CN216304016U

CN216304016U - Improve frock structure of DPC surface electroplating thick film homogeneity

Info

Publication number: CN216304016U
Application number: CN202122482687.5U
Authority: CN
Inventors: 张晓�
Original assignee: Zhenjiang Jinxing Surface Engineering Technology Co ltd
Current assignee: Zhenjiang Jinxing Surface Engineering Technology Co ltd
Priority date: 2021-10-15
Filing date: 2021-10-15
Publication date: 2022-04-15
Anticipated expiration: 2031-10-15

Abstract

The utility model provides an improve frock structure of DPC surface electroplating thick film homogeneity includes the support and electroplates the board, a plurality of connecting groove has been seted up to the below of support, the electroplate board link to each other with the support through the connecting piece that activity hinge was in connecting groove, set up a plurality of evenly distributed's electroplating window on the electroplate board, the periphery of electroplating window is equipped with the base plate support, is equipped with size adjusting device on the base plate support. This frock structure is electrically conductive through the both ends from electroplating the work piece, can reduce DPC base plate surface electroplate the range of thick film to 5% from 20%, has improved the homogeneity and the electrically conductive efficiency of electroplating the thick film, and this frock structure can be through adjusting size adjusting device to accomplish the electroplating work of unidimensional DPC base plate simultaneously, has improved the suitability of frock structure.

Description

Improve frock structure of DPC surface electroplating thick film homogeneity

Technical Field

The utility model relates to a tool structure, in particular to a tool structure for improving the uniformity of a DPC surface electroplated thick film.

Background

The packaging substrate is a key part for connecting the internal and external heat dissipation passages, and can provide the effects of electric connection, protection, support, heat dissipation, assembly and the like for the chip so as to realize the purposes of multi-pin, reduction of the volume of a packaging product, improvement of electrical performance and heat dissipation, and ultrahigh density or multi-chip modularization. In the past, when the PCB is packaged on a metal PCB, an insulating layer is still required to be introduced to realize thermoelectric separation, because the thermal conductivity of the insulating layer is extremely poor, heat is not concentrated on a chip but concentrated near the insulating layer below the chip, once higher power is performed, the problem of heat dissipation can emerge, and the DPC ceramic substrate can solve the problem because the ceramic is an insulator, the heat dissipation performance is better, and the insulating layer does not need to be formed on the ceramic. But the uniformity of the surface thick film during the electroplating of the DPC ceramic substrate can not be ensured by the existing tool structure, and the service performance of the DPC ceramic substrate is seriously influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects of the prior art and provide a tool structure for improving the uniformity of a DPC surface electroplated thick film.

The utility model provides an improve frock structure of DPC surface electroplating thick film homogeneity includes the support and electroplates the board, the top of support is equipped with the conducting rod of two bilateral symmetry, and the support passes through the conducting rod and links to each other with the power connection electrode, and a plurality of connecting groove has been seted up to the below of support, electroplate the board and link to each other with the support through the connecting piece that the activity articulated in connecting groove, the electroplating window of having seted up a plurality of evenly distributed on the electroplating board, the periphery of electroplating the window is equipped with the base plate support, is equipped with size adjusting device on the base plate support.

Preferably, a horizontally placed insulating connecting rod is arranged between the two conducting rods.

Preferably, four bilaterally symmetrical connecting grooves are formed below the bracket.

Preferably, the connecting piece is movably hinged in the connecting groove through a pin rod.

Preferably, six electroplating windows distributed in a rectangular array are arranged on the electroplating plate.

Preferably, the substrate support is composed of two C-shaped frames symmetrically distributed up and down, and the size adjusting device is located between the two C-shaped frames.

Preferably, the width of the C-shaped frame is greater than the width of the plating window.

Has the advantages that: the utility model discloses a tool structure for improving the uniformity of a DPC surface electroplated thick film, which can reduce the range of the DPC substrate surface electroplated thick film from 20% to 5% by conducting electricity from two ends of an electroplated workpiece, thereby improving the uniformity and the conduction efficiency of the electroplated thick film, and can finish the electroplating work of DPC substrates with different sizes by adjusting a size adjusting device, thereby improving the applicability of the tool structure.

