CN217160327U - Heat radiation structure for signal emitter - Google Patents
Heat radiation structure for signal emitter Download PDFInfo
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- CN217160327U CN217160327U CN202220423597.0U CN202220423597U CN217160327U CN 217160327 U CN217160327 U CN 217160327U CN 202220423597 U CN202220423597 U CN 202220423597U CN 217160327 U CN217160327 U CN 217160327U
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- heat
- substrate
- signal transmitter
- heat dissipation
- heat conduction
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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Abstract
The utility model provides a heat radiation structure for signal transmitter, which comprises a substrate, radiator unit and heat-conducting component, radiator unit includes a plurality of radiating blocks, each radiating block sets up respectively on a side of base plate, and the equidistance distributes between each radiating block, heat-conducting component includes at least one shields ring and a plurality of heat conduction boss, each heat conduction boss sets up respectively on the another side of base plate, be provided with the interval between each heat conduction boss, shield the ring and set up on that side that the base plate is close to the heat conduction boss, shield the ring and be used for around partial heat conduction boss. So, through setting up a plurality of heat conduction bosss with the position contact that generates heat with signal transmitter, can be used for and carry out radiating the condition to a plurality of signal transmitter, improve the radiating efficiency to each signal transmitter, the ring that shields that sets up moreover can be applied to when single signal transmitter dispels the heat, the inhomogeneous condition of each heat dissipation part position heat for the heat of each heat dissipation part position can not take place to interfere, thereby improves the radiating efficiency.
Description
Technical Field
The utility model relates to a technical field of fin especially relates to a heat radiation structure for signal transmitter.
Background
A base station, i.e., a common mobile communication base station, is a form of a radio station, which refers to a radio transceiver station for information transfer with a mobile phone terminal through a mobile communication switching center in a certain radio coverage area.
The base station transmits signals to the periphery through the signal transmitter. The signal emitter generates a large amount of heat during long-term operation, and in order to avoid temperature increase caused by heat accumulation, a corresponding heat sink needs to be installed on the signal emitter, so that the heat dissipation efficiency is improved.
However, the conventional heat sink has a problem that, in actual use, the heat absorbing surface of the conventional heat sink is adhered to the signal emitter through the heat conductive adhesive, but since the shapes of the signal emitters are different, when the heat sink is mounted to the plurality of signal emitters, the heat sink has a region where the heat sink is not closely attached to the signal emitter, and thus, the heat dissipation effect of the heat sink may be reduced. Secondly, because the heat at each position often all differs on the signal transmitter, but current fin is all laminated whole heat-absorbing surface and signal transmitter mutually, so, the position that leads to the heat many can conduct the position that the heat is low through the fin to can influence the radiating effect.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the weak point among the prior art, providing a heat radiation structure for signal transmitter, can laminate mutually with signal transmitter better, but also can realize the subregion heat conduction, consequently can effectively improve the radiating effect.
The purpose of the utility model is realized through the following technical scheme:
a heat dissipating structure for a signal emitter, comprising:
a substrate;
the radiating assembly comprises a plurality of radiating blocks, the radiating blocks are respectively arranged on one side surface of the substrate, and the radiating blocks are distributed at equal intervals; and
the heat conduction assembly comprises at least one shielding ring and a plurality of heat conduction bosses, the heat conduction bosses are respectively arranged on the other side face of the substrate, intervals are arranged among the heat conduction bosses, the shielding ring is arranged on the side face, close to the heat conduction bosses, of the substrate, and the shielding ring is used for surrounding part of the heat conduction bosses.
In one embodiment, each of the heat dissipation blocks and the substrate are in an integrally formed structure.
In one embodiment, a rounded portion is disposed on an end of the heat dissipation block away from the substrate.
In one embodiment, the thickness of the heat dissipation block gradually decreases away from the substrate.
In one embodiment, the heat dissipation structure for a signal transmitter further includes a fastening block disposed on the sidewall of the substrate, and the fastening block is provided with a locking hole.
In one embodiment, the fastening blocks are provided in plurality, and a space is provided between the fastening blocks.
In one embodiment, the inner side wall of the shielding ring and the bottom wall of the substrate jointly enclose a shielding groove.
