CN216958649U - 外接防水装置 - Google Patents
外接防水装置 Download PDFInfo
- Publication number
- CN216958649U CN216958649U CN202122128197.5U CN202122128197U CN216958649U CN 216958649 U CN216958649 U CN 216958649U CN 202122128197 U CN202122128197 U CN 202122128197U CN 216958649 U CN216958649 U CN 216958649U
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- China
- Prior art keywords
- waterproof
- external
- silica gel
- silicone rubber
- jack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000000741 silica gel Substances 0.000 claims abstract description 39
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 39
- 239000011148 porous material Substances 0.000 claims abstract description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 16
- 239000004945 silicone rubber Substances 0.000 claims description 15
- 238000001746 injection moulding Methods 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 description 10
- 238000007789 sealing Methods 0.000 description 7
- 239000000499 gel Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202122128197.5U CN216958649U (zh) | 2021-09-03 | 2021-09-03 | 外接防水装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122128197.5U CN216958649U (zh) | 2021-09-03 | 2021-09-03 | 外接防水装置 |
Publications (1)
Publication Number | Publication Date |
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CN216958649U true CN216958649U (zh) | 2022-07-12 |
Family
ID=82288299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202122128197.5U Active CN216958649U (zh) | 2021-09-03 | 2021-09-03 | 外接防水装置 |
Country Status (1)
Country | Link |
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CN (1) | CN216958649U (zh) |
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2021
- 2021-09-03 CN CN202122128197.5U patent/CN216958649U/zh active Active
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Legal Events
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Room 903, convenience service center, Jiaodong sub district office, Jiaozhou City, Qingdao City, Shandong Province, 266300 Patentee after: Qingdao Zhixin Semiconductor Technology Co.,Ltd. Patentee after: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY Co.,Ltd. Patentee after: STATE GRID CORPORATION OF CHINA Patentee after: STATE GRID INFORMATION & TELECOMMUNICATION GROUP Co.,Ltd. Address before: Room 903, convenience service center, Jiaodong sub district office, Jiaozhou City, Qingdao City, Shandong Province, 266300 Patentee before: State Grid Sigi Ziguang (Qingdao) Microelectronics Technology Co.,Ltd. Patentee before: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY Co.,Ltd. Patentee before: STATE GRID CORPORATION OF CHINA Patentee before: STATE GRID INFORMATION & TELECOMMUNICATION GROUP Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |