CN216960613U - Heat dissipation device of acousto-optic linkage controller - Google Patents

Heat dissipation device of acousto-optic linkage controller Download PDF

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Publication number
CN216960613U
CN216960613U CN202123441681.XU CN202123441681U CN216960613U CN 216960613 U CN216960613 U CN 216960613U CN 202123441681 U CN202123441681 U CN 202123441681U CN 216960613 U CN216960613 U CN 216960613U
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China
Prior art keywords
heat
acousto
dissipation device
linkage controller
heat dissipation
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CN202123441681.XU
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Chinese (zh)
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高伟峰
钟能能
谢尧寰
许晓程
高康
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Shanghai Qingjin Photoelectron Technology Co ltd
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Shanghai Qingjin Photoelectron Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/40Control techniques providing energy savings, e.g. smart controller or presence detection

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Abstract

The utility model relates to the technical field of electronic devices, in particular to a heat dissipation device of an acousto-optic linkage controller, which comprises a main body, wherein heat conduction equipment is arranged in an inner cavity of the main body, the heat conduction equipment is attached to an electrical element in the main body and dissipates heat of the electrical element through the heat conduction equipment, grid plates are arranged on two sides of the main body, and heat in the main body is led out through the grid plates. Derive the produced heat of the inside electron device of main part through heat conduction equipment, and then avoid electron device high temperature, lead to the inside damage that takes place of electron device, thereby the effectual life that improves electron device, and the effectual probability that reduces electron device's damage, simultaneously through closely laminating between heat conduction ball and the fin, the cooking that electron device derived the heat, and then accelerate the gaseous velocity of flow of heat pipe inside through power device cooperation blade, and then accelerate refrigerated efficiency.

Description

Heat dissipation device of acousto-optic linkage controller
Technical Field
The utility model relates to the technical field of electronic devices, especially, relate to a heat abstractor of reputation coordinated control ware.
Background
The traditional sound and light control switch belongs to a frequent on-off switch device. In many occasions, such as underground parking lots, toilets, farmyard yards and the like, the device not only has the function of switching on or off for a long time, but also has the function of conveniently and briefly controlling the on and off by sound and light. However, after the acousto-optic sensor works for a long time, the heating phenomenon is common, especially when the acousto-optic sensor is used in summer, electronic elements in the controller generate heat seriously, most of the electronic elements are allowed to stand still to dissipate heat naturally, the heat dissipation effect is poor, electrical elements are easy to damage after long-time use, and the service life of the controller can be shortened due to continuous high temperature.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems existing in the prior art, the heat dissipation device of the acousto-optic linkage controller is provided.
The design is a heat dissipation device of an acousto-optic linkage controller, which comprises a main body, heat conduction equipment is installed in an inner cavity of the main body, and the heat conduction equipment is attached to an electrical element inside the main body and dissipates heat to the electrical element through the heat conduction equipment, grid plates are installed on two sides of the main body, and the grid plates are used for guiding out heat inside the main body.
As a further description of the above technical solution: the heat conducting equipment comprises a heat conducting plate, and two sleeves are assembled in the inner cavity of the heat conducting plate.
As a further description of the above technical solution: and a heat conduction pipe is assembled between the two sleeves.
As a further description of the above technical solution: and a plurality of fins are arranged on the outer surface of the heat conduction pipe.
As a further description of the above technical solution: the fins are arranged in a multi-section adjacent staggered mode.
As a further description of the above technical solution: and a heat conducting ball is arranged in the inner cavity of the heat conducting plate and outside the heat conducting pipe.
As a further description of the above technical solution: the outer surface of the heat conducting ball is attached to the fin.
As a further description of the above technical solution: one end of the fin penetrates through the heat conduction pipe and extends to the interior of the heat conduction pipe.
As a further description of the above technical solution: and a power device is arranged in the inner cavity of the sleeve.
As a further description of the above technical solution: the output end of the power device is provided with a blade through a speed reducer.
The technical scheme has the following advantages or beneficial effects:
derive the produced heat of the inside electron device of main part through heat conduction equipment, and then avoid electron device high temperature, lead to the inside damage that takes place of electron device, thereby the effectual life that improves electron device, and the effectual probability that reduces electron device's damage, simultaneously through closely laminating between heat conduction ball and the fin, the cooking that electron device derived the heat, and then accelerate the gaseous velocity of flow of heat pipe inside through power device cooperation blade, and then accelerate refrigerated efficiency.
Drawings
Embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings. The drawings are only for purposes of illustration and description, and are not intended to limit the scope of the present disclosure.
FIG. 1 is a perspective view of an external structure of an embodiment of the present invention;
FIG. 2 is a front view of the internal structure of the heat conducting apparatus according to the embodiment of the present invention;
FIG. 3 is a perspective view of an external structure of a heat pipe according to an embodiment of the present invention;
FIG. 4 is a perspective view of the external structure of the sleeve according to the embodiment of the present invention.
The above reference numerals denote: 1. a main body; 2. a heat conducting device; 3. a grid plate; 21. a heat conducting plate; 22. a sleeve; 23. a heat conducting pipe; 24. a fin; 25. a heat conducting ball; 26. a power plant; 27. a blade.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, a heat abstractor of reputation coordinated control ware, includes main part 1, and heat conduction equipment 2 is installed to the inner chamber of main part 1, and heat conduction equipment 2 and the laminating of the inside electrical components of main part 1 to dispel the heat to electrical components through heat conduction equipment 2, grid plate 3 is all installed to the both sides of main part 1, exports the heat of main part 1 inside through grid plate 3.
The heat generated by the electronic device in the main body 1 is conducted out through the heat conducting equipment 2, and further the phenomenon that the electronic device is damaged due to overhigh temperature is avoided.
As shown in fig. 2, based on the above technical solution, further describing the heat conducting device 2, the heat conducting device 2 includes a heat conducting plate 21, and two sleeves 22 are assembled in an inner cavity of the heat conducting plate 21. A heat conductive pipe 23 is fitted between the two sleeves 22. A plurality of fins 24 are attached to the outer surface of the heat transfer pipe 23. The fins 24 are arranged in a plurality of adjacent staggered sections.
The heat generated by the electronic components is conducted away by the fins 24 fitted on the heat conductive pipes 23.
As shown in fig. 3, in addition to the above technical solution, the heat conducting plate 21 is further described, and the heat conducting ball 25 is disposed in the inner cavity of the heat conducting plate 21 and outside the heat conducting pipe 23. The outer surface of the thermally conductive ball 25 is fitted to the fin 24. One end of the fin 24 penetrates the heat transfer pipe 23 and extends into the heat transfer pipe 23.
The heat generated from the electronic component is transferred out through the heat conductive balls 25 between the heat conductive plate 21 and the heat conductive pipe 23, and the transferred heat is conducted to the inside of the heat conductive pipe 23 through the fins 24.
As shown in fig. 4, based on the above technical solution, the sleeve 22 is further described, and the power device 26 is installed in the inner cavity of the sleeve 22. The output of the power unit 26 is fitted with blades 27 via a speed reducer.
The power device 26 and the blades 27 in the sleeve 22 accelerate the air flow speed in the heat conducting pipe 23, and then the heat is rapidly led out.
The working principle is as follows: when the device is used, the power device 26 is started and drives the blades 27 to rotate, heat generated by the electronic device is transferred out through the heat conducting balls 25 between the heat conducting plate 21 and the heat conducting pipe 23, the transferred heat is conducted into the heat conducting pipe 23 through the fins 24, and meanwhile, the flow velocity of gas in the heat conducting pipe 23 is increased through wind power generated by the power device 26 and the blades 27, and the cooling efficiency of the electronic device is further increased.
The above description is only an example of the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and it should be understood that all modifications and obvious variations of the present invention, which are equivalent to those of the present invention and illustrated in the drawings, should be included in the scope of the present invention.

