CN217387642U - Power electronic conversion module - Google Patents
Power electronic conversion module Download PDFInfo
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- CN217387642U CN217387642U CN202221456272.9U CN202221456272U CN217387642U CN 217387642 U CN217387642 U CN 217387642U CN 202221456272 U CN202221456272 U CN 202221456272U CN 217387642 U CN217387642 U CN 217387642U
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- heat dissipation
- heat
- dissipation structure
- conversion module
- copper bar
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Abstract
The utility model discloses a power electronic conversion module, which comprises a shell, a copper bar, a first heat dissipation structure and a second heat dissipation structure, wherein a containing cavity for containing an electronic device is formed inside the shell; one end of the copper bar is positioned in the accommodating cavity, and the other end of the copper bar penetrates through the shell and extends to the outer side of the accommodating cavity; the first heat dissipation structure is arranged on the surface of the shell and used for dissipating heat of the electronic device; the second heat dissipation structure is fixed on the surface of the shell and is abutted against the copper bar to dissipate heat of the copper bar. The utility model discloses technical scheme aims at promoting power electronic conversion module's radiating effect.
Description
Technical Field
The utility model relates to an electronic equipment heat dissipation technical field, in particular to power electronic conversion module.
Background
Electronic devices inevitably generate heat during operation, and particularly, power devices such as power electronic switching modules (IGBTs) generate heat excessively to affect normal operation of the modules and even damage the modules. The power electronic conversion module comprises a shell, an electronic device and a copper bar, wherein the copper bar penetrates through the side surface of the shell from the inside of the shell and extends to the outer side of the shell. The heating source of the power electronic conversion module comprises an electronic device and a copper bar, and the traditional heat dissipation structure is a plurality of heat dissipation columns which are arranged in a dense array and are arranged on the bottom surface of the shell. The heat that the power electronic module during operation produced conducts to the heat dissipation post, contacts and takes away the heat through the surface of heat dissipation post through outside coolant liquid or air flow to the realization is cooled down power electronic module. However, the heat dissipation structure can only cool the electronic device inside the shell, and cannot dissipate heat of the copper bar extending out of the shell, and the heat dissipation effect of the heat dissipation structure is difficult to meet the heat dissipation requirement of the power electronic conversion module.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a power electronic conversion module aims at promoting power electronic conversion module's radiating effect.
In order to achieve the above object, the utility model provides a power electronic conversion module, include:
the electronic device comprises a shell, a first connecting piece and a second connecting piece, wherein a containing cavity for containing an electronic device is formed inside the shell;
one end of the copper bar is positioned in the accommodating cavity, and the other end of the copper bar penetrates through the shell and extends to the outer side of the accommodating cavity;
the first heat dissipation structure is arranged on the surface of the shell and used for dissipating heat of the electronic device; and
and the second heat dissipation structure is fixed on the surface of the shell and is abutted against the copper bar to dissipate heat of the copper bar.
The utility model discloses an in the embodiment, still include that second heat radiation structure's inside is formed with cooling channel, second heat radiation structure's surface still is equipped with the intercommunication cooling channel's heat transfer entry and heat transfer export, be used for the holding coolant in the cooling channel.
In an embodiment of the present invention, the heat exchange inlet and the heat exchange outlet are respectively disposed at two ends of the extending direction of the second heat dissipation structure.
In an embodiment of the present invention, a heat conducting adhesive is disposed between the second heat dissipation structure and the housing and/or between the second heat dissipation structure and the copper bar.
In an embodiment of the present invention, the housing has a back surface and a side surface which are adjacently disposed, and the first heat dissipation structure is disposed on the back surface of the housing;
the copper bar is arranged on the side in a penetrating mode, the second heat dissipation structure comprises a first heat dissipation section and a second heat dissipation section which are connected, the first heat dissipation section is fixed on the side and abutted against the copper bar, and the second heat dissipation section is fixed on the back face of the shell.
In an embodiment of the present invention, the copper bar is disposed on two opposite side surfaces of the housing, the number of the second heat dissipation structures is two, and the two heat dissipation structures are respectively two side surfaces of the housing are fixedly connected.
In an embodiment of the present invention, the second heat dissipation structure is made of copper or copper alloy.
