element is a heating paste, and the heating paste is mounted on a side surface of the supporting seat, which faces away from the adsorption disc.

In an alternative embodiment, the heating device further comprises a temperature controller connected to the heating member for adjusting a heating temperature of the heating member.

In an alternative embodiment, the device further comprises a base, wherein the supporting seat is arranged on the base;

an air exhaust channel is arranged in the base and is communicated between the through hole of the supporting seat and the vacuumizing device.

In an optional embodiment, a hollow connecting column with openings at two ends is arranged on the base, one end of the connecting column passes through the through hole of the supporting seat and then is communicated with the working cavity, and the other end of the connecting column is communicated with one end of the air exhaust channel;

the lateral wall of the base is provided with a through hole, and the other end of the air exhaust channel is communicated with the through hole of the base.

In an optional embodiment, be equipped with the hole of stepping down on the base, heating device still includes power and wire, the one end of wire with the power is connected, and the other end passes behind the hole of stepping down with the heating member is connected.

In an alternative embodiment, the projection is a dot-shaped projection or a linear projection.

In an alternative embodiment, the air holes are formed on the disk surface of the adsorption disk at the cavity.

The utility model provides a tool for separating a chip from a glue film, which comprises an adsorption disc and a vacuumizing device; the adsorption disc is provided with a plurality of convex parts which are used for supporting the adhesive film; a cavity is formed between each two adjacent protruding portions and the adhesive film, air holes are formed in the adsorption disc, the vacuumizing device is communicated with the cavity through the air holes, and the vacuumizing device is used for vacuumizing the cavity. When the chip and the adhesive film are separated by the tool, the adhesive film attached with the chip can be placed on the adsorption disc, the adhesive film is in contact with the protrusions on the adsorption disc, and a cavity is formed between two adjacent protrusions and the adhesive film. Then, the vacuumizing device is started to vacuumize the cavity, at the moment, gas in the cavity is reduced, the pressure intensity is reduced, the adhesive film at the cavity can be separated from the chip under the pressure intensity change and is sunken towards the adsorption disc, and therefore the contact area between the adhesive film and the chip can be reduced, and the chip can be easily separated from the adhesive film. Because the chip easily separates with the glued membrane, therefore can easily absorb the chip with the help of adsorption tools such as suction pen this moment, need not use tweezers to get the chip by clamp, can effectively prevent the chip fracture.

Compared with the prior art, the utility model provides a chip and glued membrane separation are with instrument can and the glued membrane between form a plurality of cavitys through the bulge of adsorbing the dish, then can adopt evacuating device to the cavity evacuation for the glued membrane of cavity department is kept away from the chip above that and is sunken towards the adsorbing dish, thereby reduces the area of contact between glued membrane and the chip, makes the chip easily separate with the glued membrane, and then can absorb the chip with the help of adsorption tools such as suction pen, prevents effectively that the chip from splitting.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is an exploded view of a tool for separating a chip from a film according to an embodiment of the present invention;

fig. 2 is a schematic structural view of an adsorption tray provided in an embodiment of the present invention;

FIG. 3 is an enlarged view of I in FIG. 2;

fig. 4 is a top view of an adsorption plate according to an embodiment of the present invention;

FIG. 5 is a sectional view taken along line A-A of FIG. 4;

FIG. 6 is an enlarged view of section II of FIG. 4;

fig. 7 is a bottom view of an adsorption plate according to an embodiment of the present invention;

FIG. 8 is a cross-sectional view taken along line B-B of FIG. 7;

fig. 9 is a schematic structural view of a support seat according to an embodiment of the present invention;

fig. 10 is a top view of a support base according to an embodiment of the present invention;

FIG. 11 is a cross-sectional view taken at C-C of FIG. 10;

fig. 12 is a schematic structural diagram of a base according to an embodiment of the present invention;

fig. 13 is a top view of a base according to an embodiment of the present invention;

FIG. 14 is a cross-sectional view taken along line D-D of FIG. 13;

fig. 15 is a cross-sectional view E-E of fig. 13.

