CN218416806U - Prevent golden finger fever plate structure - Google Patents
Prevent golden finger fever plate structure Download PDFInfo
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- CN218416806U CN218416806U CN202222726373.XU CN202222726373U CN218416806U CN 218416806 U CN218416806 U CN 218416806U CN 202222726373 U CN202222726373 U CN 202222726373U CN 218416806 U CN218416806 U CN 218416806U
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- finger
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- waste material
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Abstract
The utility model relates to the technical field of circuit boards, in particular to a structure for preventing golden fingers from burning, which comprises a circuit board body, wherein a golden finger area and a waste material area are arranged on the circuit board body; the golden finger district is equipped with the circuit finger, circuit finger top pass through the wire with waste material district intercommunication, with current reposition of redundant personnel on the circuit finger extremely waste material district, circuit finger bottom is equipped with the electric current lead wire for conduct the electric current extremely from the bottom circuit finger top, the utility model discloses simple structure, reasonable in design through wire intercommunication circuit finger top and waste material district, makes the high-order electric current district flow to the waste material limit for the electric current in the golden finger district is steady to use, and electroplates more evenly to and through setting up the electric current lead wire, make electric current evenly distributed, reduce local high current and produce, thereby make the circuit finger evenly receive the plating, effectively solve golden finger end burning board and report useless problem.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a prevent golden finger fever plate structure.
Background
The soft board and the thin hard board plug-in fingers are generally applied to circuit boards of mobile phones, flat panels and computers, have the characteristics of thin lines, micro-current, dial-insertion resistance and the like, determine that the gold fingers cannot be processed to be larger in size and higher in precision, and generally adopt large chucks and large current for electroplating during the process of producing circuit boards, so that high-level current is easily caused, the current control is unstable, and the condition that the end of the gold finger burns the board and reports waste is caused.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a prevent golden finger fever board structure, its simple structure, reasonable in design through the circuit optimization, effectively prevents to electroplate and burns the board.
The utility model adopts the technical proposal that:
a structure for preventing golden fingers from being burnt comprises a circuit board body, wherein a golden finger area and a waste material area are arranged on the circuit board body;
the golden finger district is equipped with the circuit finger, circuit finger top pass through the wire with waste material district intercommunication, in order with current shunting on the circuit finger extremely the waste material district, circuit finger bottom is equipped with the electric current lead wire for conduct the electric current from the bottom to the circuit finger top.
In some embodiments, the waste region is located at a top end of the circuit board body.
In some embodiments, a guide plate is further included, the guide plate being in communication with the current lead for draining current to the current lead.
In some embodiments, the system further comprises a floating frame, wherein the floating frame is clamped in the waste material area.
In some embodiments, the current lead introduces a current of 10-20A, and the current precision is 0.01A.
In some embodiments, the size of the wire finger is 0.05-0.10mm.
The utility model has the advantages as follows:
the utility model comprises a circuit board body, wherein a golden finger area and a waste material area are arranged on the circuit board body; the golden finger district is equipped with the circuit finger, circuit finger top pass through the wire with waste material district intercommunication, with current shunt extremely on the circuit finger waste material district, circuit finger bottom is equipped with the electric current lead wire for conduct the electric current extremely from the bottom circuit finger top, the utility model discloses simple structure, reasonable in design through wire intercommunication circuit finger top and waste material district, makes the high-order electric current district flow to the waste material limit for the electric current of using in the golden finger district is steady, electroplates more evenly, and through setting up the electric current lead wire, makes electric current evenly distributed, reduces local high current and produces, thereby makes the even electroplating of circuit finger, effectively solves golden finger end and burns the board and report useless problem.
Drawings
FIG. 1 is a schematic structural view of some embodiments of the present application;
FIG. 2 is a schematic diagram of a prior art finger PCB design with a flexible board and a thin hard board;
description of the reference numerals: the circuit board comprises a circuit board body 1, a golden finger area 2, a waste material area 3, circuit fingers 4, a lead wire 41, a current lead wire 42 and a guide plate 5.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically coupled, may be directly coupled, or may be indirectly coupled through an intermediary. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1, the structure for preventing golden finger from burning includes a circuit board body 1, wherein a golden finger area 2 and a waste area 3 are disposed on the circuit board body 1;
In this embodiment, on the one hand, through wire 41 intercommunication circuit finger 4 top and waste material district 3, make the high-order electric current distinguish and flow to the waste material limit, make the electric current of using in golden finger district 2 steady, it is more even to electroplate, on the other hand, through setting up electric current lead wire 42, make electric current evenly distributed, reduce local high current and produce, thereby make circuit finger 4 evenly receive the plating, in this embodiment, through the optimal design of two aspects, make electroplating current evenly distributed, make circuit finger 4 evenly electroplate, effectively solve golden finger tip burn board and report useless problem.
