CN216814767U

CN216814767U - Sealing beam for door body of refrigerating and freezing device

Info

Publication number: CN216814767U
Application number: CN202122787309.8U
Authority: CN
Inventors: 张纯; 吕鹏; 赵晓军; 张�浩; 孟亮
Original assignee: Qingdao Haier Refrigerator Co Ltd; Haier Smart Home Co Ltd
Current assignee: Qingdao Haier Refrigerator Co Ltd; Haier Smart Home Co Ltd
Priority date: 2021-11-15
Filing date: 2021-11-15
Publication date: 2022-06-24
Anticipated expiration: 2031-11-15
Also published as: WO2023083001A1

Abstract

The utility model provides a sealing beam for a door body of a refrigeration and freezing device. The sealing beam includes a housing and a semiconductor module. The housing has an accommodating space with an opening facing forward and extending along the length direction of the housing. The semiconductor module is provided with a refrigerating surface and a heating surface and is arranged in the accommodating space. And the heating surface of the semiconductor module is disposed at the opening of the receiving space to form part or all of the front surface of the sealing beam. The cooling surface of the semiconductor module is thermally connected to the rear wall of the housing. The characteristic that the semiconductor module heats and refrigerates at the same time is utilized, the hot end face of the semiconductor module is directly used as the front surface of the sealing beam, the installation is convenient, the structure is compact, the cost is low, and air in a room is prevented from being condensed on the surface of the sealing beam; meanwhile, the auxiliary refrigeration can improve the condensation problem of the sealing beam and reduce the loss of refrigerating capacity in the storage room.

Description

Sealing beam for door body of refrigerating and freezing device

Technical Field

The utility model relates to the technical field of refrigeration and storage, in particular to a sealing beam for a door body of a refrigeration and freezing device.

Background

With the development of science and technology, the development of social economy and the improvement of living standard of people, high living quality becomes a necessary demand of users, particularly, a refrigerating and freezing device such as a refrigerator and a freezer becomes a necessary product in family life, and most food materials in families are often stored in the refrigerator by the users. For example, french-door refrigerators are a favorite refrigerator product.

French-type side-by-side refrigerators typically have a vertical beam between the two doors that facilitates the overlapping and sealing of the door seal between the two doors, which may also be referred to as a seal beam. When the refrigerator is used for normal refrigeration, the surface temperature of the refrigerator is low, condensation is easy to generate, the attractiveness of the refrigerator is influenced, and the use feeling of a user is influenced. Therefore, in the existing refrigerator product, the problem of condensation on the front surface of the vertical beam is always a difficult problem to be solved, and the user experience is influenced. In order to solve the problem, the refrigerator is often provided with a heating wire for heating and condensation prevention, but when the heating wire heats the surface temperature of the vertical beam, the temperature difference at the position is increased, so that the cold loss of the refrigerator compartment at the position is aggravated. Moreover, the existing sealing beam is relatively complex in structure.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, the present invention has been made to provide a sealing beam for a door body of a refrigerating and freezing device, which overcomes or at least partially solves the above problems, can reduce loss of cooling capacity in a storage compartment of the refrigerating and freezing device while improving a condensation problem, and has a simple structure.

Specifically, the utility model provides a sealing beam for a door body of a refrigeration and freezing device, which comprises:

the shell is provided with an accommodating space with a forward opening and extending along the length direction of the shell;

the semiconductor module is provided with a refrigerating surface and a heating surface and is arranged in the accommodating space; the heating surface of the semiconductor module is arranged at the opening of the accommodating space to form part or all of the front surface of the sealing beam; the cooling surface of the semiconductor module is thermally connected to the rear wall of the housing.

Optionally, the seal beam further comprises:

the heat conduction device is arranged between the refrigerating surface of the semiconductor module and the rear wall of the shell, so that the rear wall of the shell and the refrigerating surface exchange heat.

Optionally, the heat conducting device comprises:

the first heat exchange plate is in contact with and abutted against the refrigerating surface;

the two connecting plates respectively extend from two edges of the first heat exchange plate, which extend along the length direction of the shell, to the direction far away from the semiconductor module; and

a second heat exchange plate in contact abutment with a rear wall of the housing; the second heat exchange plate is connected with the two connecting plates.

