CN217064148U - Welding positioning structure and positioning device - Google Patents

Welding positioning structure and positioning device Download PDF

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Publication number
CN217064148U
CN217064148U CN202121114497.1U CN202121114497U CN217064148U CN 217064148 U CN217064148 U CN 217064148U CN 202121114497 U CN202121114497 U CN 202121114497U CN 217064148 U CN217064148 U CN 217064148U
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China
Prior art keywords
positioning
circuit board
reference structure
welding
board
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CN202121114497.1U
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Chinese (zh)
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唐将
杜军红
葛振纲
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Shanghai Longqi Intelligent Technology Co ltd
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Shanghai Longcheer Technology Co Ltd
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Abstract

The application discloses welding position structure and positioner, this structure includes: the circuit board comprises a first circuit board with a plurality of first positioning holes and a second circuit board with a plurality of second positioning holes, wherein the first positioning holes and the second positioning holes are correspondingly arranged; the first positioning hole is connected with the second positioning hole by arranging a plurality of positioning columns, so that the first circuit board is connected with the second circuit board, wherein the first circuit board is a PCB, and the second circuit board is an FPC board. The positioning device comprises the welding positioning structure. The welding positioning structure fundamentally solves the adverse conditions of deviation, continuous tin, multi-tin, insufficient soldering and the like caused by FoB welding due to dislocation of the FPC board and the PCB, achieves that the maximum value of the product yield reaches 99.7%, ensures that the FPC board and the PCB are normally welded, and meets the production and manufacturing requirements.

