CN217467614U - Computer cpu radiator - Google Patents
Computer cpu radiator Download PDFInfo
- Publication number
- CN217467614U CN217467614U CN202221756765.4U CN202221756765U CN217467614U CN 217467614 U CN217467614 U CN 217467614U CN 202221756765 U CN202221756765 U CN 202221756765U CN 217467614 U CN217467614 U CN 217467614U
- Authority
- CN
- China
- Prior art keywords
- groove
- liquid gold
- heat dissipation
- silicone grease
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 65
- 239000010931 gold Substances 0.000 claims abstract description 65
- 229910052737 gold Inorganic materials 0.000 claims abstract description 65
- 239000007788 liquid Substances 0.000 claims abstract description 65
- 230000017525 heat dissipation Effects 0.000 claims abstract description 41
- 239000004519 grease Substances 0.000 claims abstract description 40
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 40
- 238000010030 laminating Methods 0.000 claims abstract description 10
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 abstract description 4
- 230000003628 erosive effect Effects 0.000 abstract description 3
- 239000003973 paint Substances 0.000 abstract description 3
- 241000883990 Flabellum Species 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 5
- 229910001338 liquidmetal Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a computer cpu radiator, including the heat dissipation casing, the first face of heat dissipation casing is provided with the laminating radiating block, liquid gold guiding groove and silicone grease groove have been seted up on the laminating radiating block, silicone grease groove cover is established on the liquid gold guiding groove, liquid gold guiding groove center has been seted up liquid gold and has been piled up the groove, liquid gold piles up and is the circular arc guiding groove of having seted up in the groove in the circumference array. The utility model provides a pair of computer cpu radiator has utilized silicone grease groove and liquid gold guiding groove, can restrict liquid gold in the silicone grease inslot when using, compare in the manual work and paint the silicone grease, the more even volume that the silicone grease groove can be better is wide the silicone grease, leak to cause the erosion to the mainboard to prevent inside liquid gold, and seted up liquid gold on the liquid gold guiding groove and piled up the groove, can pile up the groove through liquid gold and guide liquid gold to the circular arc guiding groove on just liquid gold evenly scatters, still be provided with a plurality of reinforcing heat pipe heat-sinking capacities.
Description
Technical Field
The utility model relates to a radiator technical field relates to a computer cpu radiator particularly.
Background
The CPU radiator is attached to the CPU through a heat conducting medium so as to radiate the cup in work.
According to patent No. CN202220317053.6, publication (publication) date: 2022-06-14, discloses a computer CPU heatsink comprising: the mounting base, the inside fixed heat-conducting plate that is provided with in mounting base top, the mounting base is inside to be provided with the heat conduction piece in the bottom mounting of heat-conducting plate, the bottom of heat conduction piece is passed the mounting base and is set up in the mounting base below, the fixed heat conduction pipeline that is provided with a plurality of groups in top of heat-conducting plate. The utility model discloses a contact between one side of heat conduction piece and the treater, through using fixing bolt to fix between mount pad and the mainboard, can fix the radiator this moment, rotate through air intake fan, can make the air get into the back from air intake pipe's top and pass through heat conduction pipeline, make hot-air discharge from the pipeline of giving vent to anger at last, exhaust fan through setting up can accelerate the discharge of hot-air, and cooperate two radiator fan that set up, can accelerate the heat dissipation of conducting strip, the holistic heat dispersion of device has been guaranteed.
In the prior art including the above patent, the heat conducting medium includes heat conducting silicone grease and liquid gold, and the liquid gold phase has better heat conducting ability than the heat conducting silicone grease, but when the heat conducting silicone grease is attached, the heat conducting silicone grease needs to be uniformly surrounded around the liquid gold to prevent the liquid gold from leaking and damaging the main board, but the phenomenon of non-uniformity is inevitable when the liquid gold is manually surrounded.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a computer cpu radiator aims at solving liquid gold can because the inhomogeneous phenomenon that appears leaking of silicone grease.
In order to achieve the above object, the present invention provides the following technical solutions: the utility model provides a computer cpu radiator, includes the heat dissipation casing, the first face of heat dissipation casing is provided with the laminating radiating block, liquid gold guiding groove and silicone grease groove have been seted up on the laminating radiating block, silicone grease groove cover is established on the liquid gold guiding groove, liquid gold guiding groove center has been seted up liquid gold and has been piled up the groove, liquid gold piles up to be the circular arc guiding groove of having seted up in the groove in the circumference array.
