CN217157233U - Heat dissipation component and electronic equipment - Google Patents
Heat dissipation component and electronic equipment Download PDFInfo
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- CN217157233U CN217157233U CN202220245241.2U CN202220245241U CN217157233U CN 217157233 U CN217157233 U CN 217157233U CN 202220245241 U CN202220245241 U CN 202220245241U CN 217157233 U CN217157233 U CN 217157233U
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Abstract
The application relates to a heat dissipation part and electronic equipment, the heat dissipation part includes fibrous layer and the graphite alkene layer that adopts the raw and other materials of foam structure to make, along the thickness direction of heat dissipation part, the first contact surface of graphite alkene layer and the second contact surface contact of fibrous layer and be connected through the mode of vacuum hot pressing. Support graphene layer through the fibrous layer, can promote the bulk rigidity of heat-dissipating part under the thinner condition of thickness of heat-dissipating part to reduce the possibility that heat-dissipating part takes place deformation in installation and use.
Description
Technical Field
The present application relates to the field of heat exchange technology, and in particular, to a heat dissipation member and an electronic device.
Background
With the development of technology, electronic devices such as mobile phones, tablet computers, and notebook computers have become communication devices commonly used by people, electronic elements such as processors in the electronic devices generate heat during use, which causes an increase in ambient temperature around the electronic elements, thereby affecting the electronic elements and causing a decrease in working efficiency, in order to improve the heat dissipation efficiency of the electronic devices, graphene films are generally provided to guide out the heat generated by the electronic elements, however, since the graphene films have low rigidity, creases are easily generated during assembly, which may affect the heat dissipation efficiency of the graphene films.
SUMMERY OF THE UTILITY MODEL
The application provides a heat dissipation component and an electronic device, which are used for improving the rigidity of the heat dissipation component.
The application provides a heat dissipation part, the heat dissipation part includes:
the structure of the raw material of the graphene layer is a foam structure;
a fibrous layer;
wherein, follow the thickness direction of heat dissipation part, graphite alkene layer with the fibrous layer sets gradually, graphite alkene layer with one side that the fibrous layer is adjacent has first contact surface, the fibrous layer with one side that the graphite alkene layer is adjacent has the second contact surface, first contact surface with the contact of second contact surface, just graphite alkene layer with fibrous layer hot pressing connects.
Can support graphite alkene layer through setting up the fibrous layer to improve the bulk rigidity of heat dissipation part, the graphite alkene layer of foam structure is convenient for carry out the hot pressing, and the effort between graphite alkene layer and the fibrous layer can be improved in the hot pressing, improves joint strength.
In one possible embodiment, the area of the fiber layer is not smaller than the area of the graphene layer.
This design is advantageous in improving the rigidity of the heat dissipation member.
In one possible embodiment, the area of the graphene layer is not smaller than the area of the fiber layer.
The design can be beneficial to improving the heat conduction efficiency of the heat dissipation component.
In one possible embodiment, the fibrous layer includes fiber filaments extending along a length of the heat dissipation member.
The graphene layer can be supported in the length direction by arranging the fiber yarns extending in the length direction.
In one possible embodiment, the fiber layer includes fiber filaments extending in a width direction of the heat dissipation member.
The graphene layer can be supported in the width direction by providing the fiber yarns extending in the width direction.
In a possible embodiment, the fiber layer comprises a first fiber filament and a second fiber filament, the first fiber filament and the second fiber filament are connected, and an included angle is formed between the first fiber filament and the second fiber filament.
The strength of the fiber layer can be changed by setting the fiber yarns with the included angles, and the designated positions are enhanced, so that the supporting effect of the fiber layer on the graphene layer is improved, and the rigidity of the heat dissipation part is improved.
In one possible embodiment, the first fiber filaments and the second fiber filaments are perpendicular to each other.
The design is favorable for improving the supporting effect of the fiber layer on the graphene layer.