In one embodiment, the heat dissipation structure for a signal transmitter further includes a positioning boss, the positioning boss is disposed on a side of the substrate away from the heat dissipation block, and the positioning boss extends in a direction away from the substrate.
In one embodiment, the height of the heat dissipation block is 8 mm-9 mm.
In one embodiment, the distance between any two adjacent radiating blocks is 4 mm-5 mm.
Compared with the prior art, the utility model discloses at least, following advantage has:
the utility model discloses a heat radiation structure for signal transmitter, which comprises a substrate, radiator unit and heat-conducting component, radiator unit includes a plurality of radiating blocks, each radiating block sets up respectively on a side of base plate, and the equidistance distributes between each radiating block, and heat-conducting component includes at least one shields ring and a plurality of heat conduction boss, and each heat conduction boss sets up respectively on the another side of base plate, is provided with the interval between each heat conduction boss, shields the ring and sets up on that side that the base plate is close to the heat conduction boss, shields the ring and is used for the heat conduction boss around the part. So, through setting up a plurality of heat conduction bosss with the position contact that generates heat with signal transmitter, can be used for and carry out radiating the condition to a plurality of signal transmitter, improve the radiating efficiency to each signal transmitter, the ring that shields that sets up moreover can be applied to when single signal transmitter dispels the heat, the inhomogeneous condition of each heat dissipation part position heat for the heat of each heat dissipation part position can not take place to interfere, thereby improves the radiating efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on these drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation structure for a signal transmitter according to an embodiment of the present invention;
fig. 2 is a schematic rear view of the heat dissipation structure for the signal transmitter shown in fig. 1;
FIG. 3 is a partially enlarged structural view of A of FIG. 1;
fig. 4 is a partial structural schematic view of the heat dissipation structure for the signal transmitter shown in fig. 1.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are illustrated in the accompanying drawings.
Referring to fig. 1 and 2, a heat dissipation structure 10 for a signal transmitter includes a substrate 100, a heat dissipation assembly 200 and a heat conduction assembly 300, wherein the heat dissipation assembly 200 includes a plurality of heat dissipation blocks 210, each heat dissipation block 210 is disposed on one side surface of the substrate 100, and the heat dissipation blocks 210 are distributed at equal intervals, the heat conduction assembly 300 includes at least one shielding ring 310 and a plurality of heat conduction bosses 320, each heat conduction boss 320 is disposed on the other side surface of the substrate 100, a space is disposed between the heat conduction bosses 320, the shielding ring 310 is disposed on the side surface of the substrate 100 close to the heat conduction bosses 320, and the shielding ring 310 is used for surrounding a part of the heat conduction bosses 320.
It should be noted that the substrate 100 is a plate-shaped structure, the heat dissipation assembly 200 is mounted on one side surface of the substrate 100, and the heat conduction assembly 300 is mounted on the other side surface of the substrate 100. The heat dissipation assembly 200 includes a plurality of heat dissipation blocks 210, wherein each heat dissipation block 210 is mounted on the substrate 100. In one embodiment, the heat dissipation blocks 210 and the substrate 100 are integrally formed, so as to ensure sufficient structural strength between the heat dissipation blocks 210 and the substrate 100, and facilitate heat conduction from the substrate 100 to the heat dissipation blocks 210 for heat dissipation. The heatsinks 210 are disposed at equal intervals, that is, the distance between any two neighboring heatsinks 210 is equal. Further, the heat conducting assembly 300 includes a shielding ring 310 and a plurality of heat conducting bosses 320. The heat conductive bosses 320 are respectively installed on the other side surface of the substrate 100, wherein a space is provided between the heat conductive bosses 320. Each shadow ring 310 and each heat-conducting boss 320 are located on the same side of the substrate 100, and at least one heat-conducting boss 320 is surrounded in each shadow ring 310. In one embodiment, each of the heat conductive bosses 320 is also integrally formed with the substrate 100. The shielding rings 310 are integrally formed with the substrate 100. In one embodiment, the substrate 100, the heat dissipation blocks 210, the shielding rings 310 and the heat conductive bosses 320 are made of metal, such as aluminum. This ensures sufficient heat transfer efficiency.
