CN111556654A - Printed circuit board and electronic equipment - Google Patents

Printed circuit board and electronic equipment Download PDF

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Publication number
CN111556654A
CN111556654A CN202010330197.0A CN202010330197A CN111556654A CN 111556654 A CN111556654 A CN 111556654A CN 202010330197 A CN202010330197 A CN 202010330197A CN 111556654 A CN111556654 A CN 111556654A
Authority
CN
China
Prior art keywords
antenna
circuit board
stamp hole
printed circuit
stamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010330197.0A
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Chinese (zh)
Inventor
陈国江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fibocom Wireless Inc
Original Assignee
Fibocom Wireless Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fibocom Wireless Inc filed Critical Fibocom Wireless Inc
Priority to CN202010330197.0A priority Critical patent/CN111556654A/en
Publication of CN111556654A publication Critical patent/CN111556654A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183Components mounted in and supported by recessed areas of the printed circuit board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H01Q1/2266Supports; Mounting means by structural association with other equipment or articles used with computer equipment disposed inside the computer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

The application relates to a printed circuit board and an electronic device, wherein a first stamp hole is formed in the side surface of a circuit substrate in the direction intersecting with the thickness direction, and an antenna of the printed circuit board is arranged along the routing direction of the first stamp hole (namely, the direction intersecting with the thickness direction of the circuit substrate). By reasonably applying the side surface of the circuit substrate through the scheme, the antenna which is originally printed on the front surface of the circuit substrate and occupies a certain area is arranged on the side surface, so that the radiation area of the antenna can be effectively increased; and each side surface of the printed circuit board can be utilized, so that the radiation direction of the antenna can be flexibly set, and the antenna is ensured to have higher radiation efficiency.

