CN217387103U - Silicon material sample wafer cleaning lifting basket - Google Patents

Abstract

The utility model discloses a silicon sample wafer cleaning basket, which comprises two fixed plates, two silicon wafer supporting plates and a hand-held rod; the surfaces of the two fixed plates are oppositely arranged, first mounting holes corresponding to the positions of the two fixed plates are respectively formed in the tops of the two fixed plates, and the hand-held rod can be slidably mounted between the two fixed plates through the first mounting holes; each silicon wafer supporting plate is provided with a plurality of fixing grooves along the edges, the bottoms of the two fixing plates are respectively provided with a pair of second mounting holes, the two silicon wafer supporting plates can be inserted between the two fixing plates in a sliding mode through the corresponding second mounting holes, and the edges, provided with the fixing grooves, of the silicon wafer supporting plates are arranged upwards; the surface of each fixed plate is rotatably provided with an inserting plate movably clamped with the fixed groove.

Description

Silicon material sample wafer cleaning lifting basket

The technical field is as follows:

the utility model relates to a silicon chip washs the technique, concretely relates to silicon material sample wafer washs hand-basket.

Background art:

the common silicon wafer cleaning method comprises the steps of firstly smashing a silicon wafer into small pieces, then loading the small pieces into a basket, then putting the basket into a concentrated acid tank for corrosion, after acid cleaning, then putting the basket containing the small pieces into an overflow rinsing tank for quick rinsing, after quick rinsing, putting the basket containing the small pieces into an ultrasonic rinsing tank for cleaning, and in the process, manually stirring the small pieces in the basket to ensure the cleaning effect; and after cleaning, putting the basket containing the small sheets into an oven for hot air drying, weighing and packaging, and inspecting and leaving the factory.

However, the common silicon wafer cleaning method has many disadvantages: firstly, in the cleaning process, small pieces in the basket need to be stirred manually, so that the silicon wafers are abraded by impact, and the material loss and the quality of the silicon wafers are reduced. Secondly, manual stirring requires manpower and increases production cost. Thirdly, although manual stirring is used, small pieces are still easy to stack and stick together in a basket in the pickling process, the surfaces of some silicon wafers cannot be corroded by acid liquor, so that a plurality of silicon wafers cannot be pickled unqualifiely, impurities remain on the surfaces of the silicon wafers, and the manufactured semiconductor device has potential quality hazards; and the accumulation of small flakes can prolong the cleaning time, a large amount of water is needed for rinsing, the cleaning efficiency is low, the water resource waste is serious, the accumulation of small flakes can prolong the drying time, and the energy consumption is increased.

The utility model has the following contents:

an object of the utility model is to provide a silicon material sample wafer washs hand-basket has solved and has piled up easily, paste in the basket frame because of the small piece material and lead to the silicon chip pickling unqualifiedly together, and product quality is low, and the consumption of water is big when wasing the silicon chip, and the stoving time extension, the big problem of energy resource consumption.

The utility model discloses by following technical scheme implement: a silicon sample wafer cleaning lifting basket comprises two fixing plates, two silicon wafer supporting plates and a hand-held rod; the surfaces of the two fixed plates are oppositely arranged, first mounting holes corresponding to the positions of the tops of the two fixed plates are respectively formed in the tops of the two fixed plates, and the hand-held rod penetrates through the first mounting holes and is slidably mounted between the two fixed plates; each silicon wafer support plate is provided with a plurality of fixing grooves along the edge, the bottoms of the two fixing plates are respectively provided with a pair of second mounting holes, the two silicon wafer support plates can be inserted between the two fixing plates in a sliding mode through the corresponding second mounting holes, and the edge, provided with the fixing grooves, of each silicon wafer support plate faces upwards; and each plate surface of the fixed plate is rotatably provided with an inserting plate movably clamped with the fixed groove.

Preferably, the two fixing plates are arranged in parallel.

Preferably, two second mounting holes on each fixing plate are symmetrically arranged in a splayed manner.

Preferably, a through hole is formed in the middle of each fixing plate.

Preferably, the fixing groove is of an inverted triangular structure, and the bottom of the fixing groove is an acute angle.

