CN217306536U

CN217306536U - Packaging structure

Info

Publication number: CN217306536U
Application number: CN202220216374.7U
Authority: CN
Inventors: 樊燕柳; 王斌; 蔡全华; 李勇
Original assignee: Suzhou Qingyue Optoelectronics Technology Co Ltd; Yiwu Qingyue Optoelectronic Technology Research Institute Co Ltd
Current assignee: Suzhou Qingyue Optoelectronics Technology Co Ltd; Yiwu Qingyue Optoelectronic Technology Research Institute Co Ltd
Priority date: 2022-01-26
Filing date: 2022-01-26
Publication date: 2022-08-26
Anticipated expiration: 2032-01-26

Abstract

The utility model relates to an electronic packaging technology field specifically discloses an encapsulation structure. The packaging structure comprises a substrate and a packaging sheet. The substrate comprises a display area and a non-binding area, and the non-binding area is arranged on the periphery of the display area; meanwhile, the packaging piece comprises a first area and a second area, wherein the first area corresponds to the display area, and the second area corresponds to the non-binding area; the non-binding area is provided with a lead, and the lead and the second area are arranged at intervals to form an accommodating cavity. The utility model discloses well hold the chamber and be used for holding the produced bubble between the regional and the non-binding district of second to when base plate and encapsulation piece encapsulate, the bubble that the lead wire part produced can flow in and hold the intracavity, and then has improved the encapsulation effect between base plate and the encapsulation piece, has improved the whole yield of product, and can make the product have better display effect.

Description

Packaging structure

Technical Field

The utility model relates to an electronic packaging technology field especially relates to an encapsulation structure.

Background

The substrate is a basic component of the display screen and may include an active display area and a non-active display area. Generally, in the mass production of display screens, in order to avoid the influence of the external environment on the display screens, a large substrate may be packaged by using a packaging sheet, and the large substrate is cut after packaging to obtain a plurality of substrates, where each substrate may correspond to one display screen.

When a newly developed OLED (Organic electroluminescent Display) product is in a sample stage, in order to save the cost of a jig, the jig of the previous model is used commonly, when the overall dimension of the new OLED product is smaller, a gap exists in a non-binding area between two substrates after typesetting, air in the gap cannot be removed when a large substrate and a packaging sheet are attached and packaged, and then a large number of bubbles appear in a wiring part of a screen body with the substrate, so that the reject ratio of the product is increased.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a packaging structure to there is the clearance in the non-binding district between two base plates after solving prior art typesetting, and the air in this part clearance can't be got rid of when large wafer base plate and encapsulation piece laminating encapsulation, and then makes the line portion of walking of the screen body that has this base plate appear a large amount of bubbles, leads to the problem that the product defective rate risees.

In order to achieve the purpose, the utility model adopts the following technical proposal:

the utility model provides a packaging structure, this packaging structure includes:

the substrate comprises a display area and a non-binding area, wherein the non-binding area is arranged on the periphery of the display area;

a packaging sheet including a first region and a second region, the first region corresponding to the display region and configured to package the display region; the second region corresponds to the non-binding region and is used for packaging the non-binding region; the non-binding region is provided with a lead, the lead and the second region are arranged at intervals to form an accommodating cavity, and the accommodating cavity is used for accommodating bubbles generated between the second region and the non-binding region.

As an alternative of the above package structure, the accommodating cavity includes a groove, and the second region of the package sheet is provided with the groove; the air bubbles can be discharged into the groove.

As an alternative of the above package structure, the above recess is provided in plural, and the plural recesses are provided around the above first region in a horizontal direction.

As an alternative of the above packaging structure, two adjacent grooves communicate with each other.

As an alternative to the above-mentioned package structure, the above-mentioned groove located at the edge position on the above-mentioned package sheet is communicated with the outside.

As an alternative to the above-mentioned package structure, the opening of the above-mentioned recess is rectangular or of a square-shaped.

As an alternative of the above package structure, the opening width of the groove may range from 1.5mm to 5 mm.

As an alternative of the above-mentioned package structure, the above-mentioned package structure further includes a package glue, and the above-mentioned package glue is disposed between the above-mentioned substrate and the above-mentioned package sheet, and is used for adhering the above-mentioned substrate and the above-mentioned package sheet.

As an alternative to the above-mentioned package structure, the package adhesive is disposed at a position close to the second area.

As an alternative of the above-mentioned package structure, the above-mentioned package adhesive is a UV adhesive.

