CN212462408U - Heat radiation assembly for power distribution cabinet - Google Patents
Heat radiation assembly for power distribution cabinet Download PDFInfo
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- CN212462408U CN212462408U CN202021149807.9U CN202021149807U CN212462408U CN 212462408 U CN212462408 U CN 212462408U CN 202021149807 U CN202021149807 U CN 202021149807U CN 212462408 U CN212462408 U CN 212462408U
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- heat
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- cavity
- air inlet
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- 230000005855 radiation Effects 0.000 title claims description 4
- 238000005192 partition Methods 0.000 claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims 1
- 238000005057 refrigeration Methods 0.000 abstract description 12
- 238000001816 cooling Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
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Abstract
The utility model discloses a radiator unit for switch board relates to power equipment technical field. The utility model comprises a cabinet body, wherein side plates are arranged on both sides of the cabinet body; a heat conducting partition plate is arranged on one side of the side plate close to the inner part of the cabinet body; an air inlet cavity is arranged between the top of the side plate and the heat-conducting partition plate; an air collecting cavity is arranged between the bottom of the side plate and the heat conducting partition plate; heat-conducting fins are arranged in the cavity between the side plates and the heat-conducting partition plate in an array mode; semiconductor refrigerating pieces are arranged on the side, away from the side plate, of the heat-conducting partition plate in an array manner; the top of the air collecting cavity is communicated with an air outlet pipe; an air inlet pipe is communicated with the peripheral side surface of the air outlet pipe and positioned between the two adjacent semiconductor refrigeration sheets. The utility model discloses a semiconductor refrigeration piece circular telegram back is to the internal cooling that refrigerates of cabinet, and adopts the heat dissipation channel that heat conduction baffle and heat conduction fin constitute to carry out high-efficient heat dissipation to the semiconductor refrigeration piece, can't effectively cool down the switch board when avoiding the ambient temperature higher, has reduced holistic temperature in the switch board, has improved the radiating efficiency of switch board.
Description
Technical Field
The utility model belongs to the technical field of power equipment, especially, relate to a radiator unit for switch board.
Background
A large amount of connectors and various electronic components have been installed in the switch board to there is the existence of a large amount of wires, and the total resistance value that leads to the switch board is very high, consequently can give out a large amount of heats under the electrically conductive condition, and the heat if can not obtain effectual processing, will lead to the power device in the switch board to damage because of high temperature, so the switch board generally all can be to the cooling of dispelling the heat in the cabinet.
Traditional switch board all utilizes gas vent or air discharge fan to come from the line heat dissipation, can only dispel the heat to specific position, and when ambient temperature was higher, adopts the structural design of gas vent or air discharge fan to dispel the heat to the switch board, and the radiating effect is relatively poor, can't obtain anticipated radiating effect.
Disclosure of Invention
An object of the utility model is to provide a radiating component for switch board refrigerates the cooling to the internal of cabinet through semiconductor refrigeration piece circular telegram back, and adopts the heat dissipation channel that heat conduction baffle and heat conduction fin constitute to carry out high-efficient heat dissipation to the semiconductor refrigeration piece, has solved the relatively poor problem of current switch board radiating effect.
In order to solve the technical problem, the utility model discloses a realize through following technical scheme:
the utility model relates to a heat radiation component for a power distribution cabinet, which comprises a cabinet body, wherein two sides of the cabinet body are both provided with side plates; a heat conduction partition plate is arranged on one side of the side plate close to the inner part of the cabinet body; a cavity structure is formed between the side face and the heat-conducting partition plate; an air inlet cavity is arranged between the top of the side plate and the heat-conducting partition plate; an air collecting cavity is arranged between the bottom of the side plate and the heat conducting partition plate; heat-conducting fins are arranged in the cavity between the side plate and the heat-conducting partition plate and between the air inlet cavity and the air collecting cavity in an array manner; semiconductor refrigerating pieces are arranged on the side, away from the side plate, of the heat-conducting partition plate in an array manner; the top of the air collecting cavity is communicated with a plurality of air outlet pipes; the plurality of air outlet pipes penetrate through the semiconductor refrigerating sheet; an air inlet pipe is communicated with the peripheral side surface of the air outlet pipe and is positioned between the two adjacent semiconductor refrigerating sheets; the bottom of the joint of the inner part of the air inlet pipe and the air inlet pipe is provided with a conical sleeve.
Furthermore, a plurality of heat dissipation channels are partitioned by the cavity between the side plate and the heat conduction partition plate through heat conduction fins; and two ends of the heat dissipation channel are communicated with the air inlet cavity and the air collecting cavity respectively.
Further, an air pump is arranged inside the air collecting cavity; the air outlet end of the air pump is communicated with the air outlet pipe through the multi-way connector respectively.
Further, the smaller end of the port of the conical sleeve faces the air inlet pipe.
Furthermore, a ventilator is arranged at the opening end of the air inlet cavity.
Furthermore, one end, far away from the air collecting cavity, of the air outlet pipe penetrates through the cabinet body and extends to the outer side of the cabinet body.
