CN217438329U - 一种真空电镀挂具 - Google Patents
一种真空电镀挂具 Download PDFInfo
- Publication number
- CN217438329U CN217438329U CN202220144028.2U CN202220144028U CN217438329U CN 217438329 U CN217438329 U CN 217438329U CN 202220144028 U CN202220144028 U CN 202220144028U CN 217438329 U CN217438329 U CN 217438329U
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- CN
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- Prior art keywords
- conductive copper
- mainboard
- copper sheet
- backplate
- evacuation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000009713 electroplating Methods 0.000 title description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052802 copper Inorganic materials 0.000 claims abstract description 42
- 239000010949 copper Substances 0.000 claims abstract description 42
- 238000007747 plating Methods 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000003814 drug Substances 0.000 abstract description 3
- 230000005389 magnetism Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004880 explosion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202220144028.2U CN217438329U (zh) | 2022-01-19 | 2022-01-19 | 一种真空电镀挂具 |
Applications Claiming Priority (1)
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CN202220144028.2U CN217438329U (zh) | 2022-01-19 | 2022-01-19 | 一种真空电镀挂具 |
Publications (1)
Publication Number | Publication Date |
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CN217438329U true CN217438329U (zh) | 2022-09-16 |
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Family Applications (1)
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CN202220144028.2U Active CN217438329U (zh) | 2022-01-19 | 2022-01-19 | 一种真空电镀挂具 |
Country Status (1)
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CN (1) | CN217438329U (zh) |
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2022
- 2022-01-19 CN CN202220144028.2U patent/CN217438329U/zh active Active
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230328 Address after: No. 45 and 51, Yougu Industrial Park, Xibei Town, Xishan District, Wuxi City, Jiangsu Province, 214000 Patentee after: GMC SEMITECH Co.,Ltd. Address before: 214194 No. 75, Yougu Industrial Park, Xibei Town, Xishan District, Wuxi City, Jiangsu Province Patentee before: Wuxi jizhixin Semiconductor Technology Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: No. 1 Jingxiang Road, Xibei Town, Xishan District, Wuxi City, Jiangsu Province, 214000 Patentee after: Jimsi Semiconductor Technology (Wuxi) Co.,Ltd. Country or region after: China Address before: No. 45 and 51, Yougu Industrial Park, Xibei Town, Xishan District, Wuxi City, Jiangsu Province, 214000 Patentee before: GMC SEMITECH Co.,Ltd. Country or region before: China |