CN216960630U

CN216960630U - Be suitable for low temperature and burn ceramic substrate heat abstractor altogether

Info

Publication number: CN216960630U
Application number: CN202220201786.3U
Authority: CN
Inventors: 冷和平; 王炯一; 张斌; 吴辉
Original assignee: Weike Electronic Modules Shenzhen Co ltd
Current assignee: Weike Electronic Modules Shenzhen Co ltd
Priority date: 2022-01-25
Filing date: 2022-01-25
Publication date: 2022-07-12
Anticipated expiration: 2032-01-25

Abstract

The utility model discloses a heat dissipation device suitable for a low-temperature co-fired ceramic substrate, which comprises a substrate body and a heat dissipation cover, wherein the top of the substrate body is fixedly connected with a support frame, four corners of the support frame are fixedly connected with positioning columns, the heat dissipation cover is provided with positioning grooves corresponding to the positioning columns, the heat dissipation cover is provided with a mounting port, a heat dissipation fan is fixedly connected in the mounting port, the outer side wall of the heat dissipation cover close to the positioning grooves is fixedly connected with a vertical plate, clamping rods are slidably inserted on the vertical plate, the outer side wall of the positioning column is provided with clamping grooves corresponding to the clamping rods, one end of the clamping rods far away from the positioning columns is fixedly connected with a limiting plate, the top of the vertical plate is fixedly connected with a horizontal plate, and fixing rods are slidably inserted on the horizontal plate. Thereby make the clearance overhaul more convenient, be fit for using widely.

Description

Be suitable for low temperature and burn ceramic substrate heat abstractor altogether

Technical Field

The utility model relates to the field of low-temperature co-fired ceramic related products, in particular to a heat dissipation device applicable to a low-temperature co-fired ceramic substrate.

Background

The low-temperature co-fired ceramic technology is an attractive multidisciplinary cross integrated component technology in recent years, and relates to a wide field of circuit design, material science, microwave technology and the like. It is a technology for realizing high-integration, high-performance electronic packages, offering great potential in terms of design flexibility, wiring density, and reliability. As it provides a better solution for miniaturization and lightweight of components and modules of various electronic systems in the information age, the low-temperature co-fired ceramic substrate is more and more emphasized domestically and internationally, is widely applied to substrate materials, packaging materials, microwave device materials and the like, along with rapid development of microelectronic technology and continuous improvement of manufacturing processes, the integration level of the low-temperature co-fired ceramic substrate is higher and higher, the size is smaller and smaller, and the running speed is faster and faster, so that the low-temperature co-fired ceramic substrate generates more heat during working to increase the temperature, and if the heat is not dissipated in time, the performance of the low-temperature co-fired ceramic substrate can be reduced and even burnt out.

However, the heat dissipation mechanism of the existing heat dissipation device for low-temperature co-fired ceramic substrates is usually fixed by screws, and is cumbersome to disassemble and assemble when needing to be cleaned and repaired, and has defects.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a heat dissipation device for low temperature co-fired ceramic substrates, so as to solve the above problems in the prior art.

In order to achieve the purpose, the utility model provides the following technical scheme: a heat dissipation device suitable for low-temperature co-fired ceramic substrates comprises a substrate body and a heat dissipation cover, wherein the top of the substrate body is fixedly connected with a supporting frame, positioning columns are fixedly connected with four corners of the supporting frame, positioning grooves corresponding to the positioning columns are arranged on the heat dissipation cover, the heat radiating cover is provided with a mounting opening, a heat radiating fan is fixedly connected in the mounting opening, a vertical plate is fixedly connected on the outer side wall of the heat radiating cover close to the positioning groove, a clamping rod is slidably inserted on the vertical plate, a clamping groove corresponding to the clamping rod is arranged on the outer side wall of the positioning column, a limiting plate is fixedly connected at one end of the clamping rod away from the positioning column, a transverse plate is fixedly connected at the top of the vertical plate, the transverse plate is slidably inserted with a fixing rod, the top of the limiting plate is provided with a fixing groove corresponding to the fixing rod, and one end of the fixing rod close to the limiting plate is fixedly sleeved with an anti-falling block.

Preferably, the fixed rod is sleeved with a spring, and two ends of the spring are respectively and fixedly connected with the anti-falling block and the transverse plate.

Preferably, one end of the fixing rod, which is far away from the anti-falling block, is fixedly connected with a pull ring.

Preferably, the heat dissipation fan is fixedly installed at a middle end of the heat dissipation cover.

Preferably, a limiting sleeve is fixedly sleeved on one end, close to the positioning column, of the clamping rod.

Compared with the prior art, the utility model has the beneficial effects that:

this be suitable for low temperature and burn ceramic substrate heat abstractor altogether, overall structure simple to operate can be convenient for carry out the dismouting to heat dissipation mechanism through the joint subassembly to it is more convenient to make the clearance overhaul, is fit for using widely.

Drawings

FIG. 1 is a schematic top view of a heat sink for a low temperature co-fired ceramic substrate according to the present invention;

FIG. 2 is a schematic diagram of a side view of a heat sink suitable for a low temperature co-fired ceramic substrate according to the present invention;

fig. 3 is an enlarged view of a portion a of fig. 2 of a heat dissipation device for a low temperature co-fired ceramic substrate according to the present invention.

