CN216751694U

CN216751694U - Resonator package and oscillator

Info

Publication number: CN216751694U
Application number: CN202121476738.7U
Authority: CN
Inventors: 伍伟; 王锦辉; 李�浩; 苏宏良
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-04-23
Filing date: 2021-06-30
Publication date: 2022-06-14
Anticipated expiration: 2031-06-30
Also published as: WO2022222570A1; CN115242209A

Abstract

The application discloses syntonizer packaging body and oscillator belongs to the temperature control technical field of syntonizer. The resonator package comprises a first shell, a resonator, at least one first heater and at least one second heater; the resonator, the at least one first heater, and the at least one second heater are all located in the first housing; the at least one first heater is fixed to the resonator, and the at least one second heater is fixed to the first housing. By adopting the resonator packaging body, the first heater and the second heater are used for heating the resonator, so that the temperature of the resonator can be maintained at the target temperature as much as possible, and the stability of the frequency of the oscillator can be improved.

Description

Resonator package and oscillator

The present application claims priority from chinese patent application No. 202110441947.6 entitled "a clock oscillator" filed on 23/04/2021, the entire contents of which are incorporated herein by reference.

Technical Field

The application relates to the technical field of temperature control of resonators, in particular to a resonator packaging body and an oscillator.

Background

An oscillator is a device used to generate a repetitive electrical signal, typically a periodic sine wave or square wave electrical signal.

The oscillator mainly comprises a shell, a chip and a resonator packaging body in structure, wherein the chip and the resonator packaging body are both positioned in the shell. The resonator in the resonator package is the core component of the oscillator for generating an electrical signal at a specific frequency, and the chip has integrated therein a circuit for controlling the resonator.

However, the frequency of the electrical signal generated by the resonator package is affected by temperature, and when the temperature of the resonator deviates from the target temperature more, the stability of the frequency of the electrical signal output from the oscillator is poor.

SUMMERY OF THE UTILITY MODEL

The application provides a resonator packaging body and oscillator, can alleviate the problem of the temperature deviation target temperature of resonator among the correlation technique, technical scheme is as follows:

in one aspect, a resonator package is provided that includes a first housing, a resonator, at least one first heater, and at least one second heater;

the resonator, the at least one first heater, and the at least one second heater are all located in the first housing;

the at least one first heater is fixed to the resonator, and the at least one second heater is fixed to a wall of the first housing.

According to the scheme, the first heater and the second heater are arranged in the resonator packaging body and used for heating the environment where the resonator is located, the temperature difference between the temperature of the resonator and the target temperature can be reduced, the temperature of the resonator can be enabled to reach the target temperature, and then the stability of the frequency of the electric signal output outwards by the oscillator where the resonator packaging body is located can be improved.

Further, since the first heater is in contact with the resonator, most of the heat can be transferred to the resonator, and the second heater is in contact with the first housing, thereby heating the resonator. Therefore, the difference between the temperature of the resonator and the temperature of the first shell can be reduced, the heat absorbed by the first shell from the first heater or the resonator is reduced, the efficiency of heating the resonator is further improved, and the temperature of the resonator can be quickly increased to the target temperature.

In one possible implementation, the at least one second heater is located on an inner surface of the first housing.

In one possible implementation, the at least one second heater is embedded in a wall of the first housing.

In one possible implementation, the first heater includes a support beam and a heating portion, one end of the support beam is fixed to a wall of the first housing, the other end of the support beam is fixed to the heating portion, and the heating portion is fixed to the resonator;

the second heater is in close proximity or in contact with a connection of the support beam and the first housing.

In the solution shown in the present application, since there is a connection between the first heater and the first housing, the heat of the first heater is easily conducted through the connection. Accordingly, in order to reduce the heat conduction between the first heater and the first housing, the second heater may be close to or in contact with a joint between the support beam of the first heater and the first housing, so that the second heater heats the joint, the temperature of the joint is increased, and the temperature difference between the joint and the first heater is reduced, so that the heat conduction between the joint and the first heater is reduced, so that most of the heat generated by the first heater is conducted to the resonator to heat the resonator, thereby enabling the temperature of the resonator to approach or reach the target temperature, and enabling the temperature of the resonator to approach or reach the target temperature more quickly.

In one possible implementation, the heating temperature of the second heater is lower than the heating temperature of the first heater.

