CN216852796U - Wiring structure and electronic equipment - Google Patents

Abstract

The utility model discloses a walk line structure and electronic equipment belongs to electron technical field. The routing structure comprises a bottom plate and at least two shields; each shielding piece is connected with the same surface of the bottom plate, and a wiring gap is formed between the outer side walls of every two adjacent shielding pieces. This disclosure can be favorable to miniaturized design.

Description

Wiring structure and electronic equipment

Technical Field

The present disclosure relates to electronic devices, and particularly to a wiring structure and an electronic device.

Background

In electronic devices, wires are often included through which connections between electronic components in the electronic devices can be made.

When assembling electronic equipment, in order to fully utilize the internal space of the electronic equipment, wires need to be routed reasonably. In the related art, the wires are usually routed against the bottom plate to minimize the thickness dimension of the electronic device in the direction perpendicular to the bottom plate. However, for the electronic device with the shielding element, since the shielding element is connected to the bottom plate, the wiring space of the wires is occupied, and the wires need to be routed from above the shielding element.

However, such routing leads to an increase in the thickness dimension of the electronic device.

SUMMERY OF THE UTILITY MODEL

In order to overcome the problems in the related art to a certain extent, the embodiments of the present disclosure provide a routing structure and an electronic device, where the technical scheme is as follows:

according to one aspect of the present disclosure, there is provided a routing structure, including a backplane and at least two shields;

each shielding piece is connected with the same surface of the bottom plate, and a wiring gap is formed between the outer side walls of every two adjacent shielding pieces.

In one implementation of the present disclosure, the outer sidewall of the shield has a curved surface;

the cambered surface is located at a position of the shielding piece corresponding to the routing gap, and the cambered surface protrudes towards the routing gap.

In one implementation of the present disclosure, an outer sidewall of the shield has a protrusion;

the protrusion is located at a position of the shielding piece corresponding to the trace gap.

In one implementation manner of the present disclosure, a length direction of the protrusion is the same as an extending direction of the trace gap.

In an implementation manner of the present disclosure, the number of the protrusions is multiple, and the multiple protrusions are sequentially arranged at intervals along the extending direction of the routing gap.

In one implementation of the present disclosure, the sidewall of the shield has at least two threading holes;

each threading hole is communicated with the inner space of the shielding piece, and the threading holes are spaced from each other.

In one implementation of the present disclosure, an included angle is formed between a penetrating direction of the threading hole and a side wall of the shielding member.

In one implementation of the present disclosure, a cross-sectional shape of the threading hole on a plane parallel to the side wall of the shield is a parallelogram.

In one implementation of the present disclosure, the routing structure further includes a covering part;

the covering piece is attached to the shielding piece and located on one side, far away from the bottom plate, of the shielding piece, and the covering piece covers the wiring gap.

According to another aspect of the present disclosure, there is provided an electronic device, including a conductive wire and the aforementioned routing structure;

the wires are laid in the routing gaps of the routing structure.

The beneficial effects brought by the technical scheme provided by the embodiment of the disclosure at least comprise:

after the wiring structure is applied to the electronic equipment, when the wires are wired, the wires can be accommodated by utilizing the wiring gaps because the wiring gaps are formed between the outer side walls of the two adjacent shielding pieces. Because the wires are accommodated in the routing gaps, the thickness dimension of the electronic equipment in the direction vertical to the bottom plate can not be increased.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a routing structure provided in the embodiment of the present disclosure;

FIG. 3 is a sectional view taken in the direction A-A of FIG. 2 provided by an embodiment of the present disclosure;

FIG. 4 is a sectional view taken in the direction A-A of FIG. 2 provided by an embodiment of the present disclosure;

FIG. 5 is a schematic view of the structure in the direction B of FIG. 4 according to an embodiment of the present disclosure;

FIG. 6 is a sectional view taken in the direction A-A of FIG. 2 provided by an embodiment of the present disclosure;

FIG. 7 is a schematic view of the arrangement of threading holes provided by the disclosed embodiment;

fig. 8 is a schematic layout diagram of a pad provided by an embodiment of the present disclosure.

The symbols in the drawings represent the following meanings:

10. a base plate;

11. a pad; 111. a first region; 112. a second region;

20. a shield;

21. a cambered surface; 22. a protrusion; 23. threading holes;

30. a routing gap;

40. a cover;

100. a wire;

200. and a wiring structure.

Detailed Description

To make the objects, technical solutions and advantages of the present disclosure more apparent, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

In electronic devices, wires are often included through which connections between electronic components in the electronic devices can be made.

