CN114945240A - Adapter plate, circuit board and electronic equipment - Google Patents
Adapter plate, circuit board and electronic equipment Download PDFInfo
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- CN114945240A CN114945240A CN202210564005.1A CN202210564005A CN114945240A CN 114945240 A CN114945240 A CN 114945240A CN 202210564005 A CN202210564005 A CN 202210564005A CN 114945240 A CN114945240 A CN 114945240A
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- 238000009434 installation Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 66
- 238000002955 isolation Methods 0.000 description 38
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- 230000009286 beneficial effect Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 230000008054 signal transmission Effects 0.000 description 7
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- 229910052751 metal Inorganic materials 0.000 description 6
- 230000005670 electromagnetic radiation Effects 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 4
- 238000005457 optimization Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
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Abstract
The application discloses keysets, circuit board and electronic equipment belongs to communication equipment technical field. This keysets includes main part, signal connection spare, first shielding piece and a plurality of ground connection connecting piece, and first shielding piece sets up in the main part, and first shielding piece has the first hole of dodging, and first mounting hole has been seted up to the main part, and first mounting hole is relative with the first hole of dodging. The signal connecting piece passes first hole and the first mounting hole of dodging, and the signal connecting piece sets up with the first inside wall interval of dodging the hole. A plurality of ground connection spare sets up around the signal connection spare interval, and a plurality of ground connection spare all links to each other with first shield. The scheme can solve the problem of poor shielding performance of the adapter plate.
Description
Technical Field
The application belongs to the technical field of communication equipment, and particularly relates to an adapter plate, a circuit board and electronic equipment.
Background
With the development of electronic devices, users have more and more functions of the electronic devices, and further more and more complex circuits need to be arranged on circuit boards in the electronic devices. The more complex the circuit laid on the circuit board, the larger the wiring area of the circuit board required. In the related art, two circuit boards are stacked by a stacking technique so that a space for accommodating electronic components is formed between the two circuit boards, so that the assembly between the two circuit boards is more compact, and a larger wiring area can be formed in a limited space.
In the related art, an Interposer (Interposer) is disposed between two circuit boards, so that a space for accommodating an electronic component can be formed between the two circuit boards through the Interposer, and pins are disposed in the Interposer, and two adjacent stacked circuit boards are electrically connected through the pins. In the related art, the shielding effect of the Interposer is poor, so that the pins in the Interposer are easily interfered by external electromagnetic radiation in the process of transmitting signals.
Disclosure of Invention
The embodiment of the application aims to provide an adapter plate, and the problem that the shielding performance of the adapter plate is poor in the related art can be solved.
In order to solve the technical problem, the present application is implemented as follows:
an adapter plate comprises a main body part, a signal connecting piece, a first shielding piece and a plurality of grounding connecting pieces,
the first shielding part is arranged in the main body part, the first shielding part is provided with a first avoidance hole, the main body part is provided with a first mounting hole, the first mounting hole is opposite to the first avoidance hole, the signal connecting part penetrates through the first avoidance hole and the first mounting hole, and the signal connecting part and the inner side wall of the first avoidance hole are arranged at intervals;
a plurality of ground connection spare sets up around the signal connection spare interval, and a plurality of ground connection spare all links to each other with first shield.
Based on the adapter plate, the embodiment of the invention also provides a circuit board. The circuit board comprises the adapter plate.
Based on the circuit board, the embodiment of the invention also provides electronic equipment. The electronic equipment comprises the circuit board.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the adapter plate disclosed by the embodiment of the invention, the first shielding piece is arranged in the main body part, the first shielding piece is provided with the avoidance hole, the main body part is provided with the first mounting hole, the first mounting hole is opposite to the first avoidance hole, the signal connecting piece penetrates through the first avoidance hole and the first mounting hole, and the signal connecting piece and the inner side wall of the first avoidance hole are arranged at intervals. First shield is connected with the ground connection spare electricity that sets up around the signal connection spare interval respectively for first shield can separate into littleer clearance with the clearance between two ground connection spares that link to each other, and then is of value to the shielding performance who improves the keysets, in order to weaken or prevent that the signal connection spare from receiving the outside electromagnetic interference of keysets.
Drawings
FIG. 1 is a schematic illustration of an interposer from a first perspective according to an alternative embodiment of the present invention;
FIG. 2 is a schematic illustration of an alternate embodiment of the present invention showing an interposer from a second perspective;
FIG. 3 is a schematic illustration of a first shield according to an alternative embodiment of the present invention;
FIG. 4 is an illustration of the assembly of the first shield, the second shield and the ground connector as disclosed in the first alternative embodiment of the present invention;
FIG. 5 is an assembly schematic of the first shield, the second shield and the ground connector disclosed in a second alternative embodiment of the invention;
FIG. 6 is a schematic illustration of a circuit board disclosed in a first alternative embodiment of the present invention;
FIG. 7 is a schematic illustration of a circuit board disclosed in a second alternative embodiment of the present invention;
FIG. 8 is a schematic illustration of a circuit board disclosed in a third alternative embodiment of the present invention;
FIG. 9 is an exploded view of the circuit board disclosed in the first alternative embodiment of the present invention;
FIG. 10 is a partial schematic view of a first sub-circuit board disclosed in accordance with a first alternative embodiment of the present invention;
FIG. 11 is a graph of isolation versus frequency for the first test port and the third test port without the first shield in the patch panel;
FIG. 12 is a graph of isolation versus frequency for a first test port and a fourth test port without a first shield in the patch panel;
FIG. 13 is a graph of isolation versus frequency for the first test port and the third test port with a layer of first shielding in the patch panel;
FIG. 14 is a graph of isolation versus frequency for a first test port and a fourth test port with a layer of first shields in the patch panel;
FIG. 15 is a graph of isolation versus frequency for a first test port and a third test port with two layers of first shields in the patch panel;
fig. 16 is a graph of isolation versus frequency for a first test port and a fourth test port with two layers of first shields in the patch panel.
Description of the reference numerals: 101-a first test port; 102-a second test port; 103-a third test port; 104-a fourth test port; 100-a main body portion; 200-a signal connection; 300-a first shield; 310-a first avoidance hole; 320-a second mounting hole; 400-a ground connection; 500-a second shield; 510-a second avoidance hole; 600-an adapter plate; 700-a first sub circuit board; 710-signal connection terminals; 720-reference voltage connection; 730-a ground plane; 800-a second sub-circuit board; 900-electronic components; 1000-installation space; 1100-shield cover.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The interposer provided in the embodiments of the present application is described in detail with reference to fig. 1 to 16 through specific embodiments and application scenarios thereof.
Referring to fig. 1-5, in one or more alternative embodiments, the patch panel of the present invention includes a main body portion 100, a signal connector 200, a first shield 300, and a plurality of ground connectors 400. Illustratively, the main body portion 100 is a base structure, and may provide a mounting base for the signal connector 200, the first shield 300, and the plurality of ground connectors 400.
In an alternative embodiment, the main body 100 may be made of an insulating material, so that the main body 100 may be used to space the signal connectors 200 and the ground connectors 400 in the interposer 600. There are many embodiments of the signal connectors 200 and the ground connectors 400 in the spaced interposer 600, such as: an insulating layer is disposed on an outer sidewall of the signal connector or ground connector 400. Therefore, the specific material for manufacturing the main body 100 is not limited in this embodiment.
In one or more alternative embodiments, the material of the main body 100 is the same as the material of the substrate in the circuit board, so that the interposer 600 can be connected to the circuit board conveniently, and the connection between the interposer 600 and the circuit board can be more stable. Illustratively, the material of the substrate in the circuit board is many, for example: paper base, epoxy glass cloth base, composite base, metal base, flexible, ceramic substrate, BT resin, and the like. Therefore, the material of the main body 100 is not limited in this embodiment.
Referring to fig. 1 and 2, the first shielding member 300 is disposed in the main body 100, the first shielding member 300 has a first avoiding hole 310, the main body 100 has a first mounting hole, the first mounting hole is opposite to the first avoiding hole 310, the signal connector 200 passes through the first avoiding hole 310 and the first mounting hole, and the signal connector 200 and the inner sidewall of the first avoiding hole 310 are spaced apart. Illustratively, the first shielding member 300 is embedded in the main body portion 100 to avoid the first shielding member 300 from increasing the size of the main body portion 100. Further, a plurality of ground connectors 400 are spaced around the signal connector 200, and the plurality of ground connectors 400 are connected to the first shield 300.
In the above embodiment, the plurality of ground connectors 400 are spaced around the signal connector 200, and a portion of electromagnetic interference may be shielded by the ground connectors 400, but a gap may still exist between two adjacent ground connectors 400, so a portion of electromagnetic waves may still leak from the gap between two adjacent ground connectors 400. Further, the first shield 300 is disposed in the main body 100, and the two adjacent ground connectors 400 are electrically connected through the first shield 300, so that the first shield 300 can divide a gap between the two adjacent ground connectors 400 to reduce a single electromagnetic wave leakage path. Therefore, this scheme is beneficial to improve the shielding performance of the interposer 600.
Four test ports are illustrated in fig. 1. The four ports are respectively: a first test port 101, a second test port 102, a third test port 103 and a fourth test port 104. Illustratively, in the process of transmitting signals from the first test port 101 to the second test port 102, the test is performed by using the interposer 600 without the first shielding member 300, with one layer of the first shielding member 300, and with two layers of the first isolation layer 300 in the main body 100, and fig. 11 to fig. 16, and tables 1 and 2 are obtained.
