CN210377336U - A high-efficiency computer cooling device - Google Patents
A high-efficiency computer cooling device Download PDFInfo
- Publication number
- CN210377336U CN210377336U CN201920684539.1U CN201920684539U CN210377336U CN 210377336 U CN210377336 U CN 210377336U CN 201920684539 U CN201920684539 U CN 201920684539U CN 210377336 U CN210377336 U CN 210377336U
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- China
- Prior art keywords
- heat
- water pipe
- fan
- heat conduction
- heat dissipation
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- 238000001816 cooling Methods 0.000 title claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 74
- 229910052802 copper Inorganic materials 0.000 claims abstract description 74
- 239000010949 copper Substances 0.000 claims abstract description 74
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 50
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims description 40
- 238000000465 moulding Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 238000012856 packing Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 4
- 241000883990 Flabellum Species 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high-efficient computer heat abstractor, including pure copper contact base, the front surface and the equal fixed mounting in rear surface of pure copper contact base have three heat conduction copper pipe, the last fixed surface of pure copper contact base installs water pipe head, water pipe head's last fixed surface installs heat conduction water pipe, the inner surface of base has been seted up to the internal surface of pure copper contact base, the inside surface packing of inner cavity of the base and heat conduction water pipe has heat conduction liquid, the last fixed surface of heat conduction copper pipe and heat conduction water pipe installs a plurality of aluminum alloy heat radiation fins. A high-efficient computer heat abstractor, increased water-cooling's structure, make heat abstractor can dispel the heat the cooling through metal and heat conduction liquid simultaneously, more efficient dispels the heat to the computer processor, has increased the heat area of contact of heat conduction copper pipe, makes the faster heat conduction heat of heat conduction copper pipe, improves thermal giving off speed.
Description
Technical Field
The utility model relates to a heat abstractor field, in particular to high-efficient computer heat abstractor.
Background
The computer heat dissipation device is a heat dissipation device used for dissipating heat of a central processor of a computer, is widely used in a mainboard of the computer, has a better use effect, and is more and more widely used by people along with the continuous development of society, but the existing computer heat dissipation device can not meet the requirements of people, so that the computer heat dissipation device with more efficient heat dissipation is needed; when the computer heat dissipation device is used, heat is usually dissipated only through conduction between metals, so that the heat effect is poor, and meanwhile, the copper pipe used for heat conduction is single in structure, and heat cannot be conducted more quickly, so that the heat dissipation speed is low.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a high-efficient computer heat dissipation device, which can effectively solve the problem of poor heat dissipation effect in the background and slow heat dissipation speed.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a high-efficient computer heat abstractor, includes pure copper contact base, the equal fixed mounting in front surface and the back surface of pure copper contact base has three heat conduction copper pipe, the last fixed surface of pure copper contact base installs water pipe head, water pipe head's last fixed surface installs heat conduction water pipe, the base inner chamber has been seted up to the internal surface of pure copper contact base, the inside surface packing of base inner chamber and heat conduction water pipe has heat conduction liquid, the last fixed surface of heat conduction copper pipe and heat conduction water pipe installs a plurality of aluminum alloy heat radiation fins, the equal fixed mounting in edge position of aluminum alloy heat radiation fins's upper surface and lower surface has two fan to connect the buckle, one side surface of aluminum alloy heat radiation fins is connected the buckle through the fan and is fixed the installation and is equipped with radiator fan, the internal surface of heat conduction copper pipe is provided with a.
Preferably, six copper pipe rivets and water pipe rivets are fixedly mounted on the upper surface of the aluminum alloy radiating fins, the water pipe rivets are located on the inner sides of the copper pipe rivets, the heat conduction copper pipes penetrate through the aluminum alloy radiating fins and are connected with the copper pipe rivets, and the heat conduction water pipes penetrate through the aluminum alloy radiating fins and are connected with the water pipe rivets.
Preferably, radiator fan includes fan mount pad, fan pivot and rotates the flabellum, fan mount pad fixed mounting is at one side surface of aluminum alloy heat radiation fins, the fan pivot rotates the inboard of installing at the fan mount pad, rotate flabellum fixed mounting at the surface of fan pivot, the fan pivot can drive the inboard rotatory activity of rotation flabellum at the fan mount pad.
