CN217293779U - Graphene heat conduction gasket with sandwich structure - Google Patents
Graphene heat conduction gasket with sandwich structure Download PDFInfo
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- CN217293779U CN217293779U CN202220696527.2U CN202220696527U CN217293779U CN 217293779 U CN217293779 U CN 217293779U CN 202220696527 U CN202220696527 U CN 202220696527U CN 217293779 U CN217293779 U CN 217293779U
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- heat dissipation
- heat
- sandwich structure
- gasket
- heat conduction
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Abstract
The utility model discloses a graphene heat-conducting gasket with a sandwich structure, which comprises an upper padding plate, a heat-conducting interlayer and a lower padding plate which are distributed and arranged from top to bottom in sequence; a plurality of first heat dissipation through grooves penetrate through the upper base plate in a rectangular array mode; a plurality of second heat dissipation through grooves penetrate through the lower base plate in a rectangular array mode; first heat dissipation leads to the groove with crisscross setting from top to bottom each other between the second heat dissipation leads to the groove, leads to the cooperation such as groove through first heat dissipation recess, first heat dissipation, second heat dissipation recess and second heat dissipation and can improve heat-conducting gasket's effective heat radiating area greatly, has improved radiating effect and the efficiency of gasket to the device that generates heat, and the heat conduction ability of heat-conducting gasket can be strengthened to the heat conduction intermediate layer.
Description
Technical Field
The utility model relates to an interface heat conduction material technical field, concretely relates to graphite alkene thermal gasket with sandwich structure.
Background
The heat conducting gaskets fill the air gap between the heat generating device and the heat sink or metal base, and their flexible and elastic characteristics enable them to be used to cover very uneven surfaces. Heat is conducted from the discrete device or the entire PCB to the metal housing or diffuser plate, thereby increasing the efficiency and life of the heat-generating electronic assembly. However, in the prior art, the effective heat dissipation area of the heat conduction gasket is small, which affects the heat dissipation effect and efficiency of the heating device.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to solve the above problems and provide a graphene thermal pad with a sandwich structure, which is intended to overcome the drawbacks of the prior art, and is described in detail below.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the utility model provides a graphene heat conduction gasket with a sandwich structure, which comprises an upper padding plate, a heat conduction interlayer and a lower padding plate which are distributed and arranged from top to bottom in sequence;
a plurality of first heat dissipation through grooves penetrate through the upper base plate in a rectangular array mode;
a plurality of second heat dissipation through grooves penetrate through the lower base plate in a rectangular array mode;
the first heat dissipation through grooves and the second heat dissipation through grooves are arranged in a staggered mode from top to bottom.
Preferably, the upper backing plate is provided with a plurality of criss-cross first heat dissipation grooves.
Preferably, the lower backing plate is provided with a plurality of second heat dissipation grooves which are criss-cross.
Preferably, the cross-sectional shapes of the first heat dissipation groove and the second heat dissipation groove are both isosceles trapezoids.
Preferably, the heat conduction interlayer is made of graphene heat conduction materials.
Preferably, the upper pad and the lower pad are made of a heat-conducting silica gel material.
Preferably, the outer side edges of the upper backing plate, the lower backing plate and the heat conduction interlayer are connected with each other in a pressing connection mode.
Has the advantages that: the effective heat dissipation area of the heat conduction gasket can be greatly improved through the cooperation of the first heat dissipation groove, the first heat dissipation through groove, the second heat dissipation through groove and the like, the heat dissipation effect and the efficiency of the gasket on a heating device are improved, and the heat conduction capability of the heat conduction gasket can be enhanced through the heat conduction interlayer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a front view of the present invention;
figure 2 is a top view of the present invention from figure 1;
fig. 3 is a bottom view of fig. 1 of the present invention;
fig. 4 is an enlarged view of a portion a of fig. 1 according to the present invention;
fig. 5 is a perspective view of fig. 1 according to the present invention.
The reference numerals are explained below: 1. an upper base plate; 2. a lower base plate; 3. a thermally conductive interlayer; 4. a first heat dissipation groove; 5. a first heat dissipation through groove; 6. a second heat dissipation groove; 7. and the second heat dissipation through groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1 to 5, the utility model provides a graphene thermal conductive gasket with a sandwich structure, which comprises an upper pad 1, a thermal conductive interlayer 3 and a lower pad 2, which are sequentially distributed from top to bottom; the upper cushion plate 1 and the lower cushion plate 2 are made of heat-conducting silica gel materials. The heat conduction interlayer 3 is made of graphene heat conduction materials. A plurality of first heat dissipation through grooves 5 are formed in the upper base plate 1 in a penetrating mode in a rectangular array mode; a plurality of second heat dissipation through grooves 7 are formed in the lower base plate 2 in a penetrating mode in a rectangular array mode; the first heat dissipation through grooves 5 and the second heat dissipation through grooves 7 are arranged in a staggered mode from top to bottom.
