CN116123804A

CN116123804A - Sealing beam for door body of refrigeration and freezing device and refrigeration and freezing device

Info

Publication number: CN116123804A
Application number: CN202111349681.9A
Authority: CN
Inventors: 张纯; 吕鹏; 赵晓军; 张�浩; 孟亮
Original assignee: Qingdao Haier Refrigerator Co Ltd; Haier Smart Home Co Ltd
Current assignee: Qingdao Haier Refrigerator Co Ltd; Haier Smart Home Co Ltd
Priority date: 2021-11-15
Filing date: 2021-11-15
Publication date: 2023-05-16
Also published as: WO2023083002A1

Abstract

The invention provides a sealing beam for a door body of a refrigeration and freezing device and the refrigeration and freezing device. The sealing beam includes an outer frame and a semiconductor module. The semiconductor module has a cooling surface and a heating surface. The outer frame is arranged on the periphery of the semiconductor module, so that the refrigerating surface of the semiconductor module is part or all of the rear surface of the sealing beam, and the heating surface of the semiconductor module is part or all of the front surface of the sealing beam. When the sealing beam can compensate condensation prevention of the traditional heating wire, the cooling capacity loss near the sealing beam can be compensated, and the indoor temperature of the storage compartment can be better maintained. Furthermore, the front side and the rear side of the semiconductor module do not need to be provided with a protection surface, a protection cover and the like, so that the semiconductor module has fewer structural components, is convenient to install, reduces heat transfer, and improves the utilization rate of heat and cold.

Description

Sealing beam for door body of refrigeration and freezing device and refrigeration and freezing device

Technical Field

The invention relates to the technical field of refrigeration storage, in particular to a sealing beam for a door body of a refrigeration and freezing device and the refrigeration and freezing device.

Background

With the development of technology, the development of social economy and the improvement of the living standard of people, high living quality becomes a necessary requirement for users, particularly, a refrigerator, a freezer and other refrigeration and freezing devices become necessities in family life, and most of food materials in families are often stored in the refrigerator by the users. For example, french side by side refrigerators are a favorite refrigerator product.

French side-by-side refrigerators typically have a vertical beam between the two refrigeration doors that is present to facilitate the bridging and sealing of the door seals between the two refrigeration doors, which may also be referred to as a sealing beam. The refrigerator has lower surface temperature during normal refrigeration, and is easy to generate condensation, thereby affecting the beautiful appearance of the refrigerator and affecting the use feeling of users. Therefore, in the existing refrigerator products, the problem of condensation on the front surface of the vertical beam is always a problem to be solved, and the user experience is affected. In order to solve the problem, the refrigerator is often provided with a heating wire for heating to prevent condensation, but the temperature difference is increased at the outer surface of the vertical beam when the heating wire heats the temperature, so that the cold loss of the refrigerator compartment at the position can be increased. Moreover, the existing sealing beam structure is relatively complex.

Disclosure of Invention

The present invention has been made in view of the above problems, and has as its object to provide a sealing beam for a door body of a refrigeration and freezing apparatus and a refrigeration and freezing apparatus which overcome or at least partially solve the above problems, and which can reduce the loss of refrigerating capacity in a storage compartment of the refrigeration and freezing apparatus while improving the condensation problem, and which has a simple structure, a small number of components, a simple assembly, and a high energy utilization.

Specifically, the present invention provides a sealing beam for a door body of a refrigerating and freezing apparatus, comprising:

the semiconductor module is provided with a refrigerating surface and a heating surface, and the refrigerating surface and the heating surface are continuously extended surfaces; and

and the outer frame is arranged on the periphery of the semiconductor module, so that the refrigerating surface of the semiconductor module is part or all of the rear surface of the sealing beam, and the heating surface of the semiconductor module is part or all of the front surface of the sealing beam.

Optionally, the semiconductor module includes at least two semiconductor sub-modules sequentially arranged along the front-back direction; the front surface of each semiconductor sub-module is a heating surface, the rear surface is a cooling surface, so that the front surface of the semiconductor sub-module at the forefront side is the heating surface of the semiconductor module, and the rear surface of the semiconductor sub-module at the rearmost side is the cooling surface of the semiconductor module;

and two opposite surfaces of each adjacent two semiconductor sub-modules are thermally connected.

Optionally, a heat insulation structure is arranged between every two adjacent semiconductor sub-modules and between the semiconductor sub-modules and the outer frame.