Preferably, the water pipe connector penetrates through the pure copper contact base to be connected with the inner cavity of the base, and the heat conduction water pipe is connected with the inner cavity of the base through the water pipe connector.
Preferably, the heat conducting fins are fixedly connected with the heat conducting copper pipe through integral forming, and the heat conducting fins are arranged around the circle center of the heat conducting copper pipe.
Compared with the prior art, the utility model discloses following beneficial effect has: this high-efficient computer heat abstractor, through the pure copper contact base that sets up, water pipe head, heat conduction water pipe, base inner chamber and heat conduction liquid, the water-cooling's structure has been increased, make heat abstractor can dispel the heat through metal and heat conduction liquid simultaneously and cool down, more efficient dispels the heat to the computer processor, through heat conduction copper pipe and heat conduction fin, the heat area of contact of heat conduction copper pipe has been increased, make the more quick heat conduction heat of heat conduction copper pipe, improve thermal speed of giving off.
Drawings
Fig. 1 is a schematic view of the overall structure of a high-efficiency computer heat dissipation device of the present invention;
FIG. 2 is a partial exploded view of the aluminum alloy heat sink of the high efficiency computer heat sink of the present invention;
FIG. 3 is an internal structure view of a pure copper contact base of a high-efficiency computer heat dissipation device of the present invention;
fig. 4 is a cross-sectional view of the heat conducting copper tube of the high-efficiency computer heat dissipation device of the present invention.
In the figure: 1. a pure copper contact base; 2. a heat conducting copper pipe; 3. a water pipe joint; 4. a heat conducting water pipe; 5. the inner cavity of the base; 6. a heat conducting liquid; 7. aluminum alloy heat dissipation fins; 8. copper pipe rivets; 9. a water pipe rivet; 10. the fan is connected with the buckle; 11. a heat radiation fan; 12. a fan mounting base; 13. a fan rotating shaft; 14. rotating the fan blades; 15. a heat conductive fin.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-4, a high-efficiency computer heat dissipation device comprises a pure copper contact base 1, wherein three heat conduction copper pipes 2 are fixedly mounted on the front surface and the rear surface of the pure copper contact base 1, a water pipe connector 3 is fixedly mounted on the upper surface of the pure copper contact base 1, a heat conduction water pipe 4 is fixedly mounted on the upper surface of the water pipe connector 3, a base inner cavity 5 is formed in the inner surface of the pure copper contact base 1, heat conduction liquid 6 is filled in the base inner cavity 5 and the inner surface of the heat conduction water pipe 4, a plurality of aluminum alloy heat dissipation fins 7 are fixedly mounted on the upper surfaces of the heat conduction copper pipes 2 and the heat conduction water pipe 4, two fan connection buckles 10 are fixedly mounted on the edge positions of the upper surface and the lower surface of each aluminum alloy heat dissipation fin 7, and a heat dissipation fan 11 is fixedly mounted on the outer surface of one side of, the inner surface of the heat conducting copper pipe 2 is provided with a plurality of heat conducting fins 15;
six copper pipe rivets 8 and six water pipe rivets 9 are fixedly mounted on the upper surface of the aluminum alloy heat dissipation fin 7, the water pipe rivets 9 are located at the inner side positions of the copper pipe rivets 8, the heat conduction copper pipes 2 penetrate through the aluminum alloy heat dissipation fin 7 to be connected with the copper pipe rivets 8, the heat conduction water pipes 4 penetrate through the aluminum alloy heat dissipation fin 7 to be connected with the water pipe rivets 9, and the copper pipe rivets 8 and the water pipe rivets 9 are used for fixing the heat conduction copper pipes 2 and the heat conduction water pipes 4; the heat dissipation fan 11 comprises a fan mounting base 12, a fan rotating shaft 13 and rotating fan blades 14, wherein the fan mounting base 12 is fixedly mounted on the outer surface of one side of the aluminum alloy heat dissipation fins 7, the fan rotating shaft 13 is rotatably mounted on the inner side of the fan mounting base 12, the rotating fan blades 14 are fixedly mounted on the outer surface of the fan rotating shaft 13, and the fan rotating shaft 13 can drive the rotating fan blades 14 to rotate and move on the inner side of the fan mounting base 12; the water pipe connector 3 penetrates through the pure copper contact base 1 to be connected with the inner cavity 5 of the base, and the heat conduction water pipe 4 is communicated with the inner cavity 5 of the base through the water pipe connector 3; the heat conducting fins 15 are fixedly connected with the heat conducting copper pipe 2 through integral forming, and the plurality of heat conducting fins 15 are arranged around the circle center of the heat conducting copper pipe 2.
