CN221102686U

CN221102686U - Optical device, packaging base and electroplating structure thereof

Info

Publication number: CN221102686U
Application number: CN202323032708.9U
Authority: CN
Inventors: 李钢; 陈仕军
Original assignee: Deyang Sanhuan Technology Co ltd; Chengdu Sanhuan Technology Co ltd; Chaozhou Three Circle Group Co Ltd
Current assignee: Deyang Sanhuan Technology Co ltd; Chengdu Sanhuan Technology Co ltd; Chaozhou Three Circle Group Co Ltd
Priority date: 2023-11-09
Filing date: 2023-11-09
Publication date: 2024-06-07
Anticipated expiration: 2033-11-09

Abstract

The utility model relates to the technical field of packaging, and discloses an optical device, a packaging base and an electroplating structure thereof, wherein the electroplating structure comprises: a body member configured as a conductor and having a mounting slot; the input/output terminal comprises an insulator and a conductive wiring arranged on the insulator, and the insulator is arranged at the mounting groove; a wire terminal electrically connected to the conductive wiring; and the main body member, the conductive wiring and the wire terminal are electrically connected through the plated wiring, and at least one part of the plated wiring is exposed on the surface of the insulator and is not overlapped with the conductive wiring. According to the utility model, the main body piece, the input and output terminals and the lead terminals are electrically connected by arranging the electroplating wiring, and the electroplating hanger only needs to be connected with the main body piece, the conductive wiring of the input and output terminals or the lead terminals, so that the electroplating operation requirement of the packaging base is met, the electroplating operation difficulty of the packaging base is reduced, the production efficiency is improved, and the economic cost is reduced.

Description

Optical device, packaging base and electroplating structure thereof

Technical Field

The present utility model relates to the field of packaging technology, and in particular, to an optical device, a packaging base, and an electroplating structure thereof.

Background

A package base applied to the field of semiconductor lasers comprises a body member and an input/output terminal, wherein the body member and a lead terminal of the input/output terminal are separated by a ceramic material of the input/output terminal, so that the body member and the lead terminal are not electrically connected with each other. The main body part and the wire terminals need to be plated with nickel and gold on the surfaces respectively, and when electroplating is performed, the electroplating rack needs to be connected with all parts needing to be electroplated such as the main body part, the wire terminals and the like respectively, so that the design of the electroplating rack is complex, the electroplating operation is complex, the production efficiency is low, and the economic cost is high.

Disclosure of utility model

The purpose of the utility model is that: the optical device, the packaging base and the electroplating structure thereof can reduce the electroplating operation difficulty of the packaging base, improve the production efficiency and reduce the economic cost.

In order to achieve the above object, the present utility model provides an electroplating structure of a package base, including:

A main body member provided as a conductor and including a substrate and a frame provided on the substrate, the frame having a mounting groove;

The input/output terminal comprises an insulator, and a conductive wiring and an electroplating wiring which are arranged on the insulator, wherein the insulator is arranged at the mounting groove;

A wire terminal electrically connected to the conductive wiring;

And the main body piece, the conductive wiring and the lead terminal are electrically connected through the electroplating wiring, and at least a part of the electroplating wiring is exposed on the surface of the insulator and is not overlapped with the conductive wiring.

In some embodiments of the application:

The input-output terminal further comprises a metal layer, and the metal layer is arranged on the surface, which is contacted with the main body piece, of the insulator.

In some embodiments of the application:

the metal layer is provided on a surface of the insulator contacting a wall of the mounting groove.

In some embodiments of the present application, the plating structure of the package base further includes:

The sealing ring is arranged as a conductor and is arranged on the upper surfaces of the main body piece and the insulator, and the insulator is clamped by the sealing ring and the main body piece together;

The metal layer is arranged on the surface of the insulator contacting the sealing ring.

And the wire terminals are arranged in a plurality of mode, and each wire terminal is connected with each other through the wire connecting ribs.

