CN216957991U

CN216957991U - Semiconductor packaging fixing device

Info

Publication number: CN216957991U
Application number: CN202220638301.7U
Authority: CN
Inventors: 刘文恒; 徐世明; 盛余珲
Original assignee: Gree Electric Appliances Inc of Zhuhai; Zhuhai Gree Xinyuan Electronics Co Ltd
Current assignee: Gree Electric Appliances Inc of Zhuhai; Zhuhai Gree Xinyuan Electronics Co Ltd
Priority date: 2022-03-23
Filing date: 2022-03-23
Publication date: 2022-07-12
Anticipated expiration: 2032-03-23

Abstract

The utility model discloses a semiconductor packaging and fixing device which comprises a base and a support, wherein a cushion block is arranged on the base, a pressing plate is arranged on the support, and the pressing plate and the base are fixed to enable the support and the cushion block to be fixedly connected. According to the semiconductor packaging and fixing device provided by the utility model, the cushion block and the pressing plate are designed, and the plurality of fixing structures are arranged on the cushion block and the pressing plate to firmly fix the support, so that the phenomenon that the line arc is crushed by the pressing plate due to improper manual placement of the support is avoided, the pressing effect of the support in the push-pull force process is improved, and the accuracy of data is ensured.

Description

Semiconductor packaging fixing device

Technical Field

The utility model relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging fixing device.

Background

In the semiconductor packaging process, the chip mounting process is to fix a chip on a bracket through solder paste (silver colloid), and then to fix the chip through reflow soldering and cleaning; the wire binding process is to weld two ends of a lead on a chip bonding pad and a lead support or a PCB respectively by adopting an ultrasonic pressurizing mode at a certain temperature to realize the connection of an internal circuit of the chip and an external circuit. Among these, the firmness of the chip fixation and the firmness of the binding thread are important. Therefore, the effect of the patch and the binding wire must be tested using a push-pull tester.

The push-pull force test method comprises the steps of placing a product to be tested on a test fixture, then pressing the product by a pressing plate, and selecting a proper test cutter to perform corresponding test. Wherein, the fixing stability of the product to be tested can directly influence the test result.

However, the universal jig and the universal pressing plate have extremely poor fixing effect, and the chip or the bracket can deviate or float during testing each time, so that the testing result is greatly influenced.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problems that a universal semiconductor packaging fixing device in the background art is easy to deform and poor in fixing effect, the semiconductor packaging fixing device provided by the utility model avoids basic deviation caused in a testing process and improves the accuracy of a detection structure.

In order to achieve the above object, a specific technical solution of the semiconductor package fixing device of the present invention is as follows:

a semiconductor packaging fixing device comprises a base and a support, wherein a cushion block is arranged on the base, a pressing plate is arranged on the support, and the pressing plate and the base are fixed to enable the support and the cushion block to be fixedly connected.

Further, a fixing structure is arranged on the base, a matching portion is arranged on the pressing plate, and the fixing structure and the matching portion are fixed to enable the support to be fixed in an accommodating space formed by the pressing plate and the base.

Further, fixed knot constructs for at least one fixed column, and cooperation portion includes at least one fixed orifices, fixed column and fixed orifices joint cooperation so that clamp plate and base fixed connection.

Furthermore, the fixing hole is an adjusting hole which is used for adjusting the relative position of the pressure plate and the support.

Furthermore, a fixing groove is formed in the base, and the cushion block is contained in the fixing groove to limit movement of the cushion block.

Furthermore, a positioning column is arranged on the cushion block, a positioning hole is formed in the support, a mounting hole is formed in the pressing plate, the positioning hole is sleeved on the outer wall of the positioning column, and the mounting hole and one end of the positioning column are clamped and fixed, so that the cushion block, the support and the pressing plate are clamped and fixed.

Furthermore, a bump is arranged on the cushion block, a base island is arranged on the support, and the bump and the base island are clamped and fixed.

Further, the base, the cushion block and the pressing plate are made of tungsten steel materials.

Furthermore, at least two positioning plates are arranged on the cushion block and are arranged at equal intervals, and the through grooves formed in each positioning plate and the support are matched.

Furthermore, a pressing claw is arranged on the pressing plate, and the pressing claw presses downwards to be in contact with the support so as to fix the support and the cushion block.

According to the semiconductor packaging fixing device provided by the utility model, the cushion block and the pressing plate are designed, and the plurality of fixing structures are arranged on the cushion block and the pressing plate to firmly fix the support, so that the phenomenon that the pressing plate presses a wire arc due to improper manual placement of the support is avoided, the pressing effect of the support in the process of pushing and pulling force is improved, and the accuracy of data is ensured.

The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the utility model. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:

FIG. 1 is a schematic view of the overall structure of the semiconductor package fixing device of the present invention;

FIG. 2 is a schematic structural view of a stent of the present invention;

FIG. 3 is a first schematic structural diagram of a base according to the present invention;

FIG. 4 is a second schematic structural view of the base of the present invention;

FIG. 5 is a schematic view of the construction of the spacer of the present invention;

fig. 6 is a schematic structural view of the platen of the present invention.