Preferably, the distance between the two silicon wafer supporting plates and the groove bottoms of the fixing grooves is smaller than or equal to 150 mm.

Preferably, the fixing plate, the silicon wafer supporting plate, the hand-held rod and the inserting plate are all made of polypropylene or polyvinylidene fluoride.

The utility model has the advantages that: first, the utility model discloses can realize pickling, rinsing, the stoving of whole silicon chip, insert whole silicon chip and put in the fixed slot, make and keep the interval between silicon chip and the silicon chip, can avoid leading to silicon chip wearing and tearing, the problem of quality degradation because of collision friction between the silicon chip. Secondly, in the cleaning process, do not need the manual work to stir, practice thrift the human cost. And thirdly, the silicon wafers are not stacked and adhered together, so that the surfaces of all the silicon wafers can be guaranteed to be corroded by acid liquor, the qualified pickling is guaranteed, the qualification rate of semiconductor device products is improved, and the hidden danger of product quality is reduced. Fourthly, the surfaces of all the silicon wafers can be washed, so that the cleaning effect and the cleaning efficiency are improved, and the water consumption in the process of cleaning the silicon wafers is reduced; and the surfaces of all silicon wafers can be dried, so that the drying time is shortened, and the energy consumption is reduced. Fifth, the utility model discloses can be applicable to holding of circular silicon chip and square silicon chip simultaneously. Sixth, the utility model discloses an adjust the distance between the fixed plate, can control and wash the quantity that the basket held the silicon chip.

Description of the drawings:

in order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic view of an installation structure of the fixing plate and the insert plate in fig. 1.

The parts in the drawings are numbered as follows: the silicon chip fixing device comprises a fixing plate 1, a first mounting hole 1.1, a second mounting hole 1.2, a silicon chip supporting plate 2, a fixing groove 2.1, a portable rod 3, an inserting plate 4 and a through hole 5.

The specific implementation mode is as follows:

the technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "front", "rear", "top", "bottom", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

As shown in fig. 1-2, a silicon sample wafer cleaning basket comprises two fixing plates 1, two silicon wafer supporting plates 2 and a hand-held rod 3; the cleaning basket is made of polypropylene or polyvinylidene fluoride, and has the strong acid and alkali resistance; the surfaces of the two fixed plates 1 are oppositely and parallelly arranged, first mounting holes 1.1 corresponding to the positions of the tops of the two fixed plates 1 are formed in the tops of the two fixed plates 1 respectively, the hand-held rod 3 penetrates through the first mounting holes 1.1 to be slidably mounted between the two fixed plates 1, and the hand-held rod 3 is used for carrying baskets in a turnover manner; a plurality of fixing grooves 2.1 are formed in each silicon wafer supporting plate 2 along one edge, the fixing grooves 2.1 are used for inserting and placing silicon wafers, the silicon wafers are supported and limited, a pair of second mounting holes 1.2 are formed in the bottoms of the two fixing plates 1 respectively, two second mounting holes 1.2 in the fixing plates 1 are symmetrically arranged in a splayed shape, the two silicon wafer supporting plates 2 penetrate through the corresponding second mounting holes 1.2 respectively and can be slidably inserted between the two fixing plates 1, the edges of the silicon wafer supporting plates 2 with the fixing grooves 2.1 are arranged upwards, the number of the fixing grooves 2.1 in the lifting basket can be controlled by adjusting the distance between the two fixing plates 1, and the control of the silicon wafer containing number is realized; the middle part of each fixing plate 1 is provided with a through hole 5 for reducing the overall weight of the cleaning lifting basket. The fixing groove 2.1 is of an inverted triangular structure, the groove bottom of the fixing groove 2.1 is an acute angle, the stability of the fixing groove 2.1 of the inverted triangular structure is good, when the bottom of the silicon wafer is placed at the bottom of the fixing groove 2.1, the outer edge of the silicon wafer is placed at the lowest end of the inverted triangular structure, the moving space of the silicon wafer is small, and the stability of the silicon wafer is improved; the distance between the bottoms of the corresponding fixing grooves 2.1 of the two silicon wafer supporting plates 2 is less than or equal to 150mm, so that the silicon wafer supporting plates can be suitable for containing round silicon sample wafers with the diameters of 150 and 300mm, and can be suitable for containing square silicon sample wafers with the lengths of 150 and 300 mm; the fixed circle axle that is provided with on the face of every fixed plate 1, the epaxial picture peg 4 that rotates to be equipped with fixed slot 2.1 activity joint of circle, through rotating picture peg 4 joint in fixed slot 2.1, make the washing hand-basket keep firm.