In one possible embodiment, the heat dissipation member includes a plurality of graphene layers and a plurality of fiber layers, and the graphene layers and the fiber layers are spaced apart from each other.
The rigidity and the heat conducting capacity of the heat dissipation part can be improved through the design.
In one possible embodiment, the thickness of the heat dissipation member is not less than 0.02 mm.
When the thickness of the heat dissipation unit is too low, the thickness of the graphene layer 1 and the fiber layer 2 is too thin, so that the heat conduction capability of the heat dissipation unit is reduced, and meanwhile, the structural strength is low, so that the heat dissipation effect cannot be achieved, and the deformation is easy to occur in the installation process. Under the general condition, the thickness of heat dissipation part can be 0.02 millimeter to 1 millimeter, through being that the thickness of heat dissipation part is in 0.02 millimeter to 1 millimeter can have better rigidity in the heat dissipation part, still have better heat-sinking capability to and thinner thickness, when heat dissipation part is applied to electronic equipment such as cell-phone, flat board, be favorable to electronic equipment miniaturization, frivolous design, accord with actual user demand more.
The application also provides an electronic device, which comprises a heat dissipation component, wherein the heat dissipation component is any one of the heat dissipation components.
The application relates to a heat dissipation part and electronic equipment, the heat dissipation part includes fibrous layer and the graphite alkene layer that adopts the raw and other materials of foam structure to make, along the thickness direction of heat dissipation part, the first contact surface of graphite alkene layer and the second contact surface contact of fibrous layer and be connected through the mode of vacuum hot pressing. Support graphene layer through the fibrous layer, can promote the bulk rigidity of heat-dissipating part under the thinner condition of thickness of heat-dissipating part to reduce the possibility that heat-dissipating part takes place deformation in installation and use.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
Fig. 1 is a schematic structural view of a heat dissipation member provided in the present application;
FIG. 2 is an exploded view of FIG. 1;
fig. 3 is a schematic process flow diagram of a heat dissipation member provided in the present application.
Reference numerals:
1-a graphene layer;
11-a first contact surface;
2-a fibre layer;
21-a second contact surface;
22-a first filament;
23-a second filament;
and 3, a heat dissipation unit.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
Detailed Description
For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.
With the development of the technology, electronic devices such as mobile phones, tablet computers, and notebook computers have become communication devices commonly used by people, the electronic devices usually include electronic components such as processors, and the electronic components generate heat during use, and the heat is easily accumulated around the electronic components, which causes the temperature of the environment where the electronic components are located to rise, the work of the electronic components is affected, the work efficiency is reduced, and the electronic devices are prone to hot spot failure. In order to dissipate heat from electronic components, heat exchanger devices such as Heat Pipes (HP), Vapor Chambers (VC), Loop Heat Pipes (LHP) are generally installed in electronic devices, but the heat exchanger devices described above can improve heat dissipation efficiency of the electronic devices, but have disadvantages such as large thickness, large volume, heavy weight, and high cost, and are not favorable for development of light weight, thinness, and miniaturization of the electronic devices. Compared with the heat exchange device, the graphene heat dissipation film has relatively small thickness while having relatively good heat conductivity, and the graphene heat dissipation film is adopted as the heat exchange device of the electronic equipment, so that heat of each electronic element can be dissipated, and the thickness of the electronic equipment can be reduced.
Based on this, the embodiment of the application provides a heat dissipation component and an electronic device, which are used for improving the rigidity of the heat dissipation component.
As shown in fig. 1 and 2, the present embodiment provides a heat dissipation component, wherein the heat dissipation component may include a graphene layer 1 and a fiber layer 2. The structure of the raw material of the graphene layer 1 is a foam structure, for example, the graphene layer 1 may be a graphene foam film. The fiber layer 2 may be carbon fiber cloth woven by carbon fiber. Along the thickness direction Z of heat dissipation part, graphite alkene layer 1 and fibrous layer 2 set gradually, and wherein graphite alkene layer 1 mainly used conducts heat, and fibrous layer 2 is used for supporting graphite alkene layer 1. Graphene layer 1 has first contact surface 11 with the adjacent one side of fibrous layer 2, and fibrous layer 2 has second contact surface 21 with the adjacent one side of graphene layer 1, and first contact surface 11 contacts with second contact surface 21 to through the mode of vacuum hot pressing so that fibrous layer 2 and graphene layer 1 interconnect.
