CN216775312U

CN216775312U - Heat dissipation framework of vehicle-mounted power supply large-current control switch

Info

Publication number: CN216775312U
Application number: CN202122333934.5U
Authority: CN
Inventors: 葛莹
Original assignee: Ruilian Automotive Electronics Wuhu Co ltd
Current assignee: Ruilian Automotive Electronics Wuhu Co ltd
Priority date: 2021-09-26
Filing date: 2021-09-26
Publication date: 2022-06-17
Anticipated expiration: 2031-09-26

Abstract

The utility model provides a heat dissipation structure of a large-current control switch of a vehicle-mounted power supply, which relates to the field of automobiles and comprises an upper cover and a lower cover matched with the upper cover; the PCB is used for being mounted inside the lower cover, a mounting area for mounting heating components is arranged on the lower surface of the PCB, heat conduction holes are formed in the mounting area, and the heat conduction holes penetrate through the upper surface and the lower surface of the PCB; the heat conducting fins are used for being mounted on the upper surface of the PCB and cover all the heat conducting holes, and when the upper cover is mounted on the lower cover, the heat conducting fins are in contact with the upper side surface inside the upper cover. Because heating element installs the lower surface at the PCB board, and the conducting strip is installed at the upper surface of PCB, so heating element's high nonconformity can not influence the area of contact and the contact thickness of conducting strip and metal casing, and each heating element's radiating efficiency can keep unanimous basically, and the heat that heating element sent passes through the heat conduction hole after, is transmitted to the upper cover by the conducting strip to derive the heat.

Description

Heat dissipation framework of vehicle-mounted power supply large-current control switch

Technical Field

The utility model relates to the field of automobiles, in particular to a heat dissipation framework of a large-current control switch of a vehicle-mounted power supply.

Background

Along with the development of new energy automobile to intellectuality, this function of autopilot technique also more and more extensively is used, when the autopilot grade reaches more than L2 level, it is required that on-vehicle power management switch satisfies relevant function safety level requirement, because power management switch is the spare part whether monitoring and control whole car electric current are normal, itself can pass through 210A's heavy current, thereby produce great calorific capacity, traditional heat dissipation framework is that the heat dissipation of certain components and parts on the PCB board all directly pastes the heat conduction material (have the thermal grease or the radiating pad) on the components and parts usually, then the metal casing is derived the heat again, make the hot gas flow transfer to the external world from the direction of gravity. The applicant found that: in the PCB, only a single component or components with the same height are arranged, the traditional heat dissipation framework can play a good heat dissipation effect, in practice, the components on the PCB are different in height, if the thicknesses of heat conduction materials are the same, the components with the higher height can be in full contact with the heat conduction materials, and the components with the lower height cannot be in contact with the heat conduction materials, so that the heat dissipation effect is poor; if to components and parts of different heights, the shorter heating components and parts of height need paste the thicker heat conduction material of thickness, learn by the more thick basic physics principle that heat conductivity is poor more of same material thickness, short heating components and parts heat transfer efficiency can worsen, so short heating components and parts heat dissipation probably effect can not reach the expectation, have certain bad risk of dispelling the heat.

SUMMERY OF THE UTILITY MODEL

In view of this, one or more embodiments of the present disclosure provide a heat dissipation structure of a vehicle power supply large-current control switch, so as to solve a technical problem that a conventional heat dissipation frame in the prior art can only effectively dissipate heat for a single component or components with the same height.

In view of the above, one or more embodiments of the present specification provide a heat dissipation structure of a vehicle power supply high current control switch, including:

the upper cover and the lower cover matched with the upper cover;

the PCB is arranged in the lower cover, the lower surface of the PCB is provided with an installation area for installing a heating component, the installation area is provided with a heat conduction hole, and the heat conduction hole penetrates through the upper surface and the lower surface of the PCB;

the heat conducting fins are used for being mounted on the upper surface of the PCB and cover all the heat conducting holes, and when the upper cover is mounted on the lower cover, the heat conducting fins are in contact with the upper side surface inside the upper cover.

Further, the upper cover is made of aluminum alloy or magnesium alloy materials.

Furthermore, the insulation grade of the heat conducting sheet is greater than 7.5kv/mm, and the heat conductivity coefficient of the heat conducting sheet is greater than 5W/(m.K).

Furthermore, the heat conducting plate comprises a heat conducting block, wherein the heat conducting block corresponding to the heat conducting hole is arranged on the heat conducting plate, and the heat conducting block has elasticity.

Further, the heat conducting hole comprises a copper sheet covering the top of the heat conducting hole.

Furthermore, the copper plate comprises a copper block arranged in the heat conducting hole, and the copper block is fixed on the copper sheet.

The utility model has the beneficial effects that: by adopting the heat dissipation structure of the vehicle-mounted power supply large-current control switch, the heating components are arranged on the lower surface of the PCB, and the heat conducting sheet is arranged on the upper surface of the PCB, so that the contact area and the contact thickness between the heat conducting sheet and the metal shell cannot be influenced due to the inconsistent height of the heating components, the heat dissipation efficiency of each heating component can be basically kept consistent, and heat emitted by the heating components is transferred to the upper cover through the heat conducting sheet after passing through the heat conducting holes, so that the heat is led out.