In the solution shown in the present application, if the heating temperature of the second heater is equal to or even higher than the heating temperature of the first heater, it may happen that the temperature in the first housing is already heated to a relatively high level (e.g., close to the target temperature) by the second heater, and then the second heater further heats the resonator, and it is relatively easy to heat the temperature of the resonator to a level higher than the target temperature.

On the other hand, if the heating temperature of the second heater is lower than the heating temperature of the first heater, since the maximum heating temperature of the second heater is lower than the target temperature, it is difficult for the second heater to heat the temperature of the first housing to be close to the target temperature, so that the first heater further heats the resonator, but it is not easy to heat the temperature of the resonator to be higher than the target temperature.

In one possible implementation, the resonator package further includes at least one third heater;

the at least one third heater is located outside the first housing and is fixed to an outer surface of the first housing.

In the scheme shown in the application, because the first shell of the resonator packaging body is easily influenced by the temperature of the external environment, the heat of the first shell is easily absorbed by the environment, and in order to weaken the heat dissipation of the first shell, the outer surface of the first shell is also fixed with a heater, for example, at least one third heater is fixed, and the outer surface of the first shell is heated by the third heater.

Thus, the first heater mainly heats the resonator, the second heater mainly heats the joint of the first heater and the first shell to raise the temperature of the joint and reduce the absorption of more heat from the first heater at the joint, and the third heater mainly heats the whole first shell to raise the temperature of the first shell and weaken the influence of the temperature of the external environment on the first shell, so that the resonator in the first shell can reach and maintain the target temperature.

In one possible implementation, a heat conducting layer is laid between the third heater and the first housing.

The scheme shown in the application can promote the temperature of the third heater to be absorbed by the first shell quickly, and can ensure that the heat generated by the third heater can be conducted to the first shell quickly and uniformly.

In one possible implementation, the heating temperature of the third heater is lower than the heating temperature of the second heater.

According to the scheme, the heating temperature of the third heater is lower than that of the second heater, so that the situation that the temperature of the resonator exceeds the target temperature can be reduced or even avoided.

In one possible implementation, the resonator package further includes at least one second case;

the at least one second shell and the first shell are sequentially arranged from an outer layer to an inner layer, and the first shell is located on the innermost layer.

In the embodiment shown in the present application, the number of the second housings is one, and then the first housing is located in the second housing. For another example, the number of the second housings is multiple, and then the first housing and the multiple second housings are sequentially arranged from the inner layer to the outer layer, and the first housing is located at the innermost layer. The plurality of second housings serve to keep the first housing warm.

In one possible implementation, the resonator package further includes at least one fourth heater;

the fourth heater is fixed on the outer surface of at least one second shell.

In the scheme shown in the application, the second shell is also fixedly provided with at least one fourth heater, so that the second shell has the heat preservation function and also has the function of heating the first shell.

In a possible realization, the inner surface of at least one of the second housings is laid with a heat radiating layer.

The scheme shown in this application, the heat radiation layer is arranged in accelerating the temperature transfer to the cavity of second casing on the conch wall of second casing to improve the inside temperature of second casing, reduce the difference in temperature between second casing and the first casing, reduce the second casing and absorb the too much heat of first casing. Thereby maintaining the first housing in a constant temperature state as much as possible. And once the first housing is maintained in a constant temperature state, it is also advantageous to maintain the resonator in a constant temperature state.

In a possible implementation manner, at least one of the second shells has a heat resistance pad on the inner side, and the heat resistance pad is positioned at the joint of the second shell and the first shell or at the joint of the two second shells.

According to the scheme, the heat resistance pad is arranged between the fixing column of the second shell adjacent to the first shell and the first shell, so that heat can be reduced from being transferred to the second shell through the fixing column, and the first shell can be kept stable as much as possible.

In one possible implementation, the heating temperature of the fourth heater fixed on the outer surface of the at least one second housing increases from the outer layer to the inner layer and is lower than the heating temperature of the second heater.

The scheme shown in the application can reduce or even avoid the situation that the temperature of the resonator exceeds the target temperature.

In one possible implementation, the resonator package further includes a first temperature sensor fixed in the first housing;

the side parts of the resonator are respectively fixed with the first temperature sensor and the first heater, so that the resonator is suspended in the cavity of the first shell through the support of the first temperature sensor and the first heater.

