CN216902911U - Composite member - Google Patents
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- CN216902911U CN216902911U CN202122636372.1U CN202122636372U CN216902911U CN 216902911 U CN216902911 U CN 216902911U CN 202122636372 U CN202122636372 U CN 202122636372U CN 216902911 U CN216902911 U CN 216902911U
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Abstract
The utility model discloses a composite member which comprises a composite layer, wherein the composite layer comprises a base material layer and diamond particles, the base material layer is a metal material layer, the diamond particles are embedded into the surface of the base material layer, the diamond particles and the surface of the base material layer are combined to form a flat surface, and the diamond particles are distributed orderly along the surface of the base material layer. According to the composite member, the diamond particles are distributed on the base material layer in order, so that the heat conduction uniformity is effectively improved, the diamond particles and the base material layer are fully combined without a binder, the internal interface condition of the composite member is optimized, the heat transfer efficiency is improved, the direct contact area of the diamond particles and a heating device is increased, the integral heat conduction performance is effectively improved, and the heat conductivity is improved.
Description
Technical Field
The utility model relates to the technical field of heat conduction materials, in particular to a composite component.
Background
The heat dissipation problem seriously affects the working efficiency, reliability and service life of semiconductor power devices such as power semiconductors, laser diodes, high-power LEDs, supercomputer chips and the like. The diamond is the substance with the highest thermal conductivity in nature, the thermal conductivity at normal temperature is 2200-2600W/(m.K), and the thermal expansion coefficient is about 0.86 multiplied by 10-6And is an insulator at room temperature. Copper metal has high thermal conductivity, low cost, and easy processing, and is the most commonly used packaging material, with a thermal conductivity of 400W/(m.K), and a thermal expansion coefficient of 17 × 10－6And the material meets the use performance requirements of low thermal expansion coefficient and high thermal conductivity of the electronic packaging substrate material. Therefore, the diamond/copper composite material taking diamond as the reinforcing phase and copper as the matrix material has better heat conduction potential. The existing diamond/copper composite material has two modes of solid-phase forming and liquid-phase forming, and is prepared by controlling the conditions of temperature, time, pressure and the like, the common preparation methods comprise a high-temperature high-pressure method, discharge plasma sintering, a powder metallurgy method, a liquid-phase infiltration method and the like, the process is complex, the implementation difficulty is high, the cost is high, and the distribution condition of diamonds in the obtained diamond/copper composite material is random and uncontrollableThat is, the diamond serving as the reinforcing phase is unevenly distributed in the matrix material, the internal interfaces of the composite material are numerous and complex, the efficient transfer of heat is hindered, the local thermal conductivity of the composite material is poor, and the improvement of the thermal conductivity of the composite material is limited.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problems and the technical task of improving the prior art, provides a composite member and solves the problems that the diamond of the composite material in the prior art is unevenly distributed in a base material, so that the local heat conduction of the composite material is poor and the overall heat conduction performance is influenced.
In order to solve the technical problems, the technical scheme of the utility model is as follows:
the composite component comprises a composite layer, wherein the composite layer comprises a base material layer and diamond particles, the base material layer is a metal material layer, the diamond particles are embedded into the surface of the base material layer, the diamond particles and the surface of the base material layer are combined to form a flat surface, and the diamond particles are distributed in order along the surface of the base material layer. The diamond particles in the composite member are orderly distributed on the substrate layer, so that the uniformity of heat conduction is effectively improved, the uneven heat conduction caused by the fact that the diamond particles are concentrated in the local part of the substrate layer is avoided, the diamond particles are distributed along the surface of the substrate layer, the complexity degree of the internal interface of the composite member can be effectively simplified, and the heat transfer efficiency in the composite member is improved. Thereby fundamentally improving the heat-conducting property.
Further, a plane on diamond particle surface flushes with the surface of substrate layer, and furthest's the area of the diamond particle who exposes on the improvement composite bed increases the direct contact area of diamond particle and the device that generates heat, effectively improves heat conductivility.
Furthermore, the substrate layer adopts a copper layer or a copper-based composite material layer, and the copper layer or the copper-based composite material layer is an integral plate, so that the compactness is high, and the mechanical property and the heat conductivity are favorably improved.
Further, the particle size of the diamond particles is less than or equal to 5mm, and the thickness of the base material layer is less than or equal to 10 mm.
Further, the surfaces of the two sides of the base material layer are respectively provided with the diamond particles, so that the volume fraction of diamond is improved, and the heat-conducting property is effectively improved.