Icon: 1-an adsorption tray; 10-a projection; 11-air holes; 2-a support seat; 20-a through hole; 21-a groove; 3-a base; 30-an air exhaust channel; 31-a receiving tank; 32-perforation; 33-a relief hole; 34-a notch; 4-connecting column.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Example (b):

as shown in fig. 1 to 8, the tool for separating a chip from an adhesive film provided in this embodiment includes an adsorption plate 1 and a vacuum extractor; the adsorption disc 1 is provided with a plurality of convex parts 10, and the plurality of convex parts 10 are used for supporting the adhesive film; a cavity is formed between each two adjacent protruding portions 10 and the adhesive film, air holes 11 are formed in the adsorption disc 1, the vacuumizing device is communicated with the cavity through the air holes 11, and the vacuumizing device is used for vacuumizing the cavity.

When the chip and the adhesive film are separated by using the tool for separating the chip and the adhesive film, the adhesive film attached with the chip can be placed on the adsorption disc 1, the adhesive film is in contact with the convex parts on the adsorption disc 1, and a cavity is formed between the two adjacent convex parts 10 and the adhesive film. Then, the vacuumizing device is started to vacuumize the cavity, at the moment, gas in the cavity is reduced, the pressure intensity is reduced, the adhesive film at the cavity can be separated from the chip under the pressure intensity change and is sunken towards the adsorption disc 1, and therefore the contact area between the adhesive film and the chip can be reduced, and the chip can be easily separated from the adhesive film. Because the chip easily separates with the glued membrane, therefore can easily absorb the chip with the help of adsorption tools such as suction pen this moment, need not use tweezers to get the chip by clamp, can effectively prevent the chip fracture.

Compared with the prior art, the chip that this embodiment provided passes through the bulge 10 of adsorption disc 1 with the instrument for glued membrane separation can and glued membrane between form a plurality of cavitys, then can adopt evacuating device to the cavity evacuation, make the glued membrane of cavity department keep away from the chip above that and towards adsorption disc 1 sunkenly, thereby reduce the area of contact between glued membrane and the chip, make the chip easily separate with the glued membrane, and then can absorb the chip with the help of adsorption tools such as suction pen, effectively prevent the chip fracture.

Wherein, the vacuum pumping device can adopt the existing vacuum pumping pump. It should be noted that the vacuum at the cavity does not mean absolute vacuum in a physical sense, but means relative vacuum with respect to the external air.

To ensure stable operation of the vacuum pumping operation, the adhesive film may be fixed to the protrusion 10 of the adsorption plate 1. The above-mentioned fixing manner can be realized by an adhesion manner, or when the protrusion 10 has a tip, the tip of the protrusion 10 can be penetrated into the bottom layer of the adhesive film to realize the fixed connection between the adhesive film and the protrusion 10.

In this embodiment, the adsorption plate 1 is made of a heat conductive material; as shown in fig. 1, the tool for separating the chip from the adhesive film may further include a heating device for heating the adsorption plate 1.

Heating device in this embodiment can heat adsorption disc 1, because the material of adsorption disc 1 is the heat conduction material, therefore adsorption disc 1 is heated the back, can give the sunken glued membrane of cavity department with heat transfer, and then makes sunken glued membrane soften fast and stereotype, and after stopping the evacuation, the glued membrane of cavity department still can keep with the state of chip separation to promote separation process's stability and separation effect.

It should be noted that the adhesive film is usually a blue film, and the blue film can be deformed irreversibly by heating.

As shown in fig. 1, 9, 10 and 11, the heating device may include a supporting base 2 and a heating element, the supporting base 2 is mounted on a side of the adsorption tray 1 opposite to the protrusion 10 and forms a working chamber with the adsorption tray 1; the supporting seat 2 is provided with a through hole 20, and the vacuumizing device is communicated with the working cavity through the through hole 20 of the supporting seat 2; the heating member is mounted on the support base 2 for heating the working chamber.

Wherein, the working chamber can be communicated with the cavity through the air hole 11 on the adsorption disc 1, and when the working chamber is vacuumized, the cavity can also be vacuumized.

The supporting seat 2 can form stable support for the adsorption disc 1, the working cavity formed between the supporting seat 2 and the adsorption disc 1 can be an airtight cavity, and the working cavity can guarantee effective operation of vacuumizing.

