CN216957993U

CN216957993U - Pin-adjustable surface-mounted diode

Info

Publication number: CN216957993U
Application number: CN202123320030.5U
Authority: CN
Inventors: 覃荣俊
Original assignee: Dongguan Zhongzhi Electronic Technology Co ltd
Current assignee: Dongguan Taifeng Radio Frequency Identification Co ltd
Priority date: 2021-12-27
Filing date: 2021-12-27
Publication date: 2022-07-12
Anticipated expiration: 2031-12-27

Abstract

The utility model provides a pin-adjustable surface mount diode which comprises a chip and a plastic package shell coated on the outer side of the chip, wherein the lower end of the chip is connected with a first pin, one end of the first pin is positioned on the inner side of the plastic package shell, the other end of the first pin extends to the outer side of the plastic package shell, the upper end of the chip is connected with a conducting strip, the conducting strip and the plastic package shell are integrally formed, the plastic package shell is further provided with a hollow groove, a rotatable second pin is arranged in the hollow groove, one end of the second pin is abutted to the upper end of the conducting strip, the plastic package shell is further provided with a tightening screw, and the second pin and the conducting strip are fixed through the tightening screw. The surface mount diode can adjust the mounting position of the second pin, and is wide in application range.

Description

Pin-adjustable surface-mounted diode

Technical Field

The utility model relates to the technical field of diodes, in particular to a pin-adjustable surface mount diode.

Background

The surface mount diode is one of the diodes, and generally comprises a plastic package shell, a chip, a cathode pin and an anode pin, wherein the cathode pin and the anode pin are connected with the chip by using solder paste, and then the plastic package shell is manufactured by packaging and molding. In the structure, the cathode pin, the anode pin and the plastic package shell are integrally formed, so that the cathode pin and the anode pin cannot be suitable for mounting various bonding pad positions on a circuit board.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems, the utility model provides the patch diode with the adjustable pins, which can adjust the mounting position of the second pin and has a wide application range.

In order to achieve the purpose, the utility model is solved by the following technical scheme:

the utility model provides a pin adjustable paster diode, includes the chip, the cladding is in the plastic envelope shell in the chip outside, the chip lower extreme is connected with first pin, first pin one end is located the plastic envelope shell is inboard, and the other end extends to the plastic envelope shell outside, the chip upper end is connected with the conducting strip, the conducting strip with the plastic envelope shell integrated into one piece, still be equipped with the fretwork groove on the plastic envelope shell, be equipped with rotatable second pin in the fretwork groove, second pin one end with the conducting strip upper end is inconsistent, still be equipped with the elasticity screw on the plastic envelope shell, the second pin with the conducting strip passes through the elasticity screw fixation.

Specifically, the conducting strip includes with the conducting part that the chip upper end is connected, connect in the kink of conducting part upper end, connect in the installation department of kink upper end, be equipped with on the installation department with elasticity screw assorted screw.

Specifically, the chip is connected with the first pin and the conducting strip through solder paste.

Specifically, one end of the second pin is provided with a through hole for the elastic screw to pass through.

Specifically, the through hole is a round hole or a waist hole.

Specifically, a first heat-conducting fin and a second heat-conducting fin are further arranged on the inner side of the plastic package shell, and the first heat-conducting fin and the second heat-conducting fin are respectively located on two sides of the chip.

Specifically, the plastic package shell is further coated with a waterproof film.

The utility model has the beneficial effects that:

according to the chip diode, the second pin is designed to be a rotatable structure, and the mounting position of the second pin can be adjusted through the elastic fit of the elastic screw, so that the chip diode is suitable for mounting various bonding pad positions on a circuit board, and is wide in application range.

Drawings

Fig. 1 is a perspective view of a patch diode of example 1.

Fig. 2 is a top view of the patch diode of example 1.

Fig. 3 is a cross-sectional view taken along the plane a-a in fig. 2.

Fig. 4 is a perspective view of a second lead in embodiment 1.

Fig. 5 is a perspective view of a second lead in embodiment 2.

The reference signs are: the chip comprises a chip 1, a plastic package shell 2, a hollow groove 21, a first pin 3, a conducting plate 4, a conducting part 41, a bent part 42, a mounting part 43, a second pin 5, a through hole 51, a loose screw 6, a first conducting strip 7, a second conducting strip 8 and a waterproof film 9.

