CN217445702U - High-performance heat-dissipation combined integrated circuit board - Google Patents
High-performance heat-dissipation combined integrated circuit board Download PDFInfo
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- CN217445702U CN217445702U CN202220911740.0U CN202220911740U CN217445702U CN 217445702 U CN217445702 U CN 217445702U CN 202220911740 U CN202220911740 U CN 202220911740U CN 217445702 U CN217445702 U CN 217445702U
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Abstract
The utility model discloses a belong to integrated circuit board technical field, specifically be a radiating combination formula integrated circuit board of high performance, include box, circuit board, install the baffle in the box, the equal fixed mounting in box inner wall both sides has the spacing frame of U-shaped, the outer wall sliding connection of the spacing frame inner wall of U-shaped and circuit board both sides still includes the heat radiation structure who is connected with the box, the utility model discloses circuit board long-time work can produce a large amount of heat, and a large amount of heat partly transmits to the coolant liquid in the transmission pipe rather than the contact through circuit board both sides, and partly conducts to radiating fin, opens the motor, drives the dwang through the motor and rotates, drives flabellum one through the dwang and rotates, increases air flow rate, drives flabellum two simultaneously and rotates, through the rotation of flabellum two, cools down the coolant liquid in the transmission pipe, improves the radiating efficiency, The service life is prolonged.
Description
Technical Field
The utility model relates to an integrated circuit board technical field specifically is a radiating combination formula integrated circuit board of high performance.
Background
The wiring board is an important electronic component, is a support of an electronic component, and is a carrier for electrical connection of the electronic component. With the increasing development of modern electronic technology, the requirements on the circuit board are higher and higher, and more electrical components are arranged on the circuit board, so that the circuit board with a larger area is required to bear the electrical components, but in some environments, the use environment of the circuit board limits that the circuit board cannot occupy a larger area, and the application of the circuit board is limited, so that a combined integrated circuit board is provided.
The existing integrated circuit board heat dissipation is realized by increasing the heat dissipation area through heat dissipation fins, heat dissipation is carried out, the heat dissipation effect is poor, a large amount of accumulated heat is not dissipated, the internal damage of the circuit board can be caused after long-time use, the service life is shortened, and the use effect is influenced.
SUMMERY OF THE UTILITY MODEL
The present invention has been made in view of the above and/or other problems occurring in the conventional high performance heat dissipating modular integrated circuit board.
Therefore, the utility model aims at providing a radiating combination formula integrated circuit board of high performance can solve the above-mentioned heat dissipation that provides current integrated circuit board and all lean on radiating fin increase heat radiating area, dispels the heat, and the radiating effect is poor for a large amount of heats of accumulation give off and do not go out, long-time the use, can cause the inside damage of circuit board, reduce life, influence the problem of result of use.
For solving the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:
a high performance heat dissipating modular integrated circuit board, comprising: the heat dissipation device comprises a box body, a circuit board, a partition board arranged in the box body, U-shaped limiting frames fixedly arranged on two sides of the inner wall of the box body, and a heat dissipation structure connected with the box body, wherein the inner walls of the U-shaped limiting frames are connected with the outer walls of the two sides of the circuit board in a sliding manner;
the heat dissipation structure comprises an air-cooled heat dissipation assembly, a linkage heat dissipation assembly and a water cooling assembly, wherein the air-cooled heat dissipation assembly is connected with two sides of the box body, the bottom end of the linkage heat dissipation assembly is fixedly connected with one side of the top end of the box body, and the water cooling assembly is installed on the right side of the linkage heat dissipation assembly and is connected with the top end of the box body.
As a preferred scheme of a radiating combination formula integrated circuit board of high performance, wherein: the air-cooled radiating assembly comprises a first groove, a second groove and a supporting frame, wherein the first groove is formed in one side of the box body, the second groove is formed in the other side of the box body, through holes are formed in the first groove, the second groove and the inner wall of the box body, fixed frames are fixedly connected to the box body on the left side of the second groove, and the supporting frame is provided with two sets.
As a preferred scheme of a radiating combination formula integrated circuit board of high performance, wherein: the support frame fixed mounting is in two inner walls of recess, and the second is organized the support frame outer wall is connected with linkage radiator unit inboard, fixed frame outside fixed mounting has the motor, motor output end fixedly connected with dwang, the dwang right-hand member rotates with first group support frame to be connected, the dwang right-hand member passes first group support frame and fixedly connected with flabellum one, the top of circuit board and the equal fixedly connected with radiating fin in bottom.