During processing, the fiber layer 2 is placed on the graphene layer 1, and the graphene layer is placed in a high-temperature vacuum furnace at a vacuum degree of 10 -3 P～10 2 And pressing the graphene layer 1 and the fiber layer 2 by using a hot-pressing die with the pressure intensity not lower than 30MPa under the conditions of Pa and the furnace temperature of more than 1500 ℃ to form a structural plate with the laminated graphene layer 1 and the fiber layer 2, wherein the high temperature can promote the surfaces of the graphene layer 1 and the fiber layer 2 of the foam structure to form Van der Waals force in the hot-pressing process, and form mechanical engagement force under the action of pressure to finally form the composite plate of the graphene layer 1 and the fiber layer 2. Specifically, when hot pressing, all carry out vacuum hot pressing to the contact site of graphite alkene layer 1 and fibrous layer 2, all carry out vacuum hot pressing to the contact site and can effectively improve fibrous layer 2 and graphite alkene layer 1's connection stability, reduce the possibility that the layering appears between the two. Compared with the mode of connecting by adopting chemicals, adhesives and the like, the vacuum hot pressing can shorten the process time, simplify the processing process and reduce the pollution while improving the efficiency. More accords with the actual use requirement.
Adopt foam structure's graphite alkene layer 1 can be convenient for carry out vacuum hot pressing to graphite alkene layer 1 and fibrous layer 2, the scheme that directly puts into graphite alkene and carbon fiber into the roll squeezer and carry out the pressfitting need put into graphite alkene and carbon fiber respectively earlier and carry out the preforming with man-hour, put into the roll squeezer and carry out the pressfitting, and vacuum hot pressing's operation flow is simpler, and can not change the processing equipment midway, off-the-shelf quality is better simultaneously, graphite alkene layer 1 is great with fibrous layer 2's area of contact, can form mechanical interlock cohesion, the bulk rigidity of heat dissipation part obtains promoting.
Through carrying out vacuum hot pressing with graphite alkene layer 1 and fibrous layer 2, form composite board, so that fibrous layer 2 can support graphite alkene layer 1, thereby improve the overall structure intensity of heat dissipation part, so that heat dissipation part can be under the condition that has better heat-sinking capability, better rigidity still has, the whole thickness of heat dissipation part is thinner simultaneously, when being applied to electronic equipment with heat dissipation part, influence is less to electronic equipment's whole thickness, be favorable to electronic equipment to miniaturize, the frivolousization design, accord with actual user demand more.
Compared with the existing heat exchanger parts such as HP, VC and LHP, the graphene layer 1 adopted as the heat conducting component has the advantages of being thin in thickness, small in size, light in weight and the like, and the horizontal plane heat conductivity of the graphene material exceeds 1000W/(K.m), so that the graphene heat exchanger part is more in line with actual use requirements. And in general, heat exchanger parts such as HP, VC, LHP and the like are connected and sealed by a cover plate and a copper pipe, the materials are copper and copper alloy, stainless steel, titanium and titanium alloy, aluminum-grade aluminum alloy or composite materials such as steel-copper composite, aluminum-copper composite and the like, the density is more than 2.5g/cm ^3, the density of graphene is 1.8g/cm ^3, the weight reduction of the heat dissipation part is facilitated, and the weight reduction effect can exceed 30% according to actual detection.
