CN211555847U - Thimble cap for increasing vacuum adsorption force - Google Patents
Thimble cap for increasing vacuum adsorption force Download PDFInfo
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- CN211555847U CN211555847U CN202020741022.4U CN202020741022U CN211555847U CN 211555847 U CN211555847 U CN 211555847U CN 202020741022 U CN202020741022 U CN 202020741022U CN 211555847 U CN211555847 U CN 211555847U
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- 238000001179 sorption measurement Methods 0.000 title claims abstract description 124
- 238000004891 communication Methods 0.000 claims description 3
- 239000012528 membrane Substances 0.000 abstract description 29
- 238000000034 method Methods 0.000 abstract description 6
- 238000010009 beating Methods 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 238000012536 packaging technology Methods 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 description 20
- 230000000694 effects Effects 0.000 description 11
- 230000005856 abnormality Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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Abstract
The utility model provides an increase thimble cap of vacuum adsorption power, relate to LED chip packaging technology field, on the basis that traditional thimble cap utilized the blue membrane of vacuum adsorption through-hole adsorption chip, offer at the up end of thimble cap main part and adsorb the recess, the tank bottom at adsorbing the recess simultaneously sets up a plurality of vacuum adsorption slotted hole, the adsorption area between thimble cap and the blue membrane of chip has been increased through adsorbing the recess, it utilizes the low pressure adsorption effort of vacuum system and atmospheric pressure difference formation to combine closely between thimble cap and the blue membrane to see through the vacuum adsorption slotted hole, make the blue membrane of chip and thimble cap adsorb inseparabler and stabilize at the operation in-process, prevent that the chip from beating the flower and leaking and grab unusually.
Description
Technical Field
The application relates to the technical field of LED chip packaging, in particular to a thimble cap for increasing vacuum adsorption force.
Background
Chip mounting in-process needs to separate chip and blue membrane, and the chip blue membrane of chip has been placed in the absorption of thimble cap, sets up the thimble through the internal portion center of cap at the thimble cap, and the thimble is the ejecting certain distance of the chip that will need absorb to the chip is absorbed to make chip and blue membrane separation.
Fig. 1 is a thimble cap used by a traditional die bonder, wherein a thimble hole 11 is arranged on the upper end face of the thimble cap, a blue film of a chip is adsorbed by using vacuum adsorption through holes 12 around the thimble hole 11, but the adsorption area is limited due to the fact that the vacuum adsorption through holes 12 are small, the adsorption force of the thimble cap on the blue film is poor, and therefore the chip is abnormally scratched/leaked to grab, the normal absorption of the chip is influenced, and the position precision after chip installation is also influenced.
SUMMERY OF THE UTILITY MODEL
This application provides an increase vacuum adsorption's thimble cap in order to solve the poor technical problem of blue membrane adsorption power of current thimble cap adsorption chip.
The following technical scheme is adopted in the application:
increase thimble cap of vacuum adsorption power, including thimble cap main part, thimble hole and vacuum adsorption through-hole have been seted up to the up end of thimble cap main part, the adsorption recess has still been seted up to the up end of thimble cap main part, the tank bottom of adsorbing the recess is equipped with a plurality of vacuum adsorption slotted hole.
The thimble cap for increasing the vacuum adsorption force comprises an outer ring groove surrounding the vacuum adsorption through hole.
In the thimble cap for increasing the vacuum adsorption force, the bottom of the outer ring groove is provided with a plurality of vacuum adsorption groove holes, and the plurality of vacuum adsorption groove holes are distributed at equal intervals along the extending direction of the outer ring groove.
In the thimble cap for increasing the vacuum adsorption force, the number of the vacuum adsorption slots is 8, and the aperture of the vacuum adsorption slots is 0.4-0.6 mm.
Increase thimble cap of vacuum adsorption power as above, thimble hole quantity is 1 and sets up thimble cap main part up end central point puts, vacuum adsorption through-hole quantity is 12 and equidistant around the thimble hole sets up.
According to the thimble cap for increasing the vacuum adsorption force, the outer ring groove is internally provided with the plurality of supporting blocks, and the upper end surfaces of the supporting blocks are flush with the upper end surface of the thimble cap body.
According to the thimble cap for increasing the vacuum adsorption force, the upper end face of the supporting block is provided with the vacuum adsorption through hole.
The thimble cap for increasing the vacuum adsorption force is characterized in that the outer ring groove is provided with a plurality of supporting blocks, the supporting blocks are connected with two side groove walls of the outer ring groove, the outer ring groove is divided into a plurality of arc-shaped grooves which are independent from each other by the supporting blocks, and the groove bottom of each arc-shaped groove is provided with the vacuum adsorption groove hole.
