CN113976882B - Preparation method of heat-conducting composite material - Google Patents
Preparation method of heat-conducting composite material Download PDFInfo
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- CN113976882B CN113976882B CN202111274515.7A CN202111274515A CN113976882B CN 113976882 B CN113976882 B CN 113976882B CN 202111274515 A CN202111274515 A CN 202111274515A CN 113976882 B CN113976882 B CN 113976882B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/02—Compacting only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1003—Use of special medium during sintering, e.g. sintering aid
- B22F3/1007—Atmosphere
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
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- C—CHEMISTRY; METALLURGY
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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Abstract
The invention discloses a preparation method of a heat-conducting composite material, which comprises the steps of coating diamond particles with powder material of a substrate layer to obtain diamond composite particles; orderly arranging diamond composite particles on the surface of the substrate layer; pressing the diamond composite particles into the surface of the substrate layer by adopting a pressing die to obtain a semi-finished product I; sintering the semi-finished product I to obtain a semi-finished product II; and grinding the semi-finished product II to expose the diamond particles, and combining the diamond particles and the substrate layer to form a flat surface to obtain the finished heat-conducting composite material. According to the invention, the diamond particles in the heat-conducting composite material are orderly arranged, so that the heat-conducting uniformity is improved, the diamond particles are exposed on the surface of the composite material, the diamond particles can effectively contact with a heating device, the heat-conducting performance is improved, the processing is convenient, the efficiency is high, and the cost is low.
Description
Technical Field
The invention relates to the technical field of heat conduction material preparation, in particular to a preparation method of a heat conduction composite material.
Background
Diamond is the highest heat conductivity in natureThe material has a thermal conductivity of 2200 to 2600W/(mK) and a thermal expansion coefficient of about 0.86×10 at room temperature -6 K, and is an insulator at room temperature. Copper metal has high heat conductivity, low cost and easy processing, is the most commonly used packaging material, has the heat conductivity of 400W/(m.K) and the thermal expansion coefficient of 17 multiplied by 10 －6 And K, meets the service performance requirements of low thermal expansion coefficient and high thermal conductivity of the electronic packaging substrate material. Therefore, the diamond/copper composite material taking diamond as a reinforcing phase and copper as a matrix material has better heat conduction potential. The existing diamond/copper composite material is prepared by controlling conditions such as temperature, time and pressure in a solid phase forming mode and a liquid phase forming mode, the common preparation method comprises a high-temperature high-pressure method, a spark plasma sintering method, a powder metallurgy method, a liquid phase infiltration method and the like, the process is complex, the implementation difficulty is high, the equipment is complex, the investment cost is high, the distribution condition of diamond in the obtained diamond/copper composite material is random and uncontrollable, namely, the diamond serving as a reinforcing phase is unevenly distributed in a matrix material, the internal interface of the composite material is many and complex, the efficient transfer of heat is hindered, the local thermal conductivity of the composite material is poor, and the thermal conductivity of the composite material is limited.
Disclosure of Invention
The invention aims to solve the technical problems and the technical task of improving the prior art, provides a preparation method of a heat-conducting composite material, and solves the problems that the diamond of the heat-conducting composite material is unevenly distributed in a matrix material, so that the local heat conduction of the composite material is poor and the overall heat conduction performance is influenced in the prior art.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a preparation method of a heat-conducting composite material comprises the following steps:
coating diamond particles by adopting powder material of a substrate layer to obtain diamond composite particles;
orderly arranging diamond composite particles on the surface of the substrate layer;
pressing the diamond composite particles into the surface of the substrate layer by adopting a pressing die to obtain a semi-finished product I;
sintering the semi-finished product I to obtain a semi-finished product II;
and grinding the semi-finished product II to expose the diamond particles, and combining the diamond particles and the substrate layer to form a flat surface to obtain the finished heat-conducting composite material.
According to the preparation method of the heat-conducting composite material, the situation that diamond particles in the heat-conducting composite material are orderly and uniformly distributed can be achieved, the heat-conducting uniformity of the composite material is effectively improved, the problem that the diamond particles are concentrated in a part of a substrate layer to cause uneven heat conduction is solved, the volume fraction of the diamond particles in the composite material can be conveniently and flexibly controlled, further, the heat conductivity of the composite material is flexibly adjusted according to needs, the diamond particles are directly embedded into the substrate layer in a pressing mode, uniform distribution of the diamond particles on the substrate layer is conveniently and efficiently achieved, then the powder material of the substrate layer for wrapping the diamond particles is integrated with the substrate layer through sintering, the diamond particles are fully combined with the substrate layer, the adhesive used when the powder material wraps the diamond particles can be effectively removed, the finally obtained composite material only contains the material components of the diamond particles and the substrate layer, the interface bonding state of the diamond particles and the substrate layer is optimized, the heat transfer efficiency is improved, the processing is convenient and the efficiency is high compared with the existing processing method, the cost is low, the composite material is enabled to form a smooth and flat surface through a grinding treatment mode, the composite material can be fully contacted with a device, the contact area of the device is increased, the contact area of the heat-conducting device is increased, the heat-conducting device is effectively contacted with the heat-conducting device is increased, and the heat-conducting device is contacted with the heat-conducting device is heated with the diamond particles, and the heat-conducting device is heated, and the heat-conducting effect is the heat-conducting device is and the heat-conducting area is and the heat-conducting device.
Further, the powder material of the base material layer and the diamond particles are mixed and spheroidized, the adhesive is added in an atomization spraying mode, and the powder material of the base material layer is coated on the diamond particles through the adhesive to obtain the diamond composite particles. The powder of substrate layer material is adhered to the surface of the diamond particle to the coating conveniently and efficiently, the adhesive is added uniformly, the powder can uniformly coat the whole periphery of the diamond particle, so that the thickness of the powder on the surface of the diamond particle is uniform, that is, the diamond particle is positioned at the center of the diamond composite particle, and when the diamond composite particle is pressed into the surface of the substrate layer, the diamond particle is positioned at the center of a pit formed by pressing, the position deflection of the diamond particle is avoided, the orderly arrangement accuracy of the diamond particle is improved, the orderly uniform distribution of the diamond particles in the composite material is ensured, and the heat conduction uniformity is ensured.
Further, the diamond composite particles are orderly distributed on the surface of the substrate layer through a distributing device, a plurality of distributing holes matched with the particle size of the diamond composite particles are formed in the distributing device, the distributing holes are orderly distributed along the surface of the substrate layer, and each distributing hole only contains one diamond composite particle. The distribution condition of the distribution holes on the distributing device is the distribution condition of the required diamond particles on the substrate layer, and the diamond particles can be reliably and accurately distributed on the surface of the substrate layer according to the requirement by using the distributing device.
Further, the distributing hole is a slotted hole, an air hole communicated with the distributing hole is formed in the distributing device, and the caliber of the air hole is smaller than the particle size of the diamond composite particle and is used for being connected with a negative pressure device. The diamond composite particles are adsorbed in the material distribution holes in a negative pressure adsorption mode, the material distributor moves to the upper surface of the substrate layer, then the negative pressure device is closed, and the diamond composite particles can automatically fall and are orderly distributed on the surface of the substrate layer according to requirements, so that the diamond composite particle distributor is convenient to use, high in efficiency and convenient to realize automation.
Further, the diamond composite particles are orderly arranged on the adhesive tape through the distributor, then the adhesive tape is attached to the substrate layer in a mode that the diamond composite particles face the surface of the substrate layer, the pressing die is pre-pressed to pre-embed the diamond composite particles on the surface of the substrate layer, then the adhesive tape is removed, and the pressing die is used for pressing the diamond composite particles into the surface of the substrate layer to obtain a semi-finished product I. The adhesive of the adhesive tape is utilized to pre-fix the diamond composite particles, so that the orderly arrangement state of the diamond composite particles is maintained, the diamond composite particles are pre-embedded onto the substrate layer through prepressing, the existence of the adhesive tape can ensure that the diamond composite particles are orderly arranged on the surface of the substrate layer, the situation that the diamond composite particles roll and deviate in the pressing process can be avoided, the orderly arrangement state of the final diamond particles can be maintained when the final diamond particles are completely pressed into the surface of the substrate layer, the finally obtained composite material is further ensured to have orderly and uniformly distributed diamond particles, and the heat conduction uniformity is ensured.
Furthermore, the pressing die is used for pressing the diamond composite particles into the surface of the substrate layer, and meanwhile, the substrate layer is heated, and the substrate layer is softened in a hot pressing mode, so that the diamond composite particles are smoothly embedded into the surface of the substrate layer.
