CN216826275U

CN216826275U - Constant temperature metal bath

Info

Publication number: CN216826275U
Application number: CN202123012075.6U
Authority: CN
Inventors: 鲁琦; 赵红洲; 赵鹤翔; 张喻; 韩珅; 赵大鹏
Original assignee: Wuhan Servicebio Technology Co ltd
Current assignee: Wuhan Servicebio Technology Co ltd
Priority date: 2021-12-02
Filing date: 2021-12-02
Publication date: 2022-06-28
Anticipated expiration: 2031-12-02

Abstract

The utility model relates to a constant temperature metal bath, including module, connecting block, semiconductor, heat insulating board, radiating block, lid, module, connecting block, heat insulating board, radiating block are fixed connection in proper order from top to bottom, and the upper end plane size of connecting block is greater than or equal to the bottom surface size of module, sets up the through-hole in the middle of the heat insulating board, and in the middle through-hole of heat insulating board was arranged in to the semiconductor, lid detachable installed in the module outside, module, connecting block and radiating block were heat conductor material. The metal bath can well isolate external heat, and reduces the loss of cold or heat in the metal bath, thereby being capable of keeping the set temperature for a long time and reducing the consumption of electric quantity. The connecting plate can ensure that each part of the module obtains uniform heat conduction environment; the box cover enables the module to keep a set stable environment, and reduces the consumption of electric quantity; the heat insulation plate conducts heat generated by the semiconductor to the heat dissipation block in a directional mode, so that heat conduction at the lower portion of the semiconductor is avoided, and the refrigeration or heating effect at the upper portion is not affected.

Description

Constant temperature metal bath

Technical Field

The utility model relates to a reagent constant temperature storage medical instrument technical field, concretely relates to constant temperature metal bath.

Background

There are several types of metal bath on the market, including constant temperature metal bath heating type, constant temperature metal bath refrigeration type, constant temperature mixing appearance heating type etc. to constant temperature metal bath refrigeration type, prior art refrigeration effect is often not too ideal, cold volume scatters and disappears seriously, for keeping constant low temperature, the electric quantity input that needs to last, but in the time of input electric quantity, calorific capacity also increases simultaneously, radiating burden has been increased, the heat dissipation is not urgent, cause whole metal bath to heat up easily, increase the burden of fan simultaneously, and cause very big noise.

SUMMERY OF THE UTILITY MODEL

Based on the above expression, the utility model provides a constant temperature metal bath to solve the problem that current metal bath low temperature scatters and disappears easily.

The utility model provides an above-mentioned technical problem's technical scheme as follows:

the utility model provides a constant temperature metal bath, includes module, connecting block, semiconductor, heat insulating board, radiating block, lid, and module, connecting block, heat insulating board, radiating block are fixed connection from top to bottom in proper order, and the upper end plane size of connecting block is more than or equal to the bottom surface size of module, sets up the through-hole in the middle of the heat insulating board, and in the middle through-hole of heat insulating board was arranged in to the semiconductor, lid detachable installed in the module outside, and module, connecting block and radiating block are heat conductor material. The metal bath can isolate external heat well, and reduces the loss of cold in the metal bath, thereby keeping the set low temperature for a long time and reducing the consumption of electric quantity. Through the arrangement of the connecting plate, each part of the module can obtain a uniform low-temperature environment, and through the arrangement of the box cover, the module can keep the low-temperature environment, so that the consumption of electric quantity is reduced; through setting up the heat insulating board, can give the radiating block with the directional conduction of the heat that the semiconductor produced, avoid the heat conduction of semiconductor lower part and influence the refrigeration effect on upper portion.

Preferably, the periphery of the connecting block is provided with a heat insulation ring. And the heat insulation ring is arranged on the periphery of the connecting block, so that the loss of the cold energy of the connecting block can be reduced.

Preferably, the heat insulation plate comprises an upper backing plate and an upper fixing plate which are sequentially overlapped from top to bottom, and the upper backing plate is made of heat insulation elastic materials. The upper fixing plate is made of heat insulating materials, so that heat loss at the heat insulating plate is avoided or reduced, and the heat at the lower part of the semiconductor is prevented from influencing the connecting block. The upper backing plate is made of heat-insulating elastic materials, so that the connecting block is hermetically connected with the heat-insulating plate, and the loss of cold energy of the connecting block and the semiconductor is reduced. And a through hole for accommodating a semiconductor is arranged between the upper-layer backing plate and the upper fixing plate.

Preferably, the heat insulation plate further comprises a lower backing plate and a lower fixing plate, the lower backing plate and the lower fixing plate are sequentially attached to the lower portion of the upper fixing plate, and the lower backing plate is made of heat insulation elastic materials.