In the thimble cap for increasing the vacuum adsorption force, the adsorption groove further comprises an inner ring groove arranged between the thimble hole and the vacuum adsorption through hole, and the outer ring groove is communicated with the inner ring groove.
In the thimble cap for increasing the vacuum adsorption force, the communication area between the outer ring groove and the inner ring groove and the groove bottom of the inner ring groove are both provided with the vacuum adsorption groove hole.
Compared with the prior art, the beneficial effects of this application are as follows:
1. the utility model provides an increase thimble cap of vacuum adsorption power, on the basis that traditional thimble cap utilized the blue membrane of vacuum adsorption through-hole absorption chip, offer the absorption recess at the up end of thimble cap main part, the tank bottom at the absorption recess sets up a plurality of vacuum adsorption slotted hole simultaneously, absorption area between thimble cap and the blue membrane of chip has been increased through adsorbing the recess, see through the vacuum adsorption slotted hole and utilize the low pressure adsorption effort of vacuum system and atmospheric pressure difference formation to combine closely between thimble cap and the blue membrane, make the blue membrane of chip and thimble cap adsorb more closely firm in the operation process, prevent that the chip from beating the flower and leaking and grab the anomaly.
2. The utility model provides an adsorb recess includes the outer annular groove around the vacuum adsorption through-hole setting, and outer annular groove is the ring channel, on the absorption basis of original vacuum adsorption through-hole, through forming the ring channel and adsorbing between the blue membrane, with blue membrane whole absorption, has increased the adsorption area between thimble cap and the blue membrane of chip, adsorbs more firmly.
3. The utility model provides an outer annular groove is equipped with the supporting shoe, and the up end of supporting shoe and the up end parallel and level of thimble cap, supporting shoe can be used to support blue membrane, prevents blue membrane when the adsorption affinity is too big, is adsorbed into outer annular groove in, avoids blue membrane surface unevenness or perk, has seted up the vacuum adsorption through hole at the up end of supporting shoe, further increases adsorption effect.
4. The utility model provides an adsorb recess still including seting up the inner ring groove between thimble hole and vacuum adsorption through-hole, and communicate between outer ring groove and the inner ring groove, the bottom of the intercommunication area between outer ring groove and the inner ring groove and inner ring groove all is provided with the vacuum adsorption slotted hole, on the basis of vacuum adsorption through-hole, through inner ring groove and outer ring groove with blue membrane double-deck absorption, improve adsorption effect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.
Fig. 1 is a perspective view of a thimble cap used in a conventional die bonder.
Fig. 2 is a perspective view of the spike cap of embodiment 1 for increasing vacuum suction force according to the present invention.
FIG. 3 is a schematic cross-sectional view of the spike cap of example 1 for increasing the vacuum suction force of the present application.
Fig. 4 is a partially enlarged view of the portion i in fig. 3.
FIG. 5 is a perspective view of the spike cap of embodiment 2 of the present application for increasing vacuum suction.
FIG. 6 is a schematic cross-sectional view of the spike cap embodiment 3 of the present application for increasing vacuum suction.
Detailed Description
Referring to fig. 1 to 6, the thimble cap for increasing vacuum adsorption force includes a thimble cap main body 1, and a thimble hole 11 and a vacuum adsorption through hole 12 are provided on an upper end surface of the thimble cap main body 1, and is characterized in that: the thimble cap main part 1 is still seted up on the up end and is adsorbed recess 13, the tank bottom of adsorbing recess 13 is equipped with a plurality of vacuum adsorption slotted hole 14.
The utility model provides an increase thimble cap of vacuum adsorption power, up end at traditional thimble cap is equipped with thimble hole 11 and vacuum adsorption through-hole 12, utilize on the absorption basis of the blue membrane of vacuum adsorption through-hole 12 absorption chip around the thimble hole 11, offer absorption recess 13 at the up end of thimble cap main part 1, the tank bottom that adsorbs recess 13 simultaneously sets up a plurality of vacuum adsorption slotted hole 14, adsorption area between thimble cap and the blue membrane of chip has been increased through adsorbing recess 13, see through the low pressure adsorption effort that vacuum adsorption slotted hole utilized vacuum system and atmospheric pressure difference to form with inseparable combination between thimble cap and the blue membrane, make the blue membrane of chip and thimble cap adsorb more closely firm in the operation process, prevent that the chip from beating the flower and leaking and grab the anomaly.
