CN216813800U

CN216813800U - Novel ultra-thin panel lamp pearl of high heat dissipation

Info

Publication number: CN216813800U
Application number: CN202122816924.7U
Authority: CN
Inventors: 陈广明; 陈皇; 吴琼渊; 潘雅雯
Original assignee: Jiangmen Zhongyang Photoelectric Co ltd
Current assignee: Guangdong Zhongyangguang Electric Technology Co ltd
Priority date: 2021-11-06
Filing date: 2021-11-17
Publication date: 2022-06-24
Anticipated expiration: 2031-11-17

Abstract

The utility model discloses a novel high-heat-dissipation ultrathin panel lamp bead which comprises a copper substrate, wherein a plurality of supports are fixedly mounted at the top of the copper substrate, an insulating strip is arranged at the top of the copper substrate, a large bonding pad and a small bonding pad are respectively arranged at the positions, located on two sides of the insulating strip, at the top of the copper substrate, a first light source chip and a second light source chip are welded at the top of the large bonding pad, a third light source chip is welded at the top of the small bonding pad, a cup groove is formed in the top of the support, and a positioning partition strip is fixedly connected at the bottom of the support. Utilize thinner copper base plate as the base plate, the copper base plate can dispel the heat to the whole, and the support is accomplished lower for it is whole thinner, suitably enlarge through the area with little pad, optimize the position of chip, distribute third light source chip in the position of little pad, thereby can make the heat dissipation more even, illumination effect is better simultaneously, and the printing opacity is more even, and unit area's luminance is higher.

Description

Novel ultra-thin panel lamp pearl of high heat dissipation

Technical Field

The utility model relates to the field of panel lamps, in particular to a novel high-heat-dissipation ultrathin panel lamp bead.

Background

The LED lamp beads are fully called semiconductor light-emitting diodes and are made of semiconductor materials, so that electric energy is directly converted into light energy, and electric signals are converted into light signals; its advantages are low power consumption, high brightness, gay colour, vibration resistance, long service life and cold light source.

The ultrathin panel lamp is mainly sold in a thin mode, lamp bead elements of the existing ultrathin panel lamp are gathered on a disc body of a large welding disc, when the ultrathin panel lamp is used, the light and heat gathering amount is large, heat dissipation is not facilitated, the service life of the element is damaged, when the ultrathin panel lamp is detected, light is gathered, light transmission is not uniform easily, double images, dark spots and other phenomena are generated in partial areas, when glue is too much during packaging, the glue overflows into the element part, and therefore a circuit, the element and the glue are subjected to chemical reaction, and therefore the mounting and packaging structure needs to be optimized.

SUMMERY OF THE UTILITY MODEL

1. Technical problem to be solved

Aiming at the problems in the prior art, the utility model aims to provide a novel high-heat-dissipation ultrathin panel lamp bead, the scheme utilizes a thinner copper substrate as a substrate, the copper substrate can dissipate heat of the whole body, the support is lower, the whole body is thinner, the position of the chip is optimized by properly amplifying the area of a small bonding pad, and a third light source chip is distributed at the position of the small bonding pad, so that the heat dissipation is more uniform, meanwhile, the illumination effect is better, the light transmission is more uniform, the brightness of the unit area is higher, and the novel high-heat-dissipation ultrathin panel lamp bead has the advantages of good heat dissipation, high light efficiency, high temperature resistance, low light attenuation, long service life and better reliability.

2. Technical scheme

In order to solve the above problems, the present invention adopts the following technical solutions.

The utility model provides a novel ultra-thin panel lamp pearl of high heat dissipation, includes the copper base plate, the top fixed mounting of copper base plate has a plurality of supports, the top of copper base plate is provided with the insulating strip, the top of copper base plate and the position that is located the insulating strip both sides are provided with big pad and little pad respectively, the top welding of big pad has first light source chip and second light source chip, the top welding of little pad has third light source chip, the top of support is provided with the cup groove, the strip is cut off in the bottom fixedly connected with location of support, the top of copper base plate and the corresponding position of location partition strip have been seted up the anti-overflow and have been glued and separate the groove. Utilize thinner copper base plate as the base plate, the copper base plate can dispel the heat to the whole, the support is accomplished lower, make whole thinner, through suitably enlargiing the area of little pad, optimize the position of chip, distribute the position at little pad with third light source chip, thereby can make the heat dissipation more even, illumination effect is better simultaneously, the printing opacity is more even, unit area's luminance is higher, through setting up anti-overflow glue separating groove and location partition strip and carry out the gomphosis, at first be convenient for fix a position, secondly during the encapsulation colloid, can prevent the glue solution invasion, and can obstruct steam, ensure the gas tightness of lamp source, the encapsulation effect is better.

Further, the bracket is made of PCT plastic material. The PCT has high heat resistance, the continuous application temperature range is 130-150 ℃, and the deflection temperature is 243-260 ℃.

Furthermore, a lead is welded on the top of the large bonding pad, the end of the lead is welded on the top of the small bonding pad, the first light source chip, the second light source chip and the third light source chip are connected in series through the lead, and the lead is connected in series on the copper substrate circuit. And the first light source chip, the second light source chip and the third light source chip are connected in series in sequence by using leads.

Furthermore, a fixing frame is clamped at the top of the support, and a reference angle is arranged at the top of the support. The support can be fixed by the fixing frame, and the reference angle is used as a reference azimuth.

Furthermore, the edge part of the front surface of the copper substrate is provided with a mounting hole. The copper substrate can be mounted in the lamp housing by the mounting hole.

Further, the thickness of the copper substrate is 0.23mm, and the thickness of the support is 0.4 mm. The material and the arrangement structure are optimized, the whole thickness is only the thickness of the copper substrate and the support, and the thickness of the copper substrate and the support is the lowest, so that the total thickness is thinner.

Further, the cup groove is a taper hole, and the inner hole angle of the cup groove is 31.9 degrees. The radian of the groove surface is optimized, the groove depth is reduced, and light rays are convenient to diffuse.

3. Advantageous effects

Compared with the prior art, the utility model has the advantages that:

(1) this scheme utilizes thinner copper base plate as the base plate, the copper base plate can dispel the heat to the whole, the support is accomplished lowerly, make whole thinner, suitably enlarge through the area with little pad, optimize the position of chip, distribute the position at little pad with third light source chip, thereby can make the heat dissipation more even, illumination effect is better simultaneously, the printing opacity is more even, unit area's luminance is higher, it is good to have the heat dissipation, high light efficiency, high temperature resistant, low light decay, the better advantage of high life and reliability.

(2) Through setting up anti-overflow glue partition groove and location partition strip and carry out the gomphosis, at first be convenient for fix a position, during secondary encapsulation colloid, can prevent the glue solution and invade to can obstruct steam, ensure the gas tightness in lamp source, the encapsulation effect is better.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged view of the structure of the bracket of the present invention;

FIG. 3 is a cross-sectional view of the present invention;

fig. 4 is a rear view of the stent portion of the present invention.

The reference numbers in the figures illustrate:

1. copper base plate, 2, support, 3, insulating strip, 4, big pad, 5, little pad, 6, first light source chip, 7, second light source chip, 8, third light source chip, 9, the cup groove, 10, location cut off strip, 11, anti-overflow glue separation groove, 12, lead wire, 13, mount, 14, benchmark angle, 15, mounting hole.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Examples

Please refer to fig. 1-4, a novel high heat dissipation ultra-thin panel lamp pearl, includes copper substrate 1, the top fixed mounting of copper substrate 1 has a plurality of supports 2, the top of copper substrate 1 is provided with insulating strip 3, the top of copper substrate 1 and the position that is located insulating strip 3 both sides are provided with big pad 4 and little pad 5 respectively, the top welding of big pad 4 has first light source chip 6 and second light source chip 7, the top welding of little pad 5 has third light source chip 8, the top of support 2 is provided with cup groove 9, the bottom fixedly connected with location of support 2 cuts off strip 10, the top of copper substrate 1 and the location that cuts off strip 10 corresponding position has seted up anti-overflow and has glued separating groove 11. Utilize thinner copper base plate 1 as the base plate, copper base plate 1 can dispel the heat to whole, support 2 accomplishes lowly, make whole thinner, through suitably enlargiing little pad 5's area, optimize the position of chip, distribute third light source chip 8 in little pad 5's position, thereby can make the heat dissipation more even, the illumination effect is better simultaneously, the printing opacity is more even, unit area's luminance is higher, through setting up prevent overflowing glue parting bead 11 and fix a position parting bead 10 and carry out the gomphosis, at first be convenient for fix a position, during the encapsulation colloid, can prevent the glue solution invasion, and can hinder steam, ensure the gas tightness of lamp source, the encapsulation effect is better.

Referring to fig. 1-4, the bracket 2 is made of PCT plastic. The PCT has high heat resistance, the continuous application temperature range is 130-150 ℃, and the deflection temperature is 243-260 ℃.

Referring to fig. 1-4, a lead 12 is welded on the top of the large bonding pad 4, the end of the lead 12 is welded on the top of the small bonding pad 5, the first light source chip 6, the second light source chip 7 and the third light source chip 8 are connected in series through the lead 12, and the lead 12 is connected in series on the circuit of the copper substrate 1. The first light source chip 6, the second light source chip 7, and the third light source chip 8 are connected in series in this order by a wire 12.