Drawings

FIG. 1 is a schematic structural view of a tooling structure;

in the figure: 1. the device comprises a support 11, a connecting groove 12, a connecting piece 13, a pin rod 2, an electroplating plate 3, a conducting rod 4, a connecting electrode 5, an electroplating window 6, a substrate support 7, a size adjusting device 8, an insulating connecting rod 9 and a C-shaped frame.

Detailed Description

For the purpose of enhancing the understanding of the present invention, the present invention will be described in further detail with reference to the following examples and the accompanying drawings, which are provided for the purpose of illustration only and are not intended to limit the scope of the present invention.

As shown in figure 1, a frock structure of thick film homogeneity is electroplated on DPC surface includes support 1 and electroplates board 2, the top of support 1 is equipped with two bilateral symmetry's conducting rod 3, and support 1 links to each other with connection electrode 4 through conducting rod 3, and a plurality of connecting groove 11 has been seted up to the below of support 1, electroplate board 2 link to each other with support 1 through connecting piece 12 that the activity articulated in connecting groove 11, electroplate board 2 is last to have seted up a plurality of evenly distributed's electroplating window 5, the periphery of electroplating window 5 is equipped with substrate holder 6, is equipped with size adjusting device 7 on the substrate holder 6.

In this embodiment, a horizontally disposed insulating connecting rod 8 is disposed between the two conductive rods 3.

In this embodiment, four bilateral symmetric connecting grooves 11 are formed below the bracket 1.

In this embodiment, the connecting member 12 is movably hinged in the connecting groove 11 by a pin 13.

In this embodiment, the electroplating plate 2 is provided with six electroplating windows 5 distributed in a rectangular array.

In this embodiment, the substrate support 6 is composed of two C-shaped frames 9 symmetrically distributed up and down, and the size adjusting device 7 is located between the two C-shaped frames 9.

In this embodiment, the width of the C-shaped frame 9 is larger than the width of the plating window 5.

This frock structure is electrically conductive through the both ends from electroplating the work piece, can reduce DPC substrate surface electroplate the range of thick film to 5% from 20%, the homogeneity and the electrically conductive efficiency of electroplating the thick film have been improved, simultaneously this frock structure can accomplish the electroplating work of unidimensional DPC base plate through adjusting size adjusting device, the suitability of frock structure has been improved, this frock structure simple structure in addition, convenient operation, can also fold through the connecting piece that the activity articulates in connecting groove when out of work, the area of frock structure has been reduced.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. The utility model provides an improve frock structure of DPC surface electroplating thick film homogeneity, a serial communication port, including support and electroplating plate, the top of support is equipped with the conducting rod of two bilateral symmetry, and the support passes through the conducting rod and links to each other with the power connection electrode, and a plurality of connecting groove has been seted up to the below of support, electroplating plate link to each other with the support through the connecting piece that the activity articulated in connecting groove, electroplating plate is last to have seted up a plurality of evenly distributed's electroplating window, electroplating window's periphery is equipped with the base plate support, is equipped with size adjusting device on the base plate support.

2. The tooling structure for improving the uniformity of the DPC surface electroplated thick film according to claim 1, wherein a horizontally placed insulating connecting rod is arranged between the two conducting rods.

3. The tooling structure for improving the uniformity of the DPC surface electroplated thick film according to claim 1, wherein four bilaterally symmetrical connecting grooves are formed below the bracket.

4. The tooling structure for improving the uniformity of a DPC surface electroplated thick film according to claim 1, wherein the connecting member is movably hinged in the connecting groove by a pin.

5. The tooling structure for improving the uniformity of a DPC surface electroplated thick film according to claim 1, wherein six electroplating windows are arranged on the electroplating plate in a rectangular array.

6. The tooling structure for improving the uniformity of a DPC surface electroplated thick film according to claim 1, wherein the substrate support is composed of two C-shaped frames symmetrically distributed up and down, and the size adjusting device is located between the two C-shaped frames.

7. The tooling structure for improving the uniformity of a DPC surface plated thick film according to claim 6, wherein the width of the C-shaped frame is greater than the width of the plating window.