CN217280749U - Package substrate with built-in liquid cooling channel - Google Patents

Abstract

The embodiment of the utility model provides an it has packaging substrate of liquid cooling passageway to embed belongs to the packaging technology field, and packaging substrate includes: a liquid-cooled substrate, the liquid-cooled substrate comprising: a substrate body and a joint; the substrate main body includes: the liquid cooling device comprises a base material body, a liquid cooling channel and a plug, wherein the liquid cooling channel is positioned in the base material body; the liquid cooling channel is provided with an opening which is communicated with the outside; the joint is arranged on the opening; a packaging circuit disposed on the liquid-cooled substrate; the welding flux layer is positioned between the liquid cooling substrate and the packaging circuit, and the welding flux layer is connected with the liquid cooling substrate and the packaging circuit; the liquid cooling channels are provided with a plurality of liquid cooling loops, and the liquid cooling loops are mutually communicated to form a plane as an acting surface; and the liquid cooling loop acts on the solder layer and the packaging circuit in a surface form; the technical effect of improving the heat dissipation efficiency of the packaging substrate is achieved.

Description

Package substrate with built-in liquid cooling channel

Technical Field

The utility model relates to a packaging technology field especially relates to an it has packaging substrate of liquid cooling passageway to embed.

Background

With the high-speed development of the fields of new energy automobiles, new energy equipment, rail transit, smart grids, aerospace and the like, the power device module is used as a core component of electronic power equipment, and the function of the power device module directly influences the performance and value of the whole equipment. Therefore, chip manufacturers are actively improving the performance and parameters of chips, and the thermal power density per unit chip area on the package substrate is higher and higher, so that the requirements on corresponding heat dissipation systems are more and more strict.

The existing heat dissipation technology generally adopts a module air cooling or liquid cooling mode, namely a packaged substrate is fixed on a radiator or a liquid cooling plate by using heat conduction silicone grease and bolts, and then heat is transferred out by a fan or a liquid cooling medium under the liquid cooling plate. Because the performance of the conventional power chip is continuously improved, the integration level is higher and higher, the heat density in unit area is higher and higher, and the performance of the optimal performance of the chip is gradually limited due to the problem of heat dissipation bottleneck in the conventional air cooling and liquid cooling modes; some products continue to accumulate heat over time, eventually resulting in damage to the components.

Therefore, the technical problems of the prior art are as follows: the heat dissipation efficiency of the package substrate is poor.

Disclosure of Invention

The embodiment of the application provides a package substrate with a built-in liquid cooling channel, which solves the technical problem that the heat dissipation efficiency of the package substrate in the prior art is poor; the technical effect of improving the heat dissipation efficiency of the packaging substrate is achieved.

The embodiment of the application provides a built-in packaging substrate who has liquid cooling passageway, packaging substrate includes: a liquid-cooled substrate, the liquid-cooled substrate comprising: a substrate body and a joint; the substrate main body includes: the liquid cooling device comprises a base material body, a liquid cooling channel and a plug, wherein the liquid cooling channel is positioned in the base material body; the liquid cooling channel is provided with an opening which is communicated with the outside; the joint is arranged on the opening; a packaging circuit disposed on the liquid-cooled substrate; the welding flux layer is positioned between the liquid cooling substrate and the packaging circuit, and the welding flux layer is connected with the liquid cooling substrate and the packaging circuit; the liquid cooling channels are arranged in the shell, and are communicated with each other to form a liquid cooling loop with a plane acting surface; and the liquid cooling circuit acts on the solder layer and the package circuit in a surface form.

Preferably, the substrate body is a flat block, the area of the upper and lower surfaces of the substrate body is larger than the area of the side surface of the substrate body, and the openings of the liquid cooling passages are all arranged on the side surface of the substrate body.

Preferably, the packaged circuit is provided on one or both of the upper and lower surfaces of the base material body.

Preferably, a chip is arranged on the first surface of the packaging circuit, and the second surface of the packaging circuit is connected with the solder layer; and the first surface and the second surface are two opposite end surfaces.

