CN217280745U

CN217280745U - Heat radiation module

Info

Publication number: CN217280745U
Application number: CN202221017073.8U
Authority: CN
Inventors: 廖伟成; 陈博轩; 陈俊宇
Original assignee: Lantian Computer Co ltd
Current assignee: Lantian Computer Co ltd
Priority date: 2022-04-11
Filing date: 2022-04-28
Publication date: 2022-08-23
Anticipated expiration: 2032-04-28
Also published as: TWM630356U

Abstract

A heat dissipation module includes a substrate, a heat dissipation unit, and an anti-overflow unit. The anti-overflow unit is arranged on one surface of the substrate, is sheet-shaped and is provided with a plurality of reticular holes. The anti-overflow unit is provided with a placing area and surrounds the placing area, and the heat dissipation unit is placed in the placing area. The capillary phenomenon caused by the plurality of reticular holes of the anti-overflow unit can effectively prevent the mainboard short circuit problem caused by overflow generated during phase change of the heat dissipation unit.

Description

Heat radiation module

Technical Field

The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module having a heat dissipation unit that can be changed into a liquid metal.

Background

At present, various common electronic components are designed toward miniaturization, and components such as a Central Processing Unit (CPU) or a Graphics Processing Unit (GPU) are prone to generate high heat in an actual operation process due to many factors such as miniaturization and performance improvement, thereby affecting the overall operation performance. Therefore, it is necessary to dissipate heat using a micro vapor chamber.

The existing heat dissipation module is arranged on the electronic component through the heat dissipation sheet, and then the fan unit is used for guiding airflow to conduct heat energy generated by the electronic component to the outside of the shell. However, because the components inside the casing are arranged closely, the heat generated by the heat source cannot be effectively discharged outside, which causes a temperature rise effect inside the casing, and in addition, under the vicious cycle of continuous heat accumulation, if the temperature inside the casing cannot be kept within a normal range, the operation reliability and the service life of the whole electronic device are affected, and the problems of electric leakage and over-frequency over-high temperature are caused.

In addition, in order to effectively improve the heat dissipation efficiency, a metal heat-conducting fin with a high heat dissipation coefficient is required. However, overflow generated when the metal heat-conducting fins change phases easily causes a short circuit problem of the motherboard, and the heat-radiating instability phenomenon is also caused by uneven heating positions of the heat source.

Although the prior art adopts the silicon substrate paste material around the heating source to prevent leakage or uses a glue dispensing method to solidify surrounding parts to prevent short circuit, the method consumes time and labor in production line and needs to fix glue dispensing equipment, thereby increasing cost and labor hour.

Therefore, how to improve the heat dissipation effect of the heat dissipation module by improving the structural design to overcome the above-mentioned defects has become an important issue to be solved by the industry.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a not enough heat radiation module that provides to prior art to promote heat radiation module's radiating effect and solve simultaneously and leak the problem.

In order to solve the above technical problem, the present invention provides a heat dissipation module, which includes a substrate, a heat dissipation unit and an anti-overflow unit. The anti-overflow unit is sheet-shaped and has a plurality of mesh holes. The anti-overflow unit is arranged on one surface of the substrate, a placing area is formed on the anti-overflow unit, the anti-overflow unit surrounds the placing area, and the heat dissipation unit is placed in the placing area. The substrate is placed on a heat source.

Preferably, the heat dissipation unit has a first state and a second state, the first state is a solid state, and the second state is a liquid state.

Preferably, the heat dissipation unit is formed by liquid metal or heat dissipation paste.

Preferably, when the heat dissipation unit is liquid metal in the first state, the outer edge of the anti-overflow unit has a first length and a first width, a sum of twice the first length and twice the first width defines a perimeter of the anti-overflow unit, the placement area has a second length and a second width, a sum of twice the second length and twice the second width defines a perimeter of the placement area, the liquid metal has a third length and a third width, a direction of the third length is parallel to a direction of the first length or a direction of the second length, a direction of the third width is parallel to a direction of the first width or a direction of the second width, and a perimeter of the anti-overflow unit is 1.66 times of the perimeter of the heat dissipation unit.

Preferably, the second length is 1 times the third length and the second width is 1.25 times the third width.

Preferably, the shape of the mesh holes may be circular, oval, triangular or polygonal, and the thickness of the anti-overflow unit is 0.15 mm.

Preferably, when the shape of the mesh holes is circular, the diameter of the mesh holes is 0.8 mm.

Preferably, the area ratio of the anti-overflow unit on the substrate is defined as an open area ratio, and the open area ratio is between 30% and 80%.

Preferably, the open porosity is 50%.

Preferably, the anti-overflow unit has a thickness of 100 to 120% of the thickness of the substrate.