In some embodiments of the application:

the main body piece and the input and output terminals enclose a cavity for mounting the semiconductor laser;

The insulator comprises a flat plate part and a vertical wall part arranged on the flat plate part, the conductive wiring is arranged on the surface of the flat plate part connected with the vertical wall part, the vertical wall part faces to one side of the inner part of the cavity, the conductive wiring on one side of the vertical wall part faces to the outer part of the cavity forms an outer bonding pad, and the wire terminal is electrically connected with the outer bonding pad.

In some embodiments of the application:

The ratio range of the width of the plating wiring to the width of the internal pad is: 1/10-1.

The utility model also provides a package base, comprising:

an input-output terminal including an insulator and a conductive wiring provided on the insulator, the insulator being mounted at the mounting groove;

A wire terminal electrically connected to the conductive wiring;

The plating structure of any one of the above paragraphs has a portion of the plated wire removed to form a remaining portion, and the body member is not electrically connected to the conductive wire and the wire terminal.

In some embodiments of the application:

The input/output terminal further comprises a metal layer, wherein the metal layer is arranged on the surface, which is contacted with the main body piece, of the insulator;

at least one section of the retaining portion is provided, and at least a part of the retaining portion is exposed on the surface of the insulator.

The present utility model also provides an optical device comprising:

a package base as in any above paragraph;

And the optical semiconductor element is arranged in the cavity of the packaging base.

The utility model provides an optical device, a packaging base and an electroplating structure thereof, which have the beneficial effects that compared with the prior art:

According to the electroplating structure of the packaging base, the main body piece, the input and output terminals and the lead terminals are electrically connected through the electroplating wiring, and when in electroplating operation, the electroplating hanger can meet the electroplating operation requirement of the packaging base only by connecting the main body piece, the conductive wiring of the input and output terminals or the lead terminals, so that the electroplating operation difficulty of the packaging base is reduced, the production efficiency is improved, and the economic cost is reduced.

After the electroplating operation is finished, the part of the electroplating wiring exposed on the surface of the insulator in the electroplating structure is cut off, so that the electric connection between the conductive wiring and the main body piece is disconnected, and the normal use of the product is ensured while the electroplating operation difficulty of the packaging base is reduced, the production efficiency is improved and the economic cost is reduced.

The optical device comprises the packaging base, and the packaging base reduces the electroplating operation difficulty, so that the optical device can ensure the normal use of products while improving the production efficiency and reducing the economic cost.

Drawings

FIG. 1 is a perspective view of an electroplated structure of an embodiment of the utility model.

Fig. 2 is a perspective view of a package base according to an embodiment of the present utility model.

Fig. 3 is an enlarged schematic view of the retention portion of fig. 2.

Fig. 4 is a perspective view of a body member according to an embodiment of the present utility model.

Fig. 5 is a perspective view of an input-output terminal of a plating structure in an embodiment of the utility model.

Fig. 6 is a perspective view of an input/output terminal of a package base according to an embodiment of the present utility model.

Fig. 7 is a perspective view of an input-output terminal of a plating structure according to another embodiment of the utility model.

Fig. 8 is a perspective view of the corresponding package base input-output terminal in the embodiment of fig. 7.

Fig. 9 is a perspective view of an input-output terminal of a plating structure according to another embodiment of the utility model.

Fig. 10 is a perspective view of the corresponding package base input-output terminal in the embodiment of fig. 9.

Fig. 11 is a perspective view of an input-output terminal of a plating structure according to another embodiment of the utility model.

FIG. 12 is a schematic view of the connection of the metal layer, the electroplated wires and the conductive wires (with hidden parts of the body) in the embodiment of FIG. 11

Fig. 13 is a perspective view of the corresponding package base input-output terminal in the embodiment of fig. 11.

Fig. 14 is a schematic view showing connection between a body member, a metal layer, plated wires, conductive wires and wire terminals (insulation is not shown) in the plated structure according to the embodiment of the utility model.