Optionally, the second heat exchanger plate comprises two plate portions, each of which extends from an edge of one of the connection plates remote from the first heat exchanger plate towards the other connection plate;

a gap extending in a longitudinal direction of the housing is provided between the two plate portions.

Optionally, the seal beam further comprises a guide assembly,

the guide assembly is arranged at one end of a space between the first heat exchange plate and the second heat exchange plate; or, the one end outside of casing is provided with installation space, guide assembly set up in installation space.

Optionally, a heat insulation device is disposed between the rear side of the semiconductor module and the housing to fill part or all of a space between the rear side of the semiconductor module and the housing excluding the heat conduction device.

Optionally, the sealing beam further includes two sealing pads respectively disposed at two ends of the semiconductor module, and each sealing pad is disposed between one end face of the semiconductor module and the housing.

Optionally, the front edge of each said gasket extends beyond the flap in a direction away from the other gasket.

Optionally, the heat conducting device includes a plurality of heat conducting fins, each of which is perpendicular to the cooling surface of the semiconductor module, and is in contact with, abutted against, or fixedly connected to the rear wall of the housing.

Optionally, the seal beam further comprises a spindle sleeve assembly mounted to the housing;

the shell comprises a rear shell with a front opening and a front frame, the front frame is installed at the opening of the rear shell, and the semiconductor module is installed in the front frame;

the heating surface of the semiconductor module is a continuously extending surface, and the housing is made of plastic.

According to the sealing beam for the door body of the refrigerating and freezing device, the characteristics that the semiconductor module heats and refrigerates at one side are utilized, and the end face of the hot end of the semiconductor module is directly used as the front surface of the sealing beam, so that air in a room is prevented from being condensed on the surface of the sealing beam; simultaneously, with the cold junction of semiconductor module and the orientation of casing face the internal surface thermal connection of refrigeration room, supplementary refrigeration can reduce the indoor refrigerating output loss between the storing when improving sealed roof beam condensation problem. Namely, when this sealing beam can compensate traditional heater strip and prevent the condensation, the cold volume near sealing beam runs off, better indoor temperature of maintaining the storing room.

The housing is internally provided with an accommodating space extending along the length direction of the housing, the semiconductor module is installed as a whole, and the semiconductor module mounting device is convenient to install, compact in structure and low in cost. The semiconductor refrigerating sheet of the semiconductor module heats and refrigerates at the same time, the heating amount is higher than the refrigerating amount, the heating surface of the semiconductor module is directly used as the front surface of the sealing beam, the semiconductor module is particularly suitable for solving the problem of condensation of the sealing beam, and the condensation removing efficiency is high and the effect is good; in addition, the sealing beam has the characteristics of high energy density, no noise, small size and the like, can ensure that the thickness of the sealing beam is smaller, and has higher capability of solving the problem of front surface condensation. The heating surface of the semiconductor module is directly used as the front surface of the sealing beam, so that the semiconductor module is convenient to mount and manufacture, and a protection surface, a protection cover and the like are not required to be specially arranged on the front side of the semiconductor module.

Furthermore, in the sealing beam, the guide assembly and the heat insulation device are arranged at special positions of the heat conduction device, so that the space can be fully utilized, and the cold quantity in the corresponding storage chamber cannot be influenced. The heat insulation device can be a foam piece, namely a foaming piece, arranged between the first heat exchange plate and the second heat exchange plate, can prevent heat exchange between the inner surface and the outer surface of the sealing beam, and can also provide a mounting and positioning structure for the semiconductor module and/or the guide assembly and the like.

Furthermore, the sealing beam is also provided with a sealing gasket, so that heat exchange caused by a fit clearance between the semiconductor module and the shell can be reduced.

The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.

Drawings

Some specific embodiments of the utility model will be described in detail hereinafter, by way of illustration and not limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:

FIG. 1 is a schematic block diagram of a seal beam according to one embodiment of the present invention;

FIG. 2 is a schematic block diagram of another perspective of the seal beam shown in FIG. 1;

FIG. 3 is a schematic exploded view of the seal beam shown in FIG. 1;

FIG. 4 is a schematic partial block diagram of the seal beam shown in FIG. 1;

FIG. 5 is a schematic block diagram of a heat conducting device in the seal beam shown in FIG. 1;

FIG. 6 is a schematic block diagram of a seal beam according to one embodiment of the present invention;

FIG. 7 is a schematic block diagram of another perspective of the seal beam shown in FIG. 6;

FIG. 8 is a schematic exploded view of the seal beam shown in FIG. 6;

fig. 9 is a schematic block diagram of the gasket and flap of the seal bar shown in fig. 6.