The reference numbers in the figures illustrate:

1. a support; 11. positioning holes; 12. a base island; 2. a base; 21. fixing grooves; 22. fixing a column; 3. cushion blocks; 31. a bump; 32. positioning a plate; 33. a positioning column; 4. pressing a plate; 41. an adjustment hole; 42. mounting holes; 43. and pressing the claws.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the semiconductor package fixing device or element referred to must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

A semiconductor package fixing device according to the present invention is described in detail with reference to fig. 1 to 6.

In the prior art, the semiconductor packaging process mainly comprises a chip mounting process, wherein the chip mounting process is to fix a chip on a support 1 through solder paste (silver paste), and then to fix the chip through reflow soldering and cleaning. The method further comprises a wire binding process, wherein the wire binding process is that two ends of a lead are respectively welded on a chip bonding pad and a lead support 1 or a PCB (printed circuit board) in an ultrasonic pressurizing mode at a certain temperature, so that the connection between an internal circuit of the chip and an external circuit is realized. The chip fixing firmness and the binding thread fixing firmness are particularly important no matter in the chip mounting process or the binding thread process. Therefore, the effect of the patch and the binding wire must be tested using a push-pull tester. During the test, the product to be tested is usually placed on a test bench, then pressed by the pressing plate 4, and then a suitable test tool is selected for the corresponding test. The fixing effect of the universal pressing plate 4 and the fixing device is poor, and the chip or the bracket 1 can shift or float during each test, thereby causing inaccuracy of the test result.

As shown in fig. 1 to 6, some embodiments of the present invention provide a semiconductor package fixing device, which includes a base 2, a pad 3, a bracket 1 and a pressing plate 4, wherein the bracket 1 is fixed to the semiconductor package fixing device through the base 2, the pad 3 and the pressing plate 4, so as to test a chip on the bracket 1 through a pull test.

Further, the embodiment provided by the utility model improves the structures of the base 2, the cushion block 3 and the pressing plate 4, so that the base 2, the cushion block 3 and the pressing plate 4 fix the bracket 1 at the same time, and the bracket 1 is more firmly fixed in the accommodating space formed by the cushion block 3 and the base 2.

Further, the cushion block 3 in this embodiment is different from the long strip-shaped plate-shaped structure in the prior art, the thickness of the cushion block 3 is set, and the thickness of the cushion block 3 is increased to be more attached to the surface of the bracket 1.

Specifically, the cushion block 3 is a square block-shaped structure, and of course, the structure of the cushion block 3 may also be set to other structures, and the thickness of the cushion block 3 is not specifically limited, and is only described as a preferred embodiment provided by the present invention. The cushion block 3 can be in the shape of a strip, a circle, a diamond and the like.

Furthermore, the upper surface of the cushion block 3 is provided with a communication groove which is generally arranged at an intermediate position, and the position of the communication groove is mainly used for matching the welding position of the chip on the bracket 1. At least two positioning plates 32 are arranged on the cushion block 3, the at least two positioning plates 32 are arranged at equal intervals, and the communicating grooves arranged on each positioning plate 32 and the bracket 1 are matched. Of course, the structure of the positioning plate 32 may also be set to other structural forms, or may also be set to structures such as the positioning column 33 and the positioning block, and the specific structure of the positioning plate 32 is mainly determined according to the through groove on the bracket 1. The through groove on the support 1 refers to the interval between a plurality of chip welded fastening positions on the support 1, is provided with a plurality of chip fixing positions on the support 1, sets up through groove between two adjacent fixing positions, and the locating plate 32 can with through groove looks joint, further fixed bolster 1, avoid support 1 to produce and rock to increase support 1's fastness.

Further, one side that leads to the groove is provided with lug 31, the shape and the quantity of lug 31 do not do specific restriction here yet, the number of lug 31 is preferred three, the number of lug 31 mainly with the quantity phase-match of the base island 12 that sets up on the support 1, be provided with a plurality of base islands 12 on the support 1, base island 12 is hollow out construction, lug 31 and base island 12 joint mutually, further fix support 1 and cushion 3 mutually, from the removal of a plurality of fixed knot construct upper limit support 1, so that support 1 holds in the accommodation space more firmly.

Preferably, the height of the bump 31 is 0.5mm, and of course, the height of the bump 31 is not particularly limited herein and is determined mainly according to the position where the base island 12 is disposed. Will laminate position height increase 0.5mm, guarantee that it presses the fastness, avoid because of the support 1 skew that thrust caused or float, exert an influence to the test result.

Further, be provided with fixed knot on the base 2, be provided with cooperation portion on the clamp plate 4, fixed knot constructs and cooperation portion is fixed so that support 1 fixes in the accommodation space that clamp plate 4 and base 2 formed.

In a preferred embodiment, the fixing structure is at least one fixing post 22, the engaging portion includes at least one fixing hole, and the fixing post 22 and the fixing hole are snap-fitted to fixedly connect the pressing plate 4 and the base 2. The fixing hole is an adjusting hole 41, and the adjusting hole 41 is used for adjusting the relative position of the pressure plate 4 and the bracket 1.

