CN217143658U

CN217143658U - Product tool for overcoming minimum size of vertical continuous copper electroplating wire product

Info

Publication number: CN217143658U
Application number: CN202220205304.1U
Authority: CN
Inventors: 刘金峰
Original assignee: Huangshi Xipu Electronic Technology Co ltd
Current assignee: Huangshi Xipu Electronic Technology Co ltd
Priority date: 2022-01-25
Filing date: 2022-01-25
Publication date: 2022-08-09
Anticipated expiration: 2032-01-25

Abstract

The utility model relates to a product tool for overcoming the minimum dimension of a vertical continuous electro-coppering line product, which comprises a guide frame and a plate to be plated; the guide frame is provided with an installation groove matched with the plate to be plated, and the plate to be plated is fixed in the installation groove; the size of the to-be-plated plate is smaller than the minimum size allowed by the vertical continuous electroplated copper wire, and the size of the guide frame is larger than or equal to the minimum size allowed by the vertical continuous electroplated copper wire; the utility model overcomes the limitation of the minimum size of the vertical continuous electroplating copper wire product by arranging the guide frame, improves the flexibility of design makeup, improves the utilization rate of the continuous electroplating wire, and improves the wire stopping time for switching the product size back and forth; in addition, the guide frame can be formed by the bottom plate and the slidable limiting plate, so that the guide frame can be repeatedly utilized and is suitable for plates to be plated of different sizes, and the cost is greatly saved.

Description

Product tool for overcoming minimum size of vertical continuous copper electroplating wire product

Technical Field

The utility model relates to a technical field who directly links continuous copper-plated line perpendicularly, concretely relates to overcome perpendicular continuous copper-plated line product minimum size's product frock.

Background

Copper has found widespread use as the basic conductive metal in printed circuit fabrication. The electroplated copper layer has the advantages of good electrical conductivity, thermal conductivity and mechanical ductility, and is one of the indispensable key electroplating technologies in the manufacture of printed circuit boards.

The vertical continuous electroplating copper wire drives the circuit board to complete the whole process required by the electroplating process through the electric control system and the transmission system, and the mechanical arm can automatically go up and down the board in the electroplating process without pause, and the front and back treatment water washing can be repeatedly recycled, so that the electroplating production efficiency is high, the product quality is stable, the labor condition is good, and the emission and the energy are reduced.

However, due to the requirement of equipment components, when the vertical continuous electroplated copper wire is produced and processed, the minimum size of the product is required to be 250mm x 250mm, when the size of the product is smaller than 250mm x 250mm, the equipment cannot be produced, the product has abnormal quality, and therefore the flexibility of the product makeup design is limited.

SUMMERY OF THE UTILITY MODEL

Based on the above, the utility model provides an overcome perpendicular continuous electro-coppering line product minimum size's product frock through setting up the guide frame, has overcome perpendicular continuous electro-coppering line product minimum size's restriction.

The utility model provides an above-mentioned technical problem's technical scheme as follows: a product tooling for overcoming the minimum size of a vertical continuous electroplated copper wire product comprises a guide frame and a plate to be plated; the guide frame is provided with an installation groove matched with the plate to be plated, and the plate to be plated is fixed in the installation groove; the size of waiting to plate is less than the minimum size that vertical continuation electroplate copper line allows, the size of pedestal is greater than or equal to the minimum size that vertical continuation electroplate copper line allows.

On the basis of the technical scheme, the utility model discloses can also do following improvement.

Further, the guide frame comprises a bottom plate and a limiting plate; a square through hole is formed in the bottom plate; the limiting plate is L-shaped and is arranged on one side of the bottom plate in a sliding mode, the limiting plate is arranged at one corner of the square through hole, two sides of the limiting plate extend out of two adjacent sides of the square through hole, and the two sides of the limiting plate and the other two sides of the square through hole are enclosed to form the mounting groove.

Furthermore, one side of bottom plate just the edge of square through hole be provided with the recess of limiting plate adaptation, the limiting plate can slide in the recess.

Furthermore, the limiting plate is close to one side of bottom plate and the limiting plate is located border department in the square through-hole is provided with spacing arch, spacing arch is used for supporting the border of square through-hole.

