CN216980509U - 基板处理装置 - Google Patents

基板处理装置 Download PDF

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Publication number
CN216980509U
CN216980509U CN202220478074.6U CN202220478074U CN216980509U CN 216980509 U CN216980509 U CN 216980509U CN 202220478074 U CN202220478074 U CN 202220478074U CN 216980509 U CN216980509 U CN 216980509U
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CN
China
Prior art keywords
opening
door
sealing member
processing apparatus
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202220478074.6U
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English (en)
Chinese (zh)
Inventor
金炯剟
郑有善
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KCTech Co Ltd
Original Assignee
KCTech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KCTech Co Ltd filed Critical KCTech Co Ltd
Application granted granted Critical
Publication of CN216980509U publication Critical patent/CN216980509U/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/005—Drying solid materials or objects by processes not involving the application of heat by dipping them into or mixing them with a chemical liquid, e.g. organic; chemical, e.g. organic, dewatering aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Polarising Elements (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN202220478074.6U 2021-03-10 2022-03-07 基板处理装置 Active CN216980509U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0031289 2021-03-10
KR1020210031289A KR102681954B1 (ko) 2021-03-10 2021-03-10 기판 처리 장치

Publications (1)

Publication Number Publication Date
CN216980509U true CN216980509U (zh) 2022-07-15

Family

ID=82356154

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220478074.6U Active CN216980509U (zh) 2021-03-10 2022-03-07 基板处理装置

Country Status (2)

Country Link
KR (1) KR102681954B1 (ko)
CN (1) CN216980509U (ko)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010040230A1 (en) * 1999-11-30 2001-11-15 Woo Sik Yoo Compact gate valve
KR20040069449A (ko) * 2003-01-29 2004-08-06 삼성전자주식회사 화학기상증착을 위한 퍼니스 장치
JP2011003689A (ja) * 2009-06-18 2011-01-06 Hitachi Kokusai Electric Inc 基板処理装置
KR20210015056A (ko) * 2019-07-31 2021-02-10 주식회사 케이씨텍 기판 처리 장치

Also Published As

Publication number Publication date
KR20220126940A (ko) 2022-09-19
KR102681954B1 (ko) 2024-07-08

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