The beneficial effects of the utility model are that:

the packaging structure comprises a substrate and a packaging sheet. The substrate comprises a display area and a non-binding area, and the non-binding area is arranged on the periphery of the display area; meanwhile, the packaging sheet comprises a first area and a second area, the first area corresponds to the display area and is used for packaging the display area, the second area corresponds to the non-binding area and is used for packaging the non-binding area, and then the packaging sheet can completely package the substrate so as to avoid the influence of the external environment on the substrate. The non-binding area is provided with a lead, the lead and the second area are arranged at intervals to form an accommodating cavity, and the accommodating cavity is used for accommodating bubbles generated between the second area and the non-binding area, so that when the substrate and the packaging sheet are packaged, the bubbles generated by the lead part can flow into the accommodating cavity, the packaging effect between the substrate and the packaging sheet is improved, the overall yield of products is improved, and the products can have a better display effect.

Drawings

Fig. 1 is a schematic structural diagram of a package structure according to an embodiment of the present invention;

fig. 2 is a top view of a package structure according to an embodiment of the present invention.

In the figure:

1. a substrate; 11. a display area; 12. a non-binding region; 13. a lead wire; 2. packaging the sheet; 21. a first region; 22. a second region; 221. a groove; 3. an accommodating chamber; 4. and (7) packaging the glue.

Detailed Description

The technical solutions of the present invention will be described more clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Where the terms "first position" and "second position" are two different positions, and where a first feature is "over", "above" and "on" a second feature, it is intended that the first feature is directly over and obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

The embodiment provides a package structure, which can realize the package of a package chip on a large substrate.

As shown in fig. 1-2, the package structure includes a substrate 1 and a package sheet 2. The substrate 1 comprises a display area 11 and a non-binding area 12, wherein the non-binding area 12 is arranged on the periphery of the display area 11; meanwhile, the packaging sheet 2 includes a first area 21 and a second area 22, the first area 21 corresponds to the display area 11 and is used for packaging the display area 11, the second area 22 corresponds to the non-binding area 12 and is used for packaging the non-binding area 12, and then the packaging sheet 2 can completely package the substrate 1 to avoid the influence of the external environment on the substrate 1. The non-binding area 12 is provided with the lead 13, the lead 13 and the second area 22 are arranged at intervals to form the containing cavity 3, the containing cavity 3 is used for containing bubbles generated between the second area 22 and the non-binding area 12, so that when the substrate 1 and the packaging piece 2 are packaged, the bubbles generated by the lead 13 can flow into the containing cavity 3, the packaging effect between the substrate 1 and the packaging piece 2 is improved, the overall yield of products is improved, and the products have a better display effect. Further, the encapsulating sheet 2 can encapsulate the plurality of substrates 1, and the substrates 1 are arranged in an array.

Specifically, the accommodating cavity 3 includes a groove 221, the groove 221 is formed in the second region 22 of the packaging sheet 2, and bubbles can be discharged into the groove 221, so that a large number of bubbles do not appear in the lead 13 portion of the substrate 1, and increase of product reject ratio caused by deterioration of packaging effect of the substrate 1 and the packaging sheet 2 is avoided. The packaging sheet 2 is manufactured through the film, and the groove 221 of the second region 22 is etched, so that the groove 221 is easily formed in the packaging sheet 2, the packaging sheet 2 is convenient and quick to process, and the reject ratio of products can be reduced at low cost. Further, the plurality of grooves 221 are arranged, and the plurality of grooves 221 are arranged around the first area 21 in the horizontal direction, so that bubbles in the non-binding area 12 around the substrate 1 and bubbles in the lead 13 part can be discharged into the grooves 221, the packaging effect between the substrate 1 and the packaging piece 2 is further improved, and the reject ratio of products is reduced. Meanwhile, the weight of the encapsulating sheet 2 can be reduced by forming the plurality of grooves 221, so that the encapsulating sheet 2 is convenient to transport, and the substrate 1 and the encapsulating sheet 2 are convenient to encapsulate. Optionally, two adjacent grooves 221 are communicated with each other, so that bubbles in the unbonded areas 12 of the plurality of substrates 1 and bubbles in the portions of the leads 13 can be uniformly distributed in the respective grooves 221 communicated with each other after being discharged into the grooves 221, and the problem that bubbles in a certain unbonded area 12 or bubbles in a certain portion of the leads 13 cannot be discharged into the grooves 221 as much as possible when the bubbles are too much is avoided. Further alternatively, the edge-positioned groove 221 of the encapsulating sheet 2 communicates with the outside, so that air bubbles can be discharged to the outside through the edge-positioned groove 221 of the encapsulating sheet 2.