Description

Printed circuit board and electronic equipment
Technical Field
The present application relates to the field of communications technologies, and in particular, to a printed circuit board and an electronic device.
Background
A Printed Circuit Board (PCB) is an extremely important electronic component, which is a support for electronic components and a carrier for electrical connection of electronic components. Almost every electronic device, as small as electronic watches, calculators, as large as computers, communication electronics, etc., uses printed circuit boards as long as there are electronic components such as integrated circuits. For some circuit boards with communication function, a PCB antenna for transmitting or receiving wireless signals is generally disposed on the circuit board.
The conventional PCB antenna design needs to occupy a large area of a PCB board to realize the radiation effect of the antenna, and in the module design, because the space is limited and a complete shielding cover is needed to cover and protect a chip mounter on a module, the radiation efficiency of the PCB antenna is very poor. Therefore, the conventional PCB antenna has a disadvantage of poor radiation efficiency.
Disclosure of Invention
Accordingly, it is necessary to provide a printed circuit board and an electronic device for solving the problem of poor radiation efficiency of the conventional PCB antenna.
A printed circuit board comprises a circuit substrate and an antenna, wherein a first stamp hole is formed in the side surface of the circuit substrate in the direction intersecting with the thickness direction of the circuit substrate, and the antenna is arranged in the first stamp hole along the wiring direction of the first stamp hole.
In one embodiment, the number of the side surfaces of the circuit substrate, on which the first stamp hole is opened, is two or more.
In one embodiment, the printed circuit board further includes a matching circuit, the matching circuit is disposed on the circuit substrate, and the antennas disposed on any two adjacent side surfaces are connected through the matching circuit.
In one embodiment, the matching circuit includes an inductor, a first capacitor, and a second capacitor, one end of the inductor is connected to one end of the first capacitor and the antenna in the first side surface, the other end of the inductor is connected to one end of the second capacitor and the antenna in the second side surface, the other end of the first capacitor and the other end of the second capacitor are both grounded, and the first side surface and the second side surface are adjacent side surfaces.
In one embodiment, a second stamp hole is further formed in the side surface of the circuit substrate along the thickness direction, the first stamp hole is communicated with the second stamp hole, and the antenna is disposed along the routing direction of the first stamp hole and the routing direction of the second stamp hole.
In one embodiment, the first stamp hole has a routing direction perpendicular to the routing direction of the second stamp hole.
In one embodiment, the number of the second stamp holes is two, and the second stamp holes are respectively disposed at two ends of the first stamp hole in the routing direction.
In one embodiment, the trace shape of the first stamp aperture includes at least one of a straight line or an arc.
An electronic device comprises the printed circuit board.
In one embodiment, the electronic device is a mobile phone or a tablet computer.
In the printed circuit board and the electronic device, the first stamp hole is formed in the side surface of the circuit substrate in the direction intersecting the thickness direction, and the antenna of the printed circuit board is arranged along the routing direction of the first stamp hole (i.e., the direction intersecting the thickness direction of the circuit substrate). By reasonably applying the side surface of the circuit substrate through the scheme, the antenna which is originally printed on the front surface of the circuit substrate and occupies a certain area is arranged on the side surface, so that the radiation area of the antenna can be effectively increased; and each side surface of the printed circuit board can be utilized, so that the radiation direction of the antenna can be flexibly set, and the antenna is ensured to have higher radiation efficiency.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a printed circuit board according to an embodiment;
FIG. 2 is a schematic diagram of a conventional postage stamp hole design in accordance with one embodiment;
FIG. 3 is a schematic diagram of a printed circuit board structure according to another embodiment;
fig. 4 is a schematic diagram of a printed circuit board structure according to another embodiment.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Referring to fig. 1, a printed circuit board includes a circuit substrate 10 and an antenna 20, a first stamp hole (not shown) is formed in a side surface of the circuit substrate 10 in a direction intersecting a thickness direction of the circuit substrate 10, and the antenna 20 is disposed in the first stamp hole along a routing direction of the first stamp hole.
Specifically, the routing direction of the first stamp hole is the direction of opening the first stamp hole, i.e., the direction intersecting the thickness direction of the circuit substrate 10. The edges of the printed circuit board are cut to form a series of half-holes, i.e. stamp holes, by electroplating graphitization of the holes or through-holes at the edges of the printed circuit board, i.e. in the actual printed circuit board, the stamp holes are usually in the form of half-holes. The traditional stamp hole design is that stamp holes are generally formed in the thickness direction of a printed circuit board, and a plurality of stamp holes in a half-hole form are usually formed in the surface of the same side of each printed circuit board, specifically, as shown in fig. 2, the length of each stamp hole (i.e., the length of a trace corresponding to the stamp hole) depends on the thickness of the printed circuit board, the thickness of the printed circuit board is what, and the length of each stamp hole formed in the direction can only reach the same size.