When assembling electronic equipment, in order to fully utilize the internal space of the electronic equipment, wires need to be routed reasonably. In the related art, the wires are usually routed against the bottom plate to minimize the thickness dimension of the electronic device in the direction perpendicular to the bottom plate. However, for the electronic device with the shielding element, since the shielding element is connected to the bottom plate, the wiring space of the wires is occupied, and the wires need to be routed from above the shielding element.

However, such routing leads to an increase in the thickness dimension of the electronic device.

In order to solve the above technical problem, an embodiment of the present disclosure provides an electronic device, where fig. 1 is a schematic structural diagram of the electronic device, and referring to fig. 1, the electronic device includes a conductive wire 100 and a routing structure 200, and the conductive wire 100 is laid in a routing gap 30 of the routing structure 200.

When the conductive wire 100 is routed, since the conductive wire 100 is laid in the routing gap 30 of the routing structure 200, the routing gap 30 provides a routing space for the conductive wire 100, so that the thickness of the electronic device is not increased due to the routing of the conductive wire 100.

By way of example, the electronic device is a mobile phone, a tablet computer, a notebook computer, a vehicle-mounted computer, a handheld device with a screen, and the like, and the disclosure is not limited thereto.

As can be seen from the foregoing, the thickness of the electronic device provided in the embodiment of the disclosure is not increased due to the routing, because the electronic device has the routing structure 200 and the routing gap 30 of the routing structure 200 is utilized for routing. Therefore, the trace structure 200 will be described below.

Fig. 2 is a schematic structural diagram of a trace structure, and with reference to fig. 2, in this embodiment, the trace structure includes a bottom plate 10 and at least two shielding elements 20, each shielding element 20 is connected to the same surface of the bottom plate 10, and a trace gap 30 is formed between outer sidewalls of two adjacent shielding elements 20.

In the above implementation manner, the bottom plate 10 is used for bearing the shielding element 20, and the shielding element 20 is connected to the bottom plate 10 and can shield the electronic element on the bottom plate 10, so as to play a role in shielding and prevent the electronic element from receiving electromagnetic interference. Illustratively, the shielding member 20 is a shielding case, and includes a cover plate and a plurality of side walls, the side walls are sequentially connected and enclosed into a frame shape, and the cover plate covers the side walls enclosed into the frame shape.

When the wire 100 is routed by using the routing structure, since the routing gap 30 is formed between the outer sidewalls of two adjacent shielding members 20, the wire 100 can be accommodated by using the routing gap 30. Since the trace gap 30 is formed by the bottom plate 10 and the outer sidewalls of two adjacent shielding members 20, the thickness dimension of the trace gap 30 in the direction perpendicular to the bottom plate 10 is equal to the thickness dimension of the shielding members 20 in the direction perpendicular to the bottom plate 10. As such, the conductive wires 100 are accommodated in the trace gaps 30, and the thickness of the electronic device in the direction perpendicular to the bottom plate 10 is not increased.

As can be seen from the foregoing, the trace gap 30 is a key structure for accommodating the conductive trace 100, and the trace gap 30 is described below.

Fig. 3 is a sectional view taken along line a-a of fig. 2, wherein the dotted line is a schematic view of the conductive line 100. Referring to fig. 3, in the present embodiment, the outer sidewall of the shielding element 20 has an arc surface 21, the arc surface 21 is located at a position of the shielding element 20 corresponding to the trace gap 30, and the arc surface 21 protrudes toward the trace gap 30.

In the above implementation manner, the outer side wall of the shielding element 20 corresponding to the portion of the routing gap 30 is designed to be the arc surface 21, so that the size of the routing gap 30 can be appropriately reduced, the wire 100 is more stably clamped in the routing gap 30, and the wire is prevented from being separated from the routing gap 30. Therefore, a line card for wiring is not required to be arranged, and the cost of the electronic equipment is reduced. Besides, by designing the outer side wall of the shielding element 20 in this way, the wire 100 can be more easily pressed into the trace gap 30, and the assembly efficiency is improved.

Illustratively, one side of the extending direction of the trace gap 30 is an outer sidewall of one shielding element 20, the other side of the extending direction of the trace gap 30 is an outer sidewall of another shielding element 20, and the outer sidewalls of both shielding elements 20 are cambered surfaces 21. Of course, in other embodiments, only one outer sidewall of the shielding element 20 can be the arc surface 21, which is not limited by the present disclosure.

Fig. 4 is a sectional view taken along line a-a of fig. 2, wherein the dotted line is a schematic view of the conductive line 100. The viewing angles of fig. 4 and 3 are the same, except for the outer sidewall of the shield 20. Referring to fig. 4, in the present embodiment, the outer sidewall of the shielding element 20 has a protrusion 22, and the protrusion 22 is located at a position of the shielding element 20 corresponding to the trace gap 30.