Detailed Description

The refrigerating and freezing device comprises a box body, wherein one or more storage compartments are defined in the box body. Furthermore, the refrigerating and freezing device also comprises at least one door body/cover for opening and closing the plurality of storage compartments. The refrigeration and freezing apparatus further comprises a refrigeration system, which may be a compression refrigeration system for providing cold to each storage compartment. A compressor refrigeration system may include a compressor, a condenser, a throttling element, and an evaporator connected in series. The cold storage and refrigeration device can be an air-cooled cold storage and refrigeration device, and the evaporator can be arranged in the cooling chamber of the box body so as to provide cold energy to the storage chamber through the air duct assembly and the fan. Specifically, the air duct assembly is provided with an air supply air path and a return air path, and the fan is configured to enable air in the storage room to enter the cooling room from the return air path and enter the storage room through the air supply air path in a heat exchange mode with the evaporator. In some alternative embodiments, the refrigeration chiller may be a direct-cooling refrigeration chiller. In some alternative embodiments, the refrigeration system may be a semiconductor refrigeration system or other type of refrigeration system. The refrigerating and freezing device can be a refrigerator, a freezer and the like.

When the refrigeration system is a compression refrigeration system, the compressor compresses the vaporized refrigerant into a high-temperature and high-pressure gas, and then the gas is discharged from a discharge port of the compressor. The inlet of the condenser is connected with the exhaust port of the compressor, and the high-temperature and high-pressure gaseous refrigerant flows through the condenser and is gradually condensed into high-pressure liquid in the process of radiating heat outdoors. The inlet of the throttling element is connected with the outlet of the condenser, the high-pressure liquid refrigerant passes through the throttling element, the pressure of the high-pressure liquid refrigerant is reduced to be a gas-liquid mixture, then the high-pressure liquid refrigerant enters the evaporator to absorb the heat in the gas for vaporization, and then the high-pressure liquid refrigerant returns to the compressor. Meanwhile, the fan enables air flow to flow between the storage chamber and the cooling chamber, so that the temperature in the storage chamber is reduced.

In some preferred embodiments, two door bodies are arranged on the front side of the refrigerator body of the refrigerating and freezing device, the two door bodies are arranged oppositely, and the rear side of each door body is provided with one storage chamber, or the two door bodies are used for closing one storage chamber. In order to ensure the sealing performance between the two door bodies, a sealing beam, which may also be referred to as a vertical beam, is usually arranged between the two door bodies. The sealing beam may be arranged on one door body. Of course, according to the installation position of the door body, the sealing beam can be vertically arranged, horizontally arranged and extended along the front-back direction, horizontally arranged and extended along the left-right direction, and in addition, the sealing beam can be arranged into other forms.

Of course, for a door body, the rear side of the door body corresponds to a storage chamber, and a sealing beam can be arranged between the door body and the frame at the opening of the storage chamber.

Fig. 1 is a schematic configuration diagram of a refrigerating and freezing apparatus according to an embodiment of the present invention. As shown in fig. 1 and with reference to fig. 2-9, an embodiment of the present invention provides a seal beam for a door body of a refrigeration and freezing apparatus.

The sealing beam includes a case 10 and a semiconductor module 20. The housing 10 has an accommodating space with an opening facing forward and extending in a length direction of the housing 10. The semiconductor module 20 has a cooling surface and a heating surface, and the semiconductor module 20 is mounted in the accommodating space. And the heating surface of the semiconductor module 20 is disposed at the opening of the receiving space to form a part or all of the front surface of the sealing beam, that is, the heating surface of the semiconductor module 20 is a continuously extending surface, and the opening of the case 10 is directly closed with the heating surface of the semiconductor module 20 to form the front surface of the sealing beam. The cooling surface of the semiconductor module 20 is thermally connected to the rear wall of the housing 10.