It should be noted that, the utility model relates to a high-efficiency computer heat dissipation device, when using, copper pipe pure copper contact base 1 is smeared with silicone grease and is connected with a computer processor, when the processor emits heat, the heat is conducted to heat conduction copper pipe 2 on copper pipe pure copper contact base 1, the top of heat conduction copper pipe 2 is connected with aluminum alloy heat dissipation fins 7, then the heat dissipation fan 11 is electrified and rotated to generate wind force to blow to the aluminum alloy heat dissipation fins 7, thereby dissipating the heat to the computer processor, when the copper pipe pure copper contact base 1 receives the processor heat, heat conduction liquid 6 in base inner cavity 5 inside copper pipe pure copper contact base 1 receives the heat at the same time, heat conduction liquid 6 conducts the heat to the aluminum alloy heat dissipation fins 7 at the same time through heat conduction water pipe 4, receives the wind force generated by heat dissipation fan 11, thereby dissipating the heat, water pipe joint 3 is used for connecting heat conduction water pipe 4, when the heat conducting copper pipe 2 conducts heat, the heat conducting fins 15 in the heat conducting copper pipe 2 increase the heat contact area of the heat conducting copper pipe 2, so that the heat speed is conducted more quickly when the heat conducting copper pipe 2 conducts heat.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920684539.1U CN210377336U (en) | 2019-12-26 | 2019-12-26 | A high-efficiency computer cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920684539.1U CN210377336U (en) | 2019-12-26 | 2019-12-26 | A high-efficiency computer cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210377336U true CN210377336U (en) | 2020-04-21 |
Family
ID=70260164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920684539.1U Active CN210377336U (en) | 2019-12-26 | 2019-12-26 | A high-efficiency computer cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210377336U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115472582A (en) * | 2022-09-30 | 2022-12-13 | 深圳市斯贝达电子有限公司 | Heating element integrated heat absorption and exchange device |
| CN119626997A (en) * | 2024-11-25 | 2025-03-14 | 东莞市晋锋五金制品有限公司 | A heat dissipation module with high heat exchange efficiency |
| CN119847303A (en) * | 2025-03-19 | 2025-04-18 | 北京资采信息技术有限公司 | Computer radiator |
-
2019
- 2019-12-26 CN CN201920684539.1U patent/CN210377336U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115472582A (en) * | 2022-09-30 | 2022-12-13 | 深圳市斯贝达电子有限公司 | Heating element integrated heat absorption and exchange device |
| CN119626997A (en) * | 2024-11-25 | 2025-03-14 | 东莞市晋锋五金制品有限公司 | A heat dissipation module with high heat exchange efficiency |
| CN119847303A (en) * | 2025-03-19 | 2025-04-18 | 北京资采信息技术有限公司 | Computer radiator |
| CN119847303B (en) * | 2025-03-19 | 2025-06-13 | 北京资采信息技术有限公司 | A computer radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220711 Address after: 523000 Room 201, building 1, No. 457, Hengli Xincheng Road, Hengli Town, Dongguan City, Guangdong Province Patentee after: Dongguan Wanhang Electronic Technology Co.,Ltd. Address before: 362000 Xiaban 36, Wupu Mountain Village, Shishan Town, Nanan City, Quanzhou City, Fujian Province Patentee before: NANAN HAOYUNLAI RAIN GEAR Co.,Ltd. |