Optionally, a heat conducting plate or a plurality of heat conducting strips extending along the sealing beam are arranged between two opposite faces of every two adjacent semiconductor sub-modules.

Optionally, the sealing beam further includes a guide assembly mounted to the outer frame and located outside one end of the semiconductor module.

Optionally, the sealing beam further comprises a guide assembly, wherein one end of each two adjacent semiconductor sub-modules is provided with a mounting space for mounting the guide assembly.

Optionally, the sealing beam further includes a rotating shaft sleeve assembly, and the rotating shaft sleeve assembly is mounted on a frame of the outer frame extending along the length direction of the semiconductor module.

Optionally, the both sides face of heat conduction board respectively with corresponding semiconductor sub-module laminating, just the heat conduction board passes through heat conduction silica gel with corresponding semiconductor sub-module heat is connected.

The invention also provides a refrigerating and freezing device, which comprises a box body, wherein a storage compartment is arranged in the box body, a first door body is arranged at the front side of the storage compartment, and a sealing beam is arranged on the first door body, wherein the sealing beam is any one of the sealing beams, and the rear surface of the sealing beam faces the storage compartment.

Optionally, the refrigerating and freezing device further comprises a second door body, wherein the second door body is arranged at the front side of the storage compartment, and the second door body is opposite to the first door body.

In the refrigerating and freezing device and the sealing beam, the characteristics of heating and refrigerating the semiconductor module at one side are utilized, the end face of the hot end of the semiconductor module is directly used as the front surface of the sealing beam, and the air in a room is prevented from being condensed on the surface of the sealing beam; meanwhile, the cold end face of the semiconductor module is directly used as the rear surface of the sealing beam, auxiliary refrigeration can be realized, the problem of sealing Liang Ninglou can be solved, and meanwhile, the refrigeration loss in the storage compartment can be reduced.

Particularly, the hot end face of the semiconductor module is directly used as the front surface of the sealing beam, the cold end face of the semiconductor module is directly used as the rear surface of the sealing beam, and the protection surface, the protection cover and the like are not required to be arranged on the front side and the rear side of the semiconductor module, and the semiconductor module can be directly used for condensation prevention and auxiliary refrigeration, and is high in energy utilization rate and efficiency.

The semiconductor refrigerating sheet of the semiconductor module heats and refrigerates simultaneously, the heating capacity is higher than the refrigerating capacity, the heating surface of the semiconductor module is directly used as the front surface of the sealing beam, and the semiconductor refrigerating sheet is particularly suitable for solving the problem of condensation of the sealing beam, and the condensation removing efficiency is high and good; in addition, the sealing beam has the characteristics of high energy density, no noise, small volume and the like, can be smaller in thickness, and has higher capability of solving the problem of front surface condensation.

Further, in the sealing beam of the invention, the semiconductor module comprises at least two semiconductor sub-modules which are sequentially arranged along the front-back direction, so that the condensation removing efficiency can be improved. And the front side refrigerating surface is thermally connected with the rear side heating surface, so that the cooling capacity generated by the front side refrigerating surface and the heat generated by the rear side heating surface can be neutralized, the temperature difference between the rear side semiconductor sub-module heating surface and the rear side refrigerating surface can be maintained, continuous refrigeration is facilitated, and the influence on the temperature of the storage room is reduced.

The above, as well as additional objectives, advantages, and features of the present invention will become apparent to those skilled in the art from the following detailed description of a specific embodiment of the present invention when read in conjunction with the accompanying drawings.

Drawings

Some specific embodiments of the invention will be described in detail hereinafter by way of example and not by way of limitation with reference to the accompanying drawings. The same reference numbers will be used throughout the drawings to refer to the same or like parts or portions. It will be appreciated by those skilled in the art that the drawings are not necessarily drawn to scale. In the accompanying drawings:

FIG. 1 is a schematic block diagram of a seal beam according to one embodiment of the invention;

FIG. 2 is a schematic side view of the seal beam of FIG. 1;

FIG. 3 is a schematic partial block diagram of the seal beam of FIG. 1;

FIG. 4 is a schematic exploded view of the seal beam of FIG. 1;

fig. 5 is a schematic structural view of a refrigerating and freezing apparatus according to an embodiment of the present invention.

Detailed Description

Fig. 1 is a schematic configuration view of a refrigerating and freezing apparatus according to an embodiment of the present invention. As shown in fig. 1 and referring to fig. 2 to 4, an embodiment of the present invention provides a sealing beam for a door body of a refrigerating and freezing apparatus.