Further, the product tool further comprises a plurality of clamping pieces, and the clamping pieces are used for clamping the bottom plate and the plate to be plated simultaneously or clamping the bottom plate, the limiting plate and the plate to be plated simultaneously.

Furthermore, the guide frame is made of a copper-clad plate.

Further, the guide frame is square and has the size of 250mm by 250 mm.

Compared with the prior art, the technical scheme of the application has the following beneficial technical effects:

1. the utility model overcomes the limitation of the minimum size of the vertical continuous electroplating copper wire product by arranging the guide frame, improves the flexibility of design makeup, improves the utilization rate of the continuous electroplating wire, and improves the wire stopping time for switching the product size back and forth;

2. through set up slidable limiting plate on the bottom plate, make the pedestal can reuse and be applicable to not unidimensional waiting to plate the board, practiced thrift the cost by a wide margin.

Drawings

FIG. 1 is a schematic structural diagram of a product tooling for overcoming the minimum dimension of a vertical continuous electro-coppering line product according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a product tooling for overcoming the minimum dimension of a vertical continuous electro-coppering line product according to the second embodiment of the present invention;

fig. 3 is a schematic structural view of a second embodiment of the present invention;

FIG. 4 is a schematic view of the structure of FIG. 3 from another perspective;

in the drawings, the components represented by the respective reference numerals are listed below:

1. a guide frame; 11. mounting grooves; 12. a base plate; 121. a square through hole; 122. a groove; 13. a limiting plate; 131. a limiting bulge; 2. a plate to be plated; 3. a metal binding clip; 4. a first binder; 5. a second binder.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Example one

The utility model provides an overcome perpendicular continuous electroplated copper line product minimum size's product frock, includes lead frame 1 and treats plate 2, wherein treats plate 2's size and is less than the minimum size that perpendicular continuous electroplated copper line equipment required, can't directly be used for the production of perpendicular continuous electroplated copper line, and the product has the quality anomaly. The embodiment is used for overcoming the defect, so that the vertical continuous copper electroplating wire can also carry out copper electroplating on the plate to be plated 2 with the size smaller than the minimum size allowed by the vertical continuous copper electroplating wire, the design and makeup flexibility is improved, the utilization rate of the continuous copper electroplating wire is improved, and the wire stopping time for switching the product size back and forth is improved.

The guide frame 1 is a square copper-clad plate, and the size of the guide frame 1 is greater than or equal to the minimum size required by the vertical continuous copper-clad plate equipment, in this embodiment, the size of the guide frame 1 is 250mm by 250mm, so as to meet the minimum size allowed by the vertical continuous copper-clad plate in this embodiment.

The guide frame 1 is provided with a mounting groove 11 matched with the plate 2 to be plated, so that the plate 2 to be plated can be just embedded in the mounting groove 11. The mounting groove 11 in this embodiment is formed by routing data and routing by a routing machine, and the mounting groove 11 can also be formed by processing in other manners, which is not limited herein.

Optionally, the product tooling of this embodiment further includes a plurality of clamping members for clamping the guide frame 1 and the plate to be plated 2 at the same time. The clamping piece can be selected from a common clamp, a binder clip and the like, and in the embodiment, the clamping piece is a metal binding clip 3. The two opposite sides of the joint of the guide frame 1 and the plate 2 to be plated are respectively provided with three metal binding clamps 3, and the guide frame 1 and the plate 2 to be plated are clamped together, so that a firm whole is formed.

Example two

The difference between this embodiment and the first embodiment is that, in this embodiment, the guide frame 1 is composed of a bottom plate 12 and a limit plate 13.

A square through hole 121 is provided on the bottom plate 12, and a groove 122 is provided on one side surface of the bottom plate 12. The groove 122 is L-shaped and closely attached to two adjacent sides of the square through hole 121.

The limit plate 13 is arranged in the groove 122, and the limit plate 13 can slide up, down, left and right in the groove 122. The limiting plate 13 is L-shaped, two sides of the limiting plate 13 respectively extend into the square through hole 121 from two adjacent sides of the square through hole 121, and the two sides of the limiting plate 13 and the other two sides of the square through hole 121 enclose the mounting groove 11. The size of the mounting groove 11 can be adjusted by adjusting the position of the limiting plate 13, so that the plates 2 to be plated of different sizes can be mounted in the mounting groove 11, and the product tool of the embodiment can be suitable for the plates 2 to be plated of different sizes.