In the scheme of current adoption graphite alkene material, the scheme of addding the sheet metal is usually adopted in order to improve the structural strength of graphite alkene material, but such design not only has increased the weight of the heat dissipation module that graphite alkene material made and need add the adhesive alone when carrying out modes such as bonding, lead to the cost to increase, because sheet metal and graphite alkene material are different producer processing, dimensional tolerance appears easily in addition, lead to the yield reduction of the heat dissipation module that constitutes, and the loss still appears easily in the transportation, lead to the cost to increase.
In one possible embodiment, the area of the fiber layer 2 is not smaller than the area of the graphene layer 1.
Through such design can be favorable to improving fibrous layer 2 to the supporting effect of graphite alkene layer 1, reduce because of graphite alkene layer 1's rigidity is not enough, lead to the heat dissipation part to appear warping in installation, use, lead to the possibility that the radiating effect descends.
In one possible embodiment, the area of the graphene layer 1 is not smaller than the area of the fiber layer 2.
Through such design, be favorable to increasing the area of graphite alkene layer 1, consequently be favorable to promoting the radiating effect of heat dissipation part.
When processing, can adjust the area of graphite alkene layer 1 and fibrous layer 2 according to the size of the heat dissipation part of actual required, for example, can make the area of the two all be greater than predetermined area, after the hot pressing, tailor composite board to make fibrous layer 2 and graphite alkene layer 1's area equal. When the area of the graphene layer 1 is larger than that of the fiber layer 2, the rigidity of the edge of the heat dissipation member is low, and deformation is likely to occur. When graphite alkene layer 1's area is less than fibrous layer 2, because fibrous layer 2's heat conductivility is relatively poor, consequently, lead to the not position radiating effect who sets up graphite alkene layer 1 of heat dissipation part to descend, and then influence holistic radiating effect, therefore, it is preferred, tailor composite board after processing, so that fibrous layer 2 and graphite alkene layer 1's area equals, when having better heat conductivility, still have better rigidity, it is less to take place the possibility of deformation when equipment and use, accord with actual user demand more.
In one possible embodiment, the fiber layer 2 includes fiber filaments, which may extend in the length direction X of the heat dissipation member.
The graphene layer 1 can be supported by the fiber layer 2 along the longitudinal direction X of the heat dissipation member by providing the fiber filaments extending along the longitudinal direction X.
In one possible embodiment, the fiber layer 2 includes fiber filaments, and the fiber filaments may extend in the width direction Y of the heat dissipation member.
The provision of the fiber yarn extending in the width direction Y allows the fiber layer 2 to support the graphene assembly 1 in the width direction Y of the heat dissipation member.
In one possible embodiment, as shown in fig. 3, the fiber layer 2 may include a first fiber filament 22 and a second fiber filament 23, the first fiber filament 22 and the second fiber filament 23 are connected, and an included angle is formed between the first fiber filament 22 and the second fiber filament 23.
Can promote the holistic structural strength of fibrous layer 2 through the cellosilk that sets up a plurality of not equidirectionals of edge to promote fibrous layer 2 to the supporting effect of graphite alkene layer 1. The contained angle of first cellosilk 22 and second cellosilk 23 can set up according to actual demand to change the structural strength of fibrous layer 2 different positions, thereby improve the structural strength of fibrous layer 2 assigned position, thereby promote the holistic rigidity of heat dissipation part.
In one possible embodiment, as shown in fig. 3, the first filaments 22 and the second filaments 23 are perpendicular to each other.
This design is advantageous for increasing the overall structural strength of the fibre layer 2. Taking the angle of the fiber filaments with respect to the length direction X of the heat dissipation member as an example, the inclination angles of the first fiber filaments 22 and the second fiber filaments 23 may be a combination of 0 degree and 90 degrees, 45 degrees and 135 degrees, and the inclination angles of the first fiber filaments 22 and the second fiber filaments 23 with respect to the length direction X of the heat dissipation member may be set according to practical circumstances, including but not limited to the above-mentioned angle combinations.