Further, the diamond particles are arranged on the surfaces of the two sides of the base material layer in a staggered mode, the thickness of the base material layer is reduced on the basis that the surfaces of the two sides of the base material layer are provided with the diamond particles, the volume fraction of the diamond particles is effectively improved, and the thermal conductivity of the composite member is improved.
Further, the diamond particles are pressed into the surface of the base material layer through pressure, the processing is convenient, the efficiency is high, the cost is low, the diamond particles can be fully combined with the base material layer, no binder exists between the diamond particles and the base material layer, the interface combination state of the diamond particles and the base material layer is improved, the base material layer is a plate with high density, and the heat conducting performance is effectively improved.
Furthermore, the composite layer is laminated with a plurality of layers, and can be processed into various shapes and sizes to meet various different requirements.
Furthermore, the substrate layers of the adjacent composite layers are sintered into a whole, and the adjacent composite layers of the composite member have no actual boundary, so that the density of the composite member is improved, the interface thermal resistance is reduced, and the overall heat-conducting performance is improved.
Compared with the prior art, the utility model has the advantages that:
according to the composite member, the diamond particles are distributed on the base material layer in order, so that the heat conduction uniformity is effectively improved, the diamond particles and the base material layer are fully combined without a binder, the internal interface condition of the composite member is optimized, the heat transfer efficiency is improved, the direct contact area of the diamond particles and a heating device is increased, the integral heat conduction performance is effectively improved, the heat conductivity is improved, and the heat conductivity of the composite member can reach 600-1000W/(m.K).
Drawings
FIG. 1 is a schematic structural view of a composite member of the present invention;
FIG. 2 is another schematic structural view of the composite member of the present invention;
FIG. 3 is a schematic structural diagram of a composite member with diamond particles disposed on both sides of a substrate layer;
FIG. 4 is a schematic structural diagram of a composite member in which diamond particles are arranged on one surface of a substrate layer and a plurality of composite layers are stacked;
FIG. 5 is a schematic structural view of a composite member in which diamond particles are provided on both surfaces of a base material layer and a plurality of composite layers are stacked;
FIG. 6 is a schematic structural view of a pressing die and a material distributor;
FIG. 7 is a schematic view of the distributor removed after diamond particles are arranged on the surface of the substrate layer;
fig. 8 is a schematic view of the configuration in which the indenter is pressed down to press the diamond particles into the substrate layer.
Wherein:
the composite layer comprises a composite layer 1, a substrate layer 2, diamond particles 3, a distributor 4, a distribution hole 41, air holes 42, a base 5 and a pressure head 6.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
According to the composite component disclosed by the embodiment of the utility model, the diamonds are uniformly distributed on the base material, so that the heat conduction uniformity of the composite component is improved, the interface bonding state of the composite component is effectively improved, the interface thermal resistance is reduced, and the overall thermal conductivity of the composite component is effectively improved.
As shown in fig. 1 to 5, a composite member mainly includes a composite layer 1, the composite layer 1 includes a substrate layer 2 and diamond particles 3, the substrate layer 2 is a sheet-shaped metal material layer prepared in advance, the density is high, the mechanical property is good, and the excellent thermal conductivity can be ensured, specifically, the substrate layer 2 is a copper layer or a copper-based composite material layer, the copper layer is made of pure copper, the copper-based composite material layer is made of copper as an essential component and doped with silver, aluminum, neodymium and other elements, the diamond particles 3 are embedded on the surface of the substrate layer 2, the diamond particles 3 and the surface of the substrate layer 2 are combined to form a flat surface, that is, the diamond particles 3 are exposed on the surface of the substrate layer 2 and the diamond particles 3 and the surface of the substrate layer 2 are flush to form a flat surface with high smoothness and good flatness, and the diamond particles 3 are distributed orderly along the surface of the substrate layer 2, preferably, the diamond particles 3 are uniformly distributed along the surface of the substrate layer 2, so that the volume fraction of the diamond particles can be effectively increased, and the overall thermal conductivity of the composite member can be improved.
In this embodiment, the diamond particles 3 are single crystal particles, and the shapes thereof include tetrahedrons, hexahedrons, octahedrons, dodecahedrons, etc., that is, the surface of the diamond particles 3 must have a plane, as shown in fig. 2, when the diamond particles 3 are embedded on the surface of the substrate layer 2, one plane of the surface of the diamond particles 3 is flush with the surface of the substrate layer 2, that is, the exposed area of the diamond particles 3 on the surface of the substrate layer 2 is increased to the maximum extent, so that the direct contact area of the diamond particles and a heating device is effectively increased, and the heat conduction performance is further effectively improved.