As a preferred scheme of a radiating combination formula integrated circuit board of high performance, wherein: the water cooling assembly comprises a connecting groove and a storage box, the connecting groove is formed in the bottom end of the inner wall of the U-shaped limiting frame, a transmission pipe is connected to the inner wall of the connecting groove in a sliding mode, one end of the transmission pipe is connected with one end of the storage box, the bottom end of the storage box is fixedly connected with the top end of the box body, the other end of the transmission pipe is connected with one end of a water pump, and the other end of the water pump is connected with the other end of the storage box.
As a preferred scheme of a radiating combination formula integrated circuit board of high performance, wherein: the shape of the connecting groove is opened to be U-shaped.
As a preferred scheme of a radiating combination formula integrated circuit board of high performance, wherein: the connecting groove is U-shaped and provided with round corners at the corners.
As a preferred scheme of a radiating combination formula integrated circuit board of high performance, wherein: linkage radiator unit includes fixed frame two, belt pulley two, two bottoms of fixed frame and box top left side fixed connection, two inner walls of fixed frame and the second support frame fixed connection of organizing.
As a preferred scheme of a radiating combination formula integrated circuit board of high performance, wherein: and the second group is characterized in that the inner wall of the support frame is rotatably connected with a driven rod, the outer wall of the driven rod is fixedly connected with a first belt pulley, the inner side of a second belt pulley is fixedly connected with the outer wall of a rotating rod, a belt is connected between the first belt pulley and the second belt pulley in a transmission manner, and the right end of the driven rod penetrates through a second group of support frame fixedly connected with fan blades.
Compared with the prior art:
the circuit board can produce a large amount of heats for long-time work, a large amount of heat are partly transmitted to the coolant liquid in the transmission pipe rather than the contact through the circuit board both sides, partly conduction is to radiating fin, open the motor, it rotates to drive the dwang through the motor, it rotates to drive flabellum one through the dwang, increase air flow rate, it rotates to drive belt pulley one through the belt simultaneously, it rotates to drive the follower lever through belt pulley one, rotation through the follower lever drives flabellum two and rotates, rotation through flabellum two, cool down the coolant liquid in the transmission pipe, and the heat dissipation efficiency is improved, and the service life is prolonged.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a rear view of the present invention;
fig. 3 is a top view of the present invention;
fig. 4 is a side view of the conveying pipe of the present invention;
FIG. 5 is a top view of the connection between the transmission pipe and the connection groove of the present invention;
fig. 6 is a side view of the support frame of the present invention;
fig. 7 is a top view of the U-shaped connecting slot with rounded corners and the transmission pipe of the present invention.
In the figure: 1. a box body; 2. a partition plate; 3. a circuit board; 4. a U-shaped limit frame; 61. a through hole; 62. a first groove; 63. a second groove; 64. a fixing frame; 65. a motor; 66. rotating the rod; 67. a first fan blade; 68. a support frame; 69. a heat dissipating fin; 71. a second fixing frame; 72. a driven lever; 73. a first belt pulley; 74. a second belt pulley; 75. a second fan blade; 81. a storage box; 82. a conveying pipe; 83. and (4) a water pump.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
The first embodiment is as follows:
the utility model provides a high-performance heat-dissipation combined integrated circuit board, which has the advantages of convenient use and prolonged service life, please refer to fig. 1-6, and comprises a box body 1, a circuit board 3 and a baffle plate 2 arranged in the box body 1, wherein both sides of the inner wall of the box body 1 are fixedly provided with U-shaped limiting frames 4, the inner walls of the U-shaped limiting frames 4 are connected with the outer walls of both sides of the circuit board 3 in a sliding way, and the integrated circuit board also comprises a heat dissipation structure connected with the box body 1;
the heat dissipation structure comprises an air-cooled heat dissipation assembly, a linkage heat dissipation assembly and a water cooling assembly, wherein the air-cooled heat dissipation assembly is connected with two sides of the box body 1, the bottom end of the linkage heat dissipation assembly is fixedly connected with one side of the top end of the box body 1, and the water cooling assembly 8 is installed on the right side of the linkage heat dissipation assembly and is connected with the top end of the box body 1.