Preferably, the base material is red copper, oxygen-free copper, super copper, copper-aluminum composite, copper diamond, aluminum diamond or copper shovel teeth.

Preferably, the solder layer is specifically a nano silver solder layer, a tin sheet layer, a high thermal conductivity tin paste layer or a brazing material layer.

Preferably, the packaging circuit is a DPC (differential copper-clad ceramic) or DBC (direct copper-clad ceramic) ceramic circuit board, a diamond circuit board or a SIC circuit board.

Preferably, the liquid cooling channel is divided into a first liquid cooling channel and a second liquid cooling channel; the first liquid cooling channels are arranged in two groups at intervals, and openings of the two groups of first liquid cooling channels are respectively connected with a connector for the liquid cooling medium to enter and exit; the second liquid cooling channel is communicated with the two groups of first liquid cooling channels, so that the liquid cooling medium moves in the substrate body.

Preferably, the second liquid cooling channels are provided with a plurality of groups, and the plurality of groups of second liquid cooling channels are arranged at intervals; and a plug is arranged on the opening of the second liquid cooling channel, and the opening of the second liquid cooling channel is sealed through the plug.

Preferably, a microstructure is machined in the liquid cooling channel.

One or more technical solutions in the embodiments of the present application have at least one or more of the following technical effects:

1. in the embodiment of the application, compared with the structure of the traditional packaging substrate, the novel packaging substrate is formed by welding the packaging circuit and the liquid cooling substrate through the solder layer, has the advantages of small thermal resistance, high heat conductivity coefficient and the like, can quickly conduct heat generated by a chip to the liquid cooling substrate, and forms surface-to-body diffusion of the heat; the built-in liquid cooling channel is designed in the liquid cooling substrate and is the same component, heat can be rapidly transmitted out through a liquid cooling medium in the liquid cooling channel through the connector, and the purpose of rapid heat dissipation is achieved, so that the chip can operate in a higher-power and lower-temperature environment, and higher product performance is achieved; the technical problem that the heat dissipation efficiency of the packaging substrate is poor in the prior art is solved; the technical effect of improving the heat dissipation efficiency of the packaging substrate is achieved.

2. In the embodiment of the application, the defect that the traditional substrate needs heat dissipation layer by layer is fundamentally overcome, the liquid cooling channel is directly designed in the cavity of the substrate main body, the thermal resistance of heat dissipation layer by layer in physical contact in the traditional packaging substrate is eliminated, and the liquid cooling packaging substrate has the advantages of short heat dissipation path, high heat dissipation speed and good heat dissipation effect, simultaneously realizes the characteristic of a double-sided packaging circuit, and can be used for packaging a super-high-power chip. Further still set up the microstructure in the liquid cooling passageway, increase the area of contact with the liquid cooling medium, increase the dwell time of liquid cooling medium, and let the velocity of flow of liquid cooling medium in the liquid cooling passageway more even stable.

Drawings

Fig. 1 is a schematic axial-direction structure diagram of a package substrate with a liquid cooling channel built therein according to an embodiment of the present disclosure;

FIG. 2 is an exploded view of the state of FIG. 1;

FIG. 3 is a perspective view of the state of FIG. 2;

FIG. 4 is a perspective view of the substrate body from above in the embodiment of the present application;

fig. 5 is a schematic view of an axial explosion structure of a package substrate with a liquid cooling channel built therein according to another embodiment.

Reference numerals: 100. a substrate main body; 110. a substrate body; 120. a liquid cooling channel; 120a, a first liquid cooling channel; 120b, a second liquid cooling channel; 121. a microstructure; 130. a plug; 200. a joint; 200a, a first joint; 200b, a second joint; 300. a solder layer; 400. and (6) packaging the circuit.