In the sealing beam of the embodiment of the utility model, the characteristics that the semiconductor module 20 heats and cools simultaneously are utilized, and the hot end face of the semiconductor module 20 is directly used as the front surface of the sealing beam, so that air in a room is prevented from being condensed on the surface of the sealing beam; meanwhile, the cold end of the semiconductor module 20 is thermally connected with the inner surface of the shell 10 facing the refrigerating chamber, so that auxiliary refrigeration is realized, the condensation problem of the sealing beam can be improved, and the loss of refrigerating capacity in the storage chamber can be reduced. The housing 10 has an accommodating space extending in the longitudinal direction of the housing 10, and the semiconductor module 20 is mounted as a whole, which is convenient to mount, compact in structure, and low in cost. The semiconductor refrigerating sheets of the semiconductor module 20 simultaneously heat and refrigerate, the heating amount of the semiconductor refrigerating sheets is higher than the refrigerating amount, the heating surface of the semiconductor module 20 is directly used as the front surface of the sealing beam, the semiconductor refrigerating sheet is particularly suitable for solving the problem of condensation of the sealing beam, and the condensation removing efficiency is high and good; in addition, the sealing beam has the characteristics of high energy density, no noise, small size and the like, can ensure that the thickness of the sealing beam is smaller, and has higher capability of solving the problem of front surface condensation.

In some embodiments of the present invention, the cooling surface and the heating surface of the semiconductor module 20 are both continuous surfaces, and it can also be understood that there are no holes on the cooling surface and the heating surface. The semiconductor refrigerating sheet of the semiconductor module 20 is powered on to refrigerate and heat simultaneously, and the working principle is that energy required by electron current is provided by a direct current power supply, after the power supply is powered on, an electron cathode starts to firstly pass through a P-type semiconductor, heat is absorbed by the P-type semiconductor, then the N-type semiconductor is reached, heat is released, and every time the P-type semiconductor passes through an NP module, the heat is transmitted to the other side from one side to cause temperature difference, so that a cold end and a hot end are formed.

In some embodiments of the present invention, as shown in fig. 3 and 8, the sealing beam further includes a heat conduction device 30, and the heat conduction device 30 is disposed between the cooling surface of the semiconductor module 20 and the rear wall of the housing 10 to allow the rear wall of the housing 10 to exchange heat with the cooling surface. In some alternative embodiments of the utility model, the refrigerated face of the semiconductor module 20 is in contact against the rear wall of the casing 10, so as to bring the rear wall of the casing 10 into heat exchange with the refrigerated face.

In order to ensure the sealing performance, a heat insulating device 60 is provided between the side of the semiconductor module 20 facing the heat conducting device 30 and the case 10 to fill a part or all of a space between the side of the semiconductor module 20 facing the heat conducting device 30 and the case 10 excluding the heat conducting device 30. For example, the thermal insulation device 60 may be formed by foaming, and the thermal insulation device 60 may be referred to as a foamed member, an insulating layer, or the like.

In some embodiments of the present invention, as shown in fig. 5, the heat conducting means 30 comprises a first heat exchanger plate 31, a second heat exchanger plate 32 and two connection plates 33. The first heat exchanger plate 31 is in contact against the cooling surface. The two connection plates 33 extend from two edges of the first heat exchange plate 31 extending in the length direction of the case 10 toward a direction away from the semiconductor module 20, respectively. The second heat exchanger plate 32 is in contact against the rear wall of the housing 10. The second heat exchanger plate 32 connects the two connection plates 33. For ease of manufacturing, the heat conducting means 30 may be bent and the second heat exchanger plate 32 comprises two plate portions, each plate portion extending from an edge of one connection plate 33 remote from the first heat exchanger plate 31 towards the other connection plate 33. The two plate portions have a gap therebetween extending in the longitudinal direction of the housing 10.

Further, the housing 10 is made of plastic. As shown in fig. 6 to 9, the housing 10 includes a rear case 12 having a front opening and a front frame 11, the front frame 11 is mounted at the opening of the rear case 12, and the semiconductor module 20 is mounted in the front frame 11. In one embodiment, as shown in fig. 1-3, the housing 10 is integrally formed. The two connecting plates 33 and the second heat exchange plate 32 are both in contact with the inner surface of the rear shell 12, so that the cold-receiving part of the rear shell 12 can be increased, and the cold in the storage compartment is further prevented from leaking. The cooling surface of the semiconductor module 20 is bonded to the heat conduction device 30 by a heat conductive silicone adhesive, or mechanically fixed to the heat conduction device 30 by a fixing structure. The fixing structural part can be a screw, a clamping part and the like.