Fig. 15 is an enlarged schematic view of the body member, metal layer, plated wire, conductive wire and wire terminal connection of fig. 14.

Fig. 16 is a schematic structural view of the package base (not showing the insulator) according to the embodiment of the present utility model corresponding to fig. 14.

Fig. 17 is an enlarged schematic view of the retention portion of fig. 16.

In the electroplating structure of the packaging base: 1. a body member; 2. an input/output terminal; 3. a wire terminal; 4. electroplating wiring; 11. a mounting groove; 12. a seal ring; 13. a cavity; 14. a substrate; 15. a frame; 21. an insulator; 22. conductive wiring; 211. a flat plate portion; 212. a vertical wall portion; 221. an internal bonding pad; 222. an external bonding pad; 23. a metal layer; 31. and connecting the ribs.

In the package base: 2', input/output terminals; a 4' metal layer; 5. a retention portion; 21', an insulator; 22', conductive wiring.

Detailed Description

The following describes in further detail the embodiments of the present utility model with reference to the drawings and examples. The following examples are illustrative of the utility model and are not intended to limit the scope of the utility model.

In the description of the present utility model, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Furthermore, in the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1, an electroplating structure of a package base according to a preferred embodiment of the present utility model includes: a body member 1, an input/output terminal 2, a lead terminal 3, and a plating wiring 4.

Referring to fig. 4, the body member 1 is provided as a conductor and has a mounting groove 11. In this embodiment, referring to fig. 4, the main body 1 is made of metal and includes a substrate 14 and a frame 15, the frame 15 is disposed on the substrate 14, and the mounting groove 11 is disposed on the frame 15. In the present embodiment, the number of the mounting grooves 11 is not limited to two and may be provided at other portions of the frame 15.

Referring to fig. 1 and 5, the input-output terminal 2 includes an insulator 21, and a conductive wiring 22 and a plating wiring 4 provided on the insulator 21, the insulator 21 being mounted at the mounting groove 11.

The wire terminal 3 is electrically connected to the conductive wiring 22. In this embodiment, the wire terminals 3 extend in a direction away from the body member 1, but in other embodiments, the wire terminals 3 may extend upward or downward.

Referring to fig. 14 and 15, the main body 1, the conductive wiring 22, and the lead terminal 3 are electrically connected by the plating wiring 4, and at least a part of the plating wiring 4 is exposed on the surface of the insulator 21 and is not overlapped with the conductive wiring 22.

According to the electroplating structure of the packaging base, the main body piece 1, the input and output terminals 2 and the lead terminals 3 are electrically connected through the electroplating wiring 4, and when in electroplating operation, the electroplating hanger can meet the electroplating operation requirement of the packaging base only by connecting the main body piece 1 and the conductive wiring 22 of the input and output terminals 2 or the lead terminals 3, so that the electroplating operation difficulty of the packaging base is reduced, the production efficiency is improved, and the economic cost is reduced.

In some embodiments of the present utility model, the input-output terminals 2 have two or more, and some of the input-output terminals have plating wirings provided thereon, and some of the input-output terminals have no plating wirings provided thereon, in which case the portions of the input-output terminals not provided with plating wirings cannot achieve the above-described effects, so that the effect of reducing the difficulty of the plating operation of such embodiments is greatly impaired. Therefore, the preferred embodiment of the present utility model is to provide plating wirings on all the input-output terminals.

At least a part of the plating line 4 is exposed on the surface of the insulator 21 and is not overlapped with the conductive line 22, so that the plating line 4 exposed on the surface of the insulator 21 can be removed after the plating operation is completed, thereby ensuring normal use of the product.

The body member 1 and the conductive wiring 22 are electrically connected through the plating wiring 4, the substrate 14 and the frame 15 are electrically connected to each other, and the frame 15 in the body member 1 is connected to the plating wiring 4. In the present embodiment, the plating line 4 extends to the outer surface of the input-output terminal 2 and contacts the frame 15, and the electrical connection between the body member 1 and the plating line 4 is formed.

