CN217155090U - Chip assembly, heat exchange core and plate heat exchanger - Google Patents

Chip assembly, heat exchange core and plate heat exchanger Download PDF

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Publication number
CN217155090U
CN217155090U CN202123197866.0U CN202123197866U CN217155090U CN 217155090 U CN217155090 U CN 217155090U CN 202123197866 U CN202123197866 U CN 202123197866U CN 217155090 U CN217155090 U CN 217155090U
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China
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chip
concave
flow
channel
convex
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CN202123197866.0U
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陈飞飞
蒋剑锋
单聪聪
陈丹
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Zhejiang Yinlun New Energy Thermal Management System Co ltd
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Zhejiang Yinlun New Energy Thermal Management System Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

The utility model relates to a chip module, heat exchange core and plate heat exchanger, wherein, the chip module includes the first chip, and installs the second chip on the first chip, the first chip cooperates with the second chip and forms the feed liquor channel, runner and liquid outlet channel; the first chip is provided with a first concave-convex part, the second chip is provided with a second concave-convex part, the first concave-convex part and the second concave-convex part are arranged in the area where the channel is located in a crossed mode, the first concave-convex part and the second chip are matched, or the second concave-convex part and the first chip are matched and form a flow channel blocking part, and the flow channel blocking part can block the flow of the medium so as to limit the medium guided by the liquid inlet channel to flow from one side of the flow channel to the liquid outlet channel in a concentrated mode. The utility model discloses can make the distribution that the medium flows in the runner of this chip subassembly more even to receive the influence of gravity and concentrate on one side of runner and flow when the medium flows in the runner, and then have the effect that increases effective heat radiating area on this chip subassembly.