In the above implementation manner, the effect of the protrusion 22 is similar to that of the arc surface 21, and the size of the routing gap 30 can be appropriately reduced, so that the wire 100 is more stably clamped in the routing gap 30, and is prevented from being separated from the routing gap 30. Therefore, a line card for wiring is not required to be arranged, and the cost of the electronic equipment is reduced. Besides, by designing the outer side wall of the shielding element 20 in this way, the wire 100 can be more easily pressed into the trace gap 30, and the assembly efficiency is improved.

Illustratively, one side of the extending direction of the trace gap 30 is an outer sidewall of one of the shields 20, the other side of the extending direction of the trace gap 30 is an outer sidewall of the other shield 20, and the outer sidewalls of both the shields 20 have the protrusion 22. Of course, in other embodiments, only one outer sidewall of the shield 20 can have the protrusion 22, which is not limited by the present disclosure.

Fig. 5 is a schematic view of the structure in the direction B of fig. 4, and with reference to fig. 5, in the present embodiment, the protrusion 22 is a long bar shape, and the length direction of the protrusion 22 is the same as the extending direction of the trace gap 30.

After the wire 100 is laid in the routing gap 30, since the wire 100 is routed along the extending direction of the routing gap 30, the extending direction of the protrusion 22 designed in the length direction is the same as the extending direction of the routing gap 30, so that the protrusion 22 can be better contacted with the wire 100, and the wire 100 can be effectively clamped in the routing gap 30.

Illustratively, the number of the bumps 22 is plural, and the plural bumps 22 are sequentially arranged at intervals along the extending direction of the trace gap 30. Similarly, the arrangement direction of the bumps 22 is designed to be the same as the extending direction of the trace gap 30, so that the bumps 22 can better contact with the wires 100, and the wires 100 can be effectively clamped in the trace gap 30.

Illustratively, the number of bumps 22 on both sides of the trace gap 30 is the same. The protrusions 22 on both sides of the trace gap 30 can be disposed in a one-to-one opposite manner or in a staggered manner, which is not limited by the present disclosure.

In this embodiment, the protrusion 22 is connected to the outer sidewall of the shield 20 by welding. In other embodiments, the protrusion 22 is a flange formed by folding the outer wall of the shielding element 20, and thus the manufacturing efficiency can be effectively improved.

Fig. 6 is a sectional view taken along the line a-a of fig. 2, in which the broken line is a schematic view of the conductive line 100. Fig. 6 is the same as fig. 3 in view, except that a cover 40 is added. Referring to fig. 6, in the present embodiment, the trace structure further includes a covering part 40, the covering part 40 is attached to the shielding part 20 and is located on a side of the shielding part 20 far away from the bottom plate 10, and the covering part 40 covers the trace gap 30.

In the above implementation manner, the covering member 40 not only can further prevent the wires 100 from falling off the routing gap 30, but also can play a certain heat dissipation effect.

Illustratively, the covering member 40 is a part having a heat dissipation function, such as a copper foil, a graphite sheet, and/or a vapor chamber.

Referring again to fig. 5, in the present embodiment, the side wall of the shielding member 20 has at least two threading holes 23, each threading hole 23 communicates with the inner space of the shielding member 20, and the threading holes 23 are spaced apart from each other.

In the above implementation, the threading hole 23 is used to insert the wire 100. In the process of routing, the wire 100 can penetrate into the inner space of the shielding element 20 through one threading hole 23, and then penetrate out of the inner space of the shielding element 20 through the other threading hole 23, so that the routing mode of the wire 100 is further increased, and the routing of the wire 100 is more flexible. Equivalently, the routing of the wire 100 at the periphery of the shield 20 is realized by the routing gap 30, and the routing of the wire 100 at the inside of the shield 20 is realized by the threading hole 23. Of course, the threading hole 23 and the routing gap 30 can be used in cooperation with each other or separately, which is not limited by the present disclosure.

It should be noted that the arrangement of the threading holes 23 on the shielding member 20 depends on the desired routing of the wires 100. That is, where the lead wire 100 is to be inserted into the shield 20, a threading hole 23 is formed therethrough. Accordingly, where the guide is to be passed through the shield 20, another threading hole 23 is formed therethrough.

For example, fig. 7 is a schematic layout view of the threading holes 23, and the viewing angle of fig. 7 is the same as that of fig. 2, except that the outer contour of the shielding element 20 is simplified in fig. 7, and the threading holes 23 are illustrated by dashed lines, and in conjunction with fig. 7, for example, if the routing direction of the wire 100 needs to penetrate through the shielding element 20, then two threading holes 23 are respectively opened on two opposite side walls of the shielding element 20, so that the wire 100 can penetrate through the shielding element 20. Of course, the lead 100 should not interfere with the electronic components housed within the shield 20 during penetration through the shield 20.