The utility model discloses following beneficial effect has:
1. the utility model discloses a semiconductor refrigeration piece circular telegram back is to the internal cooling that refrigerates of cabinet, and adopts the heat dissipation channel that heat conduction baffle and heat conduction fin constitute to carry out high-efficient heat dissipation to the semiconductor refrigeration piece, avoids adopting gas vent or air discharge fan to ventilate when ambient temperature is higher and can't effectively cool down to the switch board, and refrigerates simultaneously in cabinet body both sides and cool down cabinet internal plant, has reduced holistic temperature in the switch board.
2. The utility model discloses a steam that the air pump will flow in the heat dissipation channel is from going out the high-speed discharge of tuber pipe to produce the negative pressure at the less end of toper sleeve pipe, adsorb the internal partial steam of cabinet and derive, increase the circulation of the internal air of cabinet, guarantee that the internal steam of cabinet fully contacts the cooling with the semiconductor refrigeration piece, and hot-air when going out the high-speed flow of tuber pipe, can derive the cabinet body to the partial heat in semiconductor refrigeration piece hot junction, further improved the radiating efficiency of switch board.
Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a heat dissipation assembly for a power distribution cabinet according to the present invention;
FIG. 2 is a schematic view of a cross-sectional vertical cross-section of a side plate, a heat-conducting partition plate, and heat-conducting fins;
FIG. 3 is a cross-sectional structural schematic view of a lateral cross-section of a side plate, a thermally conductive spacer and thermally conductive fins;
FIG. 4 is an enlarged view of the structure at A in FIG. 3;
in the drawings, the components represented by the respective reference numerals are listed below:
1-cabinet body, 2-side plate, 3-heat conduction partition plate, 4-air inlet cavity, 5-air collecting cavity, 6-heat conduction fin, 7-air outlet pipe, 8-air inlet pipe, 9-conical sleeve, 10-heat dissipation channel, 11-air pump, 12-ventilator, 13-semiconductor refrigeration piece.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-4, the utility model relates to a heat dissipation assembly for a power distribution cabinet, which comprises a cabinet body 1, wherein two sides of the cabinet body 1 are respectively provided with a side plate 2;
a heat conducting partition plate 3 is arranged on one side of the side plate 2 close to the inner part of the cabinet body 1; a cavity structure is formed between the side surface 2 and the heat-conducting partition plate 3;
an air inlet cavity 4 is arranged between the top of the side plate 2 and the heat conducting partition plate 3, and air outside the cabinet body 1 enters from the air inlet cavity 4; an air collecting cavity 5 is arranged between the bottom of the side plate 2 and the heat conducting partition plate 3; heat-conducting fins 6 are arranged in the cavity between the side plate 2 and the heat-conducting partition plate 3 and between the air inlet cavity 4 and the air collecting cavity 5 in an array manner;
the top of the air collection cavity 5 is communicated with three air outlet pipes 7; the three air outlet pipes 7 penetrate through the semiconductor refrigerating sheet 13; an air inlet pipe 8 is communicated with the peripheral side surface of the air outlet pipe 7 and is positioned between the two adjacent semiconductor refrigerating sheets 13;
the bottom of the joint of the interior of the air inlet pipe 8 and the air inlet pipe 8 is provided with a conical sleeve 9.
Wherein, a plurality of heat dissipation channels 10 are partitioned by the heat conduction fins 6 in the cavity between the side plate 2 and the heat conduction partition plate 3; two ends of the heat dissipation channel 10 are respectively communicated with the air inlet cavity 4 and the air collection cavity 5.
Wherein, an air pump 11 is arranged inside the air collecting cavity 5; the air outlet end of the air pump 11 is respectively communicated with the air outlet pipe 7 through a multi-way joint, and the hot air transmitted in the heat dissipation channel 10 by the air pump 11 is discharged out of the cabinet body 1 through the air outlet pipe 7.
The smaller end of the port of the conical sleeve 9 faces the air inlet pipe 8, when hot air flowing at high speed in the air outlet pipe 7 passes through the conical sleeve 9, negative pressure is formed at the smaller end of the port of the conical sleeve 7 of the air outlet pipe 7, the negative pressure can adsorb the hot air in the cabinet body 1 through the air inlet pipe 7, and the air flowing in the cabinet body 1 is increased.
Wherein, the open end of the air inlet cavity 4 is provided with a ventilator 12, the ventilator 12 forces the air outside the cabinet body 1 into the air inlet cavity 4, and the heat transfer is carried out when the air passes through the heat dissipation channel 10 formed by the heat conduction fins 6 and the heat conduction partition plate 3.
Wherein, the one end of air-out pipe 7 is kept away from wind collection chamber 5 and is run through cabinet body 1 and extend to the cabinet body 1 outside.