Detailed Description

The ordinal numbers used herein for the components, such as "first," "second," etc., are used merely to distinguish between the objects described, and do not have any sequential or technical meaning. The term "connected" and "coupled" as used herein includes both direct and indirect connections (couplings), unless otherwise specified. In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like are used in the orientations and positional relationships indicated in the drawings, which are based on the orientations and positional relationships indicated in the drawings, and are used for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

The embodiment of the application provides a built-in packaging substrate who has liquid cooling passageway, has the inside direct liquid cooling's of packaging substrate characteristics, and the heat dissipation route is short, and the thermal resistance is little, and the radiating rate is fast. And single-sided or double-sided circuit packaging is realized, the uniqueness of single-sided packaging of the traditional packaging substrate is eliminated, the packaging substrate is a novel packaging substrate form, a plurality of packaging chips are provided, and the packaging of ultra-high power chips can be realized. The characteristic of direct liquid cooling inside is to diffuse the heat energy generated by the chip on the circuit packaged on the surface of the substrate into a surface and a body, and the heat energy is rapidly taken away by the built-in liquid cooling channel system.

In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.

A package substrate having a liquid cooling channel disposed therein, the package substrate comprising, with reference to fig. 1-3 of the specification: the liquid-cooled substrate, the package circuit 400 and the solder layer 300, wherein the solder layer 300 is located between the liquid-cooled substrate and the package circuit 400, and the solder layer 300 connects the liquid-cooled substrate and the package circuit 400; the heat generated by the package circuit 400 is carried by the liquid-cooled substrate, so that the package circuit 400 can stably and efficiently operate.

Liquid cooling base plate, liquid cooling base plate includes: a substrate body 100 and a joint 200; the substrate main body 100 includes: the liquid cooling device comprises a substrate body 110, a liquid cooling channel 120 and a plug 130, wherein the liquid cooling channel 120 is positioned in the substrate body 110; the liquid cooling channel 120 has an opening, and the opening is communicated with the outside; the connector 200 is disposed on the opening.

A substrate body 100, the substrate body 100 comprising: the substrate body 110 and the liquid cooling channel 120; the liquid cooling channel 120 is disposed in the substrate body 110, and the liquid cooling channel 120 has at least one opening communicating with the exterior with respect to the substrate body 110; the plurality of liquid cooling channels 120 are provided, and the plurality of liquid cooling channels 120 are connected to each other to form a liquid cooling loop on the substrate 110.

The substrate body 110, referred to in the description of fig. 3, is adapted to absorb heat from a heat source module disposed thereon. The substrate 110 is a flat block, the area of the upper and lower surfaces of the substrate 110 is larger than the area of the side surface of the substrate 110, and the openings of the liquid cooling passages 120 are disposed on the side surface of the substrate 110, so as to obtain high heat conduction capability. It can be understood that the upper and lower surfaces of the substrate body 110 are used for connecting the heat source module, and further, in order to improve the heat conduction capability, the material of the substrate body 110 is preferably one of red copper, oxygen-free copper, super copper, copper-aluminum composite, copper diamond, aluminum diamond, or copper relieved tooth.

Regarding the manufacture of the substrate body 110 in a liquid-cooled substrate: for the unmachined substrate materials such as copper diamond, aluminum diamond and the like, the diamond particles with the highest heat conductivity coefficient in the nature which can be used at present are mixed with copper powder or aluminum powder and uniformly stirred according to a certain proportion, the mixture is placed into a special die with a channel structure to be sintered at high temperature, and then a closed liquid cooling substrate with an inlet channel and an outlet channel is welded by high-performance welding processes such as laser welding, vacuum welding, brazing and the like.