Furthermore, the opening of the groove 221 is rectangular or square, the groove 221 with the rectangular opening or the groove 221 with the square opening can facilitate the discharge of bubbles, and meanwhile, the groove 221 is convenient to open, so that the opening difficulty of the groove 221 on the packaging sheet 2 is reduced. Of course, the opening of the groove 221 may have other shapes, and the embodiment is not particularly limited.

Optionally, the cross-section of the groove 221 is trapezoidal or rectangular or arcuate. Of course, the cross-section of the groove 221 may have other shapes. The opening width of the groove 221 ranges from 1.5mm to 5mm, when the opening width of the groove 221 is smaller than 1.5mm, the opening width of the groove 221 is too small, and bubbles in the non-binding region 12 of the packaging sheet 2 and bubbles in the lead 13 part cannot be timely discharged into the groove 221, so that a small amount of bubbles can be remained in the non-binding region 12 and the lead 13 part, and the yield of products is further influenced; when the opening width of the groove 221 is greater than 5mm, the opening width of the groove 221 is too large, and in the process of forming the groove 221 on the packaging sheet 2, the groove 221 is formed within the range of the first region 21 of the packaging sheet 2, so that the packaging effect of the first region 21 on the display region 11 of the substrate 1 is influenced; therefore, when the opening width of the groove 221 is in the range of 1.5mm to 5mm, the air bubbles can not be discharged into the groove 221 in time, and the packaging effect of the first region 21 on the substrate 1 can not be affected.

Further, the package structure further comprises a package adhesive 4, wherein the package adhesive 4 is arranged between the substrate 1 and the package sheet 2 and used for adhering the substrate 1 and the package sheet 2 to realize the package between the substrate 1 and the package sheet 2. Optionally, the packaging adhesive 4 is an Ultraviolet (UV) adhesive, and the UV adhesive can be converted from a liquid state to a fixed state under irradiation of the UV light, so that a worker can control curing of the UV adhesive according to a packaging condition between the substrate 1 and the packaging sheet 2, and a packaging effect between the substrate 1 and the packaging sheet 2 is improved. Further optionally, the packaging adhesive 4 is disposed at a position close to the second area 22, so that the packaging adhesive 4 can flow into the accommodating cavity 3, and release air between the unbound area 12 and the second area 22, thereby reducing the generation of air bubbles. Specifically, in the packaging process of the packaging adhesive 4 between the substrate 1 and the packaging sheet 2, part of the UV adhesive can overflow into the groove 221, so that the substrate 1 and the packaging sheet 2 are uniformly stressed, and the air bubbles in the non-binding region 12 and the lead 13 are released, thereby improving the overall yield of the product and improving the display effect of the product.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A package structure, comprising:

the substrate (1), the substrate (1) comprises a display area (11) and a non-binding area (12), and the non-binding area (12) is arranged on the periphery of the display area (11);

an encapsulating sheet (2), the encapsulating sheet (2) comprising a first area (21) and a second area (22), the first area (21) corresponding to the display area (11) for encapsulating the display area (11); the second region (22) corresponds to the unbound region (12) for encapsulating the unbound region (12); the non-binding area (12) is provided with a lead (13), the lead (13) and the second area (22) are arranged at intervals to form a containing cavity (3), and the containing cavity (3) is used for containing bubbles generated between the second area (22) and the non-binding area (12).

2. The encapsulation structure according to claim 1, characterized in that the housing cavity (3) comprises a groove (221), the second region (22) of the encapsulation sheet (2) being provided with the groove (221); the gas bubbles can be discharged into the groove (221).

3. The encapsulation structure according to claim 2, wherein the groove (221) is provided in plurality, and a plurality of the grooves (221) are provided around the first region (21) in a horizontal direction.

4. The package structure according to claim 3, wherein two adjacent grooves (221) are in communication with each other.

5. Packaging structure according to claim 4, characterized in that said groove (221) of said packaging sheet (2) at the edge position communicates with the outside.

6. The encapsulation structure according to claim 2, wherein the opening of the recess (221) is rectangular or square.

7. The package structure of claim 6, wherein the opening width of the groove (221) ranges from 1.5mm to 5 mm.

8. The package structure according to claim 1, further comprising a package adhesive (4), wherein the package adhesive (4) is disposed between the substrate (1) and the package sheet (2) for adhering the substrate (1) and the package sheet (2).

9. The encapsulation structure according to claim 8, wherein the encapsulation glue (4) is provided close to the second area (22).

10. The encapsulation structure according to claim 8, wherein the encapsulation glue (4) is a UV glue.