Specifically, regulation hole 41 is rectangular hole, and the aperture in rectangular hole is different, and the aperture of the one end in rectangular hole is greater than the external diameter of reference column 33 to make reference column 33 peg graft in the rectangular hole on clamp plate 4, the aperture of the other end in rectangular hole and the external diameter looks adaptation of reference column 33, so that reference column 33 pegs graft in regulation hole 41, remove clamp plate 4, with clamp plate 4 and base 2 fixed connection, thereby realize clamp plate 4's adjustability. The bottom end of the positioning column 33 is provided with a thread, and the positioning column 33 is twisted to descend, so that the pressing plate 4 and the fixing device press the support 1, and the fixing effect is ensured.

Further, a fixing groove 21 is provided on the base 2, and the pad 3 is received in the fixing groove 21 to restrict the movement of the pad 3. The groove body shape of the fixing groove 21 arranged on the base 2 is matched with the appearance shape of the cushion block 3, so that the cushion block 3 is clamped on the base 2 and is pre-fixed to the cushion block 3. Place cushion 3 on base 2, require locating pin and fixed slot 21 to mutually support, the joint part laminating, do not have and rock.

Furthermore, a positioning column 33 is arranged on the cushion block 3, a positioning hole 11 is arranged on the support 1, a mounting hole 42 is arranged on the pressing plate 4, the positioning hole 11 is sleeved on the outer wall of the positioning column 33, and the mounting hole 42 is fixedly clamped with one end of the positioning column 33, so that the cushion block 3, the support 1 and the pressing plate 4 are fixedly clamped. The cushion block 3 is provided with a convex block 31, the support 1 is provided with a base island 12, and the convex block 31 and the base island 12 are clamped and fixed. Set up reference column 33 on the cushion 3 and avoid the artifical risk of putting line arc, chip that needs adjustment position once more when placing support 1.

Further, the pressing claw 43 is arranged on the pressing plate 4, and the pressing claw 43 presses downwards to be in contact with the support 1 so as to fix the support 1 and the cushion block 3, so that the stability of the semiconductor package fixing device is improved. Be provided with the mounting groove on the clamp plate 4, the mounting groove is for leading to the groove structure, and the relative both sides of mounting groove set up clamp plate 4, and clamp plate 4 can be adjusted and set up the position, and the one end of clamp plate 4 is the stiff end, and the other end of clamp plate 4 is the free end, according to the position of support 1 in the accommodation space, can adjust clamp plate 4's free end to make clamp plate 4 compress tightly support 1, make support 1's displacement not change.

The semiconductor packaging and fixing device in the embodiment of the utility model is made of tungsten steel material, and the surface of the jig is required to be smooth and flat, so that the support 1 is prevented from deforming.

According to the semiconductor packaging fixing device provided by the utility model, the cushion block 3 and the pressing plate 4 are designed, and the plurality of fixing structures are arranged on the cushion block 3 and the pressing plate 4 to more firmly fix the support 1, so that the phenomenon that the pressing plate 4 presses a wire arc due to improper manual placement of the support 1 is avoided, the pressing effect of the support 1 in the push-pull force process is improved, and the accuracy of data is ensured.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. The semiconductor packaging and fixing device is characterized by comprising a base and a support, wherein a cushion block is arranged on the base, a pressing plate is arranged on the support, and the pressing plate and the base are fixed to enable the support and the cushion block to be fixedly connected.

2. The semiconductor package fixing device of claim 1, wherein the base is provided with a fixing structure, the pressing plate is provided with a matching portion, and the fixing structure and the matching portion are fixed to fix the bracket in the accommodating space formed by the pressing plate and the base.

3. The semiconductor package fixing device of claim 2, wherein the fixing structure comprises at least one fixing post, the engaging portion comprises at least one fixing hole, and the fixing post and the fixing hole are snap-fitted to fixedly connect the pressing plate and the base.

4. The semiconductor package fixing device of claim 3, wherein the fixing hole is an adjusting hole for adjusting a relative position of the pressing plate and the support.

5. The semiconductor package fixing device of claim 1, wherein the base is provided with fixing grooves, and the spacers are received in the fixing grooves to restrict movement of the spacers.

6. The semiconductor package fixing device of claim 1, wherein the cushion block is provided with a positioning post, the support is provided with a positioning hole, the pressing plate is provided with a mounting hole, the positioning hole is sleeved on an outer wall of the positioning post, and the mounting hole is fixed to one end of the positioning post in a clamping manner, so that the cushion block, the support and the pressing plate are fixed in a clamping manner.

7. The semiconductor package fixing device of claim 1, wherein the pad has a bump thereon, the support has a base island thereon, and the bump and the base island are fixed by clamping.

8. The semiconductor package mounting apparatus of claim 7, wherein the base, the spacer and the pressure plate are made of tungsten steel material.

9. The semiconductor package fixing device of claim 1, wherein at least two positioning plates are disposed on the cushion block, the at least two positioning plates are disposed at equal intervals, and each positioning plate is matched with the through groove disposed on the bracket.

10. The semiconductor package fixing device of claim 1, wherein the pressing plate is provided with a pressing claw, and the pressing claw presses down to contact with the bracket to fix the bracket and the pad.