The upper backing plate 1 is provided with a plurality of criss-cross first heat dissipation grooves 4. The heat dissipation area of the upper padding plate 1 can be increased, and the heat dissipation effect and efficiency are improved.
The lower backing plate 2 is provided with a plurality of criss-cross second heat dissipation grooves 6. The heat dissipation area of the lower backing plate 2 can be increased, and the heat dissipation effect and efficiency are improved.
The cross section shapes of the first heat dissipation groove 4 and the second heat dissipation groove 6 are isosceles trapezoids.
The outer side edges of the upper padding plate 1, the lower padding plate 2 and the heat conduction interlayer 3 are connected with each other in a pressing connection mode. The direct contact among the upper padding plate 1, the lower padding plate 2 and the heat conduction interlayer 3 can be realized, and the influence on heat dissipation is avoided.
Adopt above-mentioned structure, during the use, fill the air gap between device and fin or the metal base that generates heat with this graphite alkene heat conduction gasket that has sandwich structure, in the use of gasket, along with the rising of temperature, offer some first heat dissipation logical groove 5 on the upper padding plate 1 and offer some second heat dissipation logical groove 7 on the lower bolster 2 and cooperate each other to realize greatly increased the heat radiating area of gasket, and upper padding plate 1 and lower bolster 2 are provided with heat conduction sandwich 3 between the two and can strengthen heat conduction gasket's heat conduction ability.
The effective heat dissipation area of the heat conduction gasket can be greatly improved through the cooperation of the first heat dissipation groove 4, the first heat dissipation through groove 5, the second heat dissipation groove 6, the second heat dissipation through groove 7 and the like, the heat dissipation effect and efficiency of the gasket on a heating device are improved, and the heat conduction capability of the heat conduction gasket can be enhanced through the heat conduction interlayer 3.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (7)
1. The utility model provides a graphite alkene heat conduction gasket with sandwich structure which characterized in that: comprises an upper backing plate (1), a heat conduction interlayer (3) and a lower backing plate (2) which are sequentially distributed from top to bottom;
a plurality of first heat dissipation through grooves (5) penetrate through the upper padding plate (1) in a rectangular array mode;
a plurality of second heat dissipation through grooves (7) penetrate through the lower backing plate (2) in a rectangular array mode;
the first heat dissipation through grooves (5) and the second heat dissipation through grooves (7) are arranged in a staggered mode from top to bottom.
2. The graphene thermal gasket with a sandwich structure according to claim 1, wherein: the upper padding plate (1) is provided with a plurality of criss-cross first heat dissipation grooves (4).
3. The graphene thermal gasket with a sandwich structure according to claim 2, wherein: and the lower backing plate (2) is provided with a plurality of second heat dissipation grooves (6) which are criss-cross.
4. The graphene thermal gasket with a sandwich structure according to claim 3, wherein: the cross section shapes of the first heat dissipation groove (4) and the second heat dissipation groove (6) are isosceles trapezoids.
5. The graphene thermal gasket with a sandwich structure according to claim 1, wherein: the heat conduction interlayer (3) is made of graphene heat conduction materials.
6. The graphene thermal gasket with a sandwich structure according to claim 1, wherein: the upper backing plate (1) and the lower backing plate (2) are made of heat-conducting silica gel materials.
7. The graphene thermal gasket with a sandwich structure according to claim 1, wherein: the outer side edges of the upper padding plate (1), the lower padding plate (2) and the heat conduction interlayer (3) are connected with one another in a pressing connection mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220696527.2U CN217293779U (en) | 2022-03-28 | 2022-03-28 | Graphene heat conduction gasket with sandwich structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220696527.2U CN217293779U (en) | 2022-03-28 | 2022-03-28 | Graphene heat conduction gasket with sandwich structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217293779U true CN217293779U (en) | 2022-08-26 |
Family
ID=82935576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220696527.2U Active CN217293779U (en) | 2022-03-28 | 2022-03-28 | Graphene heat conduction gasket with sandwich structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217293779U (en) |
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2022
- 2022-03-28 CN CN202220696527.2U patent/CN217293779U/en active Active
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