Description

Chip assembly, heat exchange core and plate heat exchanger
Technical Field
The utility model belongs to the technical field of the heat exchanger is relevant, especially relate to a chip module, heat transfer core and plate heat exchanger.
Background
The plate heat exchanger is a compact and efficient heat exchanger, is widely applied to industries such as power, chemical engineering, air conditioning and the like, and is also a key device in application of new energy resources such as waste heat utilization and the like. In air conditioning systems, plate heat exchangers are generally used as evaporators and condensers, and in new energy vehicles, also in battery thermal management systems, for heat exchange between a refrigerant and a coolant.
At present, when an existing plate heat exchanger is installed laterally, and a refrigerant inlet and a refrigerant outlet are located on the lower side, under the action of gravity, more refrigerants can flow through the lower portion of a flow channel in a chip assembly of the plate heat exchanger, and only less refrigerants flow through the upper portion of the flow channel in the chip assembly, namely uneven flowing of the refrigerants in the flow channel is caused, so that the effective heat dissipation area on the chip assembly is reduced, and the heat dissipation efficiency of the plate heat exchanger is reduced.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is necessary to provide a chip assembly, a heat exchange core body and a plate heat exchanger for solving the above technical problems.
A chip assembly comprises a first chip and a second chip, wherein the first chip is arranged on the second chip, the first chip and the second chip are matched and form a liquid inlet channel, a flow channel and a liquid outlet channel, the liquid inlet channel and the liquid outlet channel are arranged on one side of the flow channel, and a medium led in by the liquid inlet channel can pass through the flow channel and is discharged outwards from the liquid outlet channel;
the first chip is provided with a first concave-convex part, the second chip is provided with a second concave-convex part, the first concave-convex part and the second concave-convex part are arranged in the area where the flow channel is located in a crossed mode, the first concave-convex part and the second chip are arranged, or the second concave-convex part and the first chip are matched and form a flow channel blocking part, and the flow channel blocking part can block the flow of media so as to limit the media guided by the liquid inlet channel to flow to the liquid outlet channel from one side of the flow channel in a concentrated mode.
In this application, through the above-mentioned reasonable structure setting, utilize the blockking of runner separation portion to the medium flow to the flow direction of control medium flow in the runner, can make the distribution that the medium flowed in the runner of this chip subassembly more even, receive the influence of gravity and concentrate on one side of runner and flow when the medium flows in the runner, and then have the effect that increases effective heat radiating area on this chip subassembly.
In one embodiment, the number of the flow path blocking parts is plural so that the medium can flow uniformly in the flow path.
It will be appreciated that the uniformity of the distribution of the medium within the flow channels is further ensured by the structural arrangement described above.
In one embodiment, the first concave-convex portion and the second concave-convex portion are each provided in a corrugated structure.
It is understood that the structural arrangement of the first concave-convex part and the second concave-convex part is realized by the above structural arrangement.
In one embodiment, a plurality of first convex portions are sequentially arranged on the first chip at intervals towards one side end face of the second chip, and the first convex portions form the first concave-convex portion; and a plurality of second concave portions are sequentially arranged on one side end face of the second chip facing the first chip at intervals, and the second concave portions are formed as the second concave-convex portions.
It will be appreciated that one embodiment of the chip assembly is embodied by the structural arrangement described above.
In one embodiment, a portion of the first convex portion abutting on the second chip toward the second end plane on the first chip side is formed as the flow path blocking portion.
It will be appreciated that the structural formation of the flow path blocking part in one embodiment is realized by the structural arrangement described above.
In one embodiment, a plurality of first concave portions are sequentially arranged on the first chip at intervals towards one side end face of the second chip, and the first concave portions form the first concave-convex portion; and a plurality of second convex parts are sequentially arranged on one side end surface of the second chip facing the first chip at intervals, and the second convex parts form the second concave-convex part.
It will be appreciated that another embodiment of the chip assembly is embodied by the structural arrangement described above.
In one embodiment, a portion of the second convex portion abutting on the first end plane on the first chip side toward the second chip is formed as the flow path blocking portion.
It will be understood that the structural shaping of the flow path blocking part in another embodiment is realized by the structural arrangement described above. The structure of (2) is formed.
In one embodiment, an identifier is disposed on the first chip and/or the second chip.
It will be appreciated that the above-described structural arrangement of the identifier facilitates assembly between the first chip and the second chip.
The application also claims a heat exchange core body, which comprises a plurality of chip components, wherein the plurality of chip components are stacked; the chip assembly is any one of the chip assemblies described above.
In this application, through foretell structure setting for this heat exchange core does not receive the influence of installation direction, has ensured the heat transfer area of this heat exchange core during operation, and then has the effect that improves this heat exchange core during operation heat exchange efficiency.
The application also claims a plate heat exchanger, which comprises two connecting pipes, a top plate, a heat exchange core body and a bottom plate, wherein the top plate and the bottom plate are arranged on two sides of the heat exchange core body, and the two connecting pipes are respectively connected and communicated with the top plate; the heat exchange core body is the heat exchange core body.
In this application, through foretell structure setting for this plate heat exchanger does not receive the influence of installation direction, has ensured the heat transfer area of this plate heat exchanger during operation, and then has the effect that improves this plate heat exchanger heat exchange efficiency.
Drawings
Fig. 1 is an exploded view of a chip assembly provided in a first embodiment of the present application.
Fig. 2 is an exploded view of a chip assembly provided in a second embodiment of the present application.
Fig. 3 is a schematic structural diagram of a heat exchange core provided in the present application.
Fig. 4 is a schematic structural diagram of a plate heat exchanger provided in the present application.
100, a chip assembly; 101. a liquid inlet channel; 102. a liquid outlet channel; 110. a first end plane; 210. a second end plane; 10. a first chip; 11. a first concave-convex portion; 111. a first convex portion; 112. a first recess; 20. a second chip; 21. a second concave-convex portion; 211. a second recess; 212. a second convex portion; 1200. an identification member; 200. taking over a pipe; 300. a top plate; 400. a base plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