According to the scheme shown in the application, the first temperature sensor located in the first shell can be used for monitoring the temperature of the resonator and can also be used for fixing the resonator, correspondingly, the first temperature sensor and the first heater are both fixed with the shell wall of the first shell, and the side part of the resonator is respectively fixed with the first temperature sensor and the first heater, so that the resonator is suspended in the cavity of the first shell through the support of the first temperature sensor and the first heater.

In another aspect, an oscillator is provided, which includes a housing, a chip, and the resonator package;

the chip and the resonator package are both located in the housing;

the chip is electrically connected to the resonator, the first heater, and the second heater, respectively.

In the resonator package of the oscillator, the first heater and the second heater heat the environment where the resonator is located, so that the temperature of the resonator can be maintained at a target temperature as much as possible, and the stability of the frequency of the electric signal output to the outside by the oscillator where the resonator package is located can be improved.

In a possible implementation manner, the chip comprises an oscillation circuit, a fractional-n pll FPLL circuit, a temperature control circuit and a temperature compensation circuit;

the oscillation circuit is electrically connected with the resonator and the FPLL circuit respectively;

the temperature control circuit is electrically connected with the first heater and the second heater respectively;

the temperature compensation circuit is electrically connected to the oscillation circuit or the FPLL circuit.

According to the scheme, the temperature compensation circuit can be electrically connected with the oscillation circuit, and the temperature compensation circuit adjusts parameters in the oscillation circuit based on the deviation between the temperature of the resonator and the target temperature so that the oscillator outputs an electric signal with relatively stable frequency outwards.

Alternatively, the temperature compensation circuit may be electrically connected to the FPLL circuit, and the temperature compensation circuit adjusts a parameter in the FPLL circuit based on a deviation between the temperature of the resonator and a target temperature, so that the oscillator outputs an electrical signal with a relatively stable frequency to the outside.

Drawings

Fig. 1 is a schematic structural diagram of an oscillator provided in the present application;

fig. 2 is a schematic structural diagram of a resonator package provided in the present application;

fig. 3 is a schematic structural diagram of a resonator package provided in the present application;

fig. 4 is a schematic structural diagram of a resonator package provided in the present application;

fig. 5 is a schematic structural diagram of a resonator package provided in the present application;

fig. 6 is a schematic structural diagram of a resonator package provided in the present application;

fig. 7 is a schematic structural diagram of a resonator package provided in the present application;

fig. 8 is a schematic structural diagram of a resonator package provided in the present application;

fig. 9 is a schematic structural diagram of a resonator package provided in the present application;

fig. 10 is a schematic structural diagram of a resonator package provided in the present application;

fig. 11 is a schematic structural diagram of a resonator package provided in the present application;

fig. 12 is a schematic structural diagram of a resonator package provided in the present application;

FIG. 13 is a schematic diagram of the internal circuit connections of an oscillator provided herein;

FIG. 14 is a schematic diagram of the internal circuit connections of an oscillator provided herein;

FIG. 15 is a schematic diagram of the internal circuit connections of an oscillator provided herein;

fig. 16 is a schematic structural diagram of an oscillator provided in the present application.

Description of the figures

1. A first housing; 101. a substrate; 1011. a first groove; 102. an upper cover; 1021. a second groove;

2. a resonator; 21. a resonance member; 22. connecting columns; 23. a connecting frame;

3. a first heater; 4. a second heater; 5. a third heater; 6. a heat conductive layer;

7. a second housing; 701. a heat radiation layer; 702. fixing a column; 703. a first substrate; 704. a first package case;

8. a fourth heater; 9. a heat resistant pad;

10. a first temperature sensor; 11. a second temperature sensor; 12. a third temperature sensor;

100. a housing; 200. a chip; 300. a resonator package;

110. a second substrate; 120. a second package housing;

201. an oscillation circuit; 202. an FPLL circuit; 203. a temperature control circuit;

2031. a first temperature control circuit; 2032. a second temperature control circuit; 2033. a third temperature control circuit; 2034. and a fourth temperature control circuit.

Detailed Description

The embodiment of the application provides a resonator packaging body, which is a device for packaging a resonator, wherein the resonator is a device for realizing electrical frequency selection by utilizing sound wave resonance.

When a pressure is applied to the resonator, the resonator generates a voltage, which may be referred to as a piezoelectric effect, and when a voltage is applied to the resonator, the resonator undergoes a slight deformation, which may be referred to as a converse piezoelectric effect.