Preferably, the upper part and the lower part of the radiating block are respectively provided with a bump and a radiating fin, and the size of the upper surface of the bump is the same as that of the lower surface of the semiconductor. Because the upper backing plate and the lower backing plate arranged in the heat insulation plate can perform the function of elastic deformation, the convex block above the heat dissipation block can be tightly attached to the lower surface of the semiconductor. Therefore, heat generated below the semiconductor can be better conducted to the radiating block, and air cooling radiation is carried out through the radiating fins below the radiating block.

Preferably, the metal bath further comprises a base, the base is fixed below the radiating block, the upper portion of the base is provided with an air cavity for containing the radiating fins, and the lower portion of the base is provided with a heat insulation cavity. The radiating fins are positioned in the air cavity, so that the accelerated heat dissipation is facilitated. The heat insulation cavity 63 suspends the whole metal bath, so that the problem that the bottom is overheated due to the fact that heat in the air cavity is directly conducted to the bottom plane is avoided.

Preferably, a fan is arranged behind the base along the direction of the air cavity channel. The fan is arranged behind the base, and the air port of the fan is aligned with the rear end of the air cavity, so that heat dissipation can be accelerated.

Preferably, the metal bath further comprises a box cover frame, the box cover frame is fixed to the bottom of the module, and a shaft pin for connecting the box cover is arranged on the box cover frame. The rear side of the box cover frame is provided with a shaft pin, and the box cover is provided with a shaft hole matched with the shaft pin, so that the box cover can be conveniently opened and closed.

Preferably, a central cavity is formed in the center of the square box cover frame, and a clamping point for fixing the connecting block is arranged on the inner wall of the central cavity. The inner walls of the central cavity in four directions are provided with clamping points, so that the box cover frame is tightly matched with the module.

Compared with the prior art, the technical scheme of the application has the following beneficial technical effects: the metal bath can well isolate external heat, reduces the loss of cold in the metal bath, can keep the set low temperature for a long time, and reduces the consumption of electric quantity. The connecting plates are arranged, so that each part of the module can obtain a uniform low-temperature environment, and the box cover is arranged, so that the module can keep the low-temperature environment, and the consumption of electric quantity is reduced; through setting up the heat insulating board, can give the radiating block with the directional conduction of the heat that the semiconductor produced, avoid the heat conduction of semiconductor lower part and influence the refrigeration effect on upper portion.

Drawings

FIG. 1 is a schematic view of the structure of a metal bath according to the present invention;

FIG. 2 is an exploded view of the metal bath of the present invention;

FIG. 3 is a front view of the structure of the metal bath of the present invention;

FIG. 4 is a cross-sectional view A-A of FIG. 3;

fig. 5 is a partially enlarged view E of the present invention;

in the drawings, the components represented by the respective reference numerals are listed below:

1. a module; 2. connecting blocks; 3. a semiconductor; 4. a heat insulation plate; 5. a heat dissipating block; 6. a base; 7. a box cover; 9. a test tube; 11. a test tube hole; 21. a heat insulation ring; 22. a counter bore; 41. an upper fixing plate; 42. a lower fixing plate; 43. an upper liner plate; 44. a lower base plate; 51. a bump; 52. a heat sink; 61. a fan; 62. a wind cavity; 63. a heat insulation cavity; 71. a box cover frame; 72. a central lumen; 73. a shaft pin; 74. and (4) sticking points.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

In this embodiment, as shown in fig. 1 and 2. The utility model provides a constant temperature metal bath, including module 1, connecting block 2, semiconductor 3, heat insulating board 4, radiating block 5, lid 7, module 1, connecting block 2, heat insulating board 4, radiating block 5 is fixed connection in proper order from top to bottom, the upper end plane size of connecting block 2 is more than or equal to module 1's bottom surface size, set up the through-hole in the middle of heat insulating board 4, semiconductor 3 is arranged in the middle through-hole of

heat insulating board

4, 7 detachable installations in module 1 outsides of lid, module 1, connecting block 2 and radiating block 5 are heat conductor material. The semiconductor 3 cools the upper surface and heats the lower surface under the action of voltage. The refrigerated upper surface is connected with connecting block 2, and connecting block 2 is connected with module 1. The semiconductor 3 sequentially transmits the cold energy to the connecting block 2 and the module 1; the heat of the lower surface of the semiconductor 3 is directly conducted to the heat radiation block 5 below. The connecting block 2 is located between the semiconductor 3 and the module 1 and serves as a function of cold energy relay transmission, and because the semiconductor 3 is a standard component and generally has a limited size, the connecting block is directly arranged at the bottom of the module 1, so that uneven temperature of each part on the module 1 is easily caused. By providing the connection block 2 having a length greater than the bottom surface of the module 1, the low temperature can be uniformly conducted to each position of the module 1 through the connection block 2. The bottom surface of the connecting block 2 is provided with a boss with the same length as the surface of the semiconductor 3.