The utility model discloses an one of them beneficial effect lies in, the utility model provides a heat dissipation module makes whole heat dissipation module design simplifications because of leading-in anti-overflow flows the unit. The problem of short circuit of the mainboard caused by overflow generated during phase change of the heat dissipation unit can be effectively prevented, and the phenomenon of unstable heat dissipation caused by uneven heating position of the heat source can be avoided. In addition, when a worker produces the heat dissipation module, the manufacturer can effectively reduce the equipment required by the production line, reduce the cost and shorten the assembly time due to the simplification of the design. And according to the requirement, replace liquid metal or thermal grease, make the use elasticity of the heat-dissipating module increase.

For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description and accompanying drawings, which are provided for reference and illustration purposes only and are not intended to limit the present invention.

Drawings

Fig. 1 is a top view of the heat dissipation module of the present invention.

Fig. 2 is a sectional view of a section II-II of the anti-overflow unit and the heat dissipation unit of fig. 1.

Fig. 3 is an enlarged schematic view of a portion III of fig. 2.

Fig. 4 is a schematic diagram of the heat dissipation unit of the heat dissipation module of the present invention in the first state.

Fig. 5 is a schematic diagram of the heat dissipation unit of the heat dissipation module of the present invention in the second state.

Detailed Description

The following is a description of the embodiments of the present invention disclosed in relation to the "heat dissipation module" by specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the disclosure of the present invention. The utility model discloses the concrete embodiment of accessible other differences is implemented or is used, and each item detail in this specification also can be based on different viewpoints and application, does not deviate from the utility model discloses a carry out various modifications and changes under the design. The drawings of the present invention are merely schematic illustrations, and are not drawn to scale, but are described in advance. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

Referring to fig. 1 to 5, the present invention provides a heat dissipation module 100, which includes: a substrate 10, a heat dissipation unit 20, and an anti-overflow unit 30. The substrate 10 is used for carrying the heat dissipation unit 20 and the overflow prevention unit 30, and the substrate 10 is disposed on a heat source 200.

It should be noted that the substrate 10 of the heat dissipation module 100 is attached to the heat source 200. The heat source 200 may be disposed on a carrier substrate (not shown), and the heat source 200 may be a Central Processing Unit (CPU), a Graphic Processing Unit (GPU), a Microcontroller (MCU), a Microprocessor (MPU), an Application Specific Integrated Circuit (ASIC), or other electronic components, which is not limited by the present invention.

The heat dissipating unit 20 may include a heat dissipating material with a high heat dissipation coefficient, and has a first state and a second state. For example, the first state may be a solid state, and the second state may be a liquid state, which is not limited by the present invention. When the heat dissipating unit 20 is heated, it is transformed from the first state to the second state. In a preferred embodiment, the heat dissipation unit 20 may be formed of liquid metal or heat dissipation paste.

The overflow preventing unit 30 is disposed on one surface of the substrate 10. The area ratio of the anti-overflow unit 30 on the substrate 10 is defined as an open area ratio, and the open area ratio of the anti-overflow unit 30 is 30% to 80%. In a preferred embodiment, the open area ratio of the anti-overflow unit 30 is 50%.

As shown in fig. 2 and 3, the anti-overflow unit 30 has a sheet shape and has a plurality of mesh holes 31. The overflow preventing unit 30 has an overflow preventing unit thickness T1 and the base plate 10 has a base plate thickness T2. The overflow prevention unit thickness T1 is between 0.1 millimeters (mm) and 0.3 mm, and in a preferred embodiment, the overflow prevention unit thickness T1 is 0.15 mm. The anti-overflow unit thickness T1 is 100% to 120% of the substrate thickness T2.

The anti-overflow unit 30 may be rectangular, circular, oval, triangular, or polygonal in shape. The present invention is not limited. As shown in fig. 4, in the case where the anti-overflow unit 30 has a rectangular shape, the outer edge of the anti-overflow unit 30 has a first length L1 and a first width W1, and a perimeter of the anti-overflow unit 30 is defined by the sum of twice the first length L1 and twice the first width W1.

The shape of the plurality of mesh holes 31 may be circular, oval, triangular or polygonal. The shapes of the mesh holes 31 of the overflow preventing unit 30 are not necessarily all the same. That is, a portion of the mesh holes 31 on the anti-overflow unit 30 may be circular, and another portion of the mesh holes 31 may be oval or have other shapes. The utility model does not limit the shape of the mesh holes 31.

Referring to fig. 3 again, when the mesh holes 31 are circular in shape, each mesh hole 31 has a mesh hole diameter R between 0.5 millimeters (mm) and 1 mm, and in a preferred embodiment, the mesh hole diameter R is 0.8 mm.

The overflow preventing unit 30 is formed with a placing area S, and the overflow preventing unit 30 surrounds the placing area S. That is, the placement area S does not have outward flow openings. The placing area S may be rectangular, triangular, circular or polygonal, and the placing area S may be changed according to actual situations, so the present invention is not limited. The heat dissipation unit 20 is placed in the placement area S.

As shown in fig. 4, in the case where the placement region S is rectangular, the placement region S has a second length L2 and a second width W2, and the sum of twice the second length L2 and twice the second width W2 is defined as the circumference of the placement region S.