In this embodiment, the thickness of substrate layer 2 is less than or equal to 10mm, the particle size of diamond granule 3 is less than or equal to 5mm, and preferably, the thickness of substrate layer 2 is 0.1 ~ 1mm, the particle size of diamond granule 3 is 0.05 ~ 0.5mm, according to actual application demand, the substrate layer of different thickness and the diamond granule of different particle sizes are selected in a flexible way to control diamond granule 3 along the interval of 2 surface distributions of substrate layer, thereby the whole thermal conductivity of composite member is adjusted to the volume fraction of controlling diamond granule in a flexible way, satisfies various different demands.
The diamond particles 3 may be arranged on one side surface of the substrate layer 2, as shown in fig. 3, the diamond particles 3 may also be arranged on both side surfaces of the substrate layer 2, the diamond particles 3 on both side surfaces of the substrate layer 2 are uniformly distributed along the surface of the substrate layer 2, and the diamond particles 3 are arranged on both side surfaces of the substrate layer 2 in a staggered manner, that is, the connection line between one diamond particle 3 on one side surface of the substrate layer 2 and one diamond particle 3 on the other side surface of the substrate layer 2 is not perpendicular to the surface of the substrate layer 2, in this way, the thickness of the substrate layer can be reduced on the basis of realizing that both side surfaces of the substrate layer have diamond particles, so as to further improve the overall thermal conductivity of the composite member, that is, the thickness of the substrate layer can be less than or equal to twice the particle size of the diamond particles 3, if the diamond particles 3 on the two side surfaces of the base material layer 2 are opposite to each other, the thickness of the base material layer must be larger than twice the particle size of the diamond particles 3, so that the volume fraction of the diamond particles is limited, and the overall thermal conductivity of the composite structural member is limited to be improved.
The composite component can only comprise one layer of the composite layer 1, has small structural size and can meet various application requirements of high integration and miniaturization, as shown in fig. 4 and 5, the composite component can also comprise a plurality of layers of the composite layer 1, namely, the composite layer 1 is stacked and provided with a plurality of layers, and the substrate layers 2 of the adjacent composite layers 1 are sintered into a whole, so that the interface between the adjacent composite layers 1 is eliminated, namely, the adjacent composite layers 1 do not have actual boundaries, the interface combination state of the composite component is optimized, the heat transfer efficiency is improved, and the integral heat conduction performance of the composite component is improved.
In this embodiment, substrate layer 2 is the sheet-like copper layer or the copper base composite material layer of preparing in advance, and the density is high, mechanical properties is good, diamond granule 3 directly impresses substrate layer 2 in the surface through pressure, and diamond granule 3 is good with substrate layer 2's associativity, need not to set up the binder, optimizes composite member internal interface situation, improves thermal transfer efficiency to guarantee the heat conductivity.
Specifically, the preparation method for manufacturing the composite member comprises the following steps:
s1, as shown in fig. 6, the diamond particles 3 are orderly arranged on the surface of the substrate layer 2 through the distributor 4, the distributor 4 is provided with a plurality of distribution holes 41 matched with the particle size of the diamond particles 3, the distribution holes 41 are orderly arranged along the surface of the substrate layer 2, and each distribution hole 41 accommodates one diamond particle 3;
the distributing device 4 has two structures, one structure is that the distributing holes 41 are through holes penetrating through the upper surface and the lower surface of the distributing device 4, the distributing device 4 is identical to the screen, the substrate layer 2 is flatly placed, then the distributing device 4 is placed on the upper surface of the substrate layer 2, then the diamond particles 3 are laid on the distributing device 4, the diamond particles 3 fall on the upper surface of the substrate layer 2 through the distributing holes, so that the diamond particles 3 are uniformly distributed on the upper surface of the substrate layer 2, and then the redundant diamond particles 3 on the distributing device 4 and the distributing device 4 are removed; as shown in fig. 6, in another structure, the material distribution hole 41 is a slotted hole, the material distributor 4 is provided with an air hole 42 communicated to the material distribution hole 41, the aperture of the air hole 42 is smaller than the particle diameter of the diamond particles 3, the air hole 42 is connected with a negative pressure device, the diamond particles 3 are adsorbed in the material distribution hole 41 by negative pressure, then the material distributor 4 is placed on the upper surface of the substrate layer 2, the negative pressure device stops, the diamond particles 3 automatically fall onto the upper surface of the substrate layer 2, the same diamond particles 3 are uniformly distributed on the upper surface of the substrate layer 2, the distribution efficiency and the precision of the distribution of the diamond particles 3 by the material distributor 4 are high, the diamond particles 3 can be ensured to be orderly and uniformly distributed on the surface of the substrate layer 2 according to requirements, the finally obtained composite member is ensured to have the uniformly distributed diamond particles 3, and the heat conduction uniformity of the composite member is ensured;