Further, the embossing mold utensil includes pedestal and pressure head, arrange one deck diamond composite particle in order on the pedestal, keep the substrate layer flat on this layer diamond composite particle, again arrange one deck diamond composite particle in order at the upper surface of substrate layer, then the pressure head pushes down in order to impress the diamond composite particle in the surface of substrate layer, obtain semi-manufactured goods one, can prepare the combined material that both sides all have diamond particle, adopt the mode of two-sided simultaneous pressing, can effectively improve machining efficiency, guarantee diamond particle both evenly distributed on the both sides surface of substrate layer simultaneously, guarantee heat conduction homogeneity.
Further, the diamond composite particles are arranged on the surfaces of the two sides of the semi-finished product I in a staggered manner, so that the collision contact of the diamond particles of the upper layer and the lower layer in the pressing process is avoided, the breakage of the diamond particles due to the pressing is avoided, the integrity of the diamond particles is ensured, meanwhile, the thickness of the substrate layer can be reduced on the basis that the diamond particles are arranged on the surfaces of the two sides of the substrate layer, the volume fraction of the diamond particles is effectively improved, and the heat conductivity of the composite material is improved.
Furthermore, the semi-finished product I is sintered in a vacuum environment or in a gas protection environment, so that oxidation of diamond particles and a substrate layer in the sintering process is avoided, the sintering quality is ensured, and the composite material has good heat conduction performance.
Further, the semi-finished product I is placed in a sintering mold for limiting the shape and the size of the semi-finished product I for sintering, the problem that the obtained semi-finished product II is seriously deformed due to the fact that a base material layer is softened and deformed in the sintering process is avoided, the shape and the size of the base material layer are kept stable in the sintering process, and the structure and the size of the finally obtained composite material are ensured to meet the requirements.
A heat-conducting composite material is prepared by adopting the preparation method of the heat-conducting composite material. The heat conduction composite material is provided with the diamond particles which are orderly distributed on the surface, the diamond particles are exposed on the surface of the composite material, the heat conduction uniformity is effectively improved, uneven heat conduction caused by the fact that the diamond particles are concentrated in the local part of the substrate layer is avoided, the diamond particles can be effectively contacted with the heating device, the contact area of the diamond particles and the heating device is effectively increased, and the heat conduction performance is improved.
Compared with the prior art, the invention has the advantages that:
according to the preparation method of the heat-conducting composite material, the diamond particles in the heat-conducting composite material are orderly arranged, the heat-conducting uniformity of the composite material is improved, the volume fraction of the diamond particles in the composite material can be flexibly and conveniently controlled according to requirements, the diamond particles are exposed on the surface of the composite material, the diamond particles can effectively contact with a heating device, the contact area of the diamond particles and the heating device is increased, the heat-conducting property is improved, the heat conductivity of the composite material can reach 600-1000W/(m.K), the processing is convenient, the efficiency is high, the cost is low, the implementation is convenient, and complex equipment is not required.
Drawings
FIG. 1 is a schematic view of a diamond composite particle obtained by wrapping diamond particles with a powder material of a substrate layer according to the present invention;
FIG. 2 is a schematic diagram of a pressing mold and a distributor according to the present invention;
FIG. 3 is a schematic view of a pressing mold and another distributor according to the present invention;
FIG. 4 is a schematic view of the removal of the distributor after the diamond composite particles are arranged on the surface of the substrate layer;
FIG. 5 is a schematic view of a structure in which a indenter is depressed to press diamond composite particles into a substrate layer;
FIG. 6 is a schematic view of a pressing die with an induction heating coil thereon for hot pressing;
FIG. 7 is a schematic illustration of a powder layer automatically filling the gaps between pits and diamond particles;
FIG. 8 is a schematic view of a semi-finished product being placed in a sintering mold for sintering;
FIG. 9 is a schematic structural view of a composite material;
FIG. 10 is a schematic illustration of another construction of a composite material;
FIG. 11 is a schematic diagram of two simultaneous pressing of diamond composite particles on two sides of a substrate layer according to the second embodiment;
fig. 12 is a schematic structural view of a composite material with diamond particles arranged on both sides.
FIG. 13 is a schematic view of diamond composite particles arranged on an adhesive tape using a dispenser;
fig. 14 is a schematic view of an adhesive tape attached to a substrate layer to pre-embed diamond composite particles into the substrate layer.
In the figure:
composite layer 1, substrate layer 2, diamond particles 3, powder layer 31, diamond composite particles 32, distributor 4, distribution holes 41, air holes 42, adhesive tape 43, base 5, pressing head 6, induction heating coil 7 and sintering mold 8.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
According to the preparation method of the heat-conducting composite material disclosed by the embodiment of the invention, diamonds are orderly and uniformly distributed on the matrix material, so that the heat-conducting uniformity of the composite material is improved, the interface bonding state of the composite material is effectively improved, the interface thermal resistance is reduced, the overall heat conductivity of the composite material is effectively improved, and the preparation method is convenient to implement and low in cost.
Example 1
As shown in fig. 1 to 8, a method for preparing a heat-conducting composite material includes the steps of:
s1, the diamond particles 3 are wrapped by the powder material of the substrate layer 2 to obtain diamond composite particles 32, specifically, the diamond particles 3 are placed into a diamond wrapping device, the diamond wrapping device drives the diamond particles 3 to roll, the adhesive is sprayed into the diamond wrapping device in an atomizing mode, so that the adhesive is coated on the surfaces of the diamond particles 3, meanwhile, the powder material of the substrate layer 2 is added into the diamond wrapping device, the powder material is wrapped on the surfaces of the diamond particles 3 through the adhesive, the powder material and the diamond particles 3 are mixed and rolled in the diamond wrapping device to be spheroidized, the whole periphery of the powder material of the diamond particles 3 is wrapped by the powder material, the diamond composite particles 32 comprise the diamond particles 3 and the powder material layer 31 wrapped on the outer surfaces of the diamond particles 3, and the powder material layer 31 mainly comprises the powder material of the substrate layer 2 and the adhesive.
S2, the diamond composite particles 32 are orderly arranged on the surface of the substrate layer 2 through a distributor 4, a plurality of distribution holes 41 matched with the particle size of the diamond composite particles 32 are formed in the distributor 4, the distribution holes 41 are orderly arranged along the surface of the substrate layer 2, and each distribution hole 41 contains one diamond composite particle 32;
the distributing device 4 has two structures, as shown in fig. 3, one structure is that a distributing hole 41 is a through hole penetrating through the upper surface and the lower surface of the distributing device 4, the distributing device 4 is equivalent to a screen, the substrate layer 2 is horizontally placed, then the distributing device 4 is placed on the upper surface of the substrate layer 2, then the diamond composite particles 32 are paved on the distributing device 4, the diamond composite particles 32 fall on the upper surface of the substrate layer 2 through the distributing hole, so that the diamond composite particles 32 are uniformly distributed on the upper surface of the substrate layer 2, and then the distributing device 4 and the redundant diamond composite particles 32 on the distributing device 4 are removed; as another structure shown in fig. 2, the distributing hole 41 is a slot hole, the distributing device 4 is provided with air holes 42 communicated with the distributing hole 41, the caliber of the air holes 42 is smaller than the particle diameter of the diamond composite particles 32, the air holes 42 are connected with a negative pressure device, the diamond composite particles 32 are adsorbed in the distributing hole 41 through the negative pressure, then the distributing device 4 is placed on the upper surface of the substrate layer 2, the negative pressure device stops, the diamond composite particles 32 automatically fall on the upper surface of the substrate layer 2, the same diamond composite particles 32 are uniformly distributed on the upper surface of the substrate layer 2, the distributing device 4 is adopted to perform the distribution of the diamond composite particles 32, the distribution efficiency and the precision are high, and the diamond composite particles 32 can be ensured to be orderly and uniformly distributed on the surface of the substrate layer 2 according to requirements, so that the finally obtained heat conducting composite material has uniformly distributed diamond particles 3, and the heat conducting uniformity of the composite material is ensured.