As shown in fig. 3, in one possible embodiment, the heat dissipation member includes a plurality of graphene layers 1 and a plurality of fiber layers 2, and the graphene layers 1 and the fiber layers 2 are disposed to be spaced apart from each other.
When the heat dissipation part includes a plurality of graphene layers 1 and a plurality of fibrous layers 2, along the thickness direction Z of the heat dissipation part, one layer of graphene layers 1, one layer of fibrous layers 2 can be set in order. The arrangement mode can improve the rigidity of the heat dissipation part and has a good heat dissipation effect. When the heat dissipation part is provided with a plurality of graphite alkene layers 1 and only sets up a fibrous layer 2, make multilayer graphite alkene layer 1 through a fibrous layer 2 promptly, support that graphite alkene layer 1 adjacent with fibrous layer 2 did not receive is less, leads to the bulk rigidity of heat dissipation part lower, appears local deformation easily in the use, influences the heat-sinking capability of heat dissipation part. When having a plurality of fibrous layer 2 between adjacent graphite alkene layer 1, though the rigidity of heat dissipation part obtains effectively promoting, the distance between adjacent graphite alkene layer 1 increases, leads to heat transfer efficiency to reduce, and then influences the holistic heat conduction efficiency of heat dissipation part. Therefore, the graphene layer 1 and the fiber layer 2 are preferably arranged to be spaced apart from each other in the embodiment of the present application.
In one possible embodiment, the thickness of the heat dissipation member is not less than 0.02 mm.
When the thickness of the heat dissipation unit is too low, the thickness of the graphene layer 1 and the fiber layer 2 is too thin, so that the heat conduction capability of the heat dissipation unit is reduced, and meanwhile, the structural strength is low, so that the heat dissipation effect cannot be achieved, and the deformation is easy to occur in the installation process. Under the general condition, the thickness of heat dissipation part can be 0.02 millimeter to 1 millimeter, through being that the thickness of heat dissipation part is in 0.02 millimeter to 1 millimeter can have better rigidity in the heat dissipation part, still have better heat-sinking capability to and thinner thickness, when heat dissipation part is applied to electronic equipment such as cell-phone, flat board, be favorable to electronic equipment miniaturization, frivolous design, accord with actual user demand more.
As shown in fig. 3, in a possible embodiment, the heat dissipation component comprises at least one heat dissipation element 3, the heat dissipation element 3 comprises two graphene layers 1 and one fiber layer 2, or the heat dissipation element 3 comprises one graphene layer 1 and two fiber layers 2.
When the heat dissipation member includes a plurality of heat dissipation elements 3, adjacent heat dissipation elements 3 may share the graphene layer 1 or the fiber layer 2. Use the heat dissipation part to include two heat dissipation units 3, heat dissipation unit 3 includes two graphite alkene layers 1 and a fibrous layer 2 for the example, heat dissipation unit 3 arranges according to graphite alkene layer 1-fibrous layer 2-graphite alkene layer 1's order, adjacent heat dissipation unit 3 can share graphite alkene layer 1 to form graphite alkene layer 1-fibrous layer 2-graphite alkene layer 1-fibrous layer 2-graphite alkene layer 1's structure, when the heat dissipation part includes more heat dissipation units 3, its structure can set gradually according to above-mentioned structure.
The thickness of heat dissipation part self can be adjusted according to heat dissipation unit 3's quantity, when the heat dissipation part that needs are thick, can increase heat dissipation unit 3's quantity, when the thinner heat dissipation part of needs, can suitably reduce heat dissipation unit 3's quantity. The design can make the whole structure of the heat dissipation component more flexible, and the heat dissipation component can be integrally hot-pressed after the number of the heat dissipation units 3 is determined during processing.
Specifically, as shown in fig. 3, the heat dissipation member is processed as follows:
the fiber yarns are arranged according to actual requirements and woven into fiber cloth, and the thickness or the number of the weaving layers of the fiber cloth can be designed according to the thickness of the required fiber layer 2.