s2, as shown in fig. 7 to 8, pressing the diamond particles 3 into the surface of the substrate layer 2 by using a pressing mold to obtain a first semi-finished product, where the pressing mold includes a base 5 and a pressing head 6, the substrate layer 2 is flatly placed on the base 5, the pressing head 6 presses down to press the diamond particles 3 into the surface of the substrate layer 2, the substrate layer 2 is made of pure copper or copper-based composite material with hardness lower than that of the diamond particles 3, the pressing head 6 is made of material with hardness higher than that of the diamond particles 3, so as to ensure the service life of the pressing head 6 and the pressing quality, the pressing head 6 of the pressing mold has a plane parallel to the upper surface of the substrate layer 2, the pressing head 6 of the pressing mold presses down to be flush with the surface of the substrate layer 2, that is, the diamond particles 3 are completely pressed into the surface of the substrate layer 2, and the tops of the diamond particles 3 are flush with the surface of the substrate layer 2, the diamond particles 3 and the substrate layer 2 can be fully combined, the surface flatness of the composite member is guaranteed, the contact area of the composite member and a heating device when the composite member is used is guaranteed, the heat conduction effect is improved, and when the pressure head 6 of the pressing die is pressed to be flush with the surface of the substrate layer 2, even if the particle size of the diamond particles 3 is deviated, all the diamond particles can be fully embedded into the substrate layer 2, namely the topmost positions of all the diamond particles are flush with the surface of the substrate layer 2;
the composite component with the diamond particles 3 on the single surface is obtained through the method, the composite component with the diamond particles 3 on the two side surfaces can be obtained through firstly processing one surface, then turning over the semi-finished product and then processing the other surface, or simultaneously performing pressing processing on the two surfaces, specifically, a layer of diamond particles 3 is orderly distributed on the base 5 through the distributing device, after the distributing device is removed, the base material layer 2 is flatly placed on the layer of diamond particles 3, then a layer of diamond particles 3 is orderly distributed on the upper surface of the base material layer 2 through the distributing device, and then the pressing head 6 presses down to press the diamond particles 3 into the upper surface and the lower surface of the base material layer 2 at the same time, so that a semi-finished product I with the diamond particles 3 on the two side surfaces is obtained;
s3, pits are generated when the diamond particles 3 are pressed into the substrate layer 2, the diamond particles 3 are generally in a tetrahedron shape, a hexahedron shape, an octahedron shape, a dodecahedron shape and the like, so that the caliber of the diamond particles 3 is large in the middle and small in two ends, the pits generated when the diamond particles 3 are pressed into the substrate layer 2 are matched with the size of the middle of the diamond particles 3, but the pits are larger than the size of the top of the diamond particles 3, namely, after the diamond particles 3 are pressed into the surface of the substrate layer 2, gaps can be formed between the generated pits and the top of the diamond particles 3, the effective contact area of a composite member and a heating device can be seriously reduced through the gaps, namely, the composite member is difficult to be fully contacted with the heating device, the heat conduction effect is seriously affected, namely, the heat conduction performance of the composite member is difficult to be improved even if the volume fraction of the diamond particles in the composite member is increased, moreover, when the diamond particles 3 are pressed into the substrate layer 2, the substrate layer 2 is extruded, and the edges of the pits are raised due to extrusion, so that the surface smoothness and the flatness of the composite member are also affected, the effective contact area of the composite member and a heating device is further affected, and the heat conduction effect is also affected, so that the gap between the pits and the diamond particles 3 is required to be eliminated, the surface flatness of the composite member is improved, the combination condition of the diamond particles 3 and the substrate layer 2 is improved, the interface combination state of the composite member is improved, the interface thermal resistance is reduced, the effective contact area of the composite member and the heating device is increased, and the heat conduction effect is improved;
in this embodiment, the material of the substrate layer 2 is used to fill the gap between the diamond particles 3 and the pit generated when the diamond particles 3 on the first semi-finished product are pressed into the substrate layer 2, so as to obtain the second semi-finished product, and the material of the substrate layer 2 is used for filling because the material for filling is sintered and then is fused with the substrate layer 2, so that the interface complexity of the composite member is improved, and the heat conductivity is improved;
specifically, the method for filling the gap between the pit and the diamond particle on the first semi-finished product by using the material of the substrate layer 2 comprises one of the first method, the second method and the third method;
the method I comprises the steps of thermally spraying the material of the substrate layer 2 on the surface of a semi-finished product I, and then sintering to obtain a semi-finished product II;
coating the material of the powdery substrate layer 2 on the surface of the semi-finished product I, and then sintering to obtain a semi-finished product II;
and the third method comprises the step of immersing the first semi-finished product into the liquid of the molten base material layer 2 for a preset time, and then extracting the first semi-finished product to obtain a second semi-finished product, wherein the liquid of the molten base material layer 2 is immersed into and fills gaps between pits in the first semi-finished product and diamond particles, and the immersion time is 0.1-1 second.