The principle that the resonator realizes electrical frequency selection through acoustic wave resonance may be that resonance is also called resonance, which is a phenomenon that when the vibration frequency of an object is the same as or close to the natural frequency of the object, the amplitude of the object increases sharply, and the frequency when resonance occurs may be called resonance frequency. Then, when the resonator vibrates under the action of voltage, the vibration far away from the natural frequency is gradually attenuated, the vibration identical to or close to the fixed frequency is reserved, finally, the resonator vibrates under the resonant frequency, then, the electric signal generated under the resonant frequency is also the electric signal with the purer frequency, and further, the acoustic wave resonance realizes the electric frequency selection, so that the resonator generates the electric signal with the more stable frequency.

However, the frequency of the resonator is affected by temperature, and the sensitivity of the frequency to temperature change can be expressed by a Temperature Coefficient of Frequency (TCF), i.e., the relative average rate of change of the frequency per degree celsius rise of the temperature in a certain temperature range, which is calculated as follows:

in the formula, T₁And T₂Are all the temperature of the resonator, f (T)₁) Is that the resonator is at a temperature T₁Frequency of time, f (T)₂) Is that the resonator is at a temperature T₂The frequency of the time.

The TCF is positive, which indicates that the frequency shifts in the direction of increasing frequency with increasing temperature, and the TCF is negative, which indicates that the frequency shifts in the direction of decreasing frequency with increasing temperature.

Then, in order to cause the resonator to generate an electrical signal with a stable frequency, it is necessary to make TCF as 0 as possible so that the frequency does not vary with temperature.

Here, the temperature at which TCF is 0 may be referred to as a target temperature, and then, in order to cause the resonator to generate an electric signal with a stable frequency, it is necessary to control the temperature of the resonator to be maintained at the target temperature as much as possible.

Generally, the target temperature is higher, for example, above 85 degrees celsius, and higher than the temperature of the environment in which the resonator is located, and it is necessary to raise the temperature of the environment in which the resonator is located, so as to control the temperature of the resonator to be as high as possible at the target temperature.

The resonator packaging body of the embodiment of the application can be used for jointly acting through a plurality of heaters, so that the temperature of the resonator is maintained in a constant temperature state of a target temperature as far as possible.

Before describing the resonator package, an oscillator to which the resonator package is applied will be briefly described, and as shown in fig. 1, the oscillator may include a case 100, a chip 200, and a resonator package 300 to be described later. The chip 200 and the resonator package 300 are both packaged in the housing 100, the resonator 2 of the resonator package 300 is electrically connected to the chip 200, an oscillation circuit is integrated in the chip 200, the oscillation circuit is electrically connected to the resonator 2, the resonator 2 can input an electrical signal to the oscillation circuit, the oscillation circuit performs some processing on the electrical signal and then outputs the electrical signal to the outside, for example, the oscillation circuit amplifies and denoises the electrical signal received from the resonator 2 and then outputs the electrical signal to the outside.

From the above, the resonator package in this embodiment controls the resonator to maintain a constant temperature state at a target temperature through a plurality of heaters, which may also be controlled by the chip 200, for example, a temperature control circuit is further integrated in the chip 200, and the temperature control circuit is used to control the heating temperature of the heater, and the specific process is described in detail below when the oscillator is introduced.

The temperature control circuit mainly controls the heating temperature of the heater through the temperature of the resonator, and the temperature control circuit can acquire the temperature of the resonator through the temperature sensor, or the temperature control circuit can reversely estimate the temperature of the resonator through the frequency output in the oscillation circuit. The embodiment does not limit the way of acquiring the temperature of the resonator by the temperature control circuit, and can be flexibly selected according to the actual situation.

Since the improved point of this solution is to heat the resonator by a plurality of heaters, and the position arrangement of the plurality of heaters, and how to reduce the temperature influence of the external environment temperature on the resonator, etc., the resonator package will be described below.

Among them, the plurality of heaters described above may include a first heater 3, a second heater 4, a third heater 5, and a fourth heater 8, which will be drawn hereinafter.

Fig. 2 is a schematic structural diagram of the resonator package, and fig. 2 is a schematic diagram taken along a thickness direction of the resonator package without mounting the upper cover.