Drawings

In order to more clearly illustrate one or more embodiments or prior art solutions of the present specification, the drawings that are needed in the description of the embodiments or prior art will be briefly described below, and it is obvious that the drawings in the following description are only one or more embodiments of the present specification, and that other drawings may be obtained by those skilled in the art without inventive effort from these drawings.

FIG. 1 is a front view of an embodiment of the present invention;

FIG. 2 is an exploded view of an embodiment of the present invention;

FIG. 3 is a first cross-sectional side view of a PCB board in accordance with an embodiment of the present invention;

fig. 4 is a side sectional view of a PCB board according to an embodiment of the utility model.

Wherein, 1, an upper cover; 2. a heat conductive sheet; 3. a heat conduction hole; 4. a PCB board; 5. a copper sheet; 6. a copper block; 7. a heat conducting block.

Detailed Description

For the purposes of this disclosure; technical solutions and advantages will be more clearly understood from the following detailed description of the present disclosure with reference to specific embodiments.

It is to be noted that unless otherwise defined, technical or scientific terms used in one or more embodiments of the present specification should have the ordinary meaning as understood by those of ordinary skill in the art to which this disclosure belongs. "first" as used in one or more embodiments of the present specification; "second" and similar words do not denote any order; quantity or importance, but merely to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up"; "Down"; "left"; "right" and the like are used only to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may also be changed accordingly.

In view of the above object, a first aspect of the present invention provides an embodiment of a heat dissipation structure of a vehicle power supply large current control switch, as shown in fig. 1, 2, 3, and 4, including:

the device comprises an upper cover 1 and a lower cover matched with the upper cover 1;

the PCB board 4 is used for being installed inside the lower cover, an installation area for installing heating components is arranged on the lower surface of the PCB board 4, a heat conduction hole 3 is formed in the installation area, and the heat conduction hole 3 penetrates through the upper surface and the lower surface of the PCB board 4;

the heat conducting fin 2 is used for being installed on the upper surface of the PCB 4, the heat conducting fin 2 covers all the heat conducting holes 3, and when the upper cover 1 is installed on the lower cover, the heat conducting fin 2 is in contact with the upper side surface inside the upper cover 1.

In this embodiment, because heating element installs the lower surface at PCB board 4, and the upper surface at PCB is installed to conducting strip 2, so heating element's high nonconformity can not influence the area of contact and the contact thickness of conducting strip 2 and metal casing, and each heating element's radiating efficiency can remain unanimous basically, and the heat that heating element sent passes through behind the heat conduction hole 3, is transmitted to upper cover 1 by conducting strip 2 to derive the heat.

Here, preferably, the upper cover 1 is made of an aluminum alloy or a magnesium alloy material, so that the heat dissipation effect is better.

In addition, in order to further improve the heat dissipation effect, the insulation grade of the heat conduction sheet 2 is greater than 7.5kv/mm, and the heat conductivity of the heat conduction sheet 2 is greater than 5W/(m · K).

As an embodiment, as shown in fig. 4, the heat conducting block 7 is included, the heat conducting sheet 2 is provided with the heat conducting block 7 corresponding to the heat conducting hole 3, the heat conducting block 7 has elasticity, here, the height of the heat conducting block 7 is preferably slightly larger than the height of the heat conducting hole 3, after the upper cover 1 and the lower cover are combined, the heat conducting block 7 will be fully contacted with the heating component, and the heat conducting effect is better.

In addition, as shown in fig. 3, a copper sheet 5 covering the top of the heat conduction hole 3 can be included. Further, the heat conducting device comprises a copper block 6 arranged in the heat conducting hole 3, and the copper block 6 is fixed on the copper sheet 5. This is all to improve the heat transfer effect.

It is intended that the embodiment or embodiments of this specification cover all such alternatives as fall within the broad scope of the appended claims; modifications and variations. Accordingly, any omissions may be made that are within the spirit and principles of one or more embodiments of the present description; modifying; equivalents are substituted; modifications, etc., are intended to be included within the scope of the present disclosure.

Claims

1. The utility model provides a heat dissipation framework of vehicle mounted power supply heavy current control switch which characterized in that includes:

the upper cover and the lower cover matched with the upper cover;

the PCB is used for being mounted inside the lower cover, a mounting area for mounting a heating component is arranged on the lower surface of the PCB, a heat conduction hole is formed in the mounting area, and the heat conduction hole penetrates through the upper surface and the lower surface of the PCB;

2. The heat dissipation structure of the large-current control switch of the vehicle-mounted power supply according to claim 1, wherein the upper cover is made of aluminum alloy or magnesium alloy.

3. The heat dissipation structure of the vehicle power supply large current control switch as claimed in claim 1, wherein the insulation grade of the heat conducting sheet is greater than 7.5kv/mm, and the heat conductivity coefficient of the heat conducting sheet is greater than 5W/(m-K).

4. The heat dissipation structure of the large current control switch of the vehicle power supply according to claim 3, comprising a heat conduction block, wherein the heat conduction sheet is provided with the heat conduction block corresponding to the heat conduction hole, and the heat conduction block has elasticity.

5. The heat dissipation structure of the large-current control switch of the vehicle power supply according to claim 3, comprising a copper sheet covering the top of the heat conduction hole.

6. The heat dissipation structure of the large-current control switch of the vehicle-mounted power supply according to claim 5, comprising a copper block disposed in the heat conduction hole, wherein the copper block is fixed to the copper sheet.