The utility model can realize the acid washing, rinsing and drying of the whole silicon chip, and the whole silicon chip is inserted into the fixed groove 2.1, so that the silicon chip and the silicon chip are kept at intervals, and the problems of silicon chip abrasion and quality reduction caused by collision and friction between the silicon chips can be avoided; in the cleaning process, manual stirring is not needed, so that the labor cost is saved; the silicon wafers are not stacked and adhered together, the surfaces of all the silicon wafers can be guaranteed to be corroded by acid liquor, the qualified pickling is guaranteed, the qualification rate of semiconductor device products is improved, and the hidden danger of product quality is reduced; the surfaces of all silicon wafers can be washed, so that the cleaning effect and the cleaning efficiency are improved, and the water consumption in the process of cleaning the silicon wafers is reduced; and the surfaces of all silicon wafers can be dried, so that the drying time is shortened, and the energy consumption is reduced.

The working process is as follows: inserting a certain number of silicon wafers into the fixed grooves 2.1, movably clamping the inserting plates 4 in the corresponding fixed grooves 2.1, and then putting the cleaning basket containing the silicon wafers into a concentrated acid groove for corrosion; after the acid washing is finished, immersing the cleaning basket with the silicon wafer into an overflow rinsing tank, supplying cleaning liquid to the overflow rinsing tank and enabling the overflow rinsing tank to be in an overflow state, and quickly reducing the acid liquid concentration on the surface of the silicon wafer; then the cleaning basket with the silicon wafer is placed in an ultrasonic rinsing tank, ultrasonic rinsing is adopted, and the residual quantity of acid liquor or impurities on the surface of the silicon wafer is reduced again; and after rinsing, taking out the cleaning lifting basket, putting the cleaning lifting basket into an oven, drying the silicon wafer by utilizing hot air, crushing, weighing and packaging the silicon wafer after drying, and then inspecting and leaving the factory.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. A silicon sample wafer cleaning lifting basket is characterized by comprising two fixing plates, two silicon wafer supporting plates and a hand-held rod; the surfaces of the two fixed plates are oppositely arranged, first mounting holes corresponding to the positions of the tops of the two fixed plates are respectively formed in the tops of the two fixed plates, and the hand-held rod penetrates through the first mounting holes and is slidably mounted between the two fixed plates; each silicon wafer supporting plate is provided with a plurality of fixing grooves along the edge, the bottoms of the two fixing plates are respectively provided with a pair of second mounting holes, and the two silicon wafer supporting plates can be inserted between the two fixing plates in a sliding mode through the corresponding second mounting holes; and each plate surface of the fixed plate is rotatably provided with an inserting plate movably clamped with the fixed groove.

2. The silicon wafer cleaning basket of claim 1, wherein the two retaining plates are disposed parallel to each other.

3. The silicon wafer cleaning lifting basket according to claim 1, wherein the two second mounting holes of each fixing plate are symmetrically arranged in a splayed shape.

4. The silicon wafer cleaning basket according to claim 1, wherein a through hole is formed in the middle of each fixing plate.

5. The silicon wafer cleaning carrier as claimed in any one of claims 1 to 4, wherein the fixing groove has an inverted triangular structure, and the bottom of the fixing groove has an acute angle.

6. The silicon wafer cleaning lifting basket according to claim 5, wherein the distance between the bottoms of the two silicon wafer supporting plates corresponding to the fixing grooves is less than or equal to 150 mm.

7. The silicon wafer cleaning basket according to claim 6, wherein the fixing plate, the silicon wafer supporting plate, the lifting rod and the inserting plate are made of polypropylene or polyvinylidene fluoride.

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