Table 1 shows the isolation between test ports at a signal frequency of 2.5GHz
Table 2 shows the isolation between test ports at a signal frequency of 5.8GHz
Referring to fig. 11, 12, table 1 and table 2, in the case where the interposer 600 does not have the first shield 300 and the frequency is 2.5GHz, the isolation between the first test port 101 and the third test port 103 is-69.7 dB, and the isolation between the first test port 101 and the fourth test port 104 is-57.3 dB. Referring to fig. 13, 14, 1 and 2, a layer of the first shielding member 300 is disposed in the interposer 600, and the isolation between the first test port 101 and the third test port 103 is-83.3 dB in the case of a frequency of 2.5 GHz. The isolation between the first test port 101 and the fourth test port 104 is-82.8 dB. Therefore, in the case of a frequency of 2.5GHz, the number of the optimized isolation between the isolations of the first test port 101 and the third test port 103 is 13.6dB when the interposer 600 is provided with a layer of the first shielding 300 compared to the interposer 600 without the first shielding 300; the amount of isolation optimization between the isolation of the first test port 101 and the fourth test port 104 is 25.5 dB.
Referring to fig. 11, 12, table 1 and table 2, in the case where the interposer 600 does not have the first shield 300 and the frequency is 5.8GHz, the isolation between the first test port 101 and the third test port 103 is-69.7 dB, and the isolation between the first test port 101 and the fourth test port 104 is-57.2 dB. Referring to fig. 13, 14, table 1 and table 2, a layer of the first shielding member 300 is disposed in the interposer 600, and in the case of a frequency of 5.8GHz, the isolation between the first test port 101 and the third test port 103 is-75.8 dB. The isolation between the first test port 101 and the fourth test port 104 is-75.5 dB. Therefore, in the case of a frequency of 5.8GHz, when a layer of the first shielding member 300 is disposed in the interposer 600, compared with the case of no first shielding member 300 in the interposer 600, the optimized amount of isolation between the isolations of the first test port 101 and the third test port 103 is 6.1 dB; the optimized amount of isolation between the isolation of the first test port 101 and the fourth test port 104 is 18.3 dB.
Therefore, the first shielding member 300 disposed in the main body 100 according to the above embodiment can effectively improve the shielding performance of the interposer 600, and is further beneficial to prevent or weaken the signal connector 200 in the interposer 600 from external electromagnetic interference.
In a further alternative embodiment, a gap is provided between an inner sidewall of the first avoiding hole 310 and a surface of the signal connector 200 passing through the first avoiding hole 310, so as to prevent the main body 100 from being conducted with the signal connector 200, and further prevent external electromagnetic radiation from entering the signal connector 200 through the first shielding member 300.
In another alternative embodiment, at least a portion of the main body 100 is located within the first avoidance hole 310. In this embodiment, the main body 100 fills the first avoiding hole 310, and the main body 100 can further isolate the signal connector 200 from the inner sidewall of the first avoiding hole 310, so as to prevent the main body 100 and the signal connector 200 from being conducted. In addition, a hollow structure can be avoided at the position where the first shielding member 300 is arranged in the adapter plate 600, the strength of the position where the first shielding member 300 is arranged in the adapter plate 600 is prevented from being reduced, and the strength consistency of all positions of the adapter plate 600 is improved.
In one or more alternative embodiments, a plurality of ground connectors 400 surrounding the signal connector 200 are sequentially connected in the circumferential direction of the signal connector 200 by the first shield 300. Alternatively, the first shield 300 may be provided in a ring shape, and the plurality of ground connectors 400 are sequentially arranged at intervals in a circumferential direction of the first shield 300. Further alternatively, the adjacent two ground connectors 400 are equally spaced along the circumferential direction of the first shielding member 300, so that the signal connectors 200 have uniform shielding performance against electromagnetic radiation around.
In one or more alternative embodiments, the first shielding element 300 may be a conductive layer disposed in the main body 100, so that the first shielding element 300 may be used to shield external electromagnetic radiation, or shield external electromagnetic radiation of the signal connector 200. For example, the first shield 300 may be a metal layer disposed in the main body portion 100. There are many kinds of metals, and therefore, the specific material of the first shield 300 is not limited in this embodiment.
In an alternative embodiment, the first shielding member 300 may be made of a material with better conductivity, so as to improve the shielding performance of the interposer 600.
In an alternative embodiment, the material of the first shielding element 300 may also be silver, so that the first shielding element 300 has better conductivity.
Alternatively, the first shielding member 300 may be a copper layer disposed in the main body portion 100. The first shielding member 300 is made of a copper layer, so that the first shielding member 300 has better electrical conductivity and the manufacturing cost of the interposer 600 is also considered.
The ground connector 400 may be connected to a reference voltage terminal. Illustratively, the reference voltage terminal may be a ground terminal. The plurality of ground connectors 400 are electrically connected through the first shield 300, and thus, as long as one of the plurality of ground connectors 400 is connected to the reference voltage terminal, each ground connector 400 can be connected to the reference voltage terminal, so that the position of the reference voltage terminal connected to the ground connector 400 is conveniently arranged, and further, the wiring of the ground connector 400 connected to the reference voltage terminal is more flexible. In addition, the plurality of ground connectors 400 electrically connected through the first shield 300 may also allow the first shield 300 to be connected to a reference voltage terminal through the ground connectors 400, thereby eliminating the need to separately route a line connecting the first shield 300 and the reference voltage terminal. Illustratively, the ground connector 400 may be a pin provided to the body portion 100 so as to connect the ground connector 400 to a reference voltage terminal.