As embodiment 1 of the present application, the suction groove 13 includes an outer ring groove 131 provided around the vacuum suction through hole 12. As shown in fig. 2, the adsorption groove 13 includes an outer ring groove 131 surrounding the vacuum adsorption through hole 12, the outer ring groove 131 is an annular groove, and on the basis of the adsorption of the original vacuum adsorption through hole 12, annular adsorption is formed between the annular groove and the blue film to adsorb the blue film integrally, so that the adsorption area between the thimble cap and the blue film of the chip is increased, the thimble cap and the blue film are tightly combined by a low-pressure adsorption acting force formed by a vacuum system and an atmospheric pressure difference through the vacuum adsorption groove hole, so that the blue film and the thimble cap of the chip are adsorbed more tightly and stably in the operation process, and the chip is prevented from being scratched and catching the abnormality.
Preferably, the groove bottom of the outer ring groove 131 is provided with a plurality of vacuum suction groove holes 14, and the plurality of vacuum suction groove holes 14 are equally spaced in the extending direction of the outer ring groove 131. The purpose of this design is to make the vacuum adsorption slot 14 uniform in adsorption force and increase the adsorption effect.
Preferably, the number of the vacuum adsorption slots 14 is 8, and the aperture is 0.4-0.6 mm. As shown in fig. 2, the number of the vacuum adsorption slots 14 is set to 8, and the vacuum adsorption slots are uniformly distributed at the bottom of the outer ring groove 131, and the aperture of the vacuum adsorption slot 14 is 0.4-0.6mm, and the aperture of the vacuum adsorption slot 14 is slightly larger than that of the vacuum adsorption through hole 12, so that the vacuum adsorption slot has uniform adsorption effect and simultaneously improves adsorption effect.
Preferably, thimble hole 11 quantity is 1 and sets up thimble cap main part 1 up end central point puts, 12 quantity of vacuum adsorption through-holes are 12 and equidistant around thimble hole 11 sets up. The thimble cap main part 1 of this application is provided with a thimble hole 11, and the thimble stretches out from thimble hole 11 and lifts up the chip, and vacuum adsorption through-hole 12 evenly encircles around thimble hole 11 to set up at last top surface, direct and blue membrane contact has the even effect of absorption.
As embodiment 2 of the present application, in addition to embodiment 1, a plurality of support blocks 15 are provided in the outer annular groove 131, and an upper end surface of each support block 15 is flush with an upper end surface of the thimble cap body 1. As shown in fig. 5, the supporting block 15 is provided to support the blue film, and is used to prevent the blue film from being absorbed into the outer annular groove 131 to cause the surface of the blue film to be uneven or tilted when the absorption force is too large, and the supporting block 15 is used to contact and support the blue film, so as to prevent the blue film from being sunk into the outer annular groove 131 to prevent the surface of the blue film from being uneven.
Preferably, the upper end surface of the supporting block 15 is provided with a vacuum absorption through hole 150. Further, the supporting block 15 is further provided with a vacuum absorption through hole 150, so that the absorption effect is further improved, and the blue film is stably absorbed.
Preferably, a plurality of support blocks 15 are arranged on the outer ring groove 131, the support blocks 15 are connected with two side groove walls of the outer ring groove 131, the outer ring groove 131 is divided into a plurality of arc-shaped grooves 1311 by the plurality of support blocks 15, the arc-shaped grooves 1311 are independent of each other, and the vacuum adsorption groove holes 14 are formed in the groove bottoms of the arc-shaped grooves 1311. The arc-shaped groove 1311 can be directly processed into an arc-shaped groove on the thimble cap main body 1, then the vacuum adsorption groove hole 14 is processed in the arc-shaped groove, the outer ring groove 131 is divided into a plurality of mutually independent arc-shaped grooves 1311, the adsorption uniformity effect can be improved, and due to the independent adsorption space, when the adsorption effect of any arc-shaped groove 1311 is reduced due to blue film air leakage, the remaining arc-shaped grooves 1311 can continue to complete the adsorption work.
As embodiment 3 of the present application, the suction groove 13 further includes an inner groove 132 provided between the thimble hole 11 and the vacuum suction through hole 12, and the outer groove 131 and the inner groove 132 communicate with each other. As shown in fig. 6, an inner annular groove 132 is disposed between the vacuum adsorption through hole 12 and the thimble hole 11, the adsorption groove 13 of the present application includes the inner annular groove 132 and the outer annular groove 131, and the inner annular groove 132 and the outer annular groove 131 are communicated with each other, so that the blue membrane is adsorbed in a double layer through the inner annular groove 132 and the outer annular groove 131 on the basis of the vacuum adsorption through hole 12, thereby improving the adsorption effect.
Preferably, the vacuum suction groove hole 14 is formed in both of a communication region between the outer ring groove 131 and the inner ring groove 132 and a groove bottom of the inner ring groove 132. Its function is to further improve the adsorption effect.