A heat insulating plate 4 is arranged around the periphery of the semiconductor 3, and the heat insulating plate 4 is used for isolating the semiconductor 3 from the outside on one hand and fixing the semiconductor 3 on the other hand. Set up counter bore 22 on connecting block 2, set up the cylinder in connecting block 2 below, counter bore 22 passes the cylinder, corresponds on the heat insulating board 4 and sets up the mounting hole, corresponds and sets up the screw on 5 upper surfaces of radiating block. After the cylinder is inserted into the mounting hole, a bolt is inserted into the counter bore 22, and then the connecting block 2, the semiconductor 3, the heat insulation plate 4 and the heat dissipation block 5 are fixed together in sequence. Module 1 is made of metal material, typically aluminum alloy, and test tube holes 11 for accommodating test tubes 9 are formed in the upper surface of module 1. In the use state, the cover 7 covers the module 1 completely. The box cover 7 is made of heat insulation materials, so that external heat can be prevented or reduced from being conducted to the internal module 1, and the dissipation of cold in the module 1 is reduced. It should be noted that, the metal bath of the present application adopts a semiconductor for refrigeration, and one side of the semiconductor is refrigerated while the other side of the semiconductor is heated, so that the two sides of the semiconductor need to be separated by a heat insulation material, and the low temperature and the high temperature generated by the cold side and the hot side are prevented from influencing each other, thereby influencing the refrigeration or heating effect. When heating is needed, only the current direction needs to be changed through the inverter.

In this embodiment, as shown in fig. 2. And a heat insulation ring 21 is arranged at the periphery of the connecting block 2. The connecting block 2 is made of heat conducting material, so that heat of the semiconductor 3 can be conducted to the module 1 conveniently. The periphery of the connecting block 2 is provided with the heat insulation ring 21, so that the loss of cold energy of the connecting block 2 can be reduced. The heat insulation ring 21 is made of a heat insulation material, and can be made of a polyurethane foam material, an inorganic heat insulation plate and the like.

In this embodiment, as shown in fig. 3, 4, and 5. The heat insulation plate 4 comprises an upper layer backing plate 43 and an upper fixing plate 41 which are sequentially overlapped from top to bottom, wherein the upper layer backing plate 43 is made of heat insulation elastic materials. The upper surface and the lower surface of the heat insulation plate 4 are fixedly connected with the connecting block 2 and the heat dissipation block 5 respectively, and the length and the width of the heat insulation plate 4 are larger than those of the connecting block 2, so that the connecting block 2 is fully covered by the heat insulation ring 21 and the heat insulation plate 4, and the loss of the cold energy of the connecting block 2 is reduced. The connecting block 2, the heat insulation plate 4 and the heat dissipation block 5 are sequentially and tightly fixed, and the upper-layer cushion plate 43 is made of heat insulation elastic materials, can be made of rubber materials, so that the connecting block 2 is hermetically connected with the heat insulation plate 4, and the loss of cold energy of the connecting block 2 and the semiconductor 3 is reduced. A through hole for accommodating the semiconductor 3 is provided between the upper-layer pad 43 and the upper fixing plate 41. The upper fixing plate 41 is made of a heat insulating material to prevent or reduce heat loss at the heat insulating plate 4, thereby preventing heat at the lower portion of the semiconductor 3 from affecting the connection block 2. The heat insulation plate 4 further comprises a lower backing plate 44 and a lower fixing plate 42, the lower backing plate 44 and the lower fixing plate 42 are sequentially and closely attached to the lower portion of the upper fixing plate 41, and the lower backing plate 44 is made of heat insulation elastic materials. The lower cushion plate 44 and the lower fixing plate 42 are made of the same material as the upper cushion plate 43 and the upper fixing plate 41, respectively.

In this embodiment, as shown in fig. 3, 4, and 5. The upper and lower parts of the heat dissipation block 5 are respectively provided with a bump 51 and a heat dissipation fin 52, and the size of the upper surface of the bump 51 is the same as that of the lower surface of the semiconductor 3. Since the upper pad 43 and the lower pad 44 provided in the thermal insulation board 4 can perform elastic deformation, the bump 51 above the heat slug 5 can be closely attached to the lower surface of the semiconductor 3. So that the heat generated below the semiconductor 3 can be better conducted to the heat radiation block 5 and can be air-cooled and radiated by the heat radiation fins 52 below the heat radiation block 5.