The liquid cooling channels 120, as described with reference to FIGS. 3-4, are used to create a channel for movement of a liquid cooling medium over the substrate body 110. The liquid cooling channels 120 are provided with a plurality of liquid cooling channels 120, and the plurality of liquid cooling channels 120 are mutually communicated to form a liquid cooling loop with a plane acting surface; and the liquid cooling circuit acts on the solder layer 300 and the package circuit 400 in the form of a surface. The cross-sectional shape of the liquid-cooled passage 120 may be circular, square, oval, or other shape. In one embodiment, the liquid cooling channels 120 are in a single opening pattern with respect to the substrate body 110, improving the sealing performance of the substrate body 100; the liquid cooling channel 120 is in a linear form relative to the substrate 110, so that the processing difficulty of the liquid cooling channel 120 is reduced, and the means of mechanical processing, laser processing, linear cutting and the like, particularly the drilling mode, can be conveniently adopted. Of course, the liquid cooling channels 120 may be formed in other manners, such as by bending, such as by twisting, as long as the cooling medium is kept in fluid communication.

It should be particularly noted that, in order to further improve the heat conduction capability of the liquid cooling channel 120, a microstructure 121 is processed in the liquid cooling channel 120, and the shape of the microstructure 121 is specifically a sheet, a block, a fin or a spiral; firstly, increase area of contact, secondly prolong the residence time of liquid cooling medium.

For the specific description of the liquid cooling passage 120, the liquid cooling passage 120 is divided into a first liquid cooling passage 120a and a second liquid cooling passage 120 b; wherein, the first liquid cooling channels 120a are arranged in two groups at intervals, and the openings of the two groups of first liquid cooling channels 120a are respectively connected with a connector 200 for the liquid cooling medium to enter and exit; the second liquid cooling channel 120b is connected to the two sets of first liquid cooling channels 120a, so that the liquid cooling medium moves in the substrate 110. Preferably, the second liquid cooling passages 120b are provided in multiple groups, and the multiple groups of second liquid cooling passages 120b are arranged at intervals; and a plug 130 is arranged on the opening of the second liquid cooling passage 120b, and the opening of the second liquid cooling passage 120b is sealed by the plug 130.

It can be understood that, criss-cross between first liquid cooling passageway 120a and the second liquid cooling passageway 120b, and the interval sets up between the multiunit second liquid cooling passageway 120b for the inside support point position evenly distributed of base plate main part 100 guarantees to process under the convenient condition, guarantees the structural strength of base plate main part 100.

A package circuit 400, the package circuit 400 being disposed on a liquid-cooled substrate, with reference to fig. 2 of the specification; the first surface of the package circuit 400 is provided with a chip, and the second surface of the package circuit 400 is connected with the solder layer 300; and the first surface and the second surface are two opposite end surfaces. The package circuit 400 is specifically a DPC, DBC ceramic circuit board, a diamond circuit board, or a SIC circuit board. It should be noted that, referring to fig. 5 in the specification, the package circuit 400 may be disposed on one end surface of the liquid-cooled substrate, or may be disposed on two opposite end surfaces of the liquid-cooled substrate in two groups.

The solder layer 300, the solder layer 300 is specifically a nano silver solder layer 300, a tin sheet layer, a high thermal conductivity tin paste layer or a solder material layer 300. The solder layer 300 is formed by soldering the package circuit 400 and the liquid-cooled substrate by a special process, such as bake-bonding or pressure-bonding.

The technical effects are as follows:

1. in the embodiment of the application, compared with the structure of the traditional packaging substrate, the novel packaging substrate is formed by welding the packaging circuit and the liquid cooling substrate through the solder layer, has the advantages of small thermal resistance, high heat conductivity coefficient and the like, and can quickly conduct heat generated by a chip to the liquid cooling substrate, so that the heat forms surface-to-body diffusion; the built-in liquid cooling channel is designed in the liquid cooling substrate and is the same component, heat can be rapidly transmitted out through a liquid cooling medium in the liquid cooling channel through the connector, and the purpose of rapid heat dissipation is achieved, so that the chip can operate in a higher-power and lower-temperature environment, and higher product performance is achieved; the technical problem that the heat dissipation efficiency of the packaging substrate is poor in the prior art is solved; the technical effect of improving the heat dissipation efficiency of the packaging substrate is achieved.