Preferably, the second surface of the heat dissipation shell is provided with a heat dissipation assembly, the heat dissipation assembly comprises fan blades, the attached heat dissipation block is provided with heat dissipation fins in a circumferential array, and the fan blades face the heat dissipation fins.
Preferably, the heat dissipation assembly further comprises a fixing frame fixedly connected to the heat dissipation shell, a motor is fixedly connected to the fixing frame, and the fan blades are fixedly connected to the output end of the motor.
Preferably, the heat dissipation shell comprises a heat conduction pipe arranged on the attached heat dissipation block in a circumferential array, and the heat dissipation fins are fixedly connected to the heat conduction pipe.
Preferably, the attached heat dissipation block is an aluminum alloy block.
In the technical scheme, the utility model provides a pair of computer cpu radiator possesses following beneficial effect: utilize silicone grease groove and liquid gold guiding groove, can restrict liquid gold in the silicone grease inslot when using, compare in the manual work and paint the silicone grease, the more even more abundant silicone grease that holds that the silicone grease groove can be better, so as to prevent that inside liquid gold from leaking and cause the erosion to the mainboard, and seted up liquid gold on the liquid gold guiding groove and piled up the groove, can pile up the groove through liquid gold and guide liquid gold to the circular arc guiding groove on just liquid gold evenly scatters, still be provided with a plurality of heat pipe reinforcing heat-sinking capability.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to these drawings.
Fig. 1 is an overall schematic diagram provided in an embodiment of the present invention;
fig. 2 is a schematic structural view of a bonded heat dissipation block according to an embodiment of the present invention;
fig. 3 is a schematic diagram of an overall explosion according to an embodiment of the present invention.
Description of the reference numerals:
1. attaching a heat dissipation block; 11. a silicone grease groove; 12. a liquid gold guiding groove; 13. a liquid gold accumulation groove; 14. an arc guide groove; 2. a heat dissipating housing; 21. a heat sink; 22. a heat conducting pipe; 3. a heat dissipating component; 31. a fixed mount; 32. a motor; 33. a fan blade.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be described below clearly and completely with reference to the accompanying drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.
As shown in fig. 1-3, a cpu heat sink for a computer comprises a heat dissipating housing 2, a first surface of the heat dissipating housing 2 is provided with a heat dissipating block 1, the heat dissipating block 1 is provided with a liquid gold guiding groove 12 and a silicone grease groove 11, the silicone grease groove 11 is sleeved on the liquid gold guiding groove 12, the liquid gold guiding groove 12 is provided with a liquid gold stacking groove 13 at the center, and the liquid gold stacking groove 13 is provided with arc guiding grooves 14 in a circumferential array.
Specifically, a first surface (referring to fig. 1, the first surface is the lower end) of the heat dissipation casing 2 is provided with a joint heat dissipation block 1, the joint heat dissipation block 1 is provided with a liquid gold guiding groove 12 and a silicone grease groove 11, the size of the silicone grease groove 11 is larger than that of the liquid gold guiding groove 12, the liquid gold guiding groove 12 is sleeved with the silicone grease groove 11, the liquid gold accumulating groove 13 is arranged at the center of the liquid gold guiding groove 12, the liquid gold accumulating groove 13 is a spherical groove body, the liquid gold accumulating groove 13 is provided with arc guiding grooves 14 in a circumferential array, the liquid gold guiding groove 12 is communicated with the arc guiding grooves 14, when in use, firstly, the silicone grease is coated on the silicone grease groove 11, the viscous silicone grease can be attached on the silicone grease groove 11, then, the liquid gold is smeared in the liquid gold accumulation groove 13 and the heat dissipation block 1 is attached to the cpu, and then the liquid gold flows out from the liquid gold accumulation groove 13 along the liquid gold guide groove 12 and the arc guide groove 14, so that a good heat dissipation effect is achieved.
Among the above-mentioned technical scheme, silicone grease groove 11 and liquid gold guiding groove 12 have been utilized, can restrict liquid gold in silicone grease groove 11 when using, compare in the manual work and paint the silicone grease, more even holding of silicone grease groove 11 ability is better is stoste the silicone grease, prevent that inside liquid gold from leaking and cause the erosion to the mainboard, and seted up liquid gold on liquid gold guiding groove 12 and piled up groove 13, can pile up groove 13 through liquid gold and guide liquid gold to circular arc guiding groove 14 on just liquid gold evenly scatters, still be provided with a plurality of heat pipes 22 reinforcing heat-sinking capability.