In the first method and the second method, sintering is carried out in a vacuum environment or a gas protection environment, the gas protection environment is an inert environment such as nitrogen or a reducing gas environment such as hydrogen, or a mixed gas environment of nitrogen and hydrogen, the vacuum environment and the gas protection environment can effectively prevent diamond particles and a substrate layer from being oxidized in the sintering process, materials filled in gaps are fully combined with the substrate layer 2 into a whole through sintering, the interface combination state of the composite component is optimized, the heat transfer efficiency is improved, the overall heat conducting performance of the composite component is improved, the semi-finished product I is placed in a sintering mold for sintering, the size of the sintering mold is matched with that of the semi-finished product I, so that the size structure of the semi-finished product I is limited in the sintering process, and the phenomenon that the substrate layer 2 is softened and deformed to cause the serious deformation of the obtained semi-finished product II in the sintering process is avoided, the structure and the size of the finally obtained composite member meet the requirements, the sintering temperature is 400-1300 ℃, the sintering time is 2-10 min, the material filled into the gap can be effectively integrated with the substrate layer 2, and the interface combination condition is optimized.
S4, the surface of the semi-finished product II filled with the gap is rough and uneven and is difficult to fully and effectively contact with a heating device, so that the heat conduction performance is poor, and the diamond particles 3 are also covered by the filling material, so that the diamond particles 3 cannot directly contact with the heating device, and the heat conduction performance is influenced;
therefore, the semi-finished product II is ground, the diamond particles 3 are exposed, the diamond particles 3 and the substrate layer 2 are combined to form a flat surface, the smooth flatness of the surface of the composite member is improved, the composite member can be in good contact with a heating device, the contact area is increased, the diamond particles 3 are also exposed, the contact area of the diamond particles 3 and the heating device is large, the heat conducting performance is improved more effectively, and the finished composite member is obtained finally.
The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims. It will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the spirit and scope of the utility model, and these modifications and adaptations should be considered within the scope of the utility model.
Claims (9)
1. The composite member is characterized by comprising a composite layer (1), wherein the composite layer (1) comprises a base material layer (2) and diamond particles (3), the base material layer (2) is a metal material layer, the diamond particles (3) are embedded on the surface of the base material layer (2), the diamond particles (3) and the surface of the base material layer (2) are combined to form a flat surface, and the diamond particles (3) are distributed in order along the surface of the base material layer (2).
2. A composite member according to claim 1, characterized in that one plane of the surface of the diamond particles (3) is flush with the surface of the substrate layer (2).
3. The composite component according to claim 1, characterized in that the substrate layer (2) is a copper layer or a copper-based composite layer.
4. A composite member according to claim 1, wherein the diamond particles (3) have a particle size of 5mm or less and the substrate layer (2) has a thickness of 10mm or less.
5. A composite member according to claim 1, characterized in that the diamond particles (3) are provided on both side surfaces of the substrate layer (2), respectively.
6. A composite member according to claim 5, characterized in that the diamond particles (3) are arranged offset on both side surfaces of the substrate layer (2).
7. A composite member according to any one of claims 1 to 6, characterized in that the diamond particles (3) are pressed into the surface of the substrate layer (2) by means of pressure.
8. A composite component according to any one of claims 1-6, characterised in that the composite layer (1) is provided in layers.
9. A composite component according to claim 8, characterised in that the substrate layers (2) of adjacent composite layers (1) are sintered together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122636372.1U CN216902911U (en) | 2021-10-29 | 2021-10-29 | Composite member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122636372.1U CN216902911U (en) | 2021-10-29 | 2021-10-29 | Composite member |
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| Publication Number | Publication Date |
|---|---|
| CN216902911U true CN216902911U (en) | 2022-07-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122636372.1U Active CN216902911U (en) | 2021-10-29 | 2021-10-29 | Composite member |
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| CN (1) | CN216902911U (en) |
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2021
- 2021-10-29 CN CN202122636372.1U patent/CN216902911U/en active Active
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