The structural principle of the heat dissipation structure 10 for a signal transmitter of the present application is explained below. When being used for dispelling the heat to a plurality of signal transmitter, because each signal transmitter's distance varies, each signal transmitter's the area that generates heat is also different moreover, during the use for all paste on every signal transmitter's the area that generates heat and be equipped with a plurality of heat conduction bosss 320, so, ensure that each heat conduction boss 320 homoenergetic is as heat-conducting part, thereby improve the radiating effect. And because the interval is provided with between each heat conduction boss 320, be favorable to the air to pass, further improve the radiating efficiency. When the heat dissipation structure 10 of the present application is applied to a single signal transmitter, each heating area can be independently limited in one shielding ring 310 through the plurality of shielding rings 310, so that heat transfer interference generated at positions with different heating areas with different heating values is avoided, and the heat dissipation effect can be further improved.
Referring to fig. 1 and 3, in an embodiment, a rounded portion 211 is disposed on an end of the heat slug 210 away from the substrate 100.
Since each heat dissipation block 210 is protruded from the substrate 100, the end of the heat dissipation block 210 away from the substrate 100 is provided with the rounded corner 211 with a curvature, so that the heat dissipation block 210 can be prevented from scratching the hand of an operator during installation and use, and the use safety of the heat dissipation structure 10 for a signal transmitter of the present application can be improved.
Referring to fig. 4, in an embodiment, the thickness D of the heat slug 210 gradually decreases away from the substrate 100.
It should be noted that, the thickness of the heat dissipation block 210 is set to be a gradual change structure, specifically, the thickness D of the heat dissipation block 210 gradually decreases along a direction away from the substrate 100, and correspondingly, the distance between the outer sidewalls of any two adjacent heat dissipation blocks 210 gradually increases, so as to facilitate heat dissipation and improve the heat dissipation effect of the heat dissipation structure 10 for a signal transmitter.
Referring to fig. 1 and 2, in an embodiment, the heat dissipation structure 10 for a signal transmitter further includes a fastening block 400, the fastening block 400 is disposed on a sidewall of the substrate 100, and the fastening block 400 is provided with a locking hole 410.
It should be noted that, in order to facilitate the installation of the heat dissipation structure 10 for the signal emitter, the fastening block 400 is installed at a side edge position of the substrate 100, wherein the fastening block 400 is provided with a locking hole 410. Thus, after the screw passes through the locking hole 410, the screw is screwed on the signal emitter, and the heat dissipation structure 10 for the signal emitter of the present application can be fixed on the signal emitter. In one embodiment, the fastening block 400 and the substrate 100 are integrally formed, so that the structural strength between the fastening block 400 and the substrate 100 can be improved. Avoiding the occurrence of cracks between the two. Further, in one embodiment, the fastening blocks 400 are provided in plurality, with a space provided between the fastening blocks 400. The provision of the plurality of fastening blocks 400 can improve the stability of the heat radiation structure 10 for a signal transmitter of the present invention when fastened.
Referring to fig. 2, in an embodiment, an inner sidewall of the shielding ring 310 and a bottom wall of the substrate 100 together define a shielding groove 311. It should be noted that, the shielding ring 310 is installed on the substrate 100, and the shielding ring 310 surrounds the heat conducting boss 320, so that when the heat dissipation structure is in use, the heat conducting boss 320 is attached to the heat generating portion of the signal transmitter, and the shielding ring 310 surrounds the heat generating portion of the signal transmitter, so that the heat of the signal transmitter is conducted to the substrate 100 through the heat conducting boss 320, and then is dissipated through the heat dissipation blocks 210. Therefore, the shielding groove 311 surrounded by the shielding ring 310 separates the heat-conducting boss 320 from the external heat-conducting boss 320, and can prevent the interference of the heat-generating parts of the signal transmitter.
Referring to fig. 2 and fig. 4, in an embodiment, the heat dissipation structure 10 for a signal transmitter further includes a positioning boss 500, the positioning boss 500 is disposed on a side of the substrate 100 away from the heat dissipation block 210, and the positioning boss 500 extends away from the substrate 100.