As shown in fig. 2, the resonator package includes a first case 1, a resonator 2, at least one first heater 3, and at least one second heater 4. The resonator 2, the at least one first heater 3 and the at least one second heater 4 are all located in the first housing 1. Wherein at least one first heater 3 and the resonator 2 are fixed, and at least one second heater 4 and a wall of the first housing 1 are fixed.

In one example, the first housing 1 may include a substrate 101 and an upper cover 102, as shown in fig. 2, the substrate 101 may have a first recess 1011, the resonator 2 and the at least one first heater 3 may be located in the recess 1011, and the second heater 4 may be located outside the recess 1011 and on an upper surface of the substrate 101. As shown in fig. 3, the upper cover 102 may have a second recess 1021, the upper cover 102 covers the substrate 101, the two may be fixed by bonding, the first recess 1011 and the second recess 1021 are opposite, the resonator 2, the first heater 3, and the second heater 4 are all located in a cavity formed by the first recess 1011 and the second recess 1021, the resonator 2 is suspended in the cavity and is not in contact with a wall of the first housing 1, so as to form a thermal isolation from the first housing 1, and reduce heat transfer.

Wherein, the side of the first heater 3 may be fixed on the groove wall of the first groove 1011, the second heater 4 may be fixed on the groove wall of the second groove 1021, the bottom of the second heater 4 is fixed on the upper surface of the substrate 101, and the top of the second heater 4 is in contact with the second groove 1021, so that the second heater 4 can heat the first housing 1.

The first heater 3 and the second heater 4 are both heating devices, and the material of the heating devices can be metal, polysilicon or doped monocrystalline silicon and other materials with good joule heating characteristics.

The number of the first heater 3 and the second heater 4 may be one or more, and the specific number of the first heater 3 and the second heater 4 is not limited in this embodiment, and may be flexibly selected according to actual situations.

For example, as shown in fig. 2, the number of the first heaters 3 may be two, and the resonator 2 is connected between the two first heaters 3. Alternatively, the number of the first heaters 3 may be two or more, and the resonator 2 is located in a space surrounded by the plurality of first heaters 3. The number of the first heaters 3 is not limited in this embodiment, and can be flexibly selected according to actual situations.

For example, as shown in fig. 2, the number of the second heaters 4 may be two, and two second heaters 4 are located at opposite sides of the position of the recess 1011. For another example, as shown in fig. 4, one second heater 4 may be provided, and the second heater 4 may have a ring-shaped structure and surround the recess 1011 of the substrate 101. In this embodiment, the number and shape of the second heaters 4 are not limited, and can be flexibly selected according to actual situations.

As shown in fig. 2, the resonator 2, the at least one first heater 3, and the at least one second heater 4 are all located in the first housing 1. Wherein the first heater 3 is mainly heated by the resonator 2, so the first heater 3 and the resonator 2 are in contact, for example, the first heater 3 and the resonator 2 are fixed. The second heater 4 mainly heats the first housing 1, and therefore, the second heater 4 is in contact with the wall of the first housing 1, for example, the second heater 4 is fixed to the wall of the first housing 1. The wall of the first housing 1 may be the substrate 101 or the upper cover 102.

It can be seen that the first heater 3 and the second heater 4 in the resonator package heat the environment in which the resonator 2 is located, and the temperature of the resonator 2 can be maintained at the target temperature as much as possible, thereby improving the stability of the frequency of the electrical signal output to the outside from the oscillator in which the resonator package is located.

Further, since the first heater 3 is in contact with the resonator 2, most of the heat can be transferred to the resonator 2 to raise the temperature of the resonator 2, and the second heater 4 is in contact with the first housing 1 to transfer most of the heat to the first housing 1. In this way, it is possible to reduce the difference between the temperature of the resonator 2 and the temperature of the first housing 1, reduce the amount of heat the first housing 1 absorbs from the first heater 3 or the resonator 2, and further improve the efficiency of heating the resonator 2, so that the temperature of the resonator 2 can be quickly raised to the target temperature.

In one example, as shown in fig. 2, the first heater 3 includes a support beam 31 and a heating portion 32, one end of the support beam 31 is fixed to a wall (e.g., a side wall) of the first housing 1, the other end is fixed to the heating portion 32, and a side portion of the heating portion 32 may be fixed to a side portion of the resonator 2. Thus, heating portion 32 of first heater 3 is suspended in first housing 1 by support beam 31, and resonator 2 is suspended in first housing 1 by first heater 3.