Referring to fig. 2, the circuit of the circuit board in the prior art is configured, wherein no current is led out from the top end of the finger, and the current is conducted to the top end finger from below through the bottom end lead, and particularly, when the whole PNL is far away from the end of the clip, a high-level current is formed, which causes excessive local electroplating.
In some embodiments, the waste area 3 is located at the top end of the circuit board body 1.
In this embodiment, the waste material area 3 is arranged at the top end of the circuit board body 1, and the lead 41 led out from the circuit finger 4 can be directly communicated to the waste material area 3, so that the high-level current area flows to the waste material side, and thus, the current applied to the effective area is stable, and the electroplating is more uniform.
In some embodiments, a guide plate 5 is further included, the guide plate 5 being in communication with the current lead 42 for draining current to the current lead 42.
In this embodiment, wherein guide board 5, also can be the waste board, through setting up guide board 5, be convenient for further drainage, simultaneously in electroplating process, can also set up the waste board in waste material district 3, electroplating process can pass through the clip, and the waste board that the centre gripping is located waste material district 3 and guide board 5 respectively drain, makes whole circuit board body 1 be located the well electric current district to effectively avoid local high current to produce, cause the electroplating inequality, and burn the board problem.
In some embodiments, the system further comprises a floating frame clamped in the waste area 3.
In this embodiment, through setting up the floating frame, specifically can set up in left side, lower and right three sides of circuit board body 1 to make the waste material limit of floating frame centre gripping waste material district 3, thereby when electroplating, do the drainage to the trilateral high current district of circuit board body 1, make circuit board body 1 be located the medium current district, take place with the burn board condition of effectively avoiding local high current to cause.
In some embodiments, the current lead 42 introduces a current of 10-20A with a current accuracy of 0.01A. In the embodiment, by adopting the current of 10-20A, compared with the current output of 100A adopted in the traditional electroplating, the current is effectively reduced, and the high current region is prevented from being generated to influence the electroplating effect.
In some embodiments, the size of the circuit finger 4 is 0.05-0.10mm, and in this embodiment, the width of the circuit finger 4 is set to be 0.05-0.10mm, so that the circuit finger meets the requirement of a pluggable component on a thin circuit, and the circuit finger has a simple structure and strong practicability.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. A structure for preventing golden fingers from burning is characterized by comprising a circuit board body, wherein a golden finger area and a waste material area are arranged on the circuit board body;
the golden finger district is equipped with the circuit finger, circuit finger top pass through the wire with waste material district intercommunication, in order with current shunting on the circuit finger extremely the waste material district, circuit finger bottom is equipped with the electric current lead wire for conduct the electric current from the bottom to the circuit finger top.
2. The structure of claim 1, wherein the scrap region is located at the top end of the circuit board body.
3. The golden finger burn prevention plate structure according to claim 1, further comprising a guiding plate in communication with the current lead for guiding current to the current lead.
4. The golden finger burn prevention structure of claim 1, further comprising a floating frame, wherein the floating frame is clamped in the waste area.
5. The structure for preventing golden finger from being burned off as claimed in claim 1, wherein the current lead is used for introducing current with the magnitude of 10-20A and the current precision of 0.01A.
6. The structure of claim 1, wherein the size of the circuit finger is 0.05-0.10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222726373.XU CN218416806U (en) | 2022-10-17 | 2022-10-17 | Prevent golden finger fever plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222726373.XU CN218416806U (en) | 2022-10-17 | 2022-10-17 | Prevent golden finger fever plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218416806U true CN218416806U (en) | 2023-01-31 |
Family
ID=85004223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222726373.XU Active CN218416806U (en) | 2022-10-17 | 2022-10-17 | Prevent golden finger fever plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218416806U (en) |
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2022
- 2022-10-17 CN CN202222726373.XU patent/CN218416806U/en active Active
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