Referring to fig. 1 to 5, the first shield 300 is further provided with a plurality of second mounting holes 320. The second mounting hole 320 is disposed around the first escape hole 310, and the ground connector 400 passes through the second mounting hole 320 and is connected to the first shield 300 through the second mounting hole 320. This embodiment is beneficial to increase the contact area between the first shield 300 and the ground connector 400, and to improve the stability of the electrical connection between the first shield 300 and the ground connector 400.
For example, the outer sidewall of the ground connector 400 may be in contact with the inner sidewall of the second mounting hole 320. Of course, the ground connector 400 may be connected to the first shield 300 by soldering, bonding with conductive paste, or the like. For this reason, the present embodiment does not limit a specific manner in which the ground connector 400 is electrically connected to the first shield 300.
Referring to fig. 1-3, in one or more alternative embodiments, two adjacent ground connectors 400 are equally spaced along the outer circumference of the signal connector 200 to provide consistent shielding performance of the patch panel in all directions of the signal connector 200.
Alternatively, the signal connector 200 has a column shape, and a plurality of ground connectors 400 are disposed along the outer circumferential direction of the signal connector 200. Specifically, the plurality of ground connectors 400 are isolated from the signal connectors 200 by the body portion 100. Optionally, the signal connectors 200 and the corresponding ground connectors 400 are equally spaced. The ground connector 400 corresponding to the signal connector 200 is: and a ground connector 400 disposed along an outer circumferential direction of the signal connector 200. This embodiment is beneficial for improving the uniformity of the shielding performance of the interposer in all directions of the signal connector 200.
Referring to fig. 5, in one or more alternative embodiments, the number of the first shields 300 is plural, and the first shields 300 are stacked in a direction in which the signal connectors 200 pass through the main body 100. Optionally, the first shielding members 300 are stacked and spaced apart from each other in a direction in which the signal connector 200 passes through the main body 100, so that the first shielding members 300 and the ground connector 400 can be connected to form a mesh structure surrounding the signal connector 200, and thus a single electromagnetic wave leakage path can be further reduced and reduced, and the shielding performance of the interposer 600 can be further improved. Further, the plurality of first shielding members 300 are uniformly distributed in the main body portion 100 along the direction in which the signal connector 200 passes through the main body portion 100, that is, the distance between any two adjacent first shielding members 300 is equal along the direction in which the signal connector 200 passes through the main body portion 100.
Referring to fig. 15, 16, table 1 and table 2, two layers of the first shielding members 300 are disposed in the interposer 600, and in the case of a frequency of 2.5GHz, the isolation between the first test port 101 and the third test port 103 is-104 dB. The isolation between the first test port 101 and the fourth test port 104 is-88.7 dB. Therefore, in the case of a frequency of 2.5GHz, the two layers of the first shielding members 300 are arranged in the interposer 600, and compared with the interposer 600 without the first shielding members 300, the optimized amount of the isolation between the isolation of the first test port 101 and the isolation of the third test port 103 is 34.3 dB; the amount of isolation optimization between the isolation of the first test port 101 and the fourth test port 104 is 31.4 dB.
Referring to fig. 13, 14, 1 and 2, two layers of the first shielding members 300 are disposed in the interposer 600, and the isolation between the first test port 101 and the third test port 103 is-97 dB in the case of a frequency of 5.8 GHz. The isolation between the first test port 101 and the fourth test port 104 is-82.5 dB. Therefore, in the case of a frequency of 5.8GHz, when two layers of the first shielding members 300 are disposed in the interposer 600, compared with the case where there is no first shielding member 300 in the interposer 600, the optimized amount of isolation between the isolations of the first test port 101 and the third test port 103 is 27.3 dB; the amount of isolation optimization between the isolation of the first test port 101 and the fourth test port 104 is 25.3 dB.
Therefore, the above embodiment increases the number of layers of the first shielding element 300 in the main body 100, so as to effectively improve the shielding performance of the interposer 600, and further, is beneficial to avoiding or weakening the signal connector 200 in the interposer 600 from external electromagnetic interference.
Referring to fig. 1 and 2, the number of the signal connectors 200 is multiple, the signal connectors 200 are disposed at intervals on the main body 100, and the ground connector 400 is disposed between two adjacent signal connectors 200, so as to prevent a gap between two adjacent ground connectors 400 from being opposite to two adjacent signal connectors 200 respectively.
In the signal connector 200, during the signal transmission process, the signal connector 200 may radiate electromagnetic waves to the periphery of the signal connector 200. The interposer 600 according to the above embodiment can prevent the two adjacent signal connectors 200 from forming a leakage path directly connecting the two signal connectors 200, and further can effectively shield the electromagnetic waves radiated by the two adjacent signal connectors 200. Although electromagnetic waves radiated from two adjacent signal connectors 200 may still leak through a gap between two adjacent ground connectors 400, there is no gap directly opposite to the two adjacent signal connectors 200. Therefore, the electromagnetic wave radiated from the signal connection member 200 reaches the signal connection member 200 adjacent thereto through the gap between two adjacent ground connection members 400, and the length of the propagation path is greater than the interval between two adjacent signal connection members 200. The above-described implementation of the interposer is beneficial for improving the shielding effect between the signal connectors 200.
In the related art, the distance between two adjacent signal transmission paths is increased to extend the electromagnetic wave leakage path between two adjacent signal pins, thereby improving the shielding performance between the two adjacent signal transmission paths. But the distance between two adjacent signal transmission paths is increased, so that the wiring area of the signal transmission path occupied by the wiring of the adapter plate is increased, the utilization rate of the wiring area of the adapter plate is reduced, and the wiring difficulty of the adapter plate is increased. This application can effectively promote each signal connector 200's shielding effect through setting up first shield 300, and then is of value to reducing the interval between two adjacent signal connector 200 to the patch panel 600 is wired, improves patch panel 600 wiring area's utilization ratio.
Referring to fig. 1 and 2, the interposer 600 further includes a second shield 500, and the second shield 500 is disposed on a surface of the main body 100 and stacked with the first shield 300. The second shielding member 500 has a second avoiding hole 510, the second avoiding hole 510 is opposite to the first avoiding hole 310, the signal connector 200 passes through the second avoiding hole 510, and the signal connector 200 and the inner sidewall of the second avoiding hole 510 are spaced apart. The ground connectors 400 are all electrically connected to the second shield 500. Exemplarily, the second shielding member 500 is a conductive layer disposed on the surface of the main body portion 100. Alternatively, the ground connector 400 may be connected to the reference voltage terminal through the second shield 500.
There are many ways in which the second shield 500 is disposed on the surface of the main body 100. For example, the second shielding member 500 may be embedded in the surface of the main body 100, or may be adhered to the surface of the main body 100. Of course, the second shielding member 500 may also be a metal plating layer on the surface of the main body portion 100. For this reason, the present embodiment does not limit a specific manner in which the second shield 500 is provided on the surface of the main body portion 100.
Illustratively, the interposer 600 described herein may be used to connect two circuit boards stacked on top of each other. For example, in the case that the interposer 600 is used to connect two circuit boards stacked on each other, the second shielding member 500 is stacked on the circuit board, so that the shielding effect of the connection portion of the signal connector 200 and the circuit board can be improved.
In one or more alternative embodiments, the adapter plate 600 is configured in the shape of a ring. In the case where the interposer 600 is used to connect two circuit boards stacked on each other, the interposer 600 and the circuit boards enclose a mounting space 1000 formed so that the mounting space 1000 can be used to mount the electronic component 900.
Illustratively, the interposer 600 may be oval-shaped ring, rectangular-shaped ring, triangular-shaped ring, irregular polygonal-shaped ring, or the like. For this reason, the present embodiment does not limit the specific shape of the interposer 600.
In one or more alternative embodiments, a plurality of interposer 600 may be disposed between two circuit boards being connected. Illustratively, a plurality of the interposer 600 are spliced to each other and form a mounting space 1000 with two adjacent circuit boards.
Referring to fig. 1 to 3, the signal connector 200 passes from the first side of the body part 100 to the second side of the body part 100, and the first side surface of the body part 100 and the second side surface of the body part 100 are both provided with the second shield 500. Illustratively, in a case where the interposer 600 is used to connect two circuit boards stacked on each other, the first side surface of the body portion 100 and the second side surface of the body portion 100 are connected to the two circuit boards, respectively. This embodiment is beneficial to increase the shielding effect at the connection position of the signal connector 200 and the two circuit boards, so as to improve the shielding performance of the interposer 600.
Referring to fig. 1 and 2, the ground connector 400 is disposed in parallel with the signal connector 200, and the ground connector 400 passes through the body portion 100. Illustratively, the ground connector 400 and the signal connector 200 are metal pins disposed on the main body portion.
The above-described embodiment is advantageous for the uniformity of the shielding effect of the signal connector 200 in the direction in which the signal connector 200 passes through the main body portion 100. Further alternatively, the ground connector 400 and the signal connector 200 are perpendicular to the first side surface of the body portion 100 to reduce the wiring area of the body portion 100 occupied by the ground connector 400 and the signal connector 200.
In some embodiments, the interposer 600 includes a plurality of first shielding members 300, the number of the signal connectors 200 is multiple, the first shielding members 300 may be provided with a plurality of first avoiding holes 310, and the first avoiding holes 310 correspond to the signal connectors 200 one to one, so that the first shielding members 300 may be used to shield the plurality of signal connectors 200. In a further alternative embodiment, a second mounting hole 320 is disposed between two adjacent first avoidance holes 310 for mounting the ground connector 400 between two adjacent signal connectors 200.