2. In the embodiment of the application, the defect that the traditional substrate needs to dissipate heat layer by layer is fundamentally overcome, the liquid cooling channel is directly designed in the cavity of the substrate main body, the thermal resistance of heat dissipation of physical contact layer by layer in the traditional packaging substrate is eliminated, the advantages of short heat dissipation path, high heat dissipation speed and good heat dissipation effect are achieved, the characteristic of a double-sided packaging circuit is realized, and the double-sided packaging circuit can be used for packaging a super-power chip. Further still set up the microstructure in the liquid cooling passageway, increase the area of contact with the liquid cooling medium, increase the dwell time of liquid cooling medium, and let the velocity of flow of liquid cooling medium in the liquid cooling passageway more even stable.

While the preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the invention.

It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (10)

1. A package substrate having a liquid cooling channel (120) built therein, the package substrate comprising:

a liquid-cooled substrate, the liquid-cooled substrate comprising: a substrate body (100) and a joint (200); the substrate body (100) comprises: the liquid cooling device comprises a substrate body (110), a liquid cooling channel (120) and a plug (130), wherein the liquid cooling channel (120) is positioned in the substrate body (110); the liquid cooling channel (120) is provided with an opening which is communicated with the outside; the joint (200) is arranged on the opening;

a package circuit (400), the package circuit (400) disposed on a liquid-cooled substrate; and

a solder layer (300), the solder layer (300) being positioned between the liquid-cooled substrate and the packaged circuit (400), and the solder layer (300) connecting the liquid-cooled substrate and the packaged circuit (400);

the liquid cooling channels (120) are provided with a plurality of liquid cooling channels (120), and the plurality of liquid cooling channels (120) are mutually communicated to form a liquid cooling loop with a plane acting surface; and the liquid cooling circuit acts on the solder layer (300) and the package circuit (400) in the form of a surface.

2. The package substrate of claim 1, wherein the substrate body (110) is a flat block, the area of the upper and lower surfaces of the substrate body (110) is larger than the area of the side surface of the substrate body (110), and the openings of the liquid cooling channels (120) are disposed on the side surface of the substrate body (110).

3. The package substrate according to claim 2, wherein the package circuit (400) is disposed on one or both of upper and lower surfaces of the substrate body (110).

4. The package substrate of claim 1, wherein a first side of the package circuit (400) is provided with a chip, and a second side of the package circuit (400) is connected to the solder layer (300); and the first surface and the second surface are two opposite end surfaces.

5. The package substrate according to claim 1, wherein the substrate body (110) is made of red copper, oxygen-free copper, super copper, copper aluminum composite, copper diamond, aluminum diamond, or copper relieved tooth.

6. The package substrate according to claim 1, wherein the solder layer (300) is in particular a nano-silver solder layer, a tin foil layer, a highly thermally conductive tin paste layer or a solder layer.

7. The package substrate of claim 1, wherein the package circuit (400) is particularly a DPC, DBC ceramic circuit board, a diamond film circuit board or a SIC circuit board.

8. The package substrate of claim 5, wherein the liquid cooling channel (120) is divided into a first liquid cooling channel (120a) and a second liquid cooling channel (120 b); wherein, the first liquid cooling channels (120a) are arranged in two groups at intervals, and the openings of the two groups of first liquid cooling channels (120a) are respectively connected with a joint (200) for the liquid cooling medium to enter and exit; the second liquid cooling channel (120b) is communicated with the two groups of first liquid cooling channels (120a) so that the liquid cooling medium moves in the substrate body (110).

9. The package substrate according to claim 8, wherein the second liquid-cooled passages (120b) are arranged in a plurality of groups, and the plurality of groups of second liquid-cooled passages (120b) are arranged at intervals; and a plug (130) is arranged on the opening of the second liquid cooling channel (120b), and the opening of the second liquid cooling channel (120b) is sealed through the plug (130).

10. The package substrate according to any of claims 1 to 9, wherein microstructures (121) are formed in the liquid cooling channel (120).

Images