The sealing beam includes an outer frame 10 and a semiconductor module 20. The semiconductor module 20 has a cooling surface and a heating surface, both of which are continuously extended surfaces. The outer frame 10 is provided on the outer periphery of the semiconductor module 20 such that the cooling surface of the semiconductor module 20 is a part or the whole of the rear surface of the sealing beam, and the heating surface of the semiconductor module 20 is a part or the whole of the front surface of the sealing beam.

In the sealing beam according to the embodiment of the present invention, the protection surface, the protection cover, and the like are not particularly provided on the front side and the rear side of the semiconductor module 20, and the sealing beam has fewer structural members and is convenient to install. The characteristics of heating and refrigerating the semiconductor module 20 are utilized, and the end face of the hot end of the semiconductor module 20 is directly used as the front surface of the sealing beam, so that the air in the room is prevented from being condensed on the surface of the sealing beam; meanwhile, the cold end face of the semiconductor module 20 is directly used as the rear surface of the sealing beam, refrigeration is assisted, and the problem of sealing Liang Ninglou is solved, and meanwhile, the refrigeration loss in the storage room is reduced. That is, the sealing beam can compensate the cold loss near the sealing beam when the traditional heating wire is prevented from condensation, and the indoor temperature of the storage compartment is better maintained.

In particular, the hot end face of the semiconductor module 20 is directly used as the front surface of the sealing beam, and the cold end face of the semiconductor module 20 is directly used as the rear surface of the sealing beam, so that the front side and the rear side of the semiconductor module 20 do not need to be provided with a protection surface, a protection cover and the like, heat transfer is not required, the semiconductor module can be directly used for condensation prevention and auxiliary refrigeration, the efficiency is high, and the energy utilization rate is high.

In some embodiments of the present invention, as shown in fig. 3 and 4, the semiconductor module 20 includes at least two semiconductor sub-modules 22 disposed in sequence in the front-rear direction. The front surface of each semiconductor sub-module 22 is a heating surface thereof, and the rear surface is a cooling surface thereof, so that the front surface of the semiconductor sub-module 22 at the forefront side is a heating surface of the semiconductor module 20, and the rear surface of the semiconductor sub-module 22 at the rearmost side is a cooling surface of the semiconductor module 20. Each two opposing faces of each adjacent two of the semiconductor sub-modules 22 are thermally connected.

The semiconductor module 20 includes at least two semiconductor sub-modules 22 sequentially arranged along the front-rear direction, which is beneficial to improving the temperature difference between the heating surface and the cooling surface of the semiconductor module 20, and can improve condensation removal efficiency and reduce the influence on the temperature of the storage chamber during condensation removal. Specifically, the front side refrigerating surface is thermally connected with the rear side heating surface, so that the cooling capacity generated by the front side refrigerating surface and the heat generated by the rear side heating surface can be neutralized, the temperature difference between the rear side semiconductor sub-module 22 heating surface and the refrigerating surface can be maintained, continuous refrigeration is facilitated, and the influence on the temperature of the storage room is reduced. Preferably, the number of semiconductor sub-modules 22 is two. Each semiconductor sub-module 22 includes semiconductor cooling fins for generating cold and heat. The semiconductor refrigerating sheet is powered on, and is used for refrigerating and heating at the same time, and its working principle is that the energy required by electron flow is supplied by means of DC power supply, after the power supply is powered on, the electron negative electrode is started, firstly, the P-type semiconductor is passed through the electron negative electrode, and the heat is absorbed, and the N-type semiconductor is reached, and the heat is released, and every time the heat passes through one NP module, the heat is transferred from one side to another side, and the temperature difference is formed so as to form cold and hot ends.

Further, the heat insulation structure 30 is disposed between every two adjacent semiconductor sub-modules 22 and between the semiconductor sub-modules and the outer frame 10, for example, foaming can be performed to form a heat insulation layer, so that at least the sealing performance can be improved, the heat insulation performance of the refrigeration and freezing device can be ensured when the semiconductor modules 20 are not in operation, and the sealing beam can also have enough strength.