Description

Welding positioning structure and positioning device
Technical Field
The application belongs to the technical field of welding positioning, and particularly relates to a welding positioning structure and a positioning device.
Background
The conventional FoB (Flexible Printed Circuit Board) welding of an FPC (Flexible Printed Circuit) Board and a PCB (Printed Circuit Board) Board is easy to have poor conditions such as offset, continuous tin, multi-tin, insufficient soldering and the like, and the maximum product yield is 36%. Therefore, a structure or a device for realizing accurate alignment between the FPC board and the PCB board is required to be designed to avoid the above situation, so as to improve the yield of the product.
SUMMERY OF THE UTILITY MODEL
To overcome the above drawbacks and deficiencies of the prior art, the present application provides a welding positioning structure and a positioning device.
In order to solve the technical problem, the application is realized by the following technical scheme:
this application has provided a welding position structure on the one hand, includes: the circuit board comprises a first circuit board with a plurality of first positioning holes and a second circuit board with a plurality of second positioning holes, wherein the first positioning holes and the second positioning holes are correspondingly arranged; the first positioning hole is connected with the second positioning hole by arranging a plurality of positioning columns, so that the first circuit board is connected with the second circuit board, wherein the first circuit board is a PCB, and the second circuit board is an FPC board.
Further, in the welding positioning structure, the diameters of the first positioning hole and the second positioning hole are both larger than the diameter of the positioning column.
Further, in the above welding positioning structure, at least two first reference structures are arranged on the first circuit board; and a second reference structure corresponding to the first reference structure is arranged on the second circuit board, wherein the centers of the first reference structure and the second reference structure are aligned with each other.
Further, in the welding positioning structure, the first reference structure includes a first corresponding portion, the second reference structure includes a second corresponding portion, and centers of the first corresponding portion and the second corresponding portion are aligned with each other.
Further, in the welding positioning structure, the first reference structure further includes a first visual inspection portion connected to the first corresponding portion, the second reference structure further includes a second visual inspection portion connected to the second corresponding portion, and the first visual inspection portion and the second visual inspection portion are not overlapped.
Further, in the above welding position structure, a plurality of back adhesives are disposed between the first circuit board and the second circuit board.
Further, in the welding positioning structure, the first reference structure or the second reference structure is made of a transparent material.
Further, in the welding positioning structure, the first reference structure includes a square reference structure.
Further, in the welding positioning structure, the second reference structure includes a cross-shaped reference structure.
The application also provides a positioning device which comprises the welding positioning structure.
Further, the positioning device further comprises a bottom plate, wherein the bottom plate is provided with a plurality of positioning columns, and the first positioning holes and the second positioning holes are connected through the positioning columns, so that the first circuit board and the second circuit board are connected together.
Compared with the prior art, the method has the following technical effects:
the welding positioning structure fundamentally solves the adverse conditions of deviation, continuous tin, multi-tin, insufficient soldering and the like of FoB welding caused by dislocation of the FPC board and the PCB, realizes that the maximum value of the product yield reaches 99.7 percent, ensures that the FPC board and the PCB are normally welded, and meets the production and manufacturing requirements.
This application passes through the mode that the locating hole on reference column connection FPC board and the PCB board, realizes the accurate location of FPC board and PCB board, avoids the two to take place relative movement.
This application adds the benchmark structure on FPC board and PCB board, through the accurate laminating of benchmark structure, further promotes the accuracy nature of FPC board and PCB board laminating position.
This application still adds between FPC board and PCB board and establishes the gum, makes the two laminating more firm, further solves the problem that FPC board and PCB board take place the skew.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1: the structure schematic diagram of the welding condition of the FPC board and the PCB board in the prior art;
FIG. 2: a schematic structural diagram of a first circuit board in an embodiment of the present application;
FIG. 3: a schematic structural diagram of a second circuit board in an embodiment of the present application;
FIG. 4: the structure schematic diagram of a welding positioning structure in an embodiment of the application;
FIG. 5: a schematic structural diagram of a first reference structure in an embodiment of the present application;
FIG. 6: a schematic structural diagram of a second reference structure in an embodiment of the present application;
FIG. 7: in an embodiment of the present application, a schematic structural diagram of the first visual inspection portion;
FIG. 8: a schematic structural diagram of a second visual inspection unit in an embodiment of the present application;
FIG. 9: a schematic structural diagram of a positioning device according to an embodiment of the present application;
in the figure: the circuit board assembly comprises a first circuit board 1, a first positioning hole 10, a first reference structure 11, a first corresponding part 110, a first visual inspection part 111, a second circuit board 2, a second positioning hole 20, a second reference structure 21, a second corresponding part 210, a second visual inspection part 211, a positioning column 3, a back adhesive 4 and a bottom plate 5.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1, when the FPC board and the PCB board in the prior art are soldered FoB, they are easily misaligned, which causes misalignment of soldering areas and poor conditions such as continuous soldering, excessive soldering, and insufficient soldering.
As shown in fig. 2 and 3, in one embodiment of the present application, a welding positioning structure includes: a first circuit board 1 with a plurality of first positioning holes 10 and a second circuit board 2 with a plurality of second positioning holes 20, wherein the first positioning holes 10 and the second positioning holes 20 are correspondingly arranged; the first positioning hole 10 and the second positioning hole 20 are connected by arranging a plurality of positioning columns 3, so that the first circuit board 1 and the second circuit board 2 are connected together, wherein the first circuit board 1 is a PCB (printed circuit board), and the second circuit board 2 is an FPC (flexible printed circuit) board.
