CN217427250U - Data line - Google Patents

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Publication number
CN217427250U
CN217427250U CN202221164666.7U CN202221164666U CN217427250U CN 217427250 U CN217427250 U CN 217427250U CN 202221164666 U CN202221164666 U CN 202221164666U CN 217427250 U CN217427250 U CN 217427250U
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Prior art keywords
interface
data line
heat dissipation
controller
driving circuit
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CN202221164666.7U
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Chinese (zh)
Inventor
王振宇
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Beijing Xiaomi Mobile Software Co Ltd
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Beijing Xiaomi Mobile Software Co Ltd
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Priority to CN202221164666.7U priority Critical patent/CN217427250U/en
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Abstract

The present disclosure relates to a data line, including: a wire rod; the first interface is used for connecting equipment; and the first heat dissipation module is arranged on the wire rod close to the first interface and used for dissipating heat of the equipment and the first interface. Therefore, the data line is provided with the first heat dissipation module close to the first interface of the connecting device on the wire rod, so that the heat dissipation effect of the device and the first interface is improved when the device charges or transmits data by using the data line.

Description

Data line
Technical Field
The present disclosure relates to the field of heat dissipation technologies, and in particular, to a data line.
Background
At present, the existing scheme on the market for radiating the mobile phone is that the heat is radiated indirectly through the back of the mobile phone through a heat radiation back clip, but because a back cover of the mobile phone or even a protective shell exists in the mobile phone, the effect of radiating by using the heat radiation back clip is poor when the mobile phone is charged through a data line or data is transmitted.
Therefore, how to improve the heat dissipation effect of the mobile phone when the mobile phone is charged or data is transmitted through the data line is a problem to be solved urgently at present.
Disclosure of Invention
The utility model provides a data line sets up first heat dissipation module through on the wire rod, the first interface position that is close to connected device to equipment is when using this data line to charge or data transmission, the radiating effect of improve equipment and first interface. The technical scheme of the disclosure is as follows:
according to an embodiment of the present disclosure, a data line is provided, including:
a wire rod;
the first interface is an interface for connecting equipment;
the first heat dissipation module is arranged on the wire rod close to the first interface and used for dissipating heat of the equipment and the first interface.
In one embodiment of the present disclosure, a heat conducting channel is provided inside the apparatus; wherein the content of the first and second substances,
the heat conduction channel is arranged close to each component inside the equipment.
In one embodiment of the present disclosure, the material of the heat conducting channel is a graphite sheet and/or a copper tube.
In an embodiment of the disclosure, the data line further includes:
the second interface is an interface for connecting a power adapter;
and the second heat dissipation module is arranged on the wire rod close to the second interface and used for dissipating heat of the power adapter and the second interface.
In one embodiment of the present disclosure, the first and second heat dissipation modules include: a housing and a heat dissipating assembly; wherein the content of the first and second substances,
be provided with in the casing and hold the chamber, radiator unit installs hold in the chamber.
In one embodiment of the present disclosure, a vent is provided on the housing.
In one embodiment of the present disclosure, the heat dissipation assembly includes: a controller, a motor drive circuit and a fan; wherein the content of the first and second substances,
the power supply end of the controller and the power supply end of the motor driving circuit are connected with the wire rod so as to provide electric energy for the controller and the motor driving circuit through the wire rod;
the control end of the controller is connected with the input end of the motor driving circuit, and the controller is used for controlling the motor driving circuit;
the output end of the motor driving circuit is connected with the fan, and the motor driving circuit is used for driving the fan.
In one embodiment of the present disclosure, the heat dissipation assembly further includes: a temperature sensor; wherein the content of the first and second substances,
the power end of the temperature sensor is connected with the wire so as to provide electric energy for the temperature sensor through the wire;
the input end of the controller is connected with the temperature output end of the temperature sensor, and the controller is further used for controlling the motor driving circuit according to the temperature value measured by the temperature sensor.
The technical scheme provided by the embodiment of the disclosure at least brings the following beneficial effects:
through the embodiment of this disclosure, data line includes: a wire rod; the first interface is used for connecting equipment; and the first heat dissipation module is arranged on the wire rod close to the first interface and used for dissipating heat of the equipment and the first interface. This data line through on the wire rod, is close to the first interface position of jointing equipment and sets up first heat dissipation module to equipment when using this data line to charge or data transmission, improves the radiating effect of equipment.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the disclosure and are not to be construed as limiting the disclosure.
FIG. 1 is a schematic diagram of a data line according to one embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a data line according to another embodiment of the present disclosure;
FIG. 3 is a schematic diagram of a data line according to yet another embodiment of the present disclosure;
FIG. 4 is a schematic diagram of a first and second heat dissipation module according to one embodiment of the present disclosure;
FIG. 5 is a schematic view of a heat dissipation assembly according to one embodiment of the present disclosure;
fig. 6 is a schematic view of a heat dissipation assembly according to another embodiment of the present disclosure.
Detailed Description
In order to make the technical solutions of the present disclosure better understood by those of ordinary skill in the art, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings.
It should be noted that the terms "first," "second," and the like in the description and claims of the present disclosure and in the above-described drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the disclosure described herein are capable of operation in sequences other than those illustrated or otherwise described herein. The implementations described in the exemplary embodiments below do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
Data lines of embodiments of the present disclosure are described below with reference to the drawings.
Fig. 1 is a schematic diagram of a data line according to one embodiment of the present disclosure.
As shown in fig. 1, a data line 100 of the present disclosure includes: the wire 110, the first interface 120, and the first heat dissipation module 130.
The first interface 120 is an interface for connecting the device 200. The first heat dissipation module 130 is disposed on the wire 110 near the first interface 120, and is used for dissipating heat of the apparatus 200 and the first interface 120.
In this embodiment, the interface Type of the first interface 120 may be USB Type-C, wherein USB Type-C is a USB interface profile standard and has a smaller volume than both Type-a and Type-B. The device 200 may be an electronic product such as a cell phone, tablet, wearable device, etc.