As the embodiment that the utility model further provides, the second face of heat dissipation casing 2 is provided with radiator unit 3, and radiator unit 3 includes flabellum 33, is the circumference array on the laminating radiating block 1 and is provided with fin 21, and flabellum 33 is towards fin 21, and the cup generates heat when using, and laminating radiating block 1 absorbs the heat that the cup sent and transmits it to fin 21 on, and then flabellum 33 is driven rotatory to make the air current blow and dispel the heat to fin 21.
As the embodiment that the utility model further provides, radiator unit 3 still includes fixed connection in the mount 31 on radiator housing 2, fixedly connected with motor 32 on the mount 31, flabellum 33 fixed connection in the output of motor 32, and motor 32 starts to order about flabellum 33 and rotates when using.
As the embodiment that this utility model further provides, heat dissipation casing 2 sets up the heat pipe 22 on laminating radiating block 1 including being the circumference array, and on fin 21 fixed connection heat pipe 22, heat pipe 22 and fin 21 can carry out the heat conduction simultaneously when using to this reinforcing radiating effect.
As the embodiment that this practicality further provided, laminating radiating block 1 is made for the aluminum alloy, can play good radiating effect.
The working principle is as follows: when the metal alloy heat dissipation device is used, firstly, silicone grease is smeared on the silicone grease groove 11, viscous silicone grease can be attached to the silicone grease groove 11, then liquid metal is smeared in the liquid metal accumulation groove 13 and attached to the heat dissipation block 1 and attached to the cpu, then the liquid metal can flow out of the liquid metal accumulation groove 13 along the liquid metal guide groove 12 and the arc guide groove 14 so as to achieve a good heat dissipation effect, then the motor 32 is started, the motor 32 drives the fan blade 33 to rotate in a driven mode, and therefore air flow blows to the heat dissipation fins 21 and the heat conduction pipe 22 to dissipate heat.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the present invention. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the invention.
Claims (5)
1. The utility model provides a computer cpu radiator, its characterized in that, includes heat dissipation casing (2), the first side of heat dissipation casing (2) is provided with laminating radiating block (1), liquid gold guiding groove (12) and silicone grease groove (11) have been seted up on laminating radiating block (1), silicone grease groove (11) cover is established on liquid gold guiding groove (12), liquid gold guiding groove (12) center has been seted up liquid gold and has been piled up groove (13), it has circular arc guiding groove (14) to be the circumference array on groove (13) to pile up liquid gold.
2. The cpu heat sink of claim 1, wherein the second surface of the heat dissipation housing (2) is provided with a heat dissipation assembly (3), the heat dissipation assembly (3) comprises fan blades (33), the attached heat dissipation block (1) is provided with heat dissipation fins (21) in a circumferential array, and the fan blades (33) face the heat dissipation fins (21).
3. The cpu heat sink of claim 2, wherein the heat dissipating assembly (3) further comprises a fixing frame (31) fixedly connected to the heat dissipating housing (2), the fixing frame (31) is fixedly connected with a motor (32), and the fan blades (33) are fixedly connected to an output end of the motor (32).
4. The cpu heat sink according to claim 2, wherein the heat dissipation housing (2) comprises heat pipes (22) arranged on the attached heat dissipation block (1) in a circumferential array, and the heat dissipation fins (21) are fixedly connected to the heat pipes (22).
5. The cpu heat sink according to claim 1, wherein said attached heat dissipating block (1) is an aluminum alloy block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221756765.4U CN217467614U (en) | 2022-07-07 | 2022-07-07 | Computer cpu radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221756765.4U CN217467614U (en) | 2022-07-07 | 2022-07-07 | Computer cpu radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217467614U true CN217467614U (en) | 2022-09-20 |
Family
ID=83247099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221756765.4U Expired - Fee Related CN217467614U (en) | 2022-07-07 | 2022-07-07 | Computer cpu radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217467614U (en) |
-
2022
- 2022-07-07 CN CN202221756765.4U patent/CN217467614U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220920 |