The first positioning hole 10 of the first circuit board 1 and the second positioning hole 20 of the second circuit board 2 are connected through the positioning column 3, so that adverse conditions such as deviation, continuous tin, multi-tin, insufficient soldering and the like caused by FoB welding due to dislocation are avoided, and the problem that the first circuit board 1 and the second circuit board 2 shake is solved.
In this embodiment, the two first positioning holes 10 and the two second positioning holes 20 are connected by the two positioning posts 3, so that the first circuit board 1 and the second circuit board 2 can be accurately positioned, and the relative movement between the two circuit boards is avoided.
The diameters of the first positioning hole 10 and the second positioning hole 20 are both greater than the diameter of the positioning column 3, further, the diameters of the first positioning hole 10 and the second positioning hole 20 are 0.65mm, the diameter of the positioning column 3 is 0.6mm, the diameters of the first positioning hole 10 and the second positioning hole 20 are 0.05mm longer than the diameter of the positioning column 3, and a single-side gap is reserved between the first positioning hole 10 and the second positioning hole 20 and is 0.025mm, so that the gap can cover accumulated machining tolerance, and the accuracy is further improved. The disclosure of the above data is merely illustrative and does not limit the scope of the present application.
As shown in fig. 4, at least two first reference structures 11 are disposed on the first circuit board 1; the second circuit board 2 is provided with a second reference structure 21 corresponding to the first reference structure 11, wherein the centers of the first reference structure 11 and the second reference structure 21 are aligned with each other.
In the present embodiment, the number of the first reference structures 11 and the second reference structures 21 is two for example, but it is needless to say that a person skilled in the art will have an incentive to adaptively increase or decrease the number of the first reference structures and the second reference structures. Specifically, the middle region of the first circuit board 1 is symmetrically provided with two first reference structures 11, the second circuit board 2 is provided with two second reference structures 21 corresponding to the two first reference structures 11, the reference structures increase the region points where the first circuit board 1 and the second circuit board 2 are precisely attached, and the accuracy of the attachment positions of the first circuit board 1 and the second circuit board 2 is improved.
As shown in fig. 5 and 6, the first reference structure 11 includes a first corresponding portion 110, the second reference structure 21 includes a second corresponding portion 210, and centers of the first corresponding portion 110 and the second corresponding portion 210 are aligned with each other, so as to assist in fixing relative positions of the first circuit board 1 and the second circuit board 2, and further achieve precise positioning.
As shown in fig. 7 and 8, the first reference structure 11 further includes a first visual inspection unit 111, the first visual inspection unit 111 is connected to the first corresponding unit 110, the second reference structure 21 further includes a second visual inspection unit 211, the second visual inspection unit 211 is connected to the second corresponding unit 210, and the first visual inspection unit 111 and the second visual inspection unit 211 are not overlapped with each other.
In the present embodiment, the first visual inspection unit 111 and the second visual inspection unit 211 are not overlapped, so as to facilitate the observation and confirmation of whether the alignment of the first reference structure 11 and the second reference structure 21 is successful, and the successful alignment can be confirmed when the first visual inspection unit 111 or the second visual inspection unit 211 is observed.
As shown in fig. 4, a plurality of back adhesives 4 are disposed between the first circuit board 1 and the second circuit board 2.
In this embodiment, the back adhesive 4 is made of a high temperature resistant back adhesive 4, and is pre-disposed on the second circuit board 2, which is certainly not limited to other prior art means; before first circuit board 1 and the laminating of second circuit board 2, tear gum 4 and leave the type membrane, make second circuit board 2 be fixed in first circuit board 1 top, help solving the problem that first circuit board 1 and second circuit board 2 take place the skew, make the two laminating more firm.
As shown in fig. 7 and 8, the first reference structure 11 or the second reference structure 21 is made of a transparent material so as to facilitate identification of the visual inspection unit.
The first reference structure 11 includes, but is not limited to, a square reference structure; the second reference structure 21 includes, but is not limited to, a cross-shaped reference structure.
In the present embodiment, it is preferable that the first reference structure 11 is a square reference structure with a side length of 0.5 mm; the second reference structure 21 is a cross-shaped reference structure, specifically, a cross-shaped structure in which four corners of a square with a side length of 0.7mm are removed from four corners of the square with a side length of 0.2mm is adopted, when the centers of the first reference structure 11 and the second reference structure 21 are aligned with each other, the four corners (i.e., the first visual inspection part 111) exposed after the square reference structure is covered by the cross-shaped reference structure can be observed, or the end part (i.e., the second visual inspection part 211) exposed after the cross-shaped reference structure is covered by the square reference structure can be observed, so that the successful alignment of the first reference structure 11 and the second reference structure 21 can be quickly confirmed.
As shown in fig. 9, the present application further provides a positioning device, which includes the welding positioning structure.
The welding positioning structure is described above, and is not described herein.
The positioning device further comprises a base plate 5, the base plate 5 is provided with a plurality of positioning columns 3, and the first positioning holes 10 and the second positioning holes 20 are connected through the positioning columns 3, so that the first circuit board 1 and the second circuit board 2 are connected together.
The welding positioning structure fundamentally solves the adverse conditions of deviation, continuous tin, multi-tin, insufficient soldering and the like caused by FoB welding due to dislocation of the FPC board and the PCB, achieves that the maximum value of the product yield reaches 99.7%, ensures that the FPC board and the PCB are normally welded, and meets the production and manufacturing requirements.
In the description of the present application, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly and include, for example, fixedly connected, detachably connected, or integral to one another; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are based on the orientations and positional relationships shown in the drawings, and are only for convenience of description and simplicity of operation, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to be limiting.
The above embodiments are merely to illustrate the technical solutions of the present application and are not limitative, and the present application is described in detail with reference to preferred embodiments. It should be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the true spirit and scope of the claims which follow.