The antenna 20 in the printed circuit board generally needs a larger area to achieve the radiation effect of the antenna 20, while the thickness of the circuit board of the printed circuit board is generally smaller, only about 0.8mm-1.5mm, and obviously, the stamp hole formed along the thickness direction of the circuit board 10 cannot meet the design requirement of the antenna 20 in length and area. The stamp hole can only be used for SMT (Surface Mounted Technology) welding, and the stamp hole in the traditional printed circuit board cannot be well utilized. The technical scheme of this application will originally set up the stamp hole on the thickness direction of circuit substrate 10 again, change into and set up first stamp hole with the crossing direction of thickness direction, printed circuit board's length and width (being the length and the width of circuit substrate 10 upper and lower surface) are generally very big, often reach dozens of millimeters or even hundreds of millimeters, through beginning first stamp hole in the crossing direction with the thickness direction, the length of the corresponding line of first stamp hole is greater than 1.5mm far away this moment, generally can expand to about 40mm, accord with general antenna 20 design requirement completely. In the antenna 20 of the present application, the thickness (i.e., the side surface) of the printed circuit board and the exposed postage stamp hole of the printed circuit board act as the antenna 20 to radiate the signal, and the antenna 20 has very strong directivity and can be better used for directional transmission or short-distance transmission.
In one embodiment, the number of the side surfaces of the circuit substrate 10 on which the first stamp hole is opened is two or more.
Specifically, the circuit substrate 10 generally includes four side surfaces, each of which may be used to perform the arrangement of the antenna 20. Therefore, in order to further increase the length of the antenna 20, increase the radiation area of the antenna 20, design the antenna 20 in a specific radiation direction, and the like, the first stamp hole may be simultaneously opened in two or more side surfaces and the antenna 20 may be designed in the corresponding first stamp hole, that is, the antenna 20 may be designed by simultaneously opening the first stamp hole in two side surfaces, three side surfaces, or four side surfaces.
It will be appreciated that when the number of side surfaces on which the first stamp hole is formed is two, the two side surfaces may be adjacent side surfaces or opposite side surfaces, as long as the antennas 20 provided on the two side surfaces can be combined together by other components of the printed circuit board to form the same antenna 20 for both signal receiving and transmitting operations. It should be noted that, in one embodiment, the first stamp hole may be formed in only one of the side surfaces of the circuit substrate 10, and the antenna 20 may be designed, as long as the resulting antenna 20 is ensured to effectively perform the signal receiving and transmitting operations.
Referring to fig. 3, in an embodiment, the printed circuit board further includes a matching circuit 30, the matching circuit 30 is disposed on the circuit substrate 10, and the antennas 20 disposed on any two adjacent side surfaces are connected through the matching circuit 30.
Specifically, in order to ensure that the antennas 20 disposed on the respective side surfaces can be effectively combined to realize the final signal transmitting and receiving functions, the matching circuits 30 are disposed between the respective adjacent side surfaces and connected to each other, and the antennas 20 disposed on the different side surfaces are connected to form one antenna 20. It is understood that in other embodiments, the matching circuit 30 may be used to connect the antennas 20 on the opposite surfaces, as long as it is ensured that the antennas 20 are finally connected to form one antenna 20 through the matching circuit 30. The present embodiment uses the matching circuit 30 to connect the antennas 20 on the adjacent side surfaces, and has the advantages of simple layout and saving the area of the circuit substrate 10 while ensuring that the finally formed antenna 20 has good signal transmitting and receiving functions.
It should be noted that when the number of side surfaces of the circuit substrate 10 in which the first stamp hole is opened is not uniform, the number of the corresponding matching circuits 30 is also not uniform. When the antennas 20 are disposed only on the adjacent side surfaces, in order to realize the combination between the antennas 20, only one matching circuit 30 needs to be disposed at a position corresponding to the circuit substrate 10 near both side surfaces. Similarly, when the number of side surfaces where the first stamp hole is provided for designing the antenna 20 is three, two matching circuits 30 are required to realize the combination between the antennas 20; when the number of side surfaces where the first stamp hole is provided for the design of the antenna 20 is four, three matching circuits 30 are required to realize the combination between the antennas 20.
In one embodiment, the matching circuit 30 includes an inductor, a first capacitor and a second capacitor, one end of the inductor is connected to one end of the first capacitor and the antenna 20 in the first side surface, the other end of the inductor is connected to one end of the second capacitor and the antenna 20 in the second side surface, the other end of the first capacitor and the other end of the second capacitor are both grounded, and the first side surface and the second side surface are adjacent side surfaces.
Specifically, a simple matching circuit 30 is formed by an inductor and two capacitors, so that the antennas 20 disposed on any two adjacent side surfaces are connected together to realize transmission and reception of signals. The matching circuit 30 of this type is used to realize the splicing and assembling operations of different sections of antennas 20, and has the advantage of saving the occupied area of the circuit substrate 10.