Referring to fig. 1 to 5, in some alternative embodiments, the interposer 600 includes a second shielding element 500, the second shielding element 500 has a plurality of second avoiding holes 510, and the second avoiding holes 510 correspond to the signal connectors 200 one to one, so that the second shielding element 500 can be used to shield the signal connectors 200, and improve the shielding performance at the connection between the signal connectors 200 and the circuit board.
In some embodiments, the first shield 300 has a plurality of first avoidance holes 310, the second shield 500 has a plurality of second avoidance holes 510, and the first avoidance holes 310 and the second avoidance holes 510 may correspond one-to-one.
In other embodiments, a single first shield 300 may be disposed in an overlapping relationship with a plurality of second shields 500, respectively. Illustratively, the number of first avoidance holes 310 in a single first shield 300 is less than the number of second avoidance holes 510 in a single second shield 500.
Specifically, the number of the first avoiding holes 310 in the first shielding member 300 and the number of the second avoiding holes 510 in the second shielding member 500 may be set according to the direction of the two circuit boards connected by the interposer 600, and for this, the specific number of the first avoiding holes 310 in the first shielding member 300 and the second avoiding holes 510 in the second shielding member 500 is not limited in the embodiment of the present application. Based on the adapter plate 600, the invention also provides a circuit board.
Referring to fig. 5, the circuit board according to the present invention includes the interposer 600 according to the present invention, so that the shielding performance of the circuit board is improved by the interposer 600.
Referring to fig. 6 to 9, the circuit board further includes a first sub circuit board 700, a second sub circuit board 800, and an electronic component 900, the first sub circuit board 700 and the second sub circuit board 800 are stacked, and the interposer 600 is located between the first sub circuit board 700 and the second sub circuit board 800. Optionally, the first sub circuit board 700 is electrically connected with the second sub circuit board 800 through the interposer 600. The first sub circuit board 700 and the second sub circuit board 800 form a mounting space 1000 therebetween. The electronic component 900 is at least partially disposed in the installation space 1000.
It should be noted that, the first sub circuit board 700 and the second sub circuit board 800 are stacked, and it should be understood that the first sub circuit board 700 is at least partially opposite to the second sub circuit board 800.
In the above embodiment, one of the purposes of the interposer 600 located between the first sub circuit board 700 and the second sub circuit board 800 is: the first sub circuit board 700 and the second sub circuit board 800 are supported by the interposer 600 to prevent the first sub circuit board 700 and the second sub circuit board 800 from being attached to each other, so that a mounting space 1000 for mounting the electronic component 900 can be formed between the first sub circuit board 700 and the second sub circuit board 800.
Referring to fig. 4, in one or more alternative embodiments, the portion of the first sub circuit board 700 opposite the second sub circuit board 800 is a first mounting area 740. Optionally, the interposer 600 is disposed along an edge of the first mounting region 740, so that the interposer 600 can surround the electronic component 900 in the first mounting region 740, and the shielding performance of the circuit board can be improved by using the ground connector 400 and the first shielding member 300 in the interposer 600.
For example, in the case that the interposer 600 has a ring shape, the interposer 600 coincides with an edge of the first mounting region 740, so that the interposer 600, the first sub circuit board 700, and the second sub circuit board 800 may enclose the formed mounting space 1000. Of course, the mounting space 1000 is also formed by a plurality of adapter plates 600 disposed along the edge of the first mounting region 740. Further optionally, the interposer 600 is in sealing fit with the first sub circuit board 700 and the second sub circuit board 800, respectively, to improve the dustproof and waterproof performance of the circuit boards.
In one or more alternative embodiments, at least a portion of the edge of the first mounting region 740 is provided with an interposer 600 to support the first sub circuit board 700 and the second sub circuit board 800 by the interposer 600 to form a space between the first sub circuit board 700 and the second sub circuit board 800 where the electronic component 900 can be mounted. Illustratively, the adapter plates 600 are disposed on two opposite sides of the edge of the first mounting region 740.
In one or more alternative embodiments, the circuit board further includes a shield can 1100. The shield case 1100 is disposed on the second sub circuit board 800 such that a shielding space is formed between the shield case 1100 and the second sub circuit board 800. For example, electronic components to be shielded from the outside are disposed in the shielding space between the shield can 1100 and the second sub circuit board 800 to improve the shielding performance of the circuit board.
Illustratively, shield can 1100 is made of a conductive material. Further, the shield case 1100 is connected to a reference voltage terminal. The reference voltage connection terminal 720 may be a ground terminal so that the interference signal generated by the shield can 1100 can be conducted to the ground terminal. Optionally, the material of the shielding case 1100 may be a metal material. There are many kinds of metals, and therefore, the specific material of the shield case 1100 is not limited in this embodiment.
In one or more alternative embodiments, the first sub circuit board 700 and the second sub circuit board 800 are each provided with a signal connection terminal 710, and at least one of the first sub circuit board 700 and the second sub circuit board 800 is provided with a reference voltage connection terminal 720. Both ends of the signal connector 200 are connected to the signal connection terminal 710 of the first sub circuit board 700 and the signal connection terminal 710 of the second sub circuit board 800, respectively. The ground connection 400 is connected to a reference voltage connection 720.
In the above embodiment, the first sub circuit board 700 and the second sub circuit board 800 may implement signal transmission through the interposer 600. Illustratively, the ground connector 400 is connected to the reference voltage connection terminal 720, so that the induced signal generated by the ground connector 400 and the first shield 300 can be transmitted to the predetermined voltage terminal through the reference voltage connection terminal 720. For example, the reference voltage connection terminal 720 may be a ground terminal, so that the sensing signals generated by the ground connection member 400 and the first shielding member 300 can be transmitted to the ground terminal, thereby preventing the sensing signals generated by the ground connection member 400 and the first shielding member 300 from interfering with the signal connection member 200. Illustratively, the reference voltage connection terminal 720 may be a pad provided on the first sub circuit board 700 or the second sub circuit board 800, so that the first shield 300 may be connected to the reference voltage connection terminal 720 by soldering.
Referring to fig. 8, in one or more alternative embodiments, the first sub circuit board 700 is provided with a ground layer 730 and a reference voltage connection terminal, and the ground layer 730 is connected to the ground connection 400 through the reference voltage connection terminal 720. In this embodiment, the ground layer 730 can be used to further improve the shielding performance of the circuit board, and prevent or reduce the electromagnetic interference between the electronic components 900 on two adjacent sub-circuit boards.
Referring to fig. 8, in an alternative embodiment, the ground layer 730 is provided with a third escape hole, which is opposite and opposite to the first escape hole 310, so that a signal transmission line can be connected to an electronic component on the first sub circuit board 700, which is located outside the mounting space 1000, through the third escape hole. In this embodiment, the ground layer 730 can further improve the shielding performance of the circuit board.
In another alternative embodiment, the second sub circuit board 800 is provided with a ground layer 730 and a reference voltage connection terminal, and the ground layer 730 is connected to the ground connector 400 through the reference voltage connection terminal 720, so as to improve the shielding performance of the circuit board through the ground layer 730 of the second sub circuit board 800. Optionally, the first sub circuit board 700 and the second sub circuit board 800 are both provided with a ground layer 730, so as to improve the shielding performance of the circuit boards by the ground layer 730.
In one or more alternative embodiments, in the case that the ground layer 730 is disposed on the first sub circuit board 700, the surface of the side of the interposer 600 connected to the first sub circuit board 700 may not need to be disposed with the second shielding member 500, so as to improve the shielding performance at the connection position of the signal connector 200 and the first sub circuit board 700 by the ground layer 730 of the first sub circuit board 700. Similarly, in the case that the second sub circuit board 800 is provided with the ground layer 730, the surface of the side where the interposer 600 is connected to the second sub circuit board 800 may not need to be provided with the second shielding element 500, so as to improve the shielding performance of the connection portion of the signal connector 200 and the first sub circuit board 700 through the ground layer 730 of the second sub circuit board 800.
Based on the circuit board, the invention also provides electronic equipment. Illustratively, the electronic device comprises the circuit board of the invention.
The circuit board can improve the shielding performance of the circuit board, is beneficial to reducing the distance between the signal connecting pieces 200 and the space occupied by the circuit board inside the electronic equipment, and is further beneficial to the miniaturization design of the electronic equipment.
The electronic device according to the present invention may be, for example, a smart phone, a tablet computer, an electronic book reader, a wearable device (e.g., a smart watch, a bluetooth headset), an electronic game machine, and the like, and the specific category of the electronic device is not limited by the embodiments of the present invention.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element identified by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. An adapter plate is characterized by comprising a main body part, a signal connecting piece, a first shielding piece and a plurality of grounding connecting pieces,
the first shielding piece is arranged in the main body part, the first shielding piece is provided with a first avoidance hole, the main body part is provided with a first mounting hole, the first mounting hole is opposite to the first avoidance hole, the signal connecting piece penetrates through the first avoidance hole and the first mounting hole, and the signal connecting piece and the inner side wall of the first avoidance hole are arranged at intervals;
the plurality of ground connectors surround the signal connectors at intervals, and the plurality of ground connectors are all connected with the first shielding member.
2. The interposer as recited in claim 1, wherein the first shield further comprises a plurality of second mounting holes disposed around the first avoiding hole, and wherein the ground connector passes through the second mounting holes and is connected to the first shield.
3. The interposer as claimed in claim 1, wherein the first shield member is provided in plural number, and the first shield member is stacked in a direction in which the signal connector passes through the main body portion.