In addition, the work chamber can also be with the heat transfer that the heating member produced to adsorb dish 1 to make adsorb dish 1 can be with heat transfer to sunken glued membrane.

In order to form the working chamber, as shown in fig. 9 and fig. 11, a side of the supporting seat 2 facing the adsorption disk 1 may be provided with a groove 21, and after the side of the adsorption disk 1 facing away from the protrusion 10 is mounted on the supporting seat 2, the groove 21 is closed by the adsorption disk 1, so as to form the working chamber.

In practical application, heating device's concrete structure can have multiple selection, and for promoting heating homogeneity and heating efficiency, the preferred heating member of this embodiment is the heating subsides, and the heating subsides are installed on the side of supporting seat 2 back to adsorption disc 1.

In this embodiment, the heating device further includes a temperature controller connected to the heating member for adjusting a heating temperature of the heating member.

To the glued membrane of different thickness and different volumetric cavities, the glued membrane of cavity department softens the required heat of design and is also different, can adjust the heating temperature of heating member this moment through temperature controller for the heating member produces the temperature of preferred and reaches the softening of preferred and stereotype the effect, thereby effectively guarantees the separation effect.

As shown in fig. 12, 13, 14 and 15, the tool for separating a chip from a film provided in this embodiment further includes a base 3, and the supporting base 2 is mounted on the base 3; an air exhaust channel 30 is arranged in the base 3, and the air exhaust channel 30 is communicated between the through hole 20 of the supporting seat 2 and the vacuum extractor.

The base 3 in this embodiment can not only form stable support for the support base 2, but also accommodate the air exhaust channel 30, thereby realizing the communication between the working chamber and the vacuum pumping device, and providing a vacuum system for the working chamber.

Wherein, the air exhaust passage 30 can be formed by digging in the base 3, and the air exhaust passage 30 is hidden in the base 3 at the moment, thus not occupying too much space and not interfering the assembly between the supporting seat 2 and the base 3.

As shown in fig. 12 and 15, the side of the base 3 facing the supporting seat 2 may be provided with a receiving groove 31, and the supporting seat 2 is installed in the receiving groove 31, and the receiving groove 31 may further effectively support the supporting seat 2.

As shown in fig. 13, a hollow connecting column 4 with openings at both ends is arranged on the base 3, one end of the connecting column 4 passes through the through hole 20 of the supporting seat 2 and then is communicated with the working cavity, and the other end is communicated with one end of the air exhaust channel 30; the side wall of the base 3 is provided with a through hole 32, and the other end of the air exhaust channel 30 is communicated with the through hole 32 of the base 3.

The connecting column 4 in this embodiment can not only communicate the air exhaust channel 30 with the working chamber, but also improve the installation stability between the supporting seat 2 and the base 3.

The evacuation device may include an exhaust tube, and the through hole 32 on the sidewall of the base 3 may be communicated with the exhaust tube of the evacuation device, or the exhaust tube may extend into the exhaust passage 30 after passing through the through hole 32 of the base 3, so as to be communicated with the exhaust passage 30.

The connecting column 4 can be disposed at the center of the supporting base 2, and correspondingly, the through hole 20 of the supporting base 2 is disposed at the center of the supporting base 2.

Further, the outer wall of the connecting column 4 can also be provided with an external thread, the inner wall of the through hole 20 of the supporting seat 2 is provided with an internal thread, and the supporting seat 2 and the base 3 can be connected through the external thread of the connecting column 4 and the internal thread of the through hole 20.

At this moment, the heating paste can be provided with a yielding perforation, the heating paste is arranged between the base 3 and the supporting seat 2, and the connecting column 4 can penetrate through the yielding perforation of the heating paste.

As shown in fig. 12, the base 3 is provided with a yielding hole 33, the heating device further comprises a power supply and a wire, one end of the wire is connected with the power supply, and the other end of the wire passes through the yielding hole 33 and then is connected with the heating element.

The hole 33 of stepping down makes the wiring of wire on base 3 more neat and orderly, and further, as shown in fig. 12, the bottom department of holding tank 31 of base 3 can be located to the hole 33 of stepping down, and the circumference lateral wall of base 3 can also be equipped with the breach 34 with the hole 33 intercommunication of stepping down this moment, and the wire can pass the hole 33 of stepping down again after passing this breach 34, then is connected with the heating member.