In some embodiments of the present invention, the sealing beam further includes a guide assembly 40, as shown in fig. 4, the guide assembly 40 is disposed at one end of the space between the first heat exchange plate 31 and the second heat exchange plate 32, and the shell 10 is provided with a hole through which the guide assembly 40 passes. The heat insulating means 60 may also be arranged between the first heat exchanger plate 31 and the second heat exchanger plate 32. The guide assembly 40 and the heat insulation device 60 are disposed at a specific position of the heat conduction device 30, so that the space can be fully utilized, and the cold quantity in the corresponding storage room is not affected. The thermal insulation means 60, which may be a foamed member, is disposed between the first heat exchange plate 31 and the second heat exchange plate 32 to prevent heat exchange between the inner and outer surfaces of the seal beam. The seal beam further comprises a spindle sleeve assembly 50, the spindle sleeve assembly 50 being mounted to the housing 10.

In some alternative embodiments of the present invention, an installation space is provided outside one end of the housing 10, and the guide assembly 40 is provided in the installation space. That is, the guide assembly 40 is completely disposed on the housing 10.

In order to ensure the sealing performance and the heat insulating effect, as shown in fig. 6 to 9, the housing 10 further includes two gaskets 15 respectively provided at both ends of the semiconductor module 20, and each gasket 15 is provided between one end surface of the semiconductor module 20 and the housing 10. Further, the front edge of each gasket 15 extends beyond the flap 16 away from the other gasket 15, and the flap 16 can engage the front surface of the housing 10. The gasket 15 can reduce heat exchange due to a fit clearance between the housing 10 and the semiconductor module 20.

In some embodiments of the present invention, the rotating shaft sleeve assembly 50 may include a shaft sleeve and a torsion spring, the rotating shaft is disposed on the corresponding door body, the rotating shaft is inserted into the shaft sleeve, and the torsion spring is disposed between the rotating shaft and the shaft sleeve to urge the sealing beam to be perpendicular to the corresponding door body.

The guide assembly 40 may include a spring and a guide member, the guide member being telescopically arranged, the spring being used to extend the guide member out of the housing 10. The storage compartment roof is provided with the guide way that the opening is down. When the door body is opened, the sealing beam is in a state approximately vertical to the door body, namely a completely folded state. In the closing process of the door body, the sealing beam rotates along the vertical axis to be approximately parallel to the door body, namely, the sealing beam is in a fully unfolded state, so that a gap between the door body and the other door body is sealed. During opening and closing of the door, the guide member will follow the extending track of the guide groove to guide the sealing beam to rotate correctly.

Thus, it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the utility model have been illustrated and described in detail herein, many other variations or modifications consistent with the principles of the utility model may be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the utility model. Accordingly, the scope of the utility model should be understood and interpreted to cover all such other variations or modifications.

Claims

1. A sealing beam for a door body of a refrigeration and freezing apparatus, comprising:

2. The seal beam defined in claim 1, further comprising:

3. The seal beam defined in claim 2, wherein the heat conducting means comprises:

4. The seal beam defined in claim 3,

said second heat exchanger plate comprises two plate portions, each of said plate portions extending from an edge of one of said connection plates remote from said first heat exchanger plate towards the other of said connection plates;

5. The seal beam defined in claim 3, further comprising a guide assembly,

6. The seal beam defined in claim 2,

a heat insulating device is provided between the rear side of the semiconductor module and the case to fill a part or all of a space between the rear side of the semiconductor module and the case excluding the heat conducting device.

7. The seal beam defined in claim 1, further comprising two gaskets respectively disposed at both ends of the semiconductor module, and each of the gaskets is disposed between one end surface of the semiconductor module and the housing.

8. The seal beam defined in claim 7,

the front edge of each sealing gasket extends out of the blocking piece towards the direction far away from the other sealing gasket.

9. The seal beam defined in claim 2,

the heat conducting device comprises a plurality of heat conducting fins, each heat conducting fin is perpendicular to the refrigerating surface of the semiconductor module, contacts with the refrigerating surface of the semiconductor module to abut against or is fixedly connected with the refrigerating surface of the semiconductor module, and contacts with the rear wall of the shell to abut against or is fixedly connected with the rear wall of the shell.

10. The seal beam defined in claim 1, further comprising a bushing assembly mounted to the housing;