CN218379280U

CN218379280U - SMD ultra-thin heat dissipation highlight lamp pearl panel

Info

Publication number: CN218379280U
Application number: CN202221987503.9U
Authority: CN
Inventors: 陈广明; 陈皇; 吴琼渊; 潘雅雯
Original assignee: Jiangmen Zhongyang Photoelectric Co ltd
Current assignee: Guangdong Zhongyangguang Electric Technology Co ltd
Priority date: 2022-07-29
Filing date: 2022-07-29
Publication date: 2023-01-24
Anticipated expiration: 2032-07-29

Abstract

The utility model discloses a bright lamp pearl panel of ultra-thin heat dissipation highlight of SMD, which comprises a substrate, be equipped with the step mouth on the base plate, it is equipped with the installation adhesive tape to insert in the step mouth, the one end that the installation adhesive tape inserted the step mouth is equipped with the anti-overflow and glues the groove, be provided with the support on the base plate, the bottom both sides of support are provided with the joint strip, the joint strip inserts the anti-overflow that corresponds and glues the inslot, be equipped with the cup groove in the support, the inner wall both sides in cup groove are provided with first pad and second pad respectively, be provided with first lamp pearl on the first pad, be provided with second lamp pearl on the second pad, the cup inslot is located and is provided with the insulating strip between first pad and the second pad. Insert the installation adhesive tape in the step mouth earlier, then insert the anti-overflow glue groove that corresponds with the joint strip, then insert the T type inslot that corresponds with heat conduction adhesive tape, accomplish the installation back of light source again with the joint between mount and the support, encapsulate the operation at last, can effectual reduction glue solution invasion, the packaging effect is better.

Description

SMD ultra-thin heat dissipation highlight lamp pearl panel

Technical Field

The utility model relates to a lamp pearl panel technical field specifically is bright lamp pearl panel of SMD ultra-thin heat dissipation height.

Background

The panel light is as indoor lighting lamps and lanterns, in order to reach the luminance demand of illumination, inside is equipped with a large amount of LED chips densely, it is well known that, the LED chip only has the electric energy of a small part to turn into light energy at the in-process of work, then most electric energy turns into heat energy, that is to say that the LED chip can produce a large amount of heats when luminous, when a large amount of LED chips are installed together densely, often can cause the heat to concentrate, cause the LED chip to be in the high temperature state, seriously influence luminous efficiency and life.

For example, chinese patent No. CN204328528U discloses a high brightness LED panel lamp with good heat dissipation performance, which includes: the LED lamp comprises a back plate, an ultrathin sponge cushion, reflective paper, a light guide plate, a diffusion plate, a light source substrate with LED lamp beads and an aluminum alloy frame; the aluminum alloy frame is provided with rectangular grooves, and the light source substrate with the LED lamp beads is fixed in the rectangular grooves on two sides of the aluminum alloy frame.

However, the above scheme has the following disadvantages:

in the above patent document, only a COB packaging mode is adopted, and the LED lamp bead is directly packaged on the light source substrate, but when the glue is too much in the packaging process, the glue overflows into the element part, so that the circuit, the element and the glue are subjected to chemical reaction, and the service life of the element is damaged.

Therefore, an SMD ultra-thin heat dissipation highlight lamp bead panel is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a bright lamp pearl panel of SMD ultra-thin heat dissipation height to solve the problem of proposing in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the SMD ultrathin heat dissipation highlight lamp bead panel comprises a base plate, wherein a mounting hole is formed in the edge part of the front face of the base plate, a step opening is formed in the base plate, a mounting rubber strip is inserted into the step opening, and an anti-glue-overflow groove is formed in one end, inserted into the step opening, of the mounting rubber strip;

be provided with the support on the base plate, the bottom both sides of support are provided with the joint strip, the joint strip inserts the anti-overflow glue inslot that corresponds, be equipped with the groove in the support, the inner wall both sides in groove of cup are provided with first pad and second pad respectively, be provided with first lamp pearl on the first pad, be provided with second lamp pearl on the second pad, the inslot of cup is located and is provided with the insulating strip between first pad and the second pad, support and insulating strip are PCT plastic material.

A T-shaped groove is formed in the substrate, and a heat conducting adhesive tape is inserted into the T-shaped groove.

The cup groove is round step groove structure, and the hole angle in cup groove is 30 degrees, the inner wall upper portion in cup groove is equipped with positioning groove, the interpolation in cup groove is equipped with the mount, the lower part both sides of mount all are provided with the fixture block, the fixture block inserts in the positioning groove who corresponds.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses lamp pearl on to the base plate goes on before cob encapsulation, through in inserting the step mouth with the mounting strip in advance, then insert the anti-overflow glue inslot that corresponds with the joint strip, then insert the T type inslot that corresponds with the heat conduction adhesive tape, accomplish the shutoff of base plate and the installation of support, then will weld first lamp pearl on first pad and the second lamp pearl of welding on the second pad and pass through the lead wire and establish ties, the lead wire concatenates on the circuit of base plate, at last with joint between mount and the support, then encapsulate the operation, can effectual reduction glue solution invade, the encapsulation effect is better, and can obstruct steam, ensure the gas tightness in lamp source.

Drawings

Fig. 1 is a schematic top view of a substrate according to the present invention;

fig. 2 is a schematic top view of the bracket of the present invention;

FIG. 3 is a schematic view of a top-down cutting structure of the bracket of the present invention;

FIG. 4 is a front view of the bracket of the present invention;

fig. 5 is an enlarged schematic view of fig. 4 at a according to the present invention.