Claims (10)

1. The utility model provides a heat abstractor of reputation coordinated control ware which characterized in that: including main part (1), heat-conducting equipment (2) is installed to the inner chamber of main part (1), just heat-conducting equipment (2) with the laminating of main part (1) inside electrical components, and pass through heat-conducting equipment (2) dispels the heat to electrical components, grid plate (3) are all installed to the both sides of main part (1), through grid plate (3) will the inside heat of main part (1) is derived.
2. The heat dissipation device of an acousto-optic linkage controller according to claim 1, wherein: the heat conducting device (2) comprises a heat conducting plate (21), and the inner cavity of the heat conducting plate (21) is provided with two sleeves (22).
3. The heat dissipation device of an acousto-optic linkage controller according to claim 2, wherein: a heat conducting pipe (23) is assembled between the two sleeves (22).
4. The heat dissipation device of an acousto-optic linkage controller according to claim 3, wherein: a plurality of fins (24) are attached to the outer surface of the heat transfer pipe (23).
5. The heat dissipation device of an acousto-optic linkage controller according to claim 4, wherein: the fins (24) are arranged in a multi-section adjacent staggered mode.
6. The heat dissipation device of an acousto-optic linkage controller according to claim 4, wherein: and a heat conduction ball (25) is arranged in the inner cavity of the heat conduction plate (21) and outside the heat conduction pipe (23).
7. The heat dissipation device of an acousto-optic linkage controller according to claim 6, wherein: the outer surface of the heat conducting ball (25) is attached to the fin (24).
8. The heat dissipation device of an acousto-optic linkage controller according to claim 4, wherein: one end of the fin (24) penetrates the heat conductive pipe (23) and extends into the heat conductive pipe (23).
9. The heat dissipation device of an acousto-optic linkage controller according to claim 2, wherein: the inner cavity of the sleeve (22) is provided with a power device (26).
10. The heat dissipation device of an acousto-optic linkage controller according to claim 9, wherein: the output end of the power device (26) is provided with a blade (27) through a speed reducer.
CN202123441681.XU 2021-12-31 2021-12-31 Heat dissipation device of acousto-optic linkage controller Active CN216960613U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123441681.XU CN216960613U (en) 2021-12-31 2021-12-31 Heat dissipation device of acousto-optic linkage controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123441681.XU CN216960613U (en) 2021-12-31 2021-12-31 Heat dissipation device of acousto-optic linkage controller

Publications (1)

Publication Number Publication Date
CN216960613U true CN216960613U (en) 2022-07-12

Family

ID=82313613

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202123441681.XU Active CN216960613U (en) 2021-12-31 2021-12-31 Heat dissipation device of acousto-optic linkage controller

Country Status (1)

Country Link
CN (1) CN216960613U (en)

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