In this embodiment, in order to improve the heat dissipation effect on the device 200 and the first interface 120, when the first heat dissipation module 130 is installed, the first heat dissipation module 130 needs to be as close to the first interface 120 as possible, and during the installation process, it needs to be noted that the data line after the first heat dissipation module 130 is installed cannot affect the application of the first interface 120.
In general, if a common data line is used for charging or data transmission, a problem of serious heat generation of the device and the first interface is caused, and in order to solve the problem, the common data line is improved in the disclosure. When the data line is used, the working mode can be automatically started after the first heat dissipation module is powered on, so that the equipment and the first interface are always cooled when the data line is used for charging or data transmission, and the heat of the equipment and the first interface can be effectively reduced.
From this, this disclosed data line sets up first heat dissipation module through on the wire rod, near the first interface position of jointing equipment to equipment is when using this data line to charge or data transmission, improves the radiating effect of equipment and first interface.
In order to further improve the heat dissipation effect of the device 200 when the data line 100 is applied for charging or data transmission, in the present disclosure, as shown in fig. 2, a heat conducting channel 210 may be disposed inside the device 200.
The heat conducting channel 210 is disposed near each component inside the device 200 (e.g., a main heat source inside the device 200, such as a Central Processing Unit (CPU), a power chip, etc.).
In one embodiment of the present disclosure, the material of the thermally conductive channel 210 may be a graphite sheet and/or a copper tube.
That is, in order to more efficiently dissipate the heat generated by the device 200, the heat generated by the main heat source inside the device 200, such as a CPU, a power chip, etc., may be transferred to the housing connected to the first interface 120 through the heat conducting channel 210 independently disposed inside the device 200, so as to dissipate the heat through the housing, which greatly reduces the heat transferred to the surface of the device 200 and enhances the user experience.
In order to maintain the temperature of the power adapter and the interface connected to the power adapter during the charging process of the device 200, as shown in fig. 3, the data line 100 further includes: a second interface 140 and a second heat dissipation module 150.
The second interface 140 is an interface for connecting a power adapter. The second heat dissipation module 150 is disposed on the wire 110 near the second interface 140, and is used for dissipating heat for the power adapter and the second interface 140.
In this embodiment, in order to improve the heat dissipation effect on the power adapter and the second interface 140, when the second heat dissipation module 150 is installed, the second heat dissipation module 150 needs to be as close to the second interface 140 as possible, and during the installation process, it should be noted that the data line after the second heat dissipation module 150 is installed cannot affect the application of the second interface 140.
In general, if a common data line is used for charging, the problem that the power adapter and the second interface generate heat seriously is caused, and in order to solve the problem, the common data line is improved in the disclosure. When the data line is used, the working mode can be automatically started after the second heat dissipation module is powered on, so that the heat of the power adapter and the second interface can be effectively reduced when the data line is used for charging and is always dissipated for the power adapter and the second interface.
From this, this disclosed data line sets up second heat dissipation module through on the wire rod, the second interface position that is close to connected device to when equipment is using this data line to charge, improve the radiating effect of power adapter and second interface.
The structures of the first and second heat dissipation modules 130 and 150 of the present disclosure are explained below with reference to fig. 4.
Fig. 4 is a schematic diagram of a first and second heat dissipation module according to one embodiment of the present disclosure.
As shown in fig. 4, the first and second heat dissipation modules 130 and 150 include: a housing 161 and a heat sink assembly 162.
Wherein, a containing cavity 163 is provided in the housing 161, and the heat sink assembly 162 is installed in the containing cavity 163.
In order to further improve the heat dissipation effect of the heat dissipation module, a vent may be disposed on the housing 161, and the vent may be made of a material with good heat conductivity, such as a graphite sheet and/or a copper pipe.
A heat sink assembly 162 of the present disclosure is described below in conjunction with fig. 5.
Fig. 5 is a schematic view of a heat dissipation assembly according to one embodiment of the present disclosure.
As shown in fig. 5, the heat sink assembly 162 includes: a controller 1631, a motor drive circuit 1632, and a fan 1633.
The power supply terminals of the controller 1631 and the motor driving circuit 1632 are connected to the wire 110 to supply power to the controller 1631 and the motor driving circuit 1632 through the wire 110. The control end of the controller 1631 is connected to the input end of the motor driving circuit 1632, and the controller 1631 is used for controlling the motor driving circuit 1632. The output end of the motor driver 1632 is connected to the fan 1633, and the motor driver 1632 is used for driving the fan 1633.
The power supply of the heat dissipation assembly of the embodiment of the present disclosure does not need to additionally increase a power supply, and the power adapter can supply power to the heat dissipation assembly through a wire, which is also an advantage over a conventional heat dissipation back clip.
Another heat sink assembly 162 of the present disclosure is described below in conjunction with fig. 6.
Fig. 6 is a schematic view of a heat dissipation assembly according to another embodiment of the present disclosure.
In order to increase the intelligence of the heat sink 162 and reduce the power consumption of the heat sink 162, as shown in fig. 6, the heat sink 162 further includes: a temperature sensor 1634.
Wherein, a power end of the temperature sensor 1634 is connected to the wire 110 to provide power for the temperature sensor 1634 through the wire 110. An input end of the controller 1631 is connected to a temperature output end of the temperature sensor 1634, and the controller 1631 is further configured to control the motor driving circuit 1632 according to a temperature value measured by the temperature sensor 1634.
For example, when the temperature value measured by the temperature sensor 1634 is greater than a set temperature value (the set temperature value may be set according to actual needs, and specific values are not limited in this disclosure), the controller 1631 outputs a first control signal to cut off the electrical connection with the motor driving circuit 1632; when the temperature value measured by the temperature sensor 1634 is less than or equal to the set temperature value, the controller 1631 outputs a second control signal to connect the electrical connection with the motor driving circuit 1632, so that the motor driving circuit 1632 drives the fan 1633 to operate.
It should be noted that, in other embodiments of the present disclosure, a key switch may be further disposed between the controller and the wire, and the key switch is controlled by a user, for example, the user may selectively connect the electrical connection between the controller and the wire through the key switch according to the user's needs.
In summary, the data line according to the embodiment of the present disclosure includes: a wire rod; the first interface is used for connecting equipment; and the first heat dissipation module is arranged on the wire rod close to the first interface and used for dissipating heat of the equipment and the first interface. This data line through on the wire rod, is close to the first interface position of jointing equipment and sets up first heat dissipation module to equipment when using this data line to charge or data transmission, improves the radiating effect of equipment and first interface.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (8)