In this embodiment, as shown in fig. 4. The metal bath further comprises a base 6, the base 6 is fixed below the radiating block 5, an air cavity 62 used for containing the radiating fins 52 is formed in the upper portion of the base 6, and a heat insulation cavity 63 is formed in the lower portion of the base 6. The heat slug 5 is mounted above a base 6, the base 6 being used to support the entire metal bath. The ventilation direction of the base 6 is H-shaped, and comprises an upper air cavity 62 and a lower heat insulation cavity 63. The radiating block 5 is arranged above the base 6, and the radiating fins 52 are positioned in the air cavity 62, so that the air cavity 62 forms a ventilating duct, and the heat dissipation is accelerated. And the heat insulation cavity 63 at the lower part of the base 6 is supported by the support plates at the two sides, so that the whole metal bath is suspended in the air, and the problem that the bottom is overheated due to the fact that the heat in the air cavity 62 is directly conducted to the bottom plane is avoided. And a fan 61 is arranged behind the base 6 along the channel direction of the air cavity 62. A fan 61 is arranged behind the base 6, and an air opening of the fan 61 is aligned with the rear end of the air cavity 62, so that heat dissipation can be accelerated.

In this embodiment, as shown in fig. 2 and 3. The metal bath also comprises a box cover frame 71, the box cover frame 71 is fixed at the bottom of the module 1, and a shaft pin 73 for connecting the box cover 7 is arranged on the box cover frame 71. The box cover frame 71 is of a square frame structure and is made of heat insulation materials, and the box cover frame 71 is located at the bottom of the module 1 and can achieve a heat insulation effect to a certain extent. The rear side of the box cover frame 71 is provided with a shaft pin, and the box cover 7 is provided with a shaft hole matched with the shaft pin, so that the box cover 7 can be conveniently opened and closed. The center of the box cover frame 71 in the shape of a square frame is provided with a central cavity 72, and the inner wall of the central cavity 72 is provided with a clamping point 74 for fixing the connecting block 2. The box cover frame 71 is a square frame structure and comprises a central cavity 72, clamping points 74 are arranged on the inner walls of the central cavity 72 in four directions, and small holes are arranged at corresponding positions of the module 1, so that the box cover frame 71 is tightly matched with the module 1.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. The utility model provides a constant temperature metal bath, a serial communication port, including module (1), connecting block (2), semiconductor (3), heat insulating board (4), radiating block (5), lid (7), module (1), connecting block (2), heat insulating board (4), radiating block (5) from top to bottom fixed connection in proper order, the upper end plane dimension of connecting block (2) is greater than or equal to the bottom surface size of module (1), set up the through-hole in the middle of heat insulating board (4), semiconductor (3) are arranged in the middle through-hole of heat insulating board (4), lid (7) detachable installs in module (1) outside, module (1), connecting block (2) and radiating block (5) are heat conductor material.

2. A bath according to claim 1, characterized in that said connecting piece (2) is provided, on its periphery, with an insulating ring (21).

3. A bath according to claim 1 or 2, characterized in that said insulating panel (4) comprises, superimposed in sequence from top to bottom, an upper pad (43) and an upper fixing plate (41), said upper pad (43) being of insulating elastic material.

4. A bath according to claim 3, characterised in that said insulating panel (4) further comprises a lower plate (44) and a lower plate (42), said lower plate (44) and lower plate (42) being in turn attached to the lower part of said upper plate (41), said lower plate (44) being of insulating elastic material.

5. The bath according to claim 1 or 2, wherein the upper and lower parts of the heat sink (5) are provided with bumps (51) and heat sinks (52), respectively, and the size of the upper surface of the bumps (51) is the same as that of the lower surface of the semiconductor (3).

6. The thermostatic metal bath according to claim 1, further comprising a base (6), wherein the base (6) is fixed below the heat dissipation block (5), an air chamber (62) for accommodating the heat dissipation fins (52) is formed in the upper portion of the base (6), and an insulating chamber (63) is formed in the lower portion of the base (6).

7. A bath according to claim 6, characterized in that a fan (61) is arranged behind the base (6) in the direction of the passage of the air chamber (62).

8. A thermostatic metal bath according to claim 1, characterized in that the bath further comprises a lid frame (71), the lid frame (71) being fixed to the bottom of the module (1), the lid frame (71) being provided with a pin (73) for connecting the lid (7).

9. The thermostatic metal bath according to claim 8, characterized in that the box cover frame (71) in the shape of a square frame is centrally provided with a central cavity (72), and the inner wall of the central cavity (72) is provided with a clamping point (74) for fixing the connecting block (2).