S3, pressing the diamond composite particles 32 into the surface of the substrate layer 2 by adopting a pressing die to obtain a semi-finished product I, wherein the pressing die comprises a base 5 and a pressing head 6, the substrate layer 2 is horizontally arranged on the base 5, the pressing head 6 presses down the base 5 to press the diamond composite particles 32 into the surface of the substrate layer 2, the substrate layer 2 adopts pure copper or copper-based composite materials, the hardness is lower than that of the diamond particles 3, the pressing head 6 adopts materials with hardness higher than that of the diamond particles 3, the service life of the pressing head 6 is ensured, the pressing quality is ensured at the same time, the pressing head 6 of the pressing die is provided with a plane parallel to the upper surface of the substrate layer 2, the pressing head 6 of the pressing die is pressed down to be flush with the surface of the substrate layer 2, and the diamond particles 3 are fully pressed into the surface of the substrate layer 2;
as shown in fig. 4 and 5, the pressing mode is adopted to directly press the diamond particles 3 into the surface of the substrate layer 2 by using a pressing die, that is, only the pressing die is used to press the diamond particles 3 into the surface of the substrate layer 2 by pressure, as shown in fig. 6, a hot pressing mode can also be adopted, that is, the substrate layer 2 is heated in the pressing process, the heating temperature is 400-1000 ℃, specifically, an induction heating coil 7 can be arranged on the base 5 to heat the substrate layer 2, so that the substrate layer 2 is softened, the diamond particles 3 can be more smoothly pressed into the surface of the substrate layer 2, the diamond particles 3 can be better combined with the substrate layer 2, the interface combination state of the composite material is improved, and the heat conducting property is improved;
the hardness of the diamond particles 3 is greater than that of the substrate layer 2, pits are generated in the substrate layer 2 when the diamond particles 3 are pressed into the substrate layer 2, and the diamond particles 3 are generally tetrahedron, hexahedron, octahedron, dodecahedron and the like, so that the caliber of the diamond particles 3 is large at the middle and small at the two ends, the pits generated when the diamond particles 3 are pressed into the substrate layer 2 are matched with the size of the middle of the diamond particles 3, but are larger than the top size of the diamond particles 3, that is, after the diamond particles 3 are pressed into the surface of the substrate layer 2, gaps are formed between the generated pits and the tops of the diamond particles 3, and as shown in fig. 7, as the periphery of the diamond particles 3 is wrapped with the powder layer 31, when the diamond composite particles 32 are pressed into the substrate layer 2, the powder layer 31 is extruded to the periphery of the diamond particles 3 due to extrusion, so that the powder layer 31 automatically fills the gaps between the pits and the diamond particles 3, that is the powder layer 31 forms filling materials for filling the gaps between the pits and the diamond particles 3;
s4, sintering the semi-finished product I to enable the filler to be sintered into a compact structure so as to truly fill gaps between the pits and the tops of the diamond particles 3, wherein after sintering, the filler is changed into compact components and is fused with the substrate layer 2 into a whole, and finally the semi-finished product II is obtained;
specifically, sintering is carried out in a vacuum environment or in a gas-shielded environment, the gas-shielded environment is an inert environment such as nitrogen or a reducing gas environment such as hydrogen or a mixed gas environment of nitrogen and hydrogen, the vacuum environment and the gas-shielded environment can effectively avoid oxidization of diamond particles and a substrate layer in the sintering process, the filling material and the substrate layer 2 are fully combined into a whole through sintering, the interface condition of the composite material is optimized, the subsequent continuous and smooth surface of the composite material is conveniently formed, the contact area of the composite material and a heating device is increased, the heat transfer efficiency is improved, the overall heat conducting performance of the composite material is improved, a semi-finished product I is placed in a sintering mold 8 for sintering, a plurality of sintering molds 8 can be simultaneously accommodated in a sintering furnace, each sintering mold 8 can be placed with a single semi-finished product I or a plurality of semi-finished products I, the sintering mold 8 is matched with the dimension of the semi-finished product I, thereby limiting the dimension structure of the semi-finished product I in the sintering process, avoiding serious deformation of the obtained semi-finished product II caused by softening deformation of the base material layer 2 in the sintering process, ensuring that the structure and dimension of the finally obtained composite material meet the requirements, ensuring that the whole sintering mold 8 is a box body matched with the surface shape and dimension of the base material layer 2, limiting the edge of the semi-finished product I, further ensuring that the shape and dimension of the obtained semi-finished product II meet the requirements, ensuring that the sintering temperature is 400-1300 ℃ and the sintering time is 2-10 min, ensuring that the material filled into the gap can be effectively fused with the base material layer 2 into a whole, optimizing the interface bonding condition, and ensuring that the powder layer 31 used for filling the gap between the pit and the diamond particles 3 contains the powder material of the base material layer 2 and the adhesive, the binder is an excessive component for the finished composite material, and the heat conducting property is affected and needs to be removed, so that the sintering process of the semi-finished product is divided into two stages, wherein the temperature of the first stage is 400-600 ℃, the binder is mainly removed, and the second stage is 600-1300, so that the powder material of the substrate layer 2 in the powder material layer 31 filling the gap becomes compact and is fully combined with the substrate layer 2 into a whole, and the interface combination condition is optimized.