In some embodiments of the present invention, as shown in fig. 4, a heat-conducting plate 40 is disposed between two opposing faces of each adjacent two semiconductor sub-modules 22. The heat conductive plate 40 may be perpendicular to the front-rear direction, i.e., both side surfaces of the heat conductive plate 40 may be bonded to the corresponding semiconductor sub-module 22. The heat conductive plate 40 is thermally connected to the corresponding semiconductor sub-module 22 through a thermally conductive silicone. In some alternative embodiments of the present invention, a plurality of heat conductive strips extending along the sealing beam are disposed between two opposite sides of each adjacent two semiconductor sub-modules 22, and a thermal insulation material may be filled between the adjacent two heat conductive strips.

In some embodiments of the present invention, the sealing beam further includes a guide member 50 having an installation space at one end of the semiconductor module 20 for installing the guide member 50, that is, a portion of the structure of the guide member 50 may be disposed in the installation space. The outer frame 10 is provided with holes through which the guide members 50 pass. Specifically, one end of two adjacent semiconductor sub-modules 22 has a mounting space for mounting the guide assembly 50. Preferably, the number of semiconductor sub-modules 22 is two. The guide member 50 is disposed at a specific position of the semiconductor module 20, and can fully utilize space. In other embodiments of the present invention, the guide assembly 50 is mounted to the outer frame 10 outside one end of the semiconductor module 20. That is, an installation space is provided outside one end of the outer frame 10, and a part of the structure of the guide assembly 50 is provided in the installation space. That is, the guide assembly 50 is entirely disposed on the outer frame 10.

Further, the sealing beam further includes a rotation shaft sleeve assembly 60, and the rotation shaft sleeve assembly 60 is mounted to a frame of the outer frame 10 extending along the length direction of the semiconductor module 20.

In order to ensure sealing performance and heat insulation effect, the sealing beam further includes two sealing gaskets disposed at both ends of the semiconductor module 20, respectively, and each sealing gasket is disposed between one end face of the semiconductor module 20 and the outer frame 10. Further, the front edge of each gasket extends away from the other gasket to form a baffle, and the baffle can be attached to the front surface of the outer frame 10. The gasket can reduce heat exchange caused by the fit clearance between the outer frame 10 and the semiconductor module 20. The outer frame 10 is made of plastic material.

In some embodiments of the present invention, the shaft housing assembly 60 may include a shaft housing 61 and a torsion spring 62, a shaft is provided on the corresponding door body, the shaft is inserted into the shaft housing, and the torsion spring is provided between the shaft and the shaft housing, so that the sealing beam is perpendicular to the corresponding door body.

The guide assembly 50 may include a spring 51 and a guide 52 telescopically arranged, the spring being adapted to extend out of the outer frame 10. The top wall of the storage room is provided with a guide groove with a downward opening. When the door body is opened, the sealing beam is in a state approximately perpendicular to the door body, namely, a fully folded state. During closing of the door, the sealing beam will rotate along the vertical axis to a state approximately parallel to the door, i.e. a fully extended state, to seal the gap between the door and the other door. During opening and closing of the door, the guide member will move along the extended trajectory of the guide slot to guide the rotation of the seal Liang Zhengque.

The embodiment of the invention also provides a refrigeration and freezing device, as shown in fig. 5, which comprises a box 71, wherein one or more storage compartments are defined in the box 71. Further, the refrigerating and freezing device further comprises at least one door body/cover for opening and closing the storage compartments. The refrigeration chiller may also include a refrigeration system, which may be a compression refrigeration system for cooling each of the storage compartments. The compressor refrigeration system may include a compressor, a condenser, a throttling element, and an evaporator connected in series. The refrigeration chiller may be an air-cooled refrigeration chiller, and the evaporator may be disposed within the cooling compartment of the cabinet 71 to facilitate the supply of cooling to the storage compartment through the air duct assembly and the blower. Specifically, the air duct assembly has an air supply duct and an air return duct, and the blower is configured to facilitate air in the storage compartment from the air return duct into the cooling compartment, exchanging heat with the evaporator, and entering the storage compartment via the air supply duct. In some alternative embodiments, the refrigeration chiller may be a direct-cooled refrigeration chiller. In some alternative embodiments, the refrigeration system may be a semiconductor refrigeration system or other type of refrigeration system. The refrigeration and freezing device can be a refrigerator, a freezer and the like.