Set up fibrous layer 2 and graphite alkene layer 1 along thickness direction Z crisscross in proper order, the quantity of fibrous layer 2 and graphite alkene layer 1 can design according to the thickness of heat dissipation part.
And (3) putting the fiber layers 2 and the graphene layers 1 which are arranged in a staggered manner into a high-temperature vacuum furnace for hot pressing.
After vacuum hot pressing, slow cooling and pressure relief are performed, and then cutting, punching and other processing are performed by adopting an ultrafast laser or die cutting mode, so as to manufacture a structure for forming the required heat dissipation part (the cutting step is not shown in the figure).
Based on the above-mentioned heat dissipation component, the embodiment of the present application further provides an electronic device, where the electronic device may be a mobile phone, a tablet computer, a notebook computer, and the like, and the heat dissipation component is disposed inside the electronic device and is used for dissipating heat of electronic components such as a processor, and the heat dissipation component may be the heat dissipation component according to any of the above embodiments.
The embodiment of the application provides a heat dissipation part and electronic equipment, and the heat dissipation part includes fibrous layer 2 and the graphite alkene layer 1 that adopts the material of foam structure to make, along heat dissipation part's thickness direction Z, and graphite alkene layer 1's first contact surface 11 and fibrous layer 2 second contact surface 21 contact and connect through the mode of vacuum hot pressing. Support graphite alkene layer 1 through fibrous layer 2, can promote the bulk rigidity of heat-dissipating part under the thinner condition of thickness of heat-dissipating part to reduce the possibility that heat-dissipating part takes place the deformation in installation and use.
It is noted that a portion of this patent application contains material which is subject to copyright protection. The copyright owner reserves copyright rights except for copies of patent documents or patent document contents of records at the patent office.
Claims (10)
1. A heat dissipating member, comprising:
the structure of the raw material of the graphene layer is a foam structure;
a fibrous layer;
wherein, follow the thickness direction of heat dissipation part, graphite alkene layer with the fibrous layer sets gradually, graphite alkene layer with one side that the fibrous layer is adjacent has first contact surface, the fibrous layer with one side that the graphite alkene layer is adjacent has the second contact surface, first contact surface with the contact of second contact surface, just graphite alkene layer with fibrous layer vacuum hot pressing connects.
2. The heat dissipating component of claim 1, wherein the area of the fibrous layer is not less than the area of the graphene layer.
3. The heat dissipating component of claim 1, wherein the area of the graphene layer is not less than the area of the fibrous layer.
4. The heat sink member of claim 1, wherein the fibrous layer comprises filaments extending along a length of the heat sink member.
5. The heat sink member according to claim 1, wherein the fiber layer includes fiber filaments extending in a width direction of the heat sink member.
6. The heat dissipating component of claim 1, wherein the fibrous layer comprises a first fiber filament and a second fiber filament, the first fiber filament and the second fiber filament are connected, and an included angle is formed between the first fiber filament and the second fiber filament.
7. The heat sink of claim 6, wherein the first filaments and the second filaments are perpendicular to each other.
8. The heat dissipating component of any one of claims 1 to 7, wherein the heat dissipating component comprises a plurality of the graphene layers and a plurality of the fiber layers, and the graphene layers and the fiber layers are spaced apart from each other.
9. The heat sink member according to claim 8, wherein a thickness of the heat sink member is not less than 0.02 mm.
10. An electronic device comprising a heat-dissipating member according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220245241.2U CN217157233U (en) | 2022-01-29 | 2022-01-29 | Heat dissipation component and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220245241.2U CN217157233U (en) | 2022-01-29 | 2022-01-29 | Heat dissipation component and electronic equipment |
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| Publication Number | Publication Date |
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| CN217157233U true CN217157233U (en) | 2022-08-09 |
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| CN202220245241.2U Active CN217157233U (en) | 2022-01-29 | 2022-01-29 | Heat dissipation component and electronic equipment |
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