S5, the surface of a semi-finished product II obtained after sintering is rough and uneven, and is difficult to be in full and effective contact with a heating device, so that the heat conducting performance is poor, and the diamond particles 3 are covered by filling materials, so that the diamond particles 3 cannot be in direct contact with the heating device, and further the heat conducting performance is affected;
therefore, the semi-finished product II is ground and polished, the diamond particles 3 are exposed, the diamond particles 3 and the substrate layer 2 are combined to form a smooth surface, the smoothness and flatness of the surface of the composite material are improved, the composite material can be fully and well contacted with a heating device, the contact area is increased, and the diamond particles 3 are fully exposed, so that the contact area of the diamond particles 3 and the heating device is large, the heat conducting performance is effectively improved, and finally the composite material of the finished product is obtained.
The composite material prepared by the method is shown in fig. 9, and mainly comprises a composite layer 1, wherein the composite layer 1 comprises a substrate layer 2 and diamond particles 3, the substrate layer 2 is a sheet-shaped metal material layer prepared in advance, the compactness is high, the mechanical property is good, excellent heat conductivity can be ensured, in particular, the substrate layer 2 is a copper layer or a copper-based composite material layer, the copper layer is made of pure copper, the copper-based composite material layer is made of copper as a main component and doped with elements such as silver, aluminum and neodymium, the diamond particles 3 are embedded on the surface of the substrate layer 2, the diamond particles 3 and the surface of the substrate layer 2 are combined to form a flat surface, that is, the diamond particles 3 are exposed on the surface of the substrate layer 2, the diamond particles 3 are flush with the surface of the substrate layer 2 to form a flat surface with high smoothness and good flatness, and the diamond particles 3 are orderly distributed along the surface of the substrate layer 2, preferably the diamond particles 3 are uniformly distributed along the surface of the substrate layer 2, the volume fraction of the diamond particles can be effectively improved, the heat conductivity of the composite material is improved, and the whole heat conductivity is improved.
The diamond particles 3 are monocrystalline particles, and the shapes of the diamond particles include tetrahedrons, hexahedrons, octahedrons, dodecahedron and the like, that is, the surfaces of the diamond particles 3 must have planes, as shown in fig. 10, when the diamond particles 3 are embedded on the surface of the substrate layer 2, it is preferable that one surface of the diamond particles 3 is flush with the surface of the substrate layer 2, that is, the exposed area of the diamond particles 3 on the surface of the substrate layer 2 is increased to the greatest extent, so that the direct contact area of the diamond particles and the heating device is effectively increased, and the heat conducting property is further effectively improved.
In this embodiment, the thickness of the substrate layer 2 is less than or equal to 10mm, the particle size of the diamond particles 3 is less than or equal to 5mm, preferably, the thickness of the substrate layer 2 is 0.1-1 mm, the particle size of the diamond particles 3 is 0.05-0.5 mm, according to practical application requirements, the substrate layers with different thicknesses and the diamond particles with different particle sizes are flexibly selected, and the distance between the diamond particles 3 distributed along the surface of the substrate layer 2 is controlled, so that the volume fraction of the diamond particles is flexibly controlled to adjust the overall thermal conductivity of the composite material, and various different requirements are satisfied.
Finally, the obtained composite material of the single-layer finished product can be sintered after being laminated with a plurality of layers, so that the substrate layers 2 of the adjacent composite layers 1 are fused into a whole, thereby preparing the composite material with large-size thickness, ensuring that diamond particles in the composite material with large-size thickness are uniformly distributed, ensuring that the composite material has no components such as adhesive and the like, and effectively ensuring excellent heat conduction performance.