The utility model provides an increase thimble cap of vacuum adsorption power, up end at traditional thimble cap is equipped with thimble hole 11 and vacuum adsorption through-hole 12, utilize on the absorption basis of the blue membrane of vacuum adsorption through-hole 12 absorption chip around the thimble hole 11, offer absorption recess 13 at the up end of thimble cap main part 1, the tank bottom that adsorbs recess 13 simultaneously sets up a plurality of vacuum adsorption slotted hole 14, adsorption area between thimble cap and the blue membrane of chip has been increased through adsorbing recess 13, see through the low pressure adsorption effort that vacuum adsorption slotted hole utilized vacuum system and atmospheric pressure difference to form with inseparable combination between thimble cap and the blue membrane, make the blue membrane of chip and thimble cap adsorb more closely firm in the operation process, prevent that the chip from beating the flower and leaking and grab the anomaly.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. Thimble cap of increase vacuum adsorption power, including thimble cap main part (1), thimble hole (11) and vacuum adsorption through-hole (12), its characterized in that have been seted up to the up end of thimble cap main part (1): the thimble cap is characterized in that an adsorption groove (13) is further formed in the upper end face of the thimble cap main body (1), and a plurality of vacuum adsorption slotted holes (14) are formed in the bottom of the adsorption groove (13).
2. The spike cap for increasing vacuum suction of claim 1 wherein: the adsorption groove (13) includes an outer ring groove (131) disposed around the vacuum adsorption through hole (12).
3. The spike cap for increasing vacuum suction of claim 2 wherein: the bottom of the outer ring groove (131) is provided with a plurality of vacuum adsorption groove holes (14), and the plurality of vacuum adsorption groove holes (14) are distributed at equal intervals along the extending direction of the outer ring groove (131).
4. The spike cap for increasing vacuum suction of claim 1 wherein: the number of the vacuum adsorption slotted holes (14) is 8, and the aperture of the vacuum adsorption slotted holes is 0.4-0.6 mm.
5. The spike cap for increasing vacuum suction of claim 1 wherein: thimble hole (11) quantity is 1 and sets up thimble cap main part (1) up end central point puts, vacuum adsorption through-hole (12) quantity is 12 and equidistant centers on thimble hole (11) set up.
6. The spike cap for increasing vacuum suction of claim 2 wherein: a plurality of supporting blocks (15) are arranged in the outer annular groove (131), and the upper end faces of the supporting blocks (15) are flush with the upper end face of the thimble cap main body (1).
7. The spike cap for increasing vacuum suction of claim 6 wherein: the upper end face of the supporting block (15) is provided with a vacuum adsorption through hole (150).
8. The spike cap for increasing vacuum suction of claim 6 wherein: the vacuum adsorption groove is characterized in that the outer ring groove (131) is provided with a plurality of supporting blocks (15), the supporting blocks (15) are connected with two side groove walls of the outer ring groove (131), the outer ring groove (131) is divided into a plurality of arc-shaped grooves (1311) which are independent of each other through the supporting blocks (15), and the groove bottoms of the arc-shaped grooves (1311) are provided with the vacuum adsorption groove holes (14).
9. The spike cap for increasing vacuum suction of claim 2 wherein: the adsorption groove (13) further comprises an inner ring groove (132) arranged between the thimble hole (11) and the vacuum adsorption through hole (12), and the outer ring groove (131) is communicated with the inner ring groove (132).
10. The spike cap for increasing vacuum suction of claim 9 wherein: the vacuum adsorption slot hole (14) is formed in the communication area between the outer ring groove (131) and the inner ring groove (132) and in the groove bottom of the inner ring groove (132).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020741022.4U CN211555847U (en) | 2020-05-08 | 2020-05-08 | Thimble cap for increasing vacuum adsorption force |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020741022.4U CN211555847U (en) | 2020-05-08 | 2020-05-08 | Thimble cap for increasing vacuum adsorption force |
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| Publication Number | Publication Date |
|---|---|
| CN211555847U true CN211555847U (en) | 2020-09-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020741022.4U Active CN211555847U (en) | 2020-05-08 | 2020-05-08 | Thimble cap for increasing vacuum adsorption force |
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|---|---|
| CN (1) | CN211555847U (en) |
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- 2020-05-08 CN CN202020741022.4U patent/CN211555847U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 343000 No.288, Nantang Road, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee after: Ji'an Mulinsen Electronics Co.,Ltd. Address before: 343000 No.288, Nantang Road, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee before: Ji'an Mulinsen Lighting Devices Co.,Ltd. |
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| CP03 | Change of name, title or address |