Detailed Description

The present invention will be described in further detail with reference to examples and drawings, but the embodiments of the present invention are not limited thereto.

Example 1

As shown in fig. 1-4:

the utility model provides a pin adjustable chip diode, including chip 1, the cladding is at plastic envelope shell 2 in the 1 outside of chip, 1 lower extreme of chip is connected with

first pin

3, 3 one end of first pin is located plastic envelope shell 2 inboardly, the other end extends to the 2 outsides of plastic envelope shell, 1 upper end of chip is connected with conducting strip 4, conducting strip 4 and plastic envelope shell 2 integrated into one piece, still be equipped with fretwork groove 21 on the plastic envelope shell 2, be equipped with rotatable second pin 5 in the

fretwork groove

21, 5 one end of second pin is inconsistent with 4 upper ends of conducting strip, still be equipped with elasticity screw 6 on the plastic envelope shell 2, second pin 5 passes through elasticity screw 6 with conducting strip 4 and fixes, elasticity cooperation through elasticity screw 6, can adjust the mounted position of second pin 5, make its installation that is adapted to various pad positions on the circuit board.

Preferably, the conductive sheet 4 includes a conductive portion 41 connected to the upper end of the chip 1, a bent portion 42 connected to the upper end of the conductive portion 41, and a mounting portion 43 connected to the upper end of the bent portion 42, and the mounting portion 43 is provided with a screw hole matched with the elastic screw 6.

Preferably, the chip 1 is connected with the first pin 3 and the conductive plate 4 through solder paste.

Preferably, one end of the second pin 5 is provided with a through hole 51 for the turnbuckle screw 6 to pass through.

Preferably, the through-hole 51 is a circular hole.

Preferably, in order to improve the heat dissipation performance of the chip diode, the inner side of the plastic package housing 2 is further provided with a first heat conducting fin 7 and a second heat conducting fin 8, and the first heat conducting fin 7 and the second heat conducting fin 8 are respectively located on two sides of the chip 1.

Preferably, in order to improve the waterproof performance of the patch diode, the plastic package casing 2 is further coated with a waterproof film 9.

Example 2

As shown in fig. 5:

in order to enable the second pin 5 to rotate and extend or contract to adjust the position, the through hole 51 of the present embodiment is a waist hole.

The above examples only show one embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A pin-adjustable patch diode is characterized by comprising a chip (1) and a plastic package shell (2) coated on the outer side of the chip (1), the lower end of the chip (1) is connected with a first pin (3), one end of the first pin (3) is positioned at the inner side of the plastic package shell (2), the other end of the first pin extends to the outer side of the plastic package shell (2), the upper end of the chip (1) is connected with a conducting strip (4), the conducting strip (4) and the plastic package shell (2) are integrally molded, a hollow groove (21) is also arranged on the plastic package shell (2), a rotatable second pin (5) is arranged in the hollow groove (21), one end of the second pin (5) is pressed against the upper end of the conducting strip (4), the plastic package shell (2) is further provided with a loose screw (6), and the second pin (5) and the conducting plate (4) are fixed through the loose screw (6).

2. The pin-adjustable patch diode according to claim 1, wherein the conductive sheet (4) comprises a conductive portion (41) connected to an upper end of the chip (1), a bent portion (42) connected to an upper end of the conductive portion (41), and an installation portion (43) connected to an upper end of the bent portion (42), and the installation portion (43) is provided with a screw hole matched with the elastic screw (6).

3. The pin-adjustable patch diode as claimed in claim 1, wherein the chip (1) is connected with the first pin (3) and the conducting plate (4) through solder paste.

4. The pin-adjustable patch diode according to claim 1, wherein one end of the second pin (5) is provided with a through hole (51) for the elastic screw (6) to pass through.

5. The pin-adjustable patch diode of claim 4, wherein the through hole (51) is a round hole or a waist hole.

6. The pin-adjustable patch diode according to claim 1, wherein a first heat-conducting fin (7) and a second heat-conducting fin (8) are further disposed on an inner side of the plastic package housing (2), and the first heat-conducting fin (7) and the second heat-conducting fin (8) are respectively disposed on two sides of the chip (1).

7. The pin-adjustable patch diode according to claim 1, wherein a waterproof film (9) is further coated on the outer side of the plastic package housing (2).