The frame 15 is further provided with a through hole provided on one of the side surfaces on which the mounting groove 11 is not provided, and the light window bracket is mounted on the through hole.

In some embodiments, the input-output terminal 2 further includes a metal layer 23, and the metal layer 23 is disposed on a surface of the insulator 21 that contacts the body member 1; for example, the insulating body 21 may be provided on a side surface contacting the mounting groove 11, or may be provided on a bottom surface of the insulating body 21.

Referring to fig. 14, the plating line 4 is configured as a conductor, and both ends thereof are respectively connected to the conductive line 22 and the metal layer 23 to form an electrical connection between the metal layer 23 and the conductive line 22, and at least a portion of the plating line 4 is exposed on the surface of the insulator 21 and is not overlapped with the conductive line 22.

Referring to fig. 5, 7 and 9, the plating line 4 may be provided on at least one surface of the insulator 21, and may be provided on the upper and lower surfaces, the front and rear surfaces, and the side surfaces. Referring to fig. 11 and 12, the plated wiring 4 may be at least partially located inside the insulator 21. The plating line 4 may be formed on the same ceramic layer of the insulator 21 or on a different ceramic layer, and when formed on a different ceramic layer, the plating line 4 passes through the via hole without affecting the routing of the plating line 4, as shown in fig. 12.

In some embodiments, referring to fig. 5, a metal layer 23 is provided on the surface of the insulator 21 contacting the groove wall of the mounting groove 11.

When the input/output terminal 2 is mounted in the mounting groove 11, the metal layer 23 contacts the groove wall of the mounting groove 11, and the body member 1 is electrically connected to the metal layer 23.

In some embodiments, referring to fig. 1, the main body 1 further includes a sealing ring 12, where the sealing ring 12 is configured as a conductor, the sealing ring 12 is disposed on the upper surfaces of the main body 1 and the frame 15, and the sealing ring 12 and the frame 15 jointly clamp the insulator 21.

The sealing ring 12 contacts the body member 1 to form an electrical connection between the sealing ring 12 and the body member 1, so that the metal layer 23 can also form an electrical connection with the body member 1 by contacting the sealing ring 12. In some embodiments, a metal layer 23 is provided on the surface of the insulator 21 that contacts the seal ring 12, i.e., on the top surface of the insulator 21, forming an electrical connection of the metal layer 23 to the seal ring 12.

In some embodiments, the plating structure of the package base further includes a connection rib 31, and the wire terminals 3 are provided in plurality, and the wire terminals 3 are connected to each other through the connection rib 31.

The connection rib 31 can electrically connect the wire terminals 3 to each other, and one wire terminal 3 is connected to the plating line 4, so that all the wire terminals 3 can be connected to the plating line 4.

In some embodiments, the body member 1 and the input-output terminal 2 enclose a cavity 13 for mounting a semiconductor laser.

The insulator 21 includes a flat plate portion 211 and a standing wall portion 212 provided on the flat plate portion 211, the conductive wiring 22 is provided on the flat plate portion 211, and the conductive wiring 22 is located on a surface of the flat plate portion 211 to which the standing wall portion 212 is connected, the conductive wiring 22 of the standing wall portion 212 toward the inside of the cavity 13 forms an inner pad 221, the conductive wiring 22 of the standing wall portion 212 toward the outside of the cavity 13 forms an outer pad 222, and the wire terminal 3 is electrically connected to the outer pad 222.

In the present embodiment, the metal layer 23 may be provided on the bottom surface of the flat plate portion 211, or may be provided on the side surface of at least one of the flat plate portion 211 and the standing wall portion 212, and the plating wiring 4 is provided in the cavity 13 and connected to the internal pad 221.

In some embodiments, the ratio of the width of the plated wire 4 to the width of the internal pad 221 ranges from: 1/10-1.

If the ratio is smaller than 1/10, the parasitic resistance of the electroplating wiring 4 is too large, and the uniformity of the gold plating thickness of the bonding pad and the main body piece 1 is affected; if the ratio is greater than 1, the risk of short circuit of the plating wiring 4 is increased, and normal use of the product is affected.

The embodiment also provides a preparation method of the packaging base, which comprises the following steps:

S1, preparing an input/output terminal 2, a main body piece 1 and a wire terminal 3.

Specifically, the ceramic slurry is cast into a ceramic green body, punched and filled, and the conductive wiring 22 pattern and the plated wiring 4 are printed. The ceramic green body having the pattern of the plurality of conductive wirings 22 is laminated, cut to form a member, and if the metal layer 23, another part of the conductive wirings 22 or the plated wirings 4 are required on the side of the member, the metal layer 23, another part of the conductive wirings 22 or the plated wirings are printed on the side of the member. The input/output terminal 2 is formed by high-temperature co-firing. The exposed metal of the input/output terminal 2 is subjected to a primary nickel plating treatment.

The metal or alloy plate is cut and then formed into a base plate 14 and a frame 15, and the base plate and the frame are connected by brazing or the like to obtain the main body member 1, and for the embodiment with the sealing ring, the sealing ring is cut and connected together. The wire terminal 3 may also be obtained by cutting a metal or alloy plate.

S2, the input/output terminal 2, the body member 1, and the lead terminal 3 are mounted as an assembly, and the conductive wiring 22 and the plating wiring 4 on the input/output terminal 2 are electrically connected to the body member 1 and the lead terminal 3.

And S3, electrically connecting the main body 1 of the assembly, the conductive wiring 22 of the input/output terminal 2 or the lead terminal 3 with a plating electrode, and plating the assembly.

And using the jig to electrically conduct any metal part of the assembly, the input/output terminal 2 or the lead terminal 3 with the electroplating electrode, and electroplating the assembly.

S4, cutting off the portion of the plating line 4 exposed on the surface of the insulator 21 to disconnect the electrical connection between the conductive line 22 and the body member 1.

In some embodiments, step S4 further comprises: the distance by which the plated wiring 4 is cut is greater than 0.05mm. If the cutting distance is too small, the electric insulation effect is poor, and the use of subsequent products is affected.

In some embodiments, the wire terminals 3 are provided in plurality, and the wire terminals 3 are connected to each other by the connection ribs 31. Step S4 further includes: the connection rib 31 is removed so that the electrical connection between the wire terminals 3 is broken.

The embodiment also provides a package base, which comprises a main body piece, an input/output terminal 2', and a wire terminal.

The body member is provided as a conductor and includes a substrate and a frame body provided on the substrate, the frame body having a mounting groove.

The input-output terminal 2' includes an insulator 21' and a conductive wiring 22' on the insulator 21', a retention portion 5, and the insulator 21' is mounted at the mounting groove 1.

The wire terminals are electrically connected to the conductive wires 22';

The storage portion 5 is formed by removing a part of the plated wiring 4 having the above-described plated structure, and when the plated wiring 4 is partially removed, there is no electrical connection between the body member and the conductive wiring 22' and between the body member and the wire terminal, as shown in fig. 2 and 16.

After the electroplating operation is completed on the electroplating structure, the part of the electroplating structure, where the electroplating wiring 4 is exposed on the surface of the insulator 21', is cut off, so that the electrical connection between the conductive wiring 22' and the main body is disconnected, and the normal use of the product is ensured while the electroplating operation difficulty of the packaging base is reduced, the production efficiency is improved, and the economic cost is reduced.

The input-output terminal 2 'further includes a metal layer 4', the metal layer 4 'being provided on a surface of the insulator 21' that contacts the body member; at least one or more segments of the retaining portion 5 are provided, and at least a part of the retaining portion 5 is exposed on the surface of the insulator.

The storage part 5 in the package base is cut by the plated wiring 4 in the plated structure, and the position of the cut and the length of the cut can be flexibly set.