In one example, as shown in fig. 5, the resonator 2 may include a resonance part 21 and a connection post 22, the connection post 22 is located at a side of the resonance part 21, the connection post 22 is fixed on the heating part 32 of the first heater 3, and the resonator 2 is not in contact with both the substrate 101 and the upper cover 102 of the first housing 1.

In another example, as shown in fig. 6, the resonator 2 may include not only the resonance part 21 and the connection post 22 but also a connection frame 23, a contour shape of the connection frame 23 is adapted to a contour shape of the resonance part 21, the resonance part 21 is located in the connection frame 23, and the connection post 22 is connected between the resonance part 21 and the connection frame 23. And the outer side of the connection frame 23 is fixed to the heating part 23 of the first heater 2.

In this embodiment, the fixing manner of the resonator 2 and the first heater 3 is not limited, and can be flexibly selected according to the actual situation.

As described above, the second heater 4 is fixed to the wall of the first housing 1 for heating the first housing 1, and accordingly, as shown in fig. 2, the second heater 4 may be fixed to the upper surface of the substrate 101 of the first housing 1. Alternatively, as shown in fig. 7, the wall of the first housing 1 may have a thickness, the second heater 4 may be embedded in the wall of the first housing 1, for example, the substrate 101 may have a thickness, and the second heater 4 may be embedded in the substrate 101. Or, alternatively, the second heater 4 may be fixed to an inner surface of a wall of the first housing 1, for example, the second heater 4 may be fixed to a wall of the first recess 1011 of the substrate 101.

As shown in fig. 2, since there is a connection between the first heater 3 and the first housing 1, heat of the first heater 3 is easily conducted through the connection. Accordingly, in order to reduce the heat conduction between the first heater 3 and the first casing 1, as shown in fig. 2, the second heater 4 may be close to or in contact with the connection between the support beam 31 of the first heater 3 and the wall of the first casing 1.

Thus, since the second heater 4 is located near or in contact with the joint between the support beam 31 and the first housing 1, the second heater 4 can heat the joint, the temperature of the joint increases, the temperature difference between the joint and the first heater 3 is reduced, and the heat conduction between the joint and the first heater 3 is reduced, so that most of the heat generated by the first heater 3 is conducted to the resonator 2, and the resonator is heated, so that the temperature of the resonator 2 can approach or reach the target temperature, and the target temperature can be approached or reached more quickly.

As described above, the closer the temperature of the resonator 2 is to the target temperature, the better the stability of the frequency of the electric signal generated by the resonator 2. The maximum heating temperature of the first heater 3 may be controlled to be the target temperature or slightly less than the target temperature.

In order to reduce the temperature rise of the resonator 2 beyond the target temperature, the heating temperature of the second heater 4 is lower than the heating temperature of the first heater 3 accordingly.

For example, the maximum heating temperature of the first heater 3 is the target temperature, and the maximum heating temperature of the second heater 4 may be lower than the target temperature, and as an example, the difference between the maximum heating temperature of the first heater 3 and the maximum heating temperature of the second heater 4 may be a value between 1 and 30 degrees celsius.

Among them, the reason why the heating temperature of the second heater 4 is lower than the heating temperature of the first heater 3, and the heating can be reduced so that the temperature of the resonator is higher than the target temperature is because, if the heating temperature of the second heater 4 is equal to the heating temperature of the first heater 3, even higher than the heating temperature of the first heater 3, it may occur that the temperature inside the first housing 1 has been heated to a relatively high level (for example, close to the target temperature) by the second heater 4, and then the second heater 3 further heats the resonator 2, and it is relatively easy to heat the temperature of the resonator 2 to be higher than the target temperature.

On the other hand, if the heating temperature of the second heater 4 is lower than the heating temperature of the first heater, since the maximum heating temperature of the second heater 4 is lower than the target temperature, it is difficult for the second heater 4 to heat the temperature of the first housing 1 to be close to the target temperature, so that the first heater 3 further heats the resonator 2, but it is not easy to heat the resonator 2 to be higher than the target temperature.

In this way, by combining at least one first heater 3 and at least one second heater 4 to heat the resonator 2, with the first heater 3 being used to heat the resonator 2 and the second heater 4 being used to heat the junction of the first heater 3 and the first housing 1 on the one hand, and the entire first housing 1 on the other hand, it is possible to reduce the heat transfer between the resonator 2 and the first housing 1 and to increase the efficiency of heating the resonator 2.