In the figure: 1. a substrate body; 2. a heat dissipation cover; 3. a support frame; 4. a positioning column; 5. a heat radiation fan; 6. a vertical plate; 7. a clamping rod; 8. a limiting plate; 9. a transverse plate; 10. a fixing rod; 11. an anti-drop block; 12. a spring; 13. a pull ring; 14. a limiting sleeve.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-3, an embodiment of the present invention is shown: a heat dissipation device suitable for a low-temperature co-fired ceramic substrate comprises a substrate body 1 and a heat dissipation cover 2, wherein the top of the substrate body 1 is fixedly connected with a support frame 3, four corners of the support frame 3 are fixedly connected with positioning columns 4, the heat dissipation cover 2 is provided with positioning grooves corresponding to the positioning columns 4, the heat dissipation cover 2 is provided with a mounting port, a heat dissipation fan 5 is fixedly connected in the mounting port, the outer side wall of the heat dissipation cover 2 close to the positioning grooves is fixedly connected with a vertical plate 6, clamping rods 7 are slidably inserted on the vertical plate 6, the outer side wall of the positioning column 4 is provided with clamping grooves corresponding to the clamping rods 7, one end of each clamping rod 7 far away from the positioning column 4 is fixedly connected with a limiting plate 8, the top of the vertical plate 6 is fixedly connected with a horizontal plate 9, a fixing rod 10 is slidably inserted on the horizontal plate 9, the top of the limiting plate 8 is provided with a fixing groove corresponding to the fixing rod 10, one end of the fixing rod 10 close to the limiting plate 8 is fixedly sleeved with an anti-falling block 11, specifically, thereby the constant head tank on the cooling lid 2 is aimed at reference column 4 on the carriage 3 and is inserted and establish the top at base plate body 1 with cooling lid 2 card, slide the draw-in groove that card pole 7 on the riser 6 on later and realize cooling lid 2 in inserting the reference column 4 fixed mounting, insert the spacing inslot on the limiting plate 8 through dead lever 10 on the slip diaphragm 9 and realize limiting plate 8's fixed position, dispel the high temperature of the operation of base plate body 1 through the radiator fan 5 that starts on the cooling lid 2.

In this embodiment, the fixing rod 10 is sleeved with a spring 12, two ends of the spring 12 are respectively fixedly connected with the anti-falling block 11 and the transverse plate 9, and the fixing rod 10 can rebound to the fixing groove through resilience force of the spring 12; a pull ring 13 is fixedly connected to one end of the fixing rod 10, which is far away from the anti-falling block 11, so that the fixing rod 10 can be conveniently pulled; the heat radiation fan 5 is fixedly arranged at the middle end of the heat radiation cover 2; a limiting sleeve 14 is fixedly sleeved on one end, close to the positioning column 4, of the clamping rod 7, and the clamping position of the clamping rod 7 is limited.

The working principle is as follows: thereby at first aim at reference column 4 on the carriage 3 through the constant head tank on the cooling lid 2 and insert and establish the cooling lid 2 card in the top of base plate body 1, slide the draw-in groove that card pole 7 on the riser 6 and insert on reference column 4 afterwards and realize the fixed mounting of cooling lid 2, insert the spacing inslot on the limiting plate 8 through dead lever 10 on the slip diaphragm 9 and realize the rigidity of limiting plate 8, dispel the high temperature of 1 operation of base plate body through the radiator fan 5 that starts on the cooling lid 2.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a be suitable for low temperature and burn ceramic substrate heat abstractor altogether, includes substrate body (1) and heat dissipation lid (2), its characterized in that: the top of the base plate body (1) is fixedly connected with a supporting frame (3), four corners of the supporting frame (3) are fixedly connected with positioning columns (4), positioning grooves corresponding to the positioning columns (4) are formed in the heat dissipation cover (2), an installation opening is formed in the heat dissipation cover (2), a heat dissipation fan (5) is fixedly connected in the installation opening, a vertical plate (6) is fixedly connected on the outer side wall, close to the positioning grooves, of the heat dissipation cover (2), clamping rods (7) are slidably inserted in the vertical plate (6), clamping grooves corresponding to the clamping rods (7) are formed in the outer side wall of the positioning column (4), one end, away from the positioning columns (4), of each clamping rod (7) is fixedly connected with a limiting plate (8), a transverse plate (9) is fixedly connected to the top of each vertical plate (6), a fixing rod (10) is slidably inserted in each transverse plate (9), and fixing grooves corresponding to the fixing rods (10) are formed in the top of each limiting plate (8), an anti-drop block (11) is fixedly sleeved on one end of the fixed rod (10) close to the limiting plate (8).

2. The heat dissipation device of claim 1, wherein: the fixing rod (10) is sleeved with a spring (12), and two ends of the spring (12) are respectively and fixedly connected with the anti-falling block (11) and the transverse plate (9).

3. The heat sink adapted for use with a low temperature co-fired ceramic substrate of claim 1, wherein: one end of the fixing rod (10) far away from the anti-falling block (11) is fixedly connected with a pull ring (13).

4. The heat sink adapted for use with a low temperature co-fired ceramic substrate of claim 1, wherein: the heat radiation fan (5) is fixedly arranged at the middle end of the heat radiation cover (2).

5. The heat sink adapted for use with a low temperature co-fired ceramic substrate of claim 1, wherein: and a limiting sleeve (14) is fixedly sleeved on one end of the clamping rod (7) close to the positioning column (4).