It will be understood that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 and 2, the chip assembly 100 of the present invention includes a first chip 10 and a second chip 20.
The first chip 10 is mounted on the second chip 20, and the first chip 10 and the second chip 20 are connected and fixed in a soldering manner, the first chip 10 and the second chip 20 are matched with each other and form a liquid inlet channel 101, a flow channel (not shown) and a liquid outlet channel 102, wherein the liquid inlet channel 101 and the liquid outlet channel 102 are disposed on one side of the flow channel, and a medium introduced by the liquid inlet channel 101 can pass through the flow channel and is discharged from the liquid outlet channel 102, so that when the chip assembly 100 works, the medium flows in the chip assembly 100.
The utility model discloses in, be provided with first concave-convex part 11 on the first chip 10, be provided with second concave-convex part 21 on the second chip 20, first concave-convex part 11 and second concave-convex part 21 set up in the region at runner place crosswise, and first concave-convex part 11 and second chip 20, perhaps second concave-convex part 21 cooperates and is formed with runner separation portion with first chip 10, and runner separation portion can block the flow of medium to the restriction is concentrated from one side flow direction play liquid channel 102 of runner by the leading-in medium of inlet channel 101.
It can be understood that the utility model discloses a chip subassembly 100 utilizes runner separation portion to block the flow of medium to the control medium is in the flow direction when passing through this runner, can make the distribution that the medium flows in the runner more even, and the influence that receives gravity when the medium flows in the runner and concentrate on one side of runner and flow, and then has the effect that increases effective heat radiating area on this chip subassembly 100. Specifically, the flow path blocking portions are formed at the peripheral position of the liquid inlet channel 101 facing the liquid outlet channel 102 and at the peripheral position of the liquid outlet channel 102 facing the liquid inlet channel 101 of the chip module 100, so that the flow distribution of the medium in the chip module 100 is more uniform.
The number of the flow channel blocking parts is multiple, so that the medium can uniformly pass through the flow channel, and the uniformity of the distribution of the medium in the flow channel is further ensured.
The first concave-convex portion 11 and the second concave-convex portion 21 are provided in a corrugated structure, and the first concave-convex portion 11 and the second concave-convex portion 21 are provided in a corrugated structure. It is to be understood that the first concave-convex portion 11 and/or the second concave-convex portion 21 are not limited to those shown in the drawings, and those skilled in the art may provide the first concave-convex portion 11 and/or the second concave-convex portion 21 as a straight rib, an arc rib, a rib plate, or the like.
As shown in fig. 1, the first chip 10 of the first embodiment of the present invention is provided with a plurality of first convex portions 111 in sequence at intervals toward one side end surface of the second chip 20, and the plurality of first convex portions 111 constitute a first concave-convex portion 11; and, a plurality of second concave portions 211 are sequentially provided at intervals on one end surface of the second chip 20 facing the first chip 10, and the plurality of second concave portions 211 are formed as the second concave-convex portions 21.
The portion of the first protrusion 111 abutting against the second end plane 210 of the second chip 20 on the side facing the first chip 10 in the first embodiment is formed as a flow path blocking portion, so as to implement the structural molding of the flow path blocking portion in the first embodiment, where it should be noted that the second end plane 210 specifically refers to a planar portion on the end surface of the second chip 20 on the side facing the first chip 10.
As shown in fig. 2, the first chip 10 according to the second embodiment of the present invention is provided with a plurality of first concave portions 112 in sequence at intervals toward one side end surface of the second chip 20, and the plurality of first convex portions 111 constitute a first concave-convex portion 11; and, a plurality of second convex portions 212 are provided in sequence at intervals on one end surface of the second chip 20 facing the first chip 10, and the plurality of second convex portions 212 are formed as the second concave-convex portions 21.
The second convex portion 212 of the embodiment is formed as a flow path blocking portion at a portion of the first end plane 110, which is close to the first chip 10 and faces the second chip 20 side, so as to implement the structural molding of the flow path blocking portion in the embodiment. The first end plane 110 is a planar portion of the first chip 10 facing the second chip 20.
As the preferred embodiment of the present invention, the identification member 1200 is provided on the first chip 10 and/or the second chip 20, preferably, the identification member 1200 is provided on the first chip 10 and the second chip 20, so that when the first chip 10 and the second chip 20 are assembled, the position of the first chip 10 and the second chip 20 to be assembled can be accurately determined through the identification member 1200, and then the effect of facilitating the assembly between the first chip 10 and the second chip 20 is provided.
In addition, the first concave-convex part 11 on the first chip 10 is specifically formed on the first chip 10 by pressing; and, the second concave-convex portion 21 on the second chip 20 is also formed on the second chip 20 by press working.
As shown in fig. 3, an embodiment of the utility model provides a heat exchange core body, including a plurality of chip subassemblies 100, a plurality of chip subassemblies 100 range upon range of setting, wherein chip subassembly 100 is the aforesaid chip subassembly 100 for the work of this heat exchange core body does not receive the influence of installation direction, has ensured the heat transfer area of this heat exchange core body during operation, and then has the effect that improves this heat exchange core body during operation heat exchange efficiency.
As shown in fig. 4, the utility model provides a plate heat exchanger, including two takeovers 200, roof 300, heat transfer core and bottom plate 400, roof 300 and bottom plate 400 are installed in heat transfer chip's both sides, and two takeovers 200 are connected and are communicate with roof 300 respectively, and wherein the heat transfer core is the aforesaid for this plate heat exchanger does not receive the influence of installation direction, has ensured the heat transfer area of this plate heat exchanger during operation, and then has the effect that improves this plate heat exchanger heat exchange efficiency.
The features of the above embodiments may be arbitrarily combined, and for the sake of brevity, all possible combinations of the features in the above embodiments are not described, but should be construed as being within the scope of the present specification as long as there is no contradiction between the combinations of the features.
It will be appreciated by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be taken as limiting the present invention, and that suitable modifications and variations of the above embodiments are within the scope of the invention as claimed.