In an embodiment of the present invention, the first heat dissipation structure includes a plurality of heat dissipation pillars arranged at intervals, and a cross section of the heat dissipation pillar includes any one of a droplet shape, a circular shape, an oval shape, and a long strip shape.
In an embodiment of the present invention, the surface of the heat-dissipating stud is further provided with one or more auxiliary heat-dissipating structures.
In an embodiment of the present invention, the auxiliary heat dissipation structure includes a protrusion or a groove.
The utility model discloses a power electronic conversion module, which comprises a shell, a copper bar, a first heat dissipation structure and a second heat dissipation structure, wherein, the inside of the shell is used for accommodating electronic devices; one end and the electron device of copper bar, the other end run through the casing and extend and hold the outside in chamber for connect outside part. The surface of the shell is provided with a first heat dissipation structure for dissipating heat of an electronic device so as to reduce the temperature of the power electronic conversion module; meanwhile, the shell is further connected with a second heat dissipation structure, the second heat dissipation structure is abutted to the copper bar, so that the second heat dissipation structure can take away heat on the copper bar quickly, the temperature of the copper bar is reduced, and the heat dissipation effect of the power electronic conversion module is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a power electronic conversion module according to the present invention;
fig. 2 is a schematic view of a second heat dissipation structure in fig. 1.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Power electronic conversion module | 31 | |
| 10 | |
50 | Second heat dissipation structure |
| 11 | Back side of the |
51 | First heat dissipation section |
| 13 | |
53 | Second |
| 20 | Copper bar | 57 | |
| 30 | First heat dissipation structure | 59 | Heat exchange outlet |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front, rear … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the expression "and/or" as used throughout is meant to encompass three juxtaposed aspects, exemplified by "A and/or B", including either the A aspect, or the B aspect, or aspects in which both A and B are satisfied. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a power electronic conversion module 100.
Referring to fig. 1 and 2, in an embodiment of the present invention, the power electronic conversion module 100 includes:
a housing 10, in which a housing chamber (not shown) for housing an electronic device (not shown) is formed inside the housing 10;
one end of the copper bar 20 is positioned in the accommodating cavity, and the other end of the copper bar 20 penetrates through the shell 10 and extends to the outer side of the accommodating cavity;
the first heat dissipation structure 30, the first heat dissipation structure 30 is disposed on the surface of the housing 10 for dissipating heat of the electronic device; and
the second heat dissipation structure 50 is fixed on the surface of the housing 10, and the second heat dissipation structure 50 is abutted against the copper bar 20 to dissipate heat of the copper bar 20.
The power electronic conversion module 100 of the present invention includes a housing 10, a copper bar 20, a first heat dissipation structure 30 and a second heat dissipation structure 50, wherein the inside of the housing 10 is used for accommodating an electronic device; one end of the copper bar 20 is connected with the electronic device, and the other end of the copper bar penetrates through the shell 10 and extends to the outside of the accommodating cavity for connecting with external components. The first heat dissipation structure 30 for dissipating heat of the electronic device is arranged on the surface of the casing 10, so as to reduce the temperature of the power electronic conversion module 100; meanwhile, the casing 10 is further connected with a second heat dissipation structure 50, and the second heat dissipation structure 50 is abutted to the copper bar 20, so that heat on the copper bar 20 can be quickly taken away by the second heat dissipation structure 50, the temperature of the copper bar 20 is reduced, and the heat dissipation effect of the power electronic conversion module 100 is further improved.
The casing 10 provides the installation carrier for electron device, and this casing 10 material or the local material of casing 10 can adopt the material that the thermal conductivity is good to realize dispelling the heat to external world fast. The housing 10 is generally a cube structure to facilitate the mounting and layout of the electronic components.
The housing 10 has a back surface 11 and a side surface 13 disposed adjacent to each other, and the first heat dissipation structure 30 is disposed on the back surface 11 of the housing 10. The back surface 11 of the casing 10 is made of a material with good thermal conductivity, such as a copper material or a copper alloy material on the back surface 11 of the casing 10, and the first heat dissipation structure 30 is protruded on the back surface 11 of the casing 10. The copper bar 20 is inserted through the side 13 of the housing 10, and at this time, the second heat dissipation structure 50 is attached to the side 13 of the housing 10 and abuts against the surface of the copper bar 20.