Moreover, the heating temperature of the second heater 4 is lower than the heating temperature of the first heater 3, and the situation that the resonator 2 is heated to a temperature higher than the target temperature can be reduced or even avoided.

Since the first housing 1 of the resonator package is susceptible to the external ambient temperature, the heat of the first housing 1 is easily absorbed by the environment, and in order to reduce the heat dissipation of the first housing 1, correspondingly, as shown in fig. 8, the resonator package may further include at least one third heater 5, where the at least one third heater 5 is located outside the first housing 1 and fixed to the wall of the first housing 1.

The third heater 5 is a heating device similar to the first heater 3 and the second heater 4, and may be made of a material having good joule heating characteristics, such as metal, polysilicon, or doped monocrystalline silicon.

In one example, the third heater 5 may be fixed to an outer surface of the substrate 101 of the first housing 1, the third heater 5 may be fixed to an outer surface of the upper cover 102 of the first housing 1, and the third heater 5 may be fixed to both the outer surface of the substrate 101 and the outer surface of the upper cover 102.

In this way, the first heater 3 mainly heats the resonator 2, the second heater 4 heats the joint of the first heater 3 and the first housing 1 on the one hand, and the entire first housing 1 on the other hand, and the third heater 5 heats the entire first housing 1. The combination of the three heaters heats the resonator package, so that the temperature of the resonator 2 in the resonator package can approach or reach the target temperature, and the temperature can rapidly approach or reach the target temperature.

In one example, in order to promote the temperature of the third heater 5 to be quickly absorbed by the first housing 1, correspondingly, as shown in fig. 8, a heat conduction layer 6 is laid between the third heater 5 and the wall of the first housing 1 to ensure that the heat generated by the third heater 5 can be quickly and uniformly conducted to the first housing 1.

The heat conducting layer 6 may be made of silicon carbide SiC, copper, diamond, gold, silver, graphene, carbon nanotubes, or other materials with high thermal conductivity.

As shown in fig. 8, a heat conduction layer 6 may be laid on the outer surface of one of the shell walls of the first shell 1, and then the third heater 5 may be fixed on the surface of the heat conduction layer 6, so that the heat of the third heater 5 may be quickly and uniformly conducted to the first shell 1 through the heat conduction layer 6 due to the higher heat conductivity coefficient of the heat conduction layer 6 and the larger area of the heat conduction layer 6.

Alternatively, the heat conduction layer 6 may be laid on the entire outer surface of the first casing 1 to make the temperature of the first casing 1 uniform. In this embodiment, whether the heat conduction layer 6 is laid on the surface of the first casing 1 corresponding to the third heater 5 or the heat conduction layer 6 is laid on the entire outer surface of the first casing 1 is not limited, and the heat conduction layer can be flexibly selected according to actual conditions.

Regarding the heating temperature of the third heater 5, the heating temperature thereof may be lower than the heating temperature of the second heater 4, wherein the difference between the maximum heating temperature of the second heater 4 and the maximum heating temperature of the third heater 5 may be between 1 and 30 degrees celsius. The heating temperature of the third heater 5 is lower than that of the second heater 4, and the situation that the temperature of the resonator 2 exceeds the target temperature can be reduced or even avoided.

As can be seen from the above, the resonator package includes three heaters, i.e., a first heater 3, a second heater 4 and a third heater 5, the first heater 3 mainly heats the resonator 2, the second heater 4 and the third heater 5 mainly heat the first housing 1, the second heater 4 is located on the inner surface of the first housing 1 or embedded in the wall of the first housing 1, and the third heater is located on the outer surface of the first housing 1.

The second heater 4 is arranged inside the first shell 1 for heating, and the third heater 5 is arranged outside the first shell 1 for heating, so that even if the external environment of the first shell 1 absorbs more heat of the first shell 1, the first shell 1 is heated by the inside and the outside of the second heater 4 and the third heater 5, and the heat dissipation capacity of the first shell 1 can be reduced. And once the heat dissipation amount of the first housing 1 is reduced less, the heat absorption amount of the first housing 1 from the resonator 2 can also be reduced, reducing the heat transfer between the first housing 1 and the resonator 2. Therefore, by heating the resonator 2 by combining the three types of heaters, the efficiency of heating the resonator 2 can be improved, the temperature of the resonator 2 can be quickly brought to the target temperature, and the resonator 2 can be maintained in a constant temperature state at the target temperature.