Claims (10)

1. A chip assembly comprises a first chip (10) and a second chip (20), wherein the first chip (10) is mounted on the second chip (20), the first chip (10) and the second chip (20) are matched and are provided with a liquid inlet channel (101), a flow channel and a liquid outlet channel (102), wherein the liquid inlet channel (101) and the liquid outlet channel (102) are arranged on one side of the flow channel, and a medium led in by the liquid inlet channel (101) can pass through the flow channel and is discharged from the liquid outlet channel (102) outwards;
the method is characterized in that: the first chip (10) is provided with a first concave-convex part (11), the second chip (20) is provided with a second concave-convex part (21), the first concave-convex part (11) and the second concave-convex part (21) are arranged in the area where the flow channel is located in a crossed mode, the first concave-convex part (11) and the second chip (20) or the second concave-convex part (21) is matched with the first chip (10) and is provided with a flow channel blocking part, and the flow channel blocking part can block the flow of a medium so as to limit the medium guided by the liquid inlet channel (101) to flow to the liquid outlet channel (102) from one side of the flow channel in a concentrated mode.
2. The chip assembly according to claim 1, wherein: the number of the flow path blocking parts is multiple, so that the medium can uniformly flow in the flow path.
3. The chip assembly of claim 2, wherein: the first uneven portion (11) and the second uneven portion (21) are both provided in a corrugated structure.
4. The chip assembly according to claim 1, wherein: a plurality of first convex parts (111) are sequentially arranged on one side end face of the first chip (10) facing the second chip (20) at intervals, and the first concave-convex parts (11) are formed by the plurality of first convex parts (111); and a plurality of second concave portions (211) are sequentially arranged on one side end surface of the second chip (20) facing the first chip (10) at intervals, and the second concave portions (21) are formed by the plurality of second concave portions (211).
5. The chip assembly according to claim 4, wherein: the portion of the first convex portion (111) abutting on the second end plane (210) of the second chip (20) toward the first chip (10) side is formed as the flow path blocking portion.
6. The chip assembly according to claim 1, wherein: a plurality of first concave portions (112) are sequentially arranged on the first chip (10) at intervals on one side end surface facing the second chip (20), and the first concave portions (112) are formed into the first concave-convex portion (11); and a plurality of second convex portions (212) are sequentially provided at intervals on one end surface of the second chip (20) facing the first chip (10), and the second concave-convex portions (21) are formed by the plurality of second convex portions (212).
7. The chip assembly according to claim 6, wherein: the second convex part (212) is formed as the flow path blocking part at a part abutting on the first end plane (110) of the first chip (10) and facing to the second chip (20).
8. The chip assembly according to claim 1, wherein: an identification member (1200) is arranged on the first chip (10) and/or the second chip (20).
9. A heat exchange core body comprising a plurality of chip assemblies (100), a plurality of said chip assemblies (100) being arranged in a stack; the method is characterized in that: the chip assembly (100) is the chip assembly (100) according to any one of claims 1 to 8.
10. A plate heat exchanger comprises two connecting pipes (200), a top plate (300), a heat exchange core body and a bottom plate (400), wherein the top plate (300) and the bottom plate (400) are arranged on two sides of the heat exchange core body, and the two connecting pipes (200) are respectively connected and communicated with the top plate (300); the method is characterized in that: the heat exchange core body of claim 9.
CN202123197866.0U 2021-12-17 2021-12-17 Chip assembly, heat exchange core and plate heat exchanger Active CN217155090U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123197866.0U CN217155090U (en) 2021-12-17 2021-12-17 Chip assembly, heat exchange core and plate heat exchanger

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123197866.0U CN217155090U (en) 2021-12-17 2021-12-17 Chip assembly, heat exchange core and plate heat exchanger

Publications (1)

Publication Number Publication Date
CN217155090U true CN217155090U (en) 2022-08-09

Family

ID=82686670

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202123197866.0U Active CN217155090U (en) 2021-12-17 2021-12-17 Chip assembly, heat exchange core and plate heat exchanger

Country Status (1)

Country Link
CN (1) CN217155090U (en)

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