The notches 34 and the abdicating holes 33 can be matched with each other, so that the wiring of the lead is more reasonable.

In the present embodiment, the shape and size of the protrusion 10 are not limited, and the shape and size of the protrusion 10 may be selected according to the shape and size of the chip in order to improve the separation effect between the chip and the adhesive film.

For wafers (wafers) and bars (bars) comprising a plurality of chips, the projections 10 may be dot-like bumps, as shown in fig. 2 and 3.

For a semiconductor element (chip) including a chip, the projection 10 may be a linear bump.

As shown in fig. 4 and 6, the air holes 11 are provided on the disk surface at the cavity of the adsorption disk 1.

Compared with the air hole 11 arranged on the protruding part 10, when the air hole 11 is arranged on the disc surface of the cavity of the adsorption disc 1, the vacuumizing effect of the cavity can be optimal, and the adhesive film at the cavity is convenient to dent towards the adsorption disc 1.

In order to improve the working efficiency of the vacuum-pumping process, as shown in fig. 4, 5, 7 and 8, the side of the adsorption disk 1 facing away from the protrusion 10 may be provided with a plurality of air flow grooves for communicating the plurality of air holes 11, so that the vacuum-pumping process is smoother and the working efficiency can be improved.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims

1. A tool for separating a chip from an adhesive film is characterized by comprising an adsorption disc (1) and a vacuumizing device;

the adsorption disc (1) is provided with a plurality of protruding parts (10), and the protruding parts (10) are used for supporting the adhesive film;

a cavity is formed between each two adjacent protruding portions (10) and the adhesive film, air holes (11) are formed in the adsorption disc (1), the vacuumizing device is communicated with the cavity through the air holes (11), and the vacuumizing device is used for vacuumizing the cavity.

2. The tool for separating a chip from an adhesive film according to claim 1, wherein the material of the adsorption plate (1) is a heat conductive material;

the tool for separating the adhesive film further comprises a heating device, and the heating device is used for heating the adsorption disc (1).

3. The tool for separating the chip from the adhesive film according to claim 2, wherein the heating device comprises a support base (2) and a heating element, the support base (2) is mounted on one side of the adsorption disc (1) opposite to the protrusion (10) and a working cavity is formed between the support base and the adsorption disc (1);

the supporting seat (2) is provided with a through hole (20), and the vacuumizing device is communicated with the working cavity through the through hole (20) of the supporting seat (2);

the heating element is arranged on the supporting seat (2) and used for heating the working cavity.

4. The tool for separating a chip from an adhesive film according to claim 3, wherein the heating element is a heating tape mounted on a side of the support base (2) facing away from the adsorption plate (1).

5. The tool for separating a chip from an adhesive film according to claim 3, wherein the heating device further comprises a temperature controller connected to the heating member for adjusting a heating temperature of the heating member.

6. The tool for separating a chip from an adhesive film according to any one of claims 3 to 5, further comprising a base (3), wherein the supporting base (2) is mounted on the base (3);

an air suction channel (30) is arranged in the base (3), and the air suction channel (30) is communicated between the through hole (20) of the supporting seat (2) and the vacuum pumping device.

7. The tool for separating the chip from the adhesive film according to claim 6, wherein the base (3) is provided with a hollow connecting column (4) with openings at both ends, one end of the connecting column (4) passes through the through hole (20) of the supporting base (2) and then is communicated with the working cavity, and the other end is communicated with one end of the air suction channel (30);

the side wall of the base (3) is provided with a through hole (32), and the other end of the air exhaust channel (30) is communicated with the through hole (32) of the base (3).

8. The tool for separating the chip from the adhesive film according to claim 6, wherein the base (3) is provided with a yielding hole (33), the heating device further comprises a power supply and a wire, one end of the wire is connected with the power supply, and the other end of the wire passes through the yielding hole (33) and then is connected with the heating element.

9. The tool for separating a chip from an adhesive film according to any one of claims 1 to 5, wherein the projection (10) is a dot-shaped projection or a linear projection.

10. The tool for separating a chip from an adhesive film according to any one of claims 1 to 5, wherein the air holes (11) are provided on a surface of the suction disc (1) at the cavity.