Claims (11)

1. A weld positioning structure, comprising: the circuit board comprises a first circuit board with a plurality of first positioning holes and a second circuit board with a plurality of second positioning holes, wherein the first positioning holes and the second positioning holes are correspondingly arranged; the first positioning hole is connected with the second positioning hole through the plurality of positioning columns, so that the first circuit board is connected with the second circuit board, wherein the first circuit board is a PCB, and the second circuit board is an FPC board.
2. The welding positioning structure of claim 1, wherein the diameters of the first positioning hole and the second positioning hole are larger than the diameter of the positioning post.
3. The soldering positioning structure according to claim 1, wherein the first circuit board is provided with at least two first reference structures; and a second reference structure corresponding to the first reference structure is arranged on the second circuit board, wherein the centers of the first reference structure and the second reference structure are aligned with each other.
4. The weld positioning structure according to claim 3, wherein the first reference structure includes a first corresponding portion, the second reference structure includes a second corresponding portion, and centers of the first corresponding portion and the second corresponding portion are aligned with each other.
5. The welding positioning structure according to claim 4, wherein the first reference structure further comprises a first visual inspection portion connected to the first corresponding portion, and the second reference structure further comprises a second visual inspection portion connected to the second corresponding portion, wherein the first visual inspection portion and the second visual inspection portion are disposed in a non-overlapping manner.
6. The soldering positioning structure according to any one of claims 1 to 5, wherein a plurality of back glues are provided between the first circuit board and the second circuit board.
7. The weld positioning structure according to any one of claims 3 to 5, wherein the first reference structure or the second reference structure is made of a transparent material.
8. The weld positioning structure according to any one of claims 3 to 5, wherein the first reference structure includes a square reference structure.
9. The weld positioning structure according to any one of claims 3 to 5, wherein the second reference structure comprises a cross-shaped reference structure.
10. A positioning device comprising the weld positioning structure of any one of claims 1 to 9.
11. The positioning apparatus as claimed in claim 10, further comprising a base plate, wherein the base plate is provided with a plurality of positioning posts, and the positioning posts connect the first positioning hole and the second positioning hole, so as to connect the first circuit board and the second circuit board together.
CN202121114497.1U 2021-05-21 2021-05-21 Welding positioning structure and positioning device Active CN217064148U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121114497.1U CN217064148U (en) 2021-05-21 2021-05-21 Welding positioning structure and positioning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121114497.1U CN217064148U (en) 2021-05-21 2021-05-21 Welding positioning structure and positioning device

Publications (1)

Publication Number Publication Date
CN217064148U true CN217064148U (en) 2022-07-26

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ID=82465284

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121114497.1U Active CN217064148U (en) 2021-05-21 2021-05-21 Welding positioning structure and positioning device

Country Status (1)

Country Link
CN (1) CN217064148U (en)

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TR01 Transfer of patent right

Effective date of registration: 20221108

Address after: No.66 Miaojing Road, Minhang District, Shanghai, 201199

Patentee after: Shanghai Longqi Intelligent Technology Co.,Ltd.

Address before: Floor 1, Building 401 Caobao Road, Xuhui District, Shanghai, 2003

Patentee before: SHANGHAI LONGCHEER TECHNOLOGY Co.,Ltd.