In addition, limiting protrusion 131 stretching into square through hole 121 is arranged at one side of limiting plate 13 close to bottom plate 12 and at two edges of limiting plate 13 stretching into square through hole 121, limiting protrusion 131 can abut against two adjacent edges of square through hole 121, and by arranging limiting protrusion 131, the contact area between limiting plate 13 and plate 2 can be increased.

Optionally, a plurality of clamping members are arranged at the joint of the guide frame 1 and the plate to be plated 2. In the present embodiment, the clamping members are two first binders 4 and two second binders 5. The two first binding clamps 4 are arranged on one side of the bottom plate 12 and simultaneously clamp the bottom plate 12 and the plate 2 to be plated; the two second binding clamps 5 are arranged on the other side of the bottom plate 12, and simultaneously clamp the bottom plate 12, the limiting plate 13 and the plate 2 to be plated. Through setting up first binder 4 and second binder 5, not only can further strengthen guide frame 1, also can with guide frame 1 with treat plating 2 centre gripping together to form a firm whole, be convenient for the continuous production of electroplated copper line of hanging down.

The embodiment overcomes the limitation of the minimum size of a vertical continuous electroplated copper wire product by arranging the guide frame 1, improves the flexibility of design makeup, improves the utilization rate of the continuous electroplated wire, and improves the wire stopping time for switching the product size back and forth. In addition, the guide frame 1 can be repeatedly used and is suitable for plates 2 to be plated of different sizes, and the production cost of the guide frame 2 is greatly saved.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A product tooling for overcoming the minimum size of a vertical continuous electroplated copper wire product is characterized by comprising a guide frame (1) and a plate to be plated (2); the guide frame (1) is provided with a mounting groove (11) matched with the plate to be plated (2), and the plate to be plated (2) is fixed in the mounting groove (11); the size of the plate (2) to be plated is smaller than the minimum size allowed by the vertical continuous electroplated copper wire, and the size of the guide frame (1) is larger than or equal to the minimum size allowed by the vertical continuous electroplated copper wire.

2. The product tooling for overcoming the minimum dimension of the vertical continuous electroplated copper wire product according to claim 1, characterized in that the guide frame (1) comprises a bottom plate (12) and a limiting plate (13); a square through hole (121) is formed in the bottom plate (12); the limiting plate (13) is L-shaped and can be slidably arranged on one side of the bottom plate (12), the limiting plate (13) is arranged at one corner of the square through hole (121), two sides of the limiting plate (13) extend out of two adjacent sides of the square through hole (121), and the two sides of the limiting plate (13) and the other two sides of the square through hole (121) are enclosed to form the mounting groove.

3. The product tooling for overcoming the minimum dimension of the vertically continuous electroplated copper wire product as claimed in claim 2, characterized in that a groove (122) matched with the limiting plate (13) is provided at one side of the bottom plate (12) and the edge of the square through hole (121), and the limiting plate (13) can slide in the groove (122).

4. The product tooling for overcoming the minimum dimension of the vertical continuous copper wire electroplating product according to claim 2, wherein the limiting plate (13) is provided with a limiting protrusion (131) at one side close to the bottom plate (12) and the edge of the limiting plate (13) in the square through hole (121), and the limiting protrusion (131) is used for abutting against the edge of the square through hole (121).

5. The product tooling for overcoming the minimum dimension of the vertical continuous electroplated copper wire product as claimed in claim 2, characterized by further comprising a plurality of clamping members for simultaneously clamping the bottom plate (12) and the plate to be plated (2) or for simultaneously clamping the bottom plate (12), the limiting plate (13) and the plate to be plated (2).

6. The product tooling for overcoming the minimum dimension of the vertical continuous electroplated copper wire product as claimed in claim 1, wherein the guide frame (1) is made of copper clad laminate.

7. The tooling for overcoming the minimum dimension of the vertically continuous electroplated copper wire product as claimed in claim 1, characterized in that the lead frame (1) is square with dimensions of 250mm x 250 mm.