When the heat dissipating unit 20 is the liquid metal in the first state, the shape of the liquid metal may be rectangular, triangular, circular or polygonal, which is not limited by the present invention. In the case of a rectangular liquid metal, the liquid metal has a third length L3 and a third width W3. The direction of the third length L3 may be parallel to the direction of the first length L1 or the direction of the second length L2; the third length L3 may not be parallel to the first length L1 or the second length L2. The direction of the third width W3 may be parallel to the direction of the first width W1 or the direction of the second width W2; the third width W3 may not be parallel to the first width W1 or the second width W2.

In a case where the direction of the third length L3 is parallel to the direction of the first length L1 or the direction of the second length L2, and the direction of the third width W3 is parallel to the direction of the first width W1 or the direction of the second width W2, wherein the circumference of the overflow preventing unit 30 is 1.66 times the circumference of the heat dissipating unit 20, the second length L2 is 1 time the third length L3, and the second width W2 is 1.25 times the third width W3.

As shown in fig. 4 and 5, fig. 4 shows the heat dissipating unit 20 being a liquid metal in the first state. When the heat dissipating unit 20 is heated and changes from the first state (shown in fig. 4) to the second state (shown in fig. 5), the overflow preventing unit 30 can effectively prevent the heat dissipating unit 20 in the second state from flowing outwards, and the heat dissipating unit 20 in the second state is absorbed in the plurality of mesh holes 31 and solidified through the capillary phenomenon caused by the plurality of mesh holes 31 of the overflow preventing unit 30. Therefore, when the heat dissipating unit 20 in the second state is melted and overflows, the capillary phenomenon caused by the plurality of mesh holes 31 of the overflow preventing unit 30 can effectively prevent the mainboard short circuit problem caused by the overflow of the heat dissipating unit 20, and the heat dissipating unit 20 in the second state can also avoid the unstable heat dissipation phenomenon caused by the uneven position of the heat source 200.

[ advantageous effects of the embodiments ]

The utility model discloses an one of them beneficial effect lies in, the utility model provides a heat dissipation module makes whole heat dissipation module design simplifications because of leading-in anti-overflow flows the unit. Not only can be through the capillary phenomenon that a plurality of netted holes of anti-overflow unit caused, effectively prevent the excessive and short circuit problem that leads to the mainboard that produces when the heat dissipation unit phase transition, can also avoid and the heat source position of generating heat inhomogeneous also can cause the heat dissipation unstability phenomenon. In addition, when workers produce the heat dissipation module, the design is simplified, so that manufacturers can effectively reduce equipment required by a production line, reduce cost and shorten assembly time. And the liquid metal or the heat dissipation paste is replaced according to the requirement, so that the use elasticity of the heat dissipation module is increased.

The above disclosure is only a preferred and practical embodiment of the present invention, and is not intended to limit the scope of the claims of the present invention, so that all the modifications of the equivalent technology made by the disclosure and drawings are included in the scope of the claims of the present invention.

Claims

1. A heat dissipation module, comprising:

a substrate;

a heat dissipation unit; and

the anti-overflow unit is sheet-shaped and is provided with a plurality of reticular holes;

the anti-overflow unit is arranged on one surface of the substrate, a placing area is formed on the anti-overflow unit, the anti-overflow unit surrounds the placing area, and the heat dissipation unit is placed in the placing area;

wherein the substrate is placed on a heat source.

2. The heat dissipating module of claim 1, wherein the heat dissipating unit has a first state and a second state, the first state is a solid state and the second state is a liquid state.

3. The heat dissipation module of claim 2, wherein the heat dissipation unit is formed of a liquid metal or a heat dissipation paste.

4. The heat dissipating module of claim 3, wherein when the heat dissipating unit is a liquid metal in the first state, the outer edge of the anti-overflow unit has a first length and a first width, two times the first length and two times the first width are added to define a perimeter of the anti-overflow unit, the placement region having a second length and a second width, twice the second length and twice the second width together defining a perimeter of the placement region, the liquid metal has a third length and a third width, the direction of the third length is parallel to the direction of the first length or the direction of the second length, the direction of the third width is parallel to the direction of the first width or the direction of the second width, and the perimeter of the anti-overflow unit is 1.66 times that of the heat dissipation unit.

5. The thermal module of claim 4, wherein the second length is 1 times the third length and the second width is 1.25 times the third width.

6. The heat dissipating module of claim 1, wherein the mesh holes are circular, oval, triangular or polygonal in shape, and the thickness of the overflow preventing unit is 0.15 mm.

7. The heat dissipating module of claim 6, wherein the mesh openings have a diameter of 0.8 mm when the mesh openings are circular in shape.

8. The heat dissipation module of claim 1, wherein an area ratio of the overflow preventing unit on the substrate is defined as an open area ratio, and the open area ratio is between 30% and 80%.

9. The heat dissipation module of claim 8, wherein the open area ratio is 50%.

10. The heat dissipation module of claim 1, wherein the overflow prevention unit thickness is 100% to 120% of the substrate thickness.