When the refrigeration system is a compression refrigeration system, the compressor compresses vaporized refrigerant into high-temperature and high-pressure gas, and then discharges the gas from a discharge port of the compressor. The inlet of the condenser is connected with the exhaust port of the compressor, and the high-temperature and high-pressure gaseous refrigerant flows through the condenser and gradually condenses into high-pressure liquid in the process of radiating heat to the outdoor. The inlet of the throttling element is connected with the outlet of the condenser, and the high-pressure liquid refrigerant flows through the throttling element, then the pressure is reduced to become a gas-liquid mixture, and then the gas-liquid mixture enters the evaporator to absorb heat in the gas for vaporization, and then returns to the compressor. Meanwhile, the fan enables air flow to flow between the storage compartment and the cooling compartment, so that the temperature in the storage compartment is reduced.

In some preferred embodiments, the front side of the refrigerator-freezer housing 71 is provided with two doors disposed opposite each other, each having one storage compartment on the rear side thereof, or the two doors are used to close one storage compartment. In order to ensure sealing performance between the two door bodies, there is typically a sealing beam, also referred to as a vertical beam, between the two door bodies. The sealing beam may be provided on one door body. In particular, the sealing beam is the sealing beam in any of the embodiments described above. According to the installation position of the door body, the sealing beam can be vertically arranged, can be horizontally arranged and extend along the front-back direction, can be horizontally arranged and extend along the left-right direction, and can be arranged in other forms. Of course, in some embodiments, for a door body, the rear side of the door body corresponds to a storage compartment, and the sealing beam in any of the above embodiments may be disposed between the door body and the frame at the opening of the storage compartment.

That is, in some embodiments of the present invention, the refrigerating and freezing apparatus includes a case 71 having a storage compartment in the case 71, a first door 72 provided at a front side of the storage compartment, and a sealing beam provided on the first door 72, wherein the sealing beam is any one of the sealing beams described above, and a rear surface of the sealing beam faces the storage compartment. In some further embodiments of the present invention, the refrigerating and freezing apparatus further includes a second door 73 disposed at a front side of the storage compartment, and the second door 73 is disposed opposite to the first door 72. The first door 72 and the second door 73 may constitute a split door.

By now it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been shown and described herein in detail, many other variations or modifications of the invention consistent with the principles of the invention may be directly ascertained or inferred from the present disclosure without departing from the spirit and scope of the invention. Accordingly, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims

1. A sealing beam for a refrigeration and freezer door comprising:

a semiconductor module having a cooling face and a heating face; and

2. The sealing beam of claim 1, wherein the sealing beam comprises a sealing member,

the semiconductor module comprises at least two semiconductor sub-modules which are sequentially arranged along the front-back direction; the front surface of each semiconductor sub-module is a heating surface, the rear surface is a cooling surface, so that the front surface of the semiconductor sub-module at the forefront side is the heating surface of the semiconductor module, and the rear surface of the semiconductor sub-module at the rearmost side is the cooling surface of the semiconductor module;

3. A sealing beam as claimed in claim 2, wherein,

and heat insulation structures are arranged between every two adjacent semiconductor sub-modules and between the semiconductor sub-modules and the outer frame.

4. A sealing beam as claimed in claim 2, wherein,

and a heat conducting plate or a plurality of heat conducting strips extending along the sealing beams are arranged between two opposite surfaces of every two adjacent semiconductor sub-modules.

5. The encapsulated beam as set forth in claim 1 further comprising a guide assembly mounted to said outer frame and outboard of one end of said semiconductor module.

6. The encapsulated beam as set forth in claim 2 further comprising a guide assembly, wherein one end of two adjacent semiconductor sub-modules has a mounting space for mounting said guide assembly.

7. The sealing beam of claim 1, further comprising a swivel housing assembly mounted to a rim of the outer frame extending along a length of the semiconductor module.

8. The sealing beam of claim 4, wherein the sealing beam comprises a sealing member,

the two side surfaces of the heat conducting plate are respectively attached to the corresponding semiconductor sub-modules, and the heat conducting plate is in thermal connection with the corresponding semiconductor sub-modules through heat conducting silica gel;

each semiconductor submodule comprises a semiconductor refrigeration piece.

9. A refrigerating and freezing device, comprising a box body, wherein a storage compartment is arranged in the box body, a first door body is arranged at the front side of the storage compartment, and a sealing beam is arranged on the first door body, and the refrigerating and freezing device is characterized in that the sealing beam is any one of claims 1 to 8, and the rear surface of the sealing beam faces the storage compartment.

10. The refrigeration and chiller of claim 9, further comprising a second door disposed on a front side of the storage compartment, the second door being disposed opposite the first door.