The air-cooled heat dissipation assembly comprises a first groove 62, a second groove 63 and support frames 68, wherein the first groove 62 is arranged on one side of the box body 1, the second groove 63 is arranged on the other side of the box body 1, through holes 61 are respectively formed between the inner sides of the first groove 62 and the second groove 63 and the inner wall of the box body 1, a fixed frame 64 is fixedly connected to the box body 1 on the left side of the second groove 63, two groups of support frames 68 are arranged, the first group of support frames 68 are fixedly arranged on the inner wall of the second groove 63, the outer wall of the second group of support frames 68 is connected with the inner side of the linkage heat dissipation assembly, a motor 65 is fixedly arranged on the outer side of the fixed frame 64, a rotating rod 66 is fixedly connected to the output end of the motor 65, the right end of the rotating rod 66 is rotatably connected with the first group of support frames 68, the right end of the rotating rod 66 passes through the first group of support frames 68 and is fixedly connected with a fan blade 67, heat dissipation fins 69 are fixedly connected to the top end and the bottom end of the circuit board 3, and the rotating rod 66 is driven by the motor 65 to rotate, the first fan blades 67 are driven to rotate through the rotating rod 66, so that the air flow rate is increased, and the heat dissipation effect on the heat dissipation fins 69 is improved.
The water cooling module comprises a connecting groove and a storage box 81, the connecting groove is formed in the bottom end of the inner wall of a U-shaped limiting frame 4, a transmission pipe 82 is connected to the inner wall of the connecting groove in a sliding mode, one end of the transmission pipe 82 is connected with one end of the storage box 81, the bottom end of the storage box 81 is fixedly connected with the top end of the box body 1, the other end of the transmission pipe 82 is connected with one end of a water pump 83, the other end of the water pump 83 is connected with the other end of the storage box 81, the connecting groove is formed in a U-shaped shape, a large amount of heat is transmitted to cooling liquid in the transmission pipe 82 in contact with the heat transmission pipe through two sides of the circuit board 3, and the cooling liquid is driven to be circularly transmitted through the water pump 83.
The linkage heat dissipation assembly comprises a second fixing frame 71 and a second belt pulley 74, the bottom end of the second fixing frame 71 is fixedly connected with the left side of the top end of the box body 1, the inner wall of the second fixing frame 71 is fixedly connected with a second group of supporting frames 68, the inner wall of the second group of supporting frames 68 is rotatably connected with a driven rod 72, the outer wall of the driven rod 72 is fixedly connected with a first belt pulley 73, the inner side of the second belt pulley 74 is fixedly connected with the outer wall of the rotating rod 66, a belt is in transmission connection between the first belt pulley 73 and the second belt pulley 74, the right end of the driven rod 72 penetrates through the second group of supporting frames 68 to be fixedly connected with a second fan blade 75, the second belt pulley 74 is driven to rotate through the rotating assembly, the second belt pulley 74 drives the first belt pulley 73 and the driven rod 72 fixedly connected with the inner side of the first belt pulley 73 to rotate through the rotation of the driven rod 72, the cooling liquid in the transmission pipe 82 is cooled through the rotation of the second fan blade 75, the heat dissipation efficiency is improved, and the service life is prolonged.
When specifically using, the technical personnel in the field will store up box 81, all fill up the coolant liquid in the transmission pipe 82, circuit board 3 long-time work can produce a large amount of heats, a large amount of heat is partly transmitted to the coolant liquid in the transmission pipe 82 rather than the contact through circuit board 3 both sides, partly conduction is to radiating fin 69, open motor 65, it rotates to drive dwang 66 through motor 65, it rotates to drive flabellum one 67 through dwang 66, increase air flow rate, improve radiating fin 69 and go up thermal radiating efficiency, it rotates to drive belt pulley one 73 through the belt simultaneously, it rotates to drive driven lever 72 through belt pulley one 73, it rotates to drive flabellum two 75 through the rotation of driven lever 72, rotation through flabellum two 75, cool down the coolant liquid in the transmission pipe 82, and improve radiating efficiency, and service life is prolonged.
Example two:
the utility model provides a radiating combination formula integrated circuit board of high performance please refer to fig. 7, the shape of spread groove is opened and is established to the U-shaped to set up the fillet in the corner, through setting up the fillet, reduce edges and corners, avoid with transmission pipe 82 fish tail.
