CN216905756U

CN216905756U - Residual pressure controller

Info

Publication number: CN216905756U
Application number: CN202123420882.1U
Authority: CN
Inventors: 王帅; 王贵; 杨阳
Original assignee: Henan Suoshida Electronic Technology Co ltd
Current assignee: Henan Suoshida Electronic Technology Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-07-05
Anticipated expiration: 2031-12-31

Abstract

The utility model discloses a residual pressure controller, wherein a track clamping groove and a clamp are arranged at the bottom of a base shell, a heat dissipation plate assembly comprises a heat dissipation plate, a heat pipe and chip heat conducting fins, a plurality of chip heat conducting fins are arranged on a heat absorption section on the heat pipe, a heat dissipation section of the heat pipe is connected with one surface of the heat dissipation plate, the heat dissipation plate is arranged in the track clamping groove of the base shell, the heat pipe faces the upper surface of the base shell, a graphite paper heat conduction layer is bonded on the surface of the other side, without the heat pipe, of the heat dissipation plate, the heat pipe is bent according to the position of a chip needing heat dissipation on a circuit board to adapt to the position of the chip, the chip heat conducting fins are bonded with the chip needing heat dissipation, the circuit board is positioned in the base shell, the chip needing heat dissipation on the circuit board faces downwards, and an upper shell is buckled on the base shell to surround the circuit board. The heat conducting fin assembly is added on the shell to accelerate the dissipation of internal heat and ensure the normal work of the residual pressure controller.

Description

Excess pressure controller

Technical Field

The utility model relates to the technical field of fire safety equipment, in particular to a residual pressure controller.

Background

When a building is in fire, smoke-proof staircases, refuge walkways and front rooms thereof are life passages for people to evacuate and passage walkways for fire fighters to put out fire, and the smoke-proof performance requirements of the smoke-proof walkways and the front rooms are required to be ensured. From the perspective of smoke prevention, the excessive pressure value of the mechanical pressurization air supply system is too low to be beneficial to smoke prevention, so the higher the excessive pressure value is, the better the excessive pressure value is. But the direction of the evacuation door is opened towards the evacuation direction, and the direction of the force of the pressurized air supply is just opposite to the opening direction of the evacuation door. If the residual pressure value is too high, the pressure difference between the two sides of the evacuation door between the staircase and the front chamber and between the front chamber and the walkway is too large, so that the situation that the evacuation door cannot be normally opened is caused, and the evacuation of personnel and the rescue of fire fighters are influenced. Obviously, the design of the pressurized air supply system is firstly established on the basis of safe evacuation, and the residual pressure monitoring device refers to a set of systematic device for adjusting the residual pressure value of a fire control front room or a staircase in the positive pressure air supply system of a high-rise building, and comprises a residual pressure controller and a residual pressure detector connected with the residual pressure controller through two buses.

The excess pressure controller is a controller for receiving an excess pressure signal transmitted by the excess pressure detector and controlling the start and stop of the fan controller, and the excess pressure detector connected with the excess pressure controller is additionally provided with an electricity utilization unit, so that the power of the excess pressure controller is high, the heat productivity is high during working, and the excess pressure controller can normally work and needs to be effectively cooled.

SUMMERY OF THE UTILITY MODEL

In view of the above, an object of the present invention is to provide an excess pressure controller, in which a heat conducting plate assembly is added on a housing to accelerate internal heat dissipation and ensure normal operation of the excess pressure controller.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a residual pressure controller comprises an upper shell, a base shell, a heat dissipation plate assembly and a circuit board, wherein a track clamping groove and a clamp are arranged at the bottom of the base shell, the controller is clamped on a standard guide rail, the heat dissipation plate assembly comprises a heat dissipation plate, a heat pipe and chip heat conduction sheets, a plurality of chip heat conduction sheets are arranged on a heat absorption section of the heat pipe, the heat dissipation section of the heat pipe is connected with one surface of the heat dissipation plate, the heat dissipation plate is arranged in the track clamping groove of the base shell, the heat pipe faces the upper surface of the base shell, a graphite paper heat conduction layer is bonded on the surface of the other side of the heat dissipation plate without the heat pipe, the heat dissipation plate is in full contact with the standard guide rail, heat dissipation is carried out by utilizing the standard guide rail and a box body, the heat pipe is bent according to the position of a chip needing heat dissipation on the circuit board to adapt to the position of the chip, the chip heat conduction sheets are bonded together with the chip needing heat dissipation, the circuit board is positioned in the base shell, the chip which needs to dissipate heat on the circuit board faces downwards, and the upper shell is buckled on the base shell and surrounds the circuit board.

Further, the heat dissipation plate is made of aluminum alloy. The thickness is 1-2 mm.

Further, the heat pipe is made of copper.

Furthermore, the chip heat conducting fin is a diamond-copper composite chip heat conducting fin, and the thickness of the chip heat conducting fin is 0.3-1 mm.

Furthermore, an independent power supply module is arranged in the base shell.

Furthermore, the power supply module is a direct-plug type isolation power supply module, and the model of the power supply module is IRM-20-24.

Furthermore, the chip on the circuit board, which needs heat dissipation, comprises a microprocessor and a field effect transistor.

Further, the type of the field effect transistor is F9540N.

The waste pressure controller is arranged on the standard guide rail, the graphite paper heat conduction layer on the heat dissipation plate assembly is in contact with the standard guide rail, heat generated by the chip is transferred to the chip heat conduction sheet, then is transferred to the heat dissipation plate through the heat pipe, and is transferred to the standard guide rail through the graphite paper heat conduction layer, and the heat can be rapidly dissipated by radiation and convection through the large contact area of the standard guide rail, so that the temperature in the waste pressure controller is guaranteed to be within a reasonable range.