It is understood that in other embodiments, other types of matching circuits 30 may be used to perform the antenna 20 combining operation in the adjacent side surfaces in combination with the actual usage scenario of the printed circuit board, as long as the resulting one antenna 20 can achieve effective signal receiving and transmitting operations.
Referring to fig. 3, in one embodiment, a second stamp hole is further formed in the side surface of the circuit substrate 10 along the thickness direction, the first stamp hole is communicated with the second stamp hole, and the antenna 20 is disposed along the routing direction of the first stamp hole and the routing direction of the second stamp hole.
Specifically, in the present embodiment, the same side surface of the circuit substrate 10 includes both the second stamp hole disposed along the thickness direction of the circuit substrate 10 and the first stamp hole designed in the direction intersecting the thickness direction, and the first stamp hole and the second stamp hole are communicated with each other. When designing the antenna 20 on the side surface, the antenna 20 can be laid out along the thickness direction of the circuit board 10 and the direction intersecting the thickness direction, and in this case, the antenna 20 is designed in a meandering manner, which is not a simple one-line design. Through the technical scheme of the embodiment, the antenna 20 can be designed in the thickness direction of the circuit substrate 10 and the direction intersecting with the thickness direction, so that the length of the antenna 20 can be further increased, the antenna 20 can be designed in a more flexible radiation direction, and the radiation efficiency of the antenna 20 of the printed circuit board is further enhanced.
With continued reference to FIG. 3, in one embodiment, the routing direction of the first stamp hole is perpendicular to the routing direction of the second stamp hole.
Specifically, the trace direction of the first stamp hole is perpendicular to the trace direction of the second stamp hole, that is, the antenna 20 in the first stamp hole is laid out in the direction perpendicular to the thickness direction, and the finally obtained antenna 20 has a regular zigzag shape on the side surface. The scheme is adopted to open the first stamp hole, and the stamp hole opening method has the advantages of simple process and easiness in implementation. It is understood that in other embodiments, the trace direction of the first stamp hole and the trace direction of the second stamp hole may be at an angle greater than 0 degree and less than 90 degrees, as long as the total length of the antenna 20 designed in the first stamp hole and the second stamp hole reaches the design requirement of the antenna 20.
Furthermore, in an embodiment, as shown in fig. 4, a plurality of first stamp holes and a plurality of second stamp holes may be formed on the same side surface of the circuit substrate 10, the routing direction of each first stamp hole is the same and is perpendicular to the routing direction of each second stamp hole, and the first stamp holes and the second stamp holes are sequentially connected, so as to finally obtain the bent antenna 20 structure, which can also implement the operations of receiving and sending signals.
In one embodiment, the number of the second stamp holes is two, and the second stamp holes are respectively disposed at two ends of the first stamp hole in the routing direction.
Specifically, when two second stamp holes are respectively disposed at both ends of the first stamp hole, the corresponding antennas 20 are arranged in a zigzag shape as shown in fig. 3, so that the resulting antenna 20 is long to meet the requirement of the length design of the antenna 20. Meanwhile, due to the design of the second stamp hole at two ends of the first stamp hole and the antenna 20, when the antenna 20 is designed on a plurality of side surfaces at the same time, the antenna 20 is closer to the matching circuit 30 arranged on the circuit substrate 10, and the matching circuit 30 can more conveniently combine the antennas 20 on the side surfaces into one antenna 20.
In one embodiment, the trace shape of the first stamp aperture includes at least one of a straight line or an arc. It will be appreciated that the direction intersecting the thickness direction of the circuit substrate 10 may be a regular straight direction, or may be an arc direction having a certain radian, that is, the first stamp hole may be shaped as a straight line, an arc line, or a combination of a straight line and an arc line, and the antenna 20 designed correspondingly may be at least one of a straight line and an arc line, so as to obtain an antenna 20 with a sufficient length to implement the reception and transmission of signals. In this embodiment, the vertical (i.e., along the thickness direction) stamp hole is changed to be combined with the vertical and horizontal (i.e., perpendicular to the thickness direction) or arc-shaped stamp hole, and the antenna 20 is further designed in each stamp hole, so that the radiation area of the antenna 20 can be effectively increased, the design of the antenna 20 is enriched, and the routing of the antenna 20 is more flexible.
In the printed circuit, a first stamp hole is formed in a side surface of the circuit board 10 in a direction intersecting the thickness direction, and the antenna 20 of the printed circuit board is disposed along a routing direction of the first stamp hole (i.e., a direction intersecting the thickness direction of the circuit board 10). By reasonably applying the side surface of the circuit substrate 10 in the above scheme, the antenna 20 originally printed on the front surface of the circuit substrate 10 and occupying a certain area is arranged on the side surface, so that the radiation area of the antenna 20 can be effectively increased; and each side surface of the printed circuit board can be utilized, so that the radiation direction of the antenna 20 can be flexibly set, and the antenna 20 is ensured to have stronger radiation efficiency.
An electronic device comprises the printed circuit board.