One specific application of this embodiment is: during heat dissipation, after the semiconductor refrigeration sheet 13 is powered on, one side close to the heat-conducting partition plate 3 is a hot end, and transmits heat into the heat-conducting partition plate 3 and the heat-conducting fins 6, and one side far away from the heat-conducting partition plate 3 is a cold end, and can contact with hot air in the cabinet body 1 to carry out cooling treatment, the ventilator 12 forcibly guides air outside the cabinet body 1 into the air inlet cavity 4 and transmits the air into the heat-radiating channel 10 formed by the heat-conducting fins 6 and the heat-conducting partition plate 3 in an enclosing manner, when the air flows in the heat-radiating channel 10, the heat in the heat-conducting fins 6 and the heat-conducting partition plate 3 is carried, transmitted and collected into the air collecting cavity 5, the air pump 11 in the air collecting cavity 5 flows the hot air through the air outlet pipe 7 at high speed, when the hot air flows at high speed, partial heat at the hot end of the semiconductor refrigeration sheet 13 can be guided out of the cabinet body 1, when the, the negative pressure passes through air-supply line 7 and can adsorb the interior hot-air of the cabinet body 1, increases the flow of the interior air of the cabinet body 1, has further improved the radiating efficiency of switch board.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.
Claims (6)
1. A heat radiation component for a power distribution cabinet comprises a cabinet body (1),
the method is characterized in that:
side plates (2) are arranged on two sides of the cabinet body (1);
a heat-conducting partition plate (3) is arranged on one side of the side plate (2) close to the inner part of the cabinet body (1); a cavity structure is formed between the side plate (2) and the heat-conducting partition plate (3);
an air inlet cavity (4) is arranged between the top of the side plate (2) and the heat-conducting partition plate (3); a wind collecting cavity (5) is arranged between the bottom of the side plate (2) and the heat conducting partition plate (3); heat-conducting fins (6) are arranged in a cavity between the side plate (2) and the heat-conducting partition plate (3) and between the air inlet cavity (4) and the air collecting cavity (5) in an array manner;
semiconductor refrigerating pieces (13) are arranged on one side, far away from the side plate (2), of the heat-conducting partition plate (3) in an array manner;
the top of the air collecting cavity (5) is communicated with a plurality of air outlet pipes (7); the air outlet pipes (7) penetrate through the semiconductor refrigerating sheet (13); an air inlet pipe (8) is communicated with the peripheral side surface of the air outlet pipe (7) and is positioned between the two adjacent semiconductor refrigerating sheets (13);
the bottom of the joint of the interior of the air inlet pipe (8) and the air inlet pipe (8) is provided with a conical sleeve (9).
2. The heat dissipation assembly for the power distribution cabinet according to claim 1, wherein the cavity between the side plate (2) and the heat-conducting partition plate (3) is partitioned into a plurality of heat dissipation channels (10) by heat-conducting fins (6); and two ends of the heat dissipation channel (10) are respectively communicated with the air inlet cavity (4) and the air collecting cavity (5).
3. The heat dissipation assembly for the power distribution cabinet according to claim 1, wherein an air pump (11) is arranged inside the air collection chamber (5); the air outlet end of the air pump (11) is respectively communicated with the air outlet pipe (7) through a multi-way joint.
4. The heat-dissipating assembly for power distribution cabinets according to claim 1, characterized in that the smaller end of the port of said tapered sleeve (9) faces the air inlet duct (8).
5. The heat dissipation assembly for power distribution cabinets according to claim 1, characterized in that the open end of the air inlet chamber (4) is provided with a ventilator (12).
6. The heat dissipation assembly for the power distribution cabinet according to claim 1, wherein one end of the air outlet pipe (7) far away from the air collection cavity (5) penetrates through the cabinet body (1) and extends to the outer side of the cabinet body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021149807.9U CN212462408U (en) | 2020-06-19 | 2020-06-19 | Heat radiation assembly for power distribution cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021149807.9U CN212462408U (en) | 2020-06-19 | 2020-06-19 | Heat radiation assembly for power distribution cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212462408U true CN212462408U (en) | 2021-02-02 |
Family
ID=74469724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021149807.9U Active CN212462408U (en) | 2020-06-19 | 2020-06-19 | Heat radiation assembly for power distribution cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212462408U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113364205A (en) * | 2021-07-02 | 2021-09-07 | 湖北欧阳华俊专用汽车有限公司 | Quick radiating electricity generation dolly |
-
2020
- 2020-06-19 CN CN202021149807.9U patent/CN212462408U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113364205A (en) * | 2021-07-02 | 2021-09-07 | 湖北欧阳华俊专用汽车有限公司 | Quick radiating electricity generation dolly |
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Effective date of registration: 20240111 Address after: 841000 Awati Farm Second Branch, Korla City, Bayingolin Mongolian Autonomous Prefecture, Xinjiang Uygur Autonomous Region Patentee after: Bazhou Xinhongguang Electrical Equipment Co.,Ltd. Address before: 324000 No. 17, Xinglin Road, Kecheng District, Quzhou City, Zhejiang Province Patentee before: ZHEJIANG FURUITE POWER TECHNOLOGY CO.,LTD. Effective date of registration: 20240111 Address after: 324000 No. 17, Xinglin Road, Kecheng District, Quzhou City, Zhejiang Province Patentee after: ZHEJIANG FURUITE POWER TECHNOLOGY CO.,LTD. Address before: 324002 78 Baihua North Road, Baiyun Street, Kecheng District, Quzhou, Zhejiang Patentee before: QUZHOU University |