Further, wear to establish on the relative both sides face 13 of casing 10 when a plurality of copper bars 20, this moment, second heat radiation structure 50's quantity is two, so, can ensure that second heat radiation structure 50 can with each copper bar 20 butt to with the heat in order taking away on each copper bar 20, realize for the cooling of each copper bar 20.
Referring to fig. 1 and 2, further, the second heat dissipation structure 50 includes a first heat dissipation section 51 and a second heat dissipation section 53 connected to each other, the first heat dissipation section 51 is fixed to the side 13 and abuts against the copper bar 20, and the second heat dissipation section 53 is fixed to the back 11 of the housing 10. Through setting up second heat radiation structure 50 to including the first heat dissipation section 51 and the second heat dissipation section 53 that are connected, so, the heat that first heat dissipation section 51 was taken away from copper bar 20 can transmit to the back 11 of casing 10 through second heat dissipation section 53 to establish through the subsides of locating back 11 and dispel the heat at first heat radiation structure 30, thereby promote the radiating efficiency of copper bar 20.
Further, in an embodiment of the present invention, a cooling channel is formed inside the second heat dissipation structure 50, and the surface of the second heat dissipation structure 50 is further provided with a heat exchange inlet 57 and a heat exchange outlet 59 communicated with the cooling channel, and the cooling channel is used for accommodating a cooling medium. The second heat dissipation structure 50 has a cooling channel formed therein, that is, the second heat dissipation structure 50 is a hollow tubular structure. The second heat dissipation structure 50 may be a circular tube or a square tube. Wherein, second heat radiation structure 50 is square pipe, makes things convenient for the fixed connection of second heat radiation structure 50 and casing 10 on the one hand, and on the other hand can also promote the area of second heat radiation structure 50 and copper bar 20, the area of casing 10's contact to promote the radiating effect.
Wherein, can be used for holding cooling water or other coolant in the cooling channel, coolant is at the cooling channel internal loop flow to realize taking away the heat of copper bar 20 fast, in order to further promote the radiating efficiency of copper bar 20. In an embodiment, the second heat dissipation structure 50 has an extending direction extending along the length direction of the housing 10, and the heat exchange inlet 57 and the heat exchange outlet 59 are respectively disposed at two ends of the extending direction of the second heat dissipation structure 50, so that the distance that the cooling medium can flow in the cooling channel is longer, and thus heat dissipation of more copper bars 20 is achieved, and the heat dissipation effect is improved. Further, the heat exchange inlet 57 and the heat exchange outlet 59 are both disposed on the second heat dissipation section 53, so that the fluid flowing through the first heat dissipation structure 30 can also enter the cooling channel through the heat exchange inlet 57, and the cooling channel flows out through the heat exchange outlet 59, so as to further improve the heat exchange efficiency.
Further, in an embodiment of the present invention, a heat conducting glue (not shown) is disposed between the second heat dissipation structure 50 and the casing 10 to improve a heat conducting effect between the second heat dissipation structure 50 and the casing 10. Further, a heat conducting adhesive is also disposed between the second heat dissipation structure 50 and the copper bar 20 to improve the heat conducting effect between the second heat dissipation structure 50 and the copper bar 20.
The heat conducting glue between the second heat dissipating structure 50 and the casing 10 and between the second heat dissipating structure 50 and the copper bar 20 may be disposed at the same time, or disposed at one of the two locations, and certainly, when the heat conducting glue is disposed at the two locations, the heat conducting effect is better, and the heat dissipating performance of the power electronic conversion module 100 can be further improved.