Specifically, in the printed circuit board structure according to the above embodiments, the trace direction of the first stamp hole is the direction of opening the first stamp hole, i.e. the direction intersecting the thickness direction of the circuit substrate 10. The edges of the printed circuit board are cut to form a series of half-holes, i.e. stamp holes, by electroplating graphitization of the holes or through-holes at the edges of the printed circuit board, i.e. in the actual printed circuit board, the stamp holes are usually in the form of half-holes. The traditional stamp hole design is that stamp holes are generally formed in the thickness direction of a printed circuit board, and a plurality of stamp holes in a half-hole form are usually formed in the surface of the same side of each printed circuit board, specifically, as shown in fig. 2, the length of each stamp hole (i.e., the length of a trace corresponding to the stamp hole) depends on the thickness of the printed circuit board, the thickness of the printed circuit board is what, and the length of each stamp hole formed in the direction can only reach the same size.
The antenna 20 in the printed circuit board generally needs a larger area to achieve the radiation effect of the antenna 20, while the thickness of the circuit board of the printed circuit board is generally smaller, only about 0.8mm-1.5mm, and obviously, the stamp hole formed along the thickness direction of the circuit board 10 cannot meet the design requirement of the antenna 20 in length and area. The stamp hole can only be used for SMT welding, and the stamp hole in the traditional printed circuit board cannot be well utilized. The technical scheme of this application will originally set up the stamp hole on the thickness direction of circuit substrate 10 again, change into and set up first stamp hole with the crossing direction of thickness direction, printed circuit board's length and width (being the length and the width of circuit substrate 10 upper and lower surface) is generally very big, often reaches dozens of millimeters or even hundreds of millimeters, through beginning first stamp hole in the crossing direction with the thickness direction, the length of the corresponding line of first stamp hole this moment is greater than 1.5mm far away, accord with general antenna 20 design requirement completely.
It is to be understood that the type of electronic device is not exclusive and in one embodiment the electronic device is a cell phone or a tablet computer. In other embodiments, the electronic device may also be other types of electronic devices, and the printed circuit board in the above embodiments may be used as long as the internal circuit board of the electronic device needs to be provided with the PCB antenna 20.
In the electronic device, the first stamp hole is opened in the side surface of the circuit substrate 10 in the direction intersecting the thickness direction, and the antenna 20 of the printed circuit board is disposed along the routing direction of the first stamp hole (i.e., the direction intersecting the thickness direction of the circuit substrate 10). By reasonably applying the side surface of the circuit substrate 10 in the above scheme, the antenna 20 originally printed on the front surface of the circuit substrate 10 and occupying a certain area is arranged on the side surface, so that the radiation area of the antenna 20 can be effectively increased; and each side surface of the printed circuit board can be utilized, so that the radiation direction of the antenna 20 can be flexibly set, and the antenna 20 is ensured to have stronger radiation efficiency.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A printed circuit board is characterized by comprising a circuit substrate and an antenna, wherein a first stamp hole is formed in the side surface of the circuit substrate in the direction intersecting with the thickness direction of the circuit substrate, and the antenna is arranged in the first stamp hole along the routing direction of the first stamp hole.
2. The printed circuit board of claim 1, wherein the number of the side surfaces of the circuit substrate on which the first stamp hole is formed is two or more.
3. The printed circuit board according to claim 2, further comprising a matching circuit provided to the circuit substrate, the antennas provided to any two adjacent side surfaces being connected by the matching circuit.
4. The printed circuit board of claim 3, wherein the matching circuit comprises an inductor, a first capacitor and a second capacitor, one end of the inductor is connected to one end of the first capacitor and the antenna in the first side surface, the other end of the inductor is connected to one end of the second capacitor and the antenna in the second side surface, the other end of the first capacitor and the other end of the second capacitor are both grounded, and the first side surface and the second side surface are adjacent side surfaces.
5. The printed circuit board of claim 1, wherein a second stamp hole is further formed in the side surface of the circuit substrate along the thickness direction, the first stamp hole is communicated with the second stamp hole, and the antenna is disposed along the routing direction of the first stamp hole and the routing direction of the second stamp hole.
6. The printed circuit board of claim 5, wherein the first stamp hole has a trace direction perpendicular to a trace direction of the second stamp hole.
7. The printed circuit board of claim 5, wherein the number of the second stamp holes is two, and the second stamp holes are respectively disposed at two ends of the first stamp hole in the routing direction.
8. The printed circuit board of claim 1, wherein the trace shape of the first stamp aperture comprises at least one of a straight line or an arc.
9. An electronic device comprising a printed circuit board according to any one of claims 1 to 8.
10. The electronic device of claim 9, wherein the electronic device is a mobile phone or a tablet computer.
CN202010330197.0A 2020-04-24 2020-04-24 Printed circuit board and electronic equipment Pending CN111556654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010330197.0A CN111556654A (en) 2020-04-24 2020-04-24 Printed circuit board and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010330197.0A CN111556654A (en) 2020-04-24 2020-04-24 Printed circuit board and electronic equipment