The present embodiment provides several specific structural examples:

In some embodiments, the input-output terminal 2 'further includes a metal layer 4', and the metal layer 4 'is disposed on a surface of the insulator 21' that contacts the body member; in other embodiments, referring to fig. 10, the metal layer 4 'may be disposed on the top surface of the insulator 21' in addition to the side and bottom surfaces of the insulator 21', and the metal layer 4' may be indirectly electrically connected to the body member, such as by providing an electrically conductive seal on the top surface.

Referring to fig. 5 and 6, when the plated wire 4 in the plated structure is completely disposed on the surface of the insulator 21, both ends of the plated wire 4 are respectively connected to the conductive wire 22 and the metal layer 23, and the remaining portion after cutting the plated wire 4 forms a retention portion 5 in the package base on the surface of the insulator 21'.

Referring to fig. 11 and 13, the plated wiring 4 of the plated structure is partially inside the insulator 21, partially on the outer surface of the insulator 21, and partially inside the insulator 21 'and partially on the outer surface of the insulator 21' when the corresponding package base is held in place by the holding portion 5.

The electroplating effect is shown here by experimental data.

Fourteen sets of experiments were set up and the specific parameters are shown in table 1.

Table 1 plating line 4 arrangement of each test group

Index test is carried out on the packaging base, and the index test is concretely as follows:

Test index 1: production efficiency (hanging efficiency)

Qualified range:

The testing method comprises the following steps: the time for each 100 corresponding package bases to be manufactured is counted.

Test index 2: integrity of coating

Qualified range: n i coating thickness: 2-9 mu m; au plating thickness: not less than 1.0 μm

The testing method comprises the following steps: and an X-ray fluorescence thickness gauge is adopted to test the thickness of the gold plating layer of the main body part 1 and the bonding pad, so that the gold plating thickness is ensured not to be lower than the lower limit of the product requirement.

Test index 3: short-circuit or open-circuit condition

The testing method comprises the following steps: testing the open circuit and short circuit conditions among all parts of the product by a flying probe tester; electrical connection should be maintained between the substrate 14 and the housing 15 and between the lead terminal 3 and the conductive wiring 22 pattern, and short circuit between the conductive wiring 22 pattern and the housing 15 cannot occur.

Table 2 test results for each test group

Therefore, the main body 1, the input and output terminals 2 and the lead terminals 3 are electrically connected by the electroplating wiring 4, so that the electroplating operation requirement of the packaging base can be met, and the packaging base has higher production efficiency, better plating integrity and fewer short-circuit or open-circuit defects.

The embodiment of the utility model also provides an optical device, which comprises the packaging base and an optical semiconductor element, wherein the optical semiconductor element is arranged in the cavity 13 of the packaging base.

Because the packaging base can reduce the difficulty of electroplating operation, the production efficiency and the economic cost of the whole product of the optical device are improved, and the normal use of the product is ensured.

The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that modifications and substitutions can be made by those skilled in the art without departing from the technical principles of the present utility model, and these modifications and substitutions should also be considered as being within the scope of the present utility model.

Claims

1. An electroplating structure of a package base, comprising:

A wire terminal electrically connected to the conductive wiring;

2. The plating structure of a package base according to claim 1, wherein:

3. The plating structure of a package base according to claim 2, wherein:

4. The plating structure of a package base according to claim 2, wherein said main body member further includes a seal ring provided as a conductor, said seal ring being provided on upper surfaces of said frame body and said insulator, said seal ring and said frame body sandwiching said insulator together;

5. The plating structure of a package base of claim 1, further comprising:

6. The plating structure of a package base according to claim 1, wherein:

7. The package base electroplating structure according to claim 6, wherein:

8. A package base, comprising:

A wire terminal electrically connected to the conductive wiring;

A retention portion formed by removing a portion of the plated wire of the plated structure of any one of claims 1 to 7, the body member having no electrical connection with the conductive wire and the wire terminal.

9. The package base of claim 8, wherein:

10. An optical device, comprising:

the package base of claim 8 or 9;