Example two
In the first embodiment, a method for preparing a heat conductive composite material with diamond particles 3 on one surface is provided, when a composite material with diamond particles 3 on both surfaces is required to be prepared, the diamond composite particles 32 are pressed into one surface of the substrate layer 2, then the substrate layer 2 is turned over and the diamond composite particles 32 are pressed into the other surface of the substrate layer 2, while the embodiment adopts a mode of simultaneously processing both surfaces, as shown in fig. 11, the difference is that in the step S3, a layer of diamond composite particles 32 is orderly arranged on the base 5 through the distributor 4, the substrate layer 2 is horizontally arranged above the layer of diamond composite particles 32 after the distributor is removed, a layer of diamond composite particles 32 is orderly arranged on the upper surface of the substrate layer 2 through the distributor 4, then the pressing head 6 is pressed down to simultaneously press the diamond composite particles 32 into the upper surface and the lower surface of the substrate layer 2, the semi-finished product I with the diamond particles 3 on the surfaces of the two sides is obtained, the diamond composite particles 32 are arranged, so that the upper layer and the lower layer of the diamond composite particles 32 are arranged in a staggered manner, that is, the connection line between one diamond composite particle 32 on the lower surface of the substrate layer 2 and one diamond composite particle 32 on the upper surface of the substrate layer 2 is not perpendicular to the surface of the substrate layer 2, the collision contact of the diamond particles 3 on the upper layer and the lower layer in the pressing process is avoided, the breakage of the diamond particles 3 caused by the compression is avoided, and the integrity of the diamond particles 3 is ensured, so that the diamond particles 3 on the surfaces of the two sides of the obtained semi-finished product I are arranged in a staggered manner, the thickness of the substrate layer can be reduced on the basis that the diamond particles are arranged on the surfaces of the two sides of the substrate layer, the volume fraction of the diamond particles is effectively improved, and the thermal conductivity of the composite material is improved.
As shown in fig. 12, the two side surfaces of the finally obtained heat-conducting composite material are provided with diamond particles 3, the diamond particles 3 are respectively and orderly and uniformly distributed on the two side surfaces of the composite material, the diamond particles 3 on the two side surfaces of the composite material are arranged in a staggered manner, the heat-conducting uniformity of the composite material is good, the volume fraction of the diamond particles is high, and the overall heat conductivity of the composite material is high.
Example III
In step S2, the diamond particles 3 are wrapped by the powder material of the substrate layer 2 to form the diamond composite particles 32, specifically, the diamond composite particles 32 are obtained by mixing and spheroidizing the powder material of the substrate layer 2 with the diamond particles 3, the diamond composite particles 32 are in a spherical shape, when the diamond composite particles 32 are directly arranged on the surface of the substrate layer 2, the diamond composite particles 32 are easy to roll, so that the originally accurate arrangement position is deviated, and the orderly arranged state is easily damaged, therefore, another mode can be adopted to ensure that the diamond composite particles 32 can be stably and orderly arranged on the surface of the substrate layer 2, specifically, as shown in fig. 13 and 14, the diamond composite particles 32 are orderly arranged on the adhesive tape 43 through the distributor 4, and the diamond particles 3 can be adhered and fixed on the adhesive tape 43 due to the viscosity of the adhesive tape 43, and the orderly arranged distribution state is effectively maintained, then the adhesive tape 43 is attached to the surface of the substrate layer 2 in a manner that the diamond composite particles 32 face the surface of the substrate layer 2, the orderly arranged state of the diamond composite particles 32 can be kept stable due to the existence of the adhesive tape 43, the diamond composite particles 32 cannot roll and deviate, the follow-up accurate pressing of the diamond composite particles 32 into the surface of the substrate layer 2 is facilitated, the orderly and uniform distribution of the diamond particles 3 in the finally obtained heat-conducting composite material is ensured, after the adhesive tape 43 adhered with the diamond composite particles 32 is attached to the substrate layer 2, the follow-up step S3 can be directly carried out, namely the diamond composite particles 32 are pressed into the surface of the substrate layer 2 by adopting a pressing die, but the adhesive tape 43 is broken and remains on the diamond composite particles 32 and the substrate layer 2 due to the large pressure in the pressing process, the follow-up cleaning is needed, the cleaning difficulty is high, so that it is preferable to pre-press the diamond composite particles 32 with a small pressure, specifically, the pre-pressing mold with a pressure of 1-5 MPa, pre-embedding a small portion of the diamond composite particles 32 into the surface of the substrate layer 2, removing the adhesive tape 43, cleaning the diamond composite particles 32 and the organic matters such as the residual adhesive on the substrate layer 2 with an organic solvent, and fully pressing the diamond composite particles 32 into the surface of the substrate layer 2 by the pressing mold according to a normal pressing pressure (6-160 MPa) to obtain a semi-finished product.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that the above-mentioned preferred embodiment should not be construed as limiting the invention, and the scope of the invention should be defined by the appended claims. It will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the spirit and scope of the invention, and such modifications and adaptations are intended to be comprehended within the scope of the invention.