It should be noted that, in order to facilitate the installation of the heat dissipation structure 10 for a signal transmitter of the present application, that is, to enable the heat conduction boss 320 to be accurately attached to the heating portion of the signal transmitter, the positioning boss 500 is installed on the substrate 100, the positioning boss 500 is a structure protruding from the surface of the substrate 100, and accordingly a groove is formed on the signal transmitter, and when the heating structure of the present application is installed, the positioning boss 500 is inserted into the groove, so as to achieve rapid positioning. In one embodiment, the positioning bosses 500 are provided in plurality, and a space is provided between the positioning bosses 500. Thus, the plurality of positioning bosses 500 are utilized for common positioning, so that the installation convenience of the heat dissipation structure 10 for the signal transmitter can be further improved.
Referring to fig. 4, in an embodiment, the height E of the heat dissipation block 210 is 8mm to 9 mm. For example, the height E of the heat slug 210 may also be 8.2mm, or 8.4mm, or 8.6mm, or 8.8 mm. Further, in an embodiment, the distance F between any two adjacent heat dissipation blocks 210 is 4mm to 5 mm. For example, the distance F between any two heatsinks 210 may also be 4.2mm, or 4.4mm, or 4.6mm, or 4.8 mm. So, set up the radiating block 210 and have sufficient height to have sufficient distance between two arbitrary adjacent radiating blocks 210, can improve radiating block 210's radiating efficiency, and the structure that the thickness D of cooperation radiating block 210 reduces toward the direction of keeping away from base plate 100 gradually can further improve the radiating effect of the heat radiation structure of this application.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A heat dissipating structure for a signal transmitter, comprising:
a substrate;
the radiating assembly comprises a plurality of radiating blocks, the radiating blocks are respectively arranged on one side surface of the substrate, and the radiating blocks are distributed at equal intervals; and
the heat conduction assembly comprises at least one shielding ring and a plurality of heat conduction bosses, the heat conduction bosses are respectively arranged on the other side face of the substrate, intervals are arranged among the heat conduction bosses, the shielding ring is arranged on the side face, close to the heat conduction bosses, of the substrate, and the shielding ring is used for surrounding part of the heat conduction bosses.
2. The heat dissipating structure for a signal transmitter as claimed in claim 1, wherein each of the heat dissipating blocks is integrally formed with the substrate.
3. The heat dissipation structure for a signal transmitter as claimed in claim 1 or 2, wherein a rounded portion is provided on an end of the heat dissipation block remote from the substrate.
4. The heat dissipating structure for a signal transmitter as claimed in claim 1, wherein the thickness of the heat slug is gradually decreased in a direction away from the substrate.
5. The heat dissipation structure for a signal transmitter as claimed in claim 1, further comprising a fastening block, wherein the fastening block is disposed on the sidewall of the substrate, and the fastening block has a locking hole.
6. The heat dissipation structure for a signal transmitter as claimed in claim 5, wherein the fastening block is provided in plurality with a space provided therebetween.
7. The heat dissipation structure for signal emitters as claimed in claim 1, wherein the inner sidewall of the shielding ring and the bottom wall of the substrate together define a shielding groove.
8. The heat dissipation structure for signal emitters as claimed in claim 1, further comprising a positioning protrusion disposed on a side of the substrate away from the heat slug, wherein the positioning protrusion extends away from the substrate.
9. The heat dissipation structure for signal emitters, as claimed in claim 1, wherein the height of the heat slug is 8mm to 9 mm.
10. The heat dissipation structure for a signal transmitter as claimed in claim 1 or 9, wherein a distance between any adjacent two of the heat dissipation blocks is 4mm to 5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220423597.0U CN217160327U (en) | 2022-02-28 | 2022-02-28 | Heat radiation structure for signal emitter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220423597.0U CN217160327U (en) | 2022-02-28 | 2022-02-28 | Heat radiation structure for signal emitter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217160327U true CN217160327U (en) | 2022-08-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220423597.0U Active CN217160327U (en) | 2022-02-28 | 2022-02-28 | Heat radiation structure for signal emitter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217160327U (en) |
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2022
- 2022-02-28 CN CN202220423597.0U patent/CN217160327U/en active Active
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