In the present embodiment, the threading hole 23 has an angle α with the sidewall of the shielding member 20. So design, the length of increase through wires hole 23 that can be effectual has avoided tearing shielding member 20 because of seting up through wires hole 23 and leading to stress concentration.

Illustratively, the angle α between the penetrating direction of the threading hole 23 and the sidewall of the shield 20 is 45 °.

Illustratively, the cross-sectional shape of the threading hole 23 on a plane parallel to the side wall of the shield 20 is a parallelogram. So design for the cross sectional shape of through wires hole 23 is comparatively regular, is favorable to avoiding more because of seting up through wires hole 23 and leading to stress concentration, tears shielding 20.

It should be noted that, in order to avoid the threading hole 23 affecting the shielding effect of the shielding element 20, the aperture of the threading hole 23 should not be larger than the rf leakage threshold, for example, not larger than 0.5 mm.

In the present embodiment, the substrate 10 is a Printed Circuit Board (PCB), and the shape of the pad 11 on the substrate 10 corresponds to the shield 20. Fig. 8 is a schematic diagram of the structure of the bonding pad 11, the view angle of fig. 8 is the same as that of fig. 2, and the shape of the bonding pad 11 corresponds to the shape of the shield 20 in fig. 7.

In the present embodiment, the plurality of pads 11 form a ring shape around, and the pads 11 have a trapezoidal structure. For example: the bonding pads 11 may be isosceles trapezoids, the upper bottom of one bonding pad 11 faces inward, and the upper bottom of another bonding pad 11 adjacent to the bonding pad 11 faces outward, that is, the bonding pads 11 are arranged at intervals in a staggered manner. In this way, the waist of two adjacent pads 11 can correspond to the hole wall of the threading hole 23.

Illustratively, the bonding pad 11 includes a first region 111 and a second region 112, the first region 111 has an isosceles trapezoid shape, and the second region 112 is disposed outside the first region 111 along an upper bottom and two waist edges of the first region 111. When the first region 111 faces inward and the second region 112 faces outward, the solder paste strength of the first region 111 is weaker than that of the second region 112, and when the first region 111 faces outward and the second region 112 faces inward, the solder paste strength of the first region 111 is stronger than that of the second region 112. By the design, stress concentration caused by welding can be reduced, and welding strength is guaranteed.

The above description is intended to be exemplary only and not to limit the present disclosure, and any modification, equivalent replacement, or improvement made without departing from the spirit and scope of the present disclosure is to be considered as the same as the present disclosure.

Claims (10)

1. A routing structure, characterized by comprising a backplane (10) and at least two shields (20);

each shielding piece (20) is connected with the same surface of the bottom plate (10), and a wiring gap (30) is formed between the outer side walls of two adjacent shielding pieces (20).

2. The trace structure according to claim 1, wherein an outer side wall of the shield (20) has an arc surface (21);

the cambered surface (21) is located at a position, corresponding to the routing gap (30), of the shielding piece (20), and the cambered surface (21) protrudes towards the routing gap (30).

3. The routing structure according to claim 1, wherein an outer sidewall of the shield (20) has a protrusion (22);

the bulge (22) is positioned at the part of the shielding piece (20) corresponding to the routing gap (30).

4. Routing structure according to claim 3, wherein the length direction of the protrusion (22) is the same as the extending direction of the routing gap (30).

5. The trace structure according to claim 3, wherein the number of the protrusions (22) is plural, and the plural protrusions (22) are sequentially arranged at intervals along the extending direction of the trace gap (30).

6. Routing structure according to any of claims 1 to 5, wherein the side walls of the shield (20) have at least two threading holes (23);

the threading holes (23) are communicated with the inner space of the shielding piece (20), and the threading holes (23) are spaced from each other.

7. The routing structure according to claim 6, wherein a penetrating direction of the threading hole (23) forms an angle with a sidewall of the shielding element (20).

8. A cabling arrangement according to claim 6, wherein the threading hole (23) has a parallelogram-shaped cross-section in a plane parallel to the side walls of the shield (20).

9. Routing structure according to any of claims 1-5, wherein the routing structure further comprises a cover (40);

the covering piece (40) is attached to the shielding piece (20) and located on one side, far away from the bottom plate (10), of the shielding piece (20), and the covering piece (40) covers the wiring gap (30).

10. An electronic device, characterized in that it comprises a wire (100) and a routing structure (200) according to any of claims 1-9;

the conducting wire (100) is laid in the routing gap (30) of the routing structure (200).

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