Claims (11)
1. The preparation method of the heat-conducting composite material is characterized by comprising the following steps:
coating the diamond particles (3) with powder material of a substrate layer (2) to obtain diamond composite particles (32), wherein the diamond composite particles (32) comprise the diamond particles (3) and a powder material layer (31) coated on the outer surface of the diamond particles (3), and the substrate layer (2) is a prefabricated metal material layer;
orderly arranging diamond composite particles (32) on the surface of the substrate layer (2);
pressing the diamond composite particles (32) into the surface of the substrate layer (2) by adopting a pressing die to obtain a semi-finished product I;
sintering the semi-finished product I to obtain a semi-finished product II;
and grinding the semi-finished product II to expose the diamond particles (3), and combining the diamond particles (3) with the substrate layer (2) to form a flat surface to obtain the finished heat-conducting composite material.
2. The method for preparing the heat-conducting composite material according to claim 1, wherein the powder material of the base material layer (2) and the diamond particles (3) are mixed and spheroidized, the adhesive is added in an atomizing spraying mode, and the powder material of the base material layer (2) is coated on the diamond particles (3) through the adhesive to obtain the diamond composite particles (32).
3. The method for preparing the heat-conducting composite material according to claim 1, wherein the diamond composite particles are orderly arranged on the surface of the substrate layer (2) through a distributor (4), a plurality of distribution holes (41) matched with the particle size of the diamond composite particles are formed in the distributor (4), the distribution holes (41) are orderly arranged along the surface of the substrate layer (2), and each distribution hole (41) only contains one diamond composite particle (32).
4. A method of producing a heat conductive composite material according to claim 3, wherein the distributing hole (41) is a slot hole, and the distributing device (4) is provided with an air hole (42) connected to the distributing hole (41), and the aperture of the air hole (42) is smaller than the particle diameter of the diamond composite particles (32) and is used for connecting a negative pressure device.
5. A method of producing a thermally conductive composite material as claimed in claim 3, characterized in that the diamond composite particles (32) are sequentially arranged on the tape (43) by the distributor (4), then the tape (43) is attached to the substrate layer (2) in such a manner that the diamond composite particles (32) face the surface of the substrate layer (2), the pressing die is pre-pressed to pre-embed the diamond composite particles (32) on the surface of the substrate layer (2), then the tape (43) is removed, and the diamond composite particles (32) are pressed into the surface of the substrate layer (2) by the pressing die to obtain the semi-finished product one.
6. The method according to claim 1, wherein the substrate layer (2) is heated while the diamond composite particles are pressed into the surface of the substrate layer (2) by a pressing die, and the heating temperature is 400-1000 ℃.
7. The method for preparing a heat-conducting composite material according to claim 1, wherein the pressing mold comprises a base body (5) and a pressing head (6), a layer of diamond composite particles (32) are orderly arranged on the base body (5), the base material layer (2) is horizontally arranged on the layer of diamond composite particles, a layer of diamond composite particles (32) are orderly arranged on the upper surface of the base material layer (2), and then the pressing head (6) presses the diamond composite particles into the surface of the base material layer (2) to obtain a semi-finished product I.
8. The method of claim 7, wherein the diamond composite particles are arranged in a staggered manner on two side surfaces of the semi-finished product.
9. The method of manufacturing a thermally conductive composite material according to any one of claims 1 to 8, wherein the semi-finished product is sintered in a vacuum environment or in a gas-shielded environment.
10. The method of claim 9, wherein the first semi-finished product is placed in a sintering mold for limiting the shape and size of the first semi-finished product for sintering.
11. A thermally conductive composite material produced by the method of any one of claims 1 to 10.
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| CN101885060B (en) * | 2010-06-22 | 2012-07-25 | 上海中希合金有限公司 | High-performance copper-diamond electrical contact material and preparation process thereof |
| CN102672188B (en) * | 2012-06-05 | 2015-01-21 | 安泰科技股份有限公司 | Method for positioning and distributing diamonds in tool bit and distributing device |
| CN104858435B (en) * | 2015-05-12 | 2017-02-22 | 东南大学 | Method for preparing sandwich structure diamond-Al composite material |
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