4. The interposer as claimed in claim 1, wherein the number of the signal connectors is plural, the signal connectors are disposed at intervals on the main body portion, and the ground connector is disposed between two adjacent signal connectors.
5. The interposer as recited in any one of claims 1 to 4, further comprising a second shield disposed on a surface of the body portion and stacked with the first shield,
the second shielding part is provided with a second avoidance hole, the second avoidance hole is opposite to the first avoidance hole, the signal connecting piece penetrates through the second avoidance hole, and the signal connecting piece and the inner side wall of the second avoidance hole are arranged at intervals;
the ground connectors are all electrically connected with the second shield.
6. The interposer as recited in claim 5, wherein the first shield has a plurality of the first avoiding holes, the first avoiding holes corresponding to the signal connectors one-to-one; and/or the presence of a gas in the gas,
the second shielding part is provided with a plurality of second avoiding holes, and the second avoiding holes correspond to the signal connecting parts one to one.
7. A circuit board comprising the interposer as recited in any one of claims 1 to 6.
8. The circuit board of claim 7, further comprising a first sub circuit board, a second sub circuit board, and an electronic component, wherein the first sub circuit board and the second sub circuit board are stacked, the interposer is located between the first sub circuit board and the second sub circuit board, the first sub circuit board is electrically connected to the second sub circuit board through the interposer, and a mounting space is formed between the first sub circuit board and the second sub circuit board;
the electronic component is at least partially arranged in the installation space.
9. The circuit board of claim 8, wherein the first and second sub-circuit boards are each provided with a signal connection terminal, and at least one of the first and second sub-circuit boards is provided with a reference voltage connection terminal;
two ends of the signal connecting piece are respectively connected with the signal connecting end of the first sub circuit board and the signal connecting end of the second sub circuit board;
the ground connection is connected to the reference voltage connection.
10. An electronic device, characterized in that the electronic device comprises a circuit board according to any one of claims 7 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210564005.1A CN114945240A (en) | 2022-05-23 | 2022-05-23 | Adapter plate, circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210564005.1A CN114945240A (en) | 2022-05-23 | 2022-05-23 | Adapter plate, circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114945240A true CN114945240A (en) | 2022-08-26 |
Family
ID=82909299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210564005.1A Pending CN114945240A (en) | 2022-05-23 | 2022-05-23 | Adapter plate, circuit board and electronic equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN114945240A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1655662A (en) * | 2004-02-13 | 2005-08-17 | 三星电机株式会社 | Printed circuit board having axially parallel via holes |
| CN1697593A (en) * | 2004-05-10 | 2005-11-16 | 富士通株式会社 | Wiring base board, method of producing thereof, and electronic device |
| CN101292393A (en) * | 2005-10-18 | 2008-10-22 | 日本电气株式会社 | Vertical signal path, printed board provided with such vertical signal path, and semiconductor package provided with such printed board and semiconductor element |
| CN101355078A (en) * | 2007-07-24 | 2009-01-28 | 台湾积体电路制造股份有限公司 | Crosstalk-free wlcsp structure for high frequency application |
| US20090101402A1 (en) * | 2007-10-19 | 2009-04-23 | Advantest Corporation | Circuit board, and electronic device |
| CN201839520U (en) * | 2010-10-18 | 2011-05-18 | 深圳市龙江实业有限公司 | Multi-layer printed circuit board (PCB) |
| US20150041207A1 (en) * | 2013-08-09 | 2015-02-12 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board |
| CN111356287A (en) * | 2018-03-15 | 2020-06-30 | 华为技术有限公司 | Connecting plate, circuit board assembly and electronic equipment |
-
2022
- 2022-05-23 CN CN202210564005.1A patent/CN114945240A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1655662A (en) * | 2004-02-13 | 2005-08-17 | 三星电机株式会社 | Printed circuit board having axially parallel via holes |
| CN1697593A (en) * | 2004-05-10 | 2005-11-16 | 富士通株式会社 | Wiring base board, method of producing thereof, and electronic device |
| CN101292393A (en) * | 2005-10-18 | 2008-10-22 | 日本电气株式会社 | Vertical signal path, printed board provided with such vertical signal path, and semiconductor package provided with such printed board and semiconductor element |
| CN101355078A (en) * | 2007-07-24 | 2009-01-28 | 台湾积体电路制造股份有限公司 | Crosstalk-free wlcsp structure for high frequency application |
| US20090101402A1 (en) * | 2007-10-19 | 2009-04-23 | Advantest Corporation | Circuit board, and electronic device |
| CN201839520U (en) * | 2010-10-18 | 2011-05-18 | 深圳市龙江实业有限公司 | Multi-layer printed circuit board (PCB) |
| US20150041207A1 (en) * | 2013-08-09 | 2015-02-12 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board |
| CN111356287A (en) * | 2018-03-15 | 2020-06-30 | 华为技术有限公司 | Connecting plate, circuit board assembly and electronic equipment |
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