The utility model has the beneficial effects that:

1. according to the residual pressure controller, the heat sink assembly is additionally arranged, the chip with the heating capacity is connected with the standard guide rail, the chip is heated and rapidly cooled through the standard guide rail, and the heat dissipation effect is good.

2. According to the residual pressure controller, the heat radiating fin component conducts heat by using the heat pipe, and the heat conduction efficiency of the heat pipe is high.

3. According to the residual pressure controller, the chip heat-conducting plate attached to the chip on the heat-radiating plate assembly is made of diamond-copper, so that the heat conductivity is high, and most of heat can be transferred to the heat pipe, so that the low temperature of the chip is ensured.

Drawings

FIG. 1 is a schematic front view of the present invention.

FIG. 2 is a schematic rear view of the present invention.

Fig. 3 is a schematic view of the internal structure of the present invention.

Fig. 4 is a schematic structural diagram of a heat dissipation plate assembly according to the present invention.

In the figure, 1-an upper shell, 2-a base shell, 3-a heat dissipation plate component, 31-a heat dissipation plate, 32-a heat pipe, 33-a chip heat conducting sheet, 34-a graphite paper heat conducting layer and 4-a circuit board.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example (b):

as shown in fig. 1 to 4, the excess pressure controller includes an upper case 1, a base case 2, a heat dissipation plate assembly 3, and a circuit board 4, where a rail slot and a clip are provided at the bottom of the base case 2, so that the controller is clamped on a standard rail, the heat dissipation plate assembly 3 includes a heat dissipation plate 31, a heat pipe 32, and a chip heat conducting fin 33, and the heat dissipation plate 31 is made of aluminum alloy. The thickness of the heat pipe is 2mm, the heat pipe 32 is a copper heat pipe, the chip heat conducting sheet 33 is a diamond-copper composite chip heat conducting sheet, the thickness of the heat pipe is 0.5mm, 2 chip heat conducting sheets are arranged on a heat absorbing section on the heat pipe 32, a heat radiating section of the heat pipe 32 is connected with one surface of a heat radiating plate 31, the heat radiating plate 31 is arranged in a track clamping groove of the base shell 2, the heat pipe 32 faces the upper surface of the base shell 2, a graphite paper heat conducting layer 34 is adhered on the other side surface of the heat radiating plate 31 without the heat pipe 32, the thickness of the graphite paper heat conducting layer is enough to be in full contact with a standard guide rail, the heat pipe 32 is used for radiating by utilizing the standard guide rail and a box body, the heat pipe 32 is bent according to the position of a chip needing to be radiated on the circuit board 4 to adapt to the position of the chip, the chip needing to be radiated on the circuit board 4 comprises a microprocessor and a field effect tube, the microprocessor is an STM32F single chip microcomputer, the type of the field effect transistor is F9540N, the chip heat conducting strip 33 is attached to a chip needing heat dissipation, the circuit board 4 is located in the base shell 2, the chip needing heat dissipation on the circuit board 4 faces downwards, and the upper shell 1 is buckled on the base shell 2 and surrounds the circuit board 4.

An independent power module is arranged in the base shell 2, the power module is a direct-plug type isolation power module, and the type of the power module is IRM-20-24.

Finally, the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and other modifications or equivalent substitutions made by the technical solutions of the present invention by those of ordinary skill in the art should be covered within the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solutions of the present invention.

Claims

1. A residual pressure controller is characterized in that: the heat dissipation device comprises an upper shell (1), a base shell (2), a heat dissipation plate assembly (3) and a circuit board (4), wherein a track clamping groove and a clamp are arranged at the bottom of the base shell (2), the heat dissipation plate assembly (3) comprises a heat dissipation plate (31), a heat pipe (32) and chip heat conducting fins (33), a plurality of chip heat conducting fins (33) are arranged on a heat absorption section on the heat pipe (32), the heat dissipation section of the heat pipe (32) is connected with one surface of the heat dissipation plate (31), the heat dissipation plate (31) is arranged in the track clamping groove of the base shell (2), the heat pipe (32) faces the upper surface of the base shell (2), a layer of graphite paper heat conducting layer (34) is bonded on the surface of the other side of the heat dissipation plate (31) without the heat pipe (32), the heat pipe (32) is bent according to the position of a chip needing heat dissipation on the circuit board (4), and the chip heat conducting fins (33) are bonded together with the chip needing heat dissipation, the circuit board (4) is positioned in the base shell (2), a chip needing heat dissipation on the circuit board (4) faces downwards, and the upper shell (1) is buckled on the base shell (2) and surrounds the circuit board (4).

2. The excess pressure controller according to claim 1, characterized in that: the heat dissipation plate (31) is made of aluminum alloy, and the thickness of the heat dissipation plate is 1-2 mm.

3. The excess pressure controller according to claim 1, characterized in that: the heat pipe (32) is made of copper.

4. The excess pressure controller according to claim 1, characterized in that: the chip heat conducting fin (33) is a diamond-copper composite chip heat conducting fin, and the thickness of the chip heat conducting fin is 0.3-1 mm.

5. The excess pressure controller according to claim 1, characterized in that: an independent power supply module is arranged in the base shell (2).

6. The excess pressure controller according to claim 5, wherein: the power supply module is a direct-plug type isolation power supply module, and the model of the power supply module is IRM-20-24.

7. The excess pressure controller according to claim 1, characterized in that: the chip needing heat dissipation on the circuit board (4) comprises a microprocessor and a field effect transistor.

8. The excess pressure controller according to claim 7, wherein: the model of the field effect transistor is F9540N.