Referring to fig. 1, in an embodiment of the present invention, the first heat dissipation structure 30 includes a plurality of heat dissipation pillars 31 arranged at intervals, and a cross section of the heat dissipation pillars 31 includes any one of a droplet shape, a circular shape, an oval shape, and a long strip shape. A plurality of heat-dissipating studs 31 are arranged in an array on the back surface 11 of the housing 10. Each of the heat dissipation studs 31 is perpendicular to the back surface 11 of the housing 10, and the cross-sectional shape of the heat dissipation studs 31 is designed to improve heat dissipation efficiency. The hydromechanics characteristic is fully absorbed by the water drop-shaped heat dissipation columns 31, vortexes generated when fluid flows through the heat dissipation columns 31 are reduced, meanwhile, the fluid speed can be increased due to the fact that the circulation area between the front heat dissipation column 31 and the rear heat dissipation column 31 is reduced, the water temperature is properly reduced, the cooling effect of the surfaces of the subsequent heat dissipation columns 31 is further enhanced, and the better heat dissipation effect is achieved.
It is understood that the back 11 of a housing 10 may be provided with heat-dissipating studs 31 of various shapes, or the back 11 of a housing 10 may be provided with one of the heat-dissipating studs 31, as defined herein.
Further, in an embodiment of the present invention, the surface of the heat-dissipating stud 31 is further provided with one or more auxiliary heat-dissipating structures (not shown). The auxiliary heat dissipation structure includes a protrusion or a groove, and the protrusion or the groove can increase the contact area of the surface of the heat dissipation column 31 of the fluid, so as to further enhance the heat dissipation effect.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. A power electronic conversion module, characterized in that the power electronic conversion module comprises:
the electronic device comprises a shell, a first connecting piece and a second connecting piece, wherein a containing cavity for containing an electronic device is formed inside the shell;
one end of the copper bar is positioned in the accommodating cavity, and the other end of the copper bar penetrates through the shell and extends to the outer side of the accommodating cavity;
the first heat dissipation structure is arranged on the surface of the shell and used for dissipating heat of the electronic device; and
and the second heat dissipation structure is fixed on the surface of the shell and is abutted against the copper bar to dissipate heat of the copper bar.
2. The power electronic conversion module according to claim 1, further comprising a cooling channel formed inside the second heat dissipation structure, wherein a heat exchange inlet and a heat exchange outlet communicating with the cooling channel are further provided on a surface of the second heat dissipation structure, and the cooling channel is used for accommodating a cooling medium therein.
3. The power electronic conversion module of claim 2, wherein the heat exchange inlet and the heat exchange outlet are respectively provided at both ends of the extending direction of the second heat dissipation structure.
4. The power-electronic conversion module of claim 1, wherein a thermally conductive adhesive is disposed between the second heat dissipation structure and the housing and/or between the second heat dissipation structure and the copper bar.
5. The power electronic conversion module of claim 1 wherein said housing has a back side and a side disposed adjacent to each other, said first heat dissipation structure being disposed on said housing back side;
the copper bar is arranged on the side in a penetrating mode, the second heat dissipation structure comprises a first heat dissipation section and a second heat dissipation section which are connected, the first heat dissipation section is fixed on the side and abutted against the copper bar, and the second heat dissipation section is fixed on the back face of the shell.
6. The power electronic conversion module of claim 5, wherein the copper bars are disposed on two opposite side surfaces of the housing, the number of the second heat dissipation structures is two, and the two heat dissipation structures are respectively fixedly connected to the two side surfaces.
7. The power electronic conversion module of claim 1, wherein the second heat dissipation structure comprises copper or a copper alloy.
8. The power electronic conversion module of any of claims 1-7, wherein the first heat dissipation structure comprises a plurality of spaced-apart heat dissipation posts, and the cross-section of the heat dissipation posts comprises any one of a drop shape, a circle shape, an oval shape, and a long strip shape.
9. The power electronic conversion module of claim 8, wherein the surface of the heat-dissipating stud is further provided with one or more secondary heat-dissipating structures.
10. The power electronic conversion module of claim 9, wherein the secondary heat dissipation structure comprises a protrusion or a groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221456272.9U CN217387642U (en) | 2022-06-10 | 2022-06-10 | Power electronic conversion module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221456272.9U CN217387642U (en) | 2022-06-10 | 2022-06-10 | Power electronic conversion module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217387642U true CN217387642U (en) | 2022-09-06 |
Family
ID=83092321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221456272.9U Active CN217387642U (en) | 2022-06-10 | 2022-06-10 | Power electronic conversion module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217387642U (en) |
-
2022
- 2022-06-10 CN CN202221456272.9U patent/CN217387642U/en active Active
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