1. A data line, comprising:
a wire rod;
the first interface is an interface for connecting equipment;
the first heat dissipation module is arranged on the wire rod close to the first interface and used for dissipating heat of the equipment and the first interface.
2. The data line of claim 1, wherein a thermally conductive channel is disposed within the device; wherein the content of the first and second substances,
the heat conduction channel is arranged close to each component inside the equipment.
3. The data line of claim 2, wherein the material of the thermally conductive channel is a graphite sheet and/or a copper tube.
4. The data line of any one of claims 1-3, further comprising:
the second interface is an interface for connecting a power adapter;
and the second heat dissipation module is arranged on the wire rod close to the second interface and used for dissipating heat of the power adapter and the second interface.
5. The data line of claim 4, wherein the first and second heat dissipation modules comprise: a housing and a heat dissipating assembly; wherein the content of the first and second substances,
be provided with in the casing and hold the chamber, radiator unit installs hold in the chamber.
6. The data cable of claim 5, wherein the housing is provided with a vent.
7. The data line of claim 5, wherein the heat dissipation assembly comprises: a controller, a motor drive circuit and a fan; wherein the content of the first and second substances,
the power supply end of the controller and the power supply end of the motor driving circuit are connected with the wire rod so as to provide electric energy for the controller and the motor driving circuit through the wire rod;
the control end of the controller is connected with the input end of the motor driving circuit, and the controller is used for controlling the motor driving circuit;
the output end of the motor driving circuit is connected with the fan, and the motor driving circuit is used for driving the fan.
8. The data line of claim 7, wherein the heat dissipation assembly further comprises: a temperature sensor; wherein the content of the first and second substances,
the power end of the temperature sensor is connected with the wire so as to provide electric energy for the temperature sensor through the wire;
the input end of the controller is connected with the temperature output end of the temperature sensor, and the controller is further used for controlling the motor driving circuit according to the temperature value measured by the temperature sensor.
CN202221164666.7U 2022-05-13 2022-05-13 Data line Active CN217427250U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221164666.7U CN217427250U (en) 2022-05-13 2022-05-13 Data line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221164666.7U CN217427250U (en) 2022-05-13 2022-05-13 Data line

Publications (1)

Publication Number Publication Date
CN217427250U true CN217427250U (en) 2022-09-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221164666.7U Active CN217427250U (en) 2022-05-13 2022-05-13 Data line

Country Status (1)

Country Link
CN (1) CN217427250U (en)

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