In the figure: 1. a substrate; 2. a step opening; 3. mounting an adhesive tape; 4. an anti-overflow glue groove; 5. a support; 50. a cup slot; 51. positioning the clamping groove; 52. a fixed mount; 53. a clamping block; 55. a clamping strip; 6. a first pad; 61. a first lamp bead; 7. a second pad; 71. a second lamp bead; 8. an insulating strip; 9. a T-shaped groove; 10. a heat conducting adhesive tape; 11. and (7) installing holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: the SMD ultrathin heat dissipation highlight lamp bead panel comprises a base plate 1, wherein the base plate 1 is made of a copper plate material, a mounting hole 11 is formed in the edge part of the front face of the base plate 1, a step opening 2 is formed in the base plate 1, a mounting rubber strip 3 is inserted into the step opening 2, and an anti-overflow rubber groove 4 is formed in one end, inserted into the step opening 2, of the mounting rubber strip 3;

the support 5 is connected to the substrate 1 in an adhering mode through sealant, clamping strips 55 are arranged on two sides of the bottom end of the support 5, the support 5 and the clamping strips 55 are an injection-molded integrated piece, the clamping strips 55 are inserted into corresponding anti-overflow glue grooves 4 in a sliding mode, cup grooves 50 are formed in the support 5, the left side and the right side of the inner wall of each cup groove 50 are connected with a first pad 6 and a second pad 7 in an adhering mode respectively, the area of each first pad 6 is larger than that of each second pad 7, each first bead 61 is welded on each first pad 6, each second bead 71 is welded on each second pad 7, the anodes and the cathodes of the second beads 71 and the anodes of the first beads 61 are connected in series through leads and connected to a circuit of the substrate 1 in series through leads, the substrate 1 can be started by using higher power, the heat dissipation effect is better, an insulating strip 8 is arranged between the first pads 6 and the second pads 7 in the cup grooves 50, the support 5 and the insulating strip 8 are both made of plastic materials, the support 5 and the insulating strip 8 are the injection-molded integrated piece, a T-shaped groove 8978 zxft-shaped groove 899 is provided with a heat-shaped groove 8910 for heat-conducting strip for conducting heat-conducting of a heat-conducting panel, and a heat-conducting panel;

cup slot 50 is circular step groove structure, and cup slot 50's hole angle is 30 degrees, the cup type of the circular shape lamp pearl of cooperation, it is more even that the cooperation lens are luminous, light spreads out more evenly, cup slot 50's inner wall upper portion is equipped with positioning groove 51, cup slot 50's interpolation is equipped with mount 52, mount 52 is circle structure under the top, its lower part ring inserts in cup slot 50's the upper portion circular slot, mount 52's the left and right sides lower part both sides all are provided with fixture block 53, mount 52 and fixture block 53 are for moulding plastics an organic whole, fixture block 53 sliding insertion corresponds in positioning groove 51.

The working principle of the embodiment is as follows: before carrying out cob encapsulation to the lamp pearl on the base plate 1, through in inserting step mouth 2 with installation adhesive tape 3 in advance, then insert the anti-overflow gluey groove 4 that corresponds with joint strip 55, then insert corresponding T type inslot 9 with heat conduction adhesive tape 10, accomplish the shutoff of base plate 1 and support 5's installation, then will weld first lamp pearl 61 on first pad 6 and the second lamp pearl 71 of welding on second pad 7 and establish ties through the lead wire, the lead wire concatenates on base plate 1's circuit, at last with the joint between mount 52 and the support 5, then encapsulate the operation, can effectual reduction glue solution invasion, the encapsulation effect is better, and can hinder steam, ensure the gas tightness in lamp source.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1.SMD ultra-thin heat dissipation highlight lamp pearl panel, including base plate (1), its characterized in that: be equipped with step mouth (2) on base plate (1), step mouth (2) interpolation is equipped with installation adhesive tape (3), the one end that installation adhesive tape (3) inserted step mouth (2) is equipped with anti-overflow gluey groove (4), be provided with support (5) on base plate (1), the bottom both sides of support (5) are provided with joint strip (55), joint strip (55) insert in anti-overflow gluey groove (4) that correspond, be equipped with cup groove (50) in support (5), the inner wall both sides in cup groove (50) are provided with first pad (6) and second pad (7) respectively, be provided with first lamp pearl (61) on first pad (6), be provided with second lamp pearl (71) on second pad (7), it is provided with insulating strip (8) to be located between first pad (6) and second pad (7) in cup groove (50).

2. The SMD ultra-thin heat dissipation highlight lamp pearl panel of claim 1, characterized in that: the heat-conducting LED lamp is characterized in that a T-shaped groove (9) is formed in the substrate (1), and a heat-conducting adhesive tape (10) is inserted into the T-shaped groove (9).

3. The SMD ultra-thin heat dissipation highlight lamp pearl panel of claim 1, characterized in that: the cup is characterized in that a positioning clamping groove (51) is formed in the upper portion of the inner wall of the cup groove (50), a fixing frame (52) is inserted into the cup groove (50), clamping blocks (53) are arranged on two sides of the lower portion of the fixing frame (52), and the clamping blocks (53) are inserted into the corresponding positioning clamping grooves (51).

4. The SMD ultra-thin heat dissipation highlight lamp pearl panel of claim 1, characterized in that: the bracket (5) and the insulating strip (8) are both made of PCT plastic materials.

5. The SMD ultra-thin heat dissipation highlight lamp pearl panel of claim 1, characterized in that: the edge part of the front surface of the substrate (1) is provided with a mounting hole (11).

6. The SMD ultra-thin heat dissipation highlight lamp pearl panel of claim 1, characterized in that: the cup groove (50) is of a circular step groove structure, and the inner hole angle of the cup groove (50) is 30 degrees.