Referring to fig. 1-4, the top of the bracket 2 is provided with a reference angle 14. The holder 2 can be fixed by the fixing frame 13 with the reference angle 14 as a reference azimuth.

Referring to fig. 1-4, the edge of the front surface of the copper substrate 1 is provided with a mounting hole 15. The copper substrate 1 can be mounted in the lamp housing through the mounting hole 15.

Referring to fig. 1-4, the thickness of the copper substrate 1 is 0.23mm, and the thickness of the support 2 is 0.4 mm. The material and the arrangement structure are optimized, the whole thickness is only the thickness of the copper substrate 1 and the support 2, and the thickness of the copper substrate 1 and the support 2 is the lowest, so that the total thickness is thinner.

Referring to fig. 1-4, the cup 9 is a tapered hole, and the inner hole angle of the cup 9 is 31.9 °. The radian of the groove surface is optimized, the groove depth is reduced, and light rays are convenient to diffuse.

According to the utility model, a thinner copper substrate 1 is used as a substrate, the copper substrate 1 can dissipate heat of the whole, the support 2 is lower, so that the whole is thinner, the area of the small bonding pad 5 is properly enlarged, the position of the chip is optimized, and the third light source chips 8 are distributed at the positions of the small bonding pads 5, so that the heat dissipation is more uniform, the illumination effect is better, the light transmission is more uniform, and the brightness of the unit area is higher, the anti-overflow glue partition groove 11 and the positioning partition strip 10 are embedded, so that the positioning is convenient firstly, when the glue is packaged, the invasion of the glue can be prevented, the water vapor can be blocked, the air tightness of the light source is ensured, the packaging effect is better, the support 2 is made of PCT plastic material, the PCT has higher heat resistance, the continuous application temperature range is 130-150 ℃, the deflection temperature is 243-260 ℃, and the first light source chips 6 are sequentially arranged by using the lead 12, Second light source chip 7 and third light source chip 8 establish ties, utilize mount 13 to fix support 2, reference angle 14 is as the benchmark position, utilize mounting hole 15 can be in installing copper base plate 1 in the lamp body, optimize material and range structure, holistic thickness is only for the thickness of copper base plate 1 and support 2, accomplish minimum with the thickness of copper base plate 1 and support 2, thereby make overall thickness thinner, optimize the groove face radian of cup groove 9, reduce the groove depth, be convenient for spread light.

The foregoing is only a preferred embodiment of the present invention; the scope of the utility model is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.

Claims

1. The utility model provides a novel ultra-thin panel lamp pearl of high heat dissipation, includes copper base plate (1), its characterized in that: the top fixed mounting of copper base plate (1) has a plurality of supports (2), the top of copper base plate (1) is provided with insulating strip (3), the top of copper base plate (1) and the position that is located insulating strip (3) both sides are provided with big pad (4) and small pad (5) respectively, the top welding of big pad (4) has first light source chip (6) and second light source chip (7), the top welding of small pad (5) has third light source chip (8), the top of support (2) is provided with cup groove (9), the bottom fixedly connected with location of support (2) cuts off strip (10), the top of copper base plate (1) is cut off strip (10) corresponding position with the location and has been seted up the anti-overflow and has been glued and separate groove (11).

2. The novel high heat dissipation ultrathin panel lamp bead of claim 1, characterized in that: the bracket (2) is made of PCT plastic materials.

3. The novel high heat dissipation ultrathin panel lamp bead of claim 1, characterized in that: lead wires (12) are welded to the top of the large bonding pad (4), the end portions of the lead wires (12) are welded to the top of the small bonding pad (5), the first light source chip (6), the second light source chip (7) and the third light source chip (8) are connected in series through the lead wires (12), and the lead wires (12) are connected in series on a copper substrate (1) circuit.

4. The novel high heat dissipation ultrathin panel lamp bead of claim 1, characterized in that: the top joint of support (2) has mount (13), the top of support (2) is provided with benchmark angle (14).

5. The novel high heat dissipation ultrathin panel lamp bead of claim 1, characterized in that: the edge part of the front surface of the copper substrate (1) is provided with a mounting hole (15).

6. The novel high heat dissipation ultrathin panel lamp bead of claim 1, characterized in that: the thickness of copper base plate (1) is 0.23mm, the thickness of support (2) is 0.4 mm.

7. The novel high heat dissipation ultrathin panel lamp bead of claim 1, characterized in that: the cup groove (9) is a conical hole, and the inner hole angle of the cup groove (9) is 31.9 degrees.