When the cooling device is used specifically, a person skilled in the art fills the storage tank 81 and the transmission pipe 82 with cooling liquid, the circuit board 3 can generate a large amount of heat after working for a long time, a part of the large amount of heat is transmitted to the cooling liquid in the transmission pipe 82 which is arranged in the connecting groove with a round angle and arranged at the bottom end of the inner wall of the U-shaped limiting frame 4 through two sides of the circuit board 3, and is contacted with the connecting groove, a part of the large amount of heat is transmitted to the radiating fins 69, the motor 65 is started, the rotating rod 66 is driven to rotate through the motor 65, the fan blade I67 is driven to rotate through the rotating rod 66, the air flow rate is increased, the heat radiating efficiency on the radiating fins 69 is improved, meanwhile, the belt pulley I73 is driven to rotate through the belt pulley I73, the driven rod 72 is driven to rotate through the rotation of the driven rod 72, the fan blade II 75 is driven to rotate, the cooling liquid in the transmission pipe 82 is cooled through the rotation of the fan blade II 75, the heat dissipation efficiency is improved, and the service life is prolonged.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (8)
1. The utility model provides a radiating combination formula integrated circuit board of high performance, includes box (1), circuit board (3), installs baffle (2) in box (1), the equal fixed mounting in box (1) inner wall both sides has spacing frame of U-shaped (4), the outer wall sliding connection of spacing frame of U-shaped (4) inner wall and circuit board (3) both sides, its characterized in that: the heat dissipation structure is connected with the box body (1);
the radiating structure comprises an air-cooled radiating assembly, a linkage radiating assembly and a water-cooling assembly, wherein the air-cooled radiating assembly is connected with two sides of the box body (1), the bottom of the linkage radiating assembly is fixedly connected with one side of the top end of the box body (1), and the water-cooling assembly (8) is installed on the right side of the linkage radiating assembly and is connected with the top end of the box body (1).
2. The high-performance heat-dissipation combined integrated circuit board as claimed in claim 1, wherein the air-cooling heat-dissipation assembly comprises a first groove (62), a second groove (63) and a support frame (68), the first groove (62) is formed in one side of the box body (1), the second groove (63) is formed in the other side of the box body (1), through holes (61) are formed between the inner sides of the first groove (62) and the second groove (63) and the inner wall of the box body (1), a fixing frame (64) is fixedly connected to the box body (1) on the left side of the second groove (63), and two sets of the support frames (68) are arranged.
3. The high-performance heat-dissipation combined integrated circuit board as claimed in claim 2, wherein the first group of the support frame (68) is fixedly mounted on the inner wall of the second groove (63), the second group of the support frame (68) is connected with the inner side of the linkage heat-dissipation component, the motor (65) is fixedly mounted on the outer side of the fixed frame (64), the output end of the motor (65) is fixedly connected with a rotating rod (66), the right end of the rotating rod (66) is rotatably connected with the first group of the support frame (68), the right end of the rotating rod (66) passes through the first group of the support frame (68) and is fixedly connected with the first fan blade (67), and the top end and the bottom end of the circuit board (3) are fixedly connected with heat-dissipation fins (69).
4. The combined integrated circuit board with high heat dissipation performance according to claim 3, wherein the water cooling assembly comprises a connecting groove and a storage tank (81), the connecting groove is formed in the bottom end of the inner wall of the U-shaped limiting frame (4), a transmission pipe (82) is connected to the inner wall of the connecting groove in a sliding mode, one end of the transmission pipe (82) is connected with one end of the storage tank (81), the bottom end of the storage tank (81) is fixedly connected with the top end of the box body (1), the other end of the transmission pipe (82) is connected with one end of a water pump (83), and the other end of the water pump (83) is connected with the other end of the storage tank (81).
5. The integrated circuit board of claim 4, wherein the connecting slots are U-shaped.
6. The thermally enhanced combined ic board of claim 4, wherein the connecting slots are U-shaped and have rounded corners.
7. The combined type integrated circuit board with the high-performance heat dissipation function as claimed in claim 4, wherein the linkage heat dissipation assembly comprises a second fixing frame (71) and a second belt pulley (74), the bottom end of the second fixing frame (71) is fixedly connected with the left side of the top end of the box body (1), and the inner wall of the second fixing frame (71) is fixedly connected with the second group of support frames (68).
8. The high-performance heat-dissipation combined integrated circuit board as claimed in claim 7, wherein the inner wall of the second group of the support frames (68) is rotatably connected with a driven rod (72), the outer wall of the driven rod (72) is fixedly connected with a first belt pulley (73), the inner side of a second belt pulley (74) is fixedly connected with the outer wall of the rotating rod (66), a belt is connected between the first belt pulley (73) and the second belt pulley (74) in a transmission manner, and the right end of the driven rod (72) penetrates through a second group of the support frames (68) and is fixedly connected with a second fan blade (75).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220911740.0U CN217445702U (en) | 2022-04-19 | 2022-04-19 | High-performance heat-dissipation combined integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220911740.0U CN217445702U (en) | 2022-04-19 | 2022-04-19 | High-performance heat-dissipation combined integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217445702U true CN217445702U (en) | 2022-09-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220911740.0U Active CN217445702U (en) | 2022-04-19 | 2022-04-19 | High-performance heat-dissipation combined integrated circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN217445702U (en) |
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- 2022-04-19 CN CN202220911740.0U patent/CN217445702U/en active Active
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