Publications (1)

Publication Number Publication Date
CN111556654A true CN111556654A (en) 2020-08-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010330197.0A Pending CN111556654A (en) 2020-04-24 2020-04-24 Printed circuit board and electronic equipment

Country Status (1)

Country Link
CN (1) CN111556654A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07226614A (en) * 1994-02-09 1995-08-22 Murata Mfg Co Ltd Surface mounted type antenna
CN1716694A (en) * 2004-06-30 2006-01-04 株式会社日立制作所 Ic-tag-bearing wiring board and method of fabricating the same
CN101145635A (en) * 2007-09-26 2008-03-19 明泰科技股份有限公司 Dual-frequency printing antenna
CN104752819A (en) * 2013-12-31 2015-07-01 深圳富泰宏精密工业有限公司 Antenna structure and wireless communication device with antenna structure
CN205029984U (en) * 2015-10-26 2016-02-10 博罗康佳精密科技有限公司 Copper precipitation unit of printed circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07226614A (en) * 1994-02-09 1995-08-22 Murata Mfg Co Ltd Surface mounted type antenna
CN1716694A (en) * 2004-06-30 2006-01-04 株式会社日立制作所 Ic-tag-bearing wiring board and method of fabricating the same
CN101145635A (en) * 2007-09-26 2008-03-19 明泰科技股份有限公司 Dual-frequency printing antenna
CN104752819A (en) * 2013-12-31 2015-07-01 深圳富泰宏精密工业有限公司 Antenna structure and wireless communication device with antenna structure
CN205029984U (en) * 2015-10-26 2016-02-10 博罗康佳精密科技有限公司 Copper precipitation unit of printed circuit board

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Application publication date: 20200818

RJ01 Rejection of invention patent application after publication