Moreover, the heating temperatures of the third heater 5, the second heater 4, and the first heater 3 are sequentially increased, and the maximum heating temperature of the first heater 3 is the target temperature, so that it is possible to reduce or even avoid the situation in which the temperature of the resonator 2 exceeds the target temperature.

In order to further reduce the temperature of the first housing 1 absorbed by the external environment, as shown in fig. 9, the resonator package may further include at least one second housing 7, where the material of the second housing 7 may be metal or ceramic, which is not limited in this embodiment.

For example, the number of the second housings 7 is one, and then the first housing 1 is located in the second housing 7. For another example, the number of the second housings 7 is plural, and then the first housing 1 and the plural second housings 7 are arranged in sequence from the inner layer to the outer layer, and the first housing 1 is located at the innermost layer.

The number of the second housings 7 is not limited in this embodiment, and may be flexibly selected according to actual situations, and a single second housing 7 may be used as an example in the drawing of this embodiment.

In one example, if the bottom outer surface of the first casing 1 and the bottom inner surface of the second casing 7 are in contact, the contact area therebetween is large, and the heat transfer therebetween is fast.

Then, in order to reduce the heat transfer between the first casing 1 and the second casing 7, as shown in fig. 9, the inner side of the second casing 7 adjacent to the first casing 1 is provided with a plurality of fixing posts 702, and the first casing 1 is fixed to the fixing posts 702, so that the contact area between the first casing 1 and the second casing 7 can be reduced, and the heat transfer therebetween can be reduced. Similarly, for the two adjacent second housings 7, the inner side of the outer second housing 7 also has a plurality of fixing posts 702, and the inner second housing 7 is fixed to the fixing posts 702 to reduce heat transfer between the two second housings 7.

Another function of the fixing post 702 of the second housing 7 is that, since the wall of the second housing 7 is relatively thin and is difficult to be fixed by the first housing 1 or the second housing 7 inside, a mounting hole may be provided in the fixing post 702 for fixing the first housing 1 or the second housing 7 inside.

In order to further reduce the heat transfer between the first casing 1 and the second casing 7 and between two adjacent second casings 7, correspondingly, as shown in fig. 9, at least one second casing 7 has a heat blocking pad 9 on the inner side, and the heat blocking pad 9 is located at the joint of the second casing 7 and the first casing 1 or at the joint of two second casings 7.

The heat-resistant pad 9 may be made of polymer or polymer compound material such as silica gel, rubber or polycarbonate, or may be made of nanofiber aerogel.

For example, a heat-resistant pad 9 is provided between the fixing post 702 of the second housing 7 adjacent to the first housing 1 and the first housing 1 to reduce heat transfer from the fixing post 702 to the second housing 7, so that the first housing 1 is kept as stable as possible.

As described above, in the resonator package, the first heater 3, the second heater 4, and the third heater 5 are combined to heat the resonator 2, and the at least one second case 7 is used to keep the resonator 2 warm, so that the influence of the external environment temperature of the first case 1 on the first case 1 can be reduced, the heat absorption amount of the external environment temperature on the first case 1 can be reduced, and the heat preservation effect of the first case 1 can be enhanced. Once the heat insulating effect of the first housing 1 is good, the temperature of the resonator 2 in the first housing 1 can be caused to be maintained in a constant temperature state at the target temperature.

In an example, the second housing 7 may also be heated by a heater to reduce heat dissipation, and accordingly, as shown in fig. 9, the resonator package may further include at least one fourth heater 8; a fourth heater 8 is fixed to an outer surface of the at least one second housing 7.

As described above, the number of the second housing 7 is one or more, and if one, at least one fourth heater 8 may be fixed to the outer surface of the second housing 7. The second casing 7 has not only a heat retaining function but also a function of heating the first casing 1 so that the first casing 1 can maintain a constant temperature state.

If the number of the second housings 7 is plural, at least one fourth heater 8 may be fixed to an outer surface of a part of the second housings 7 among the plural second housings 7, and another part of the second housings 7 may not be fixed to the fourth heater 8. In this way, the second housings 7 in which the fourth heaters 8 are fixed among the plurality of second housings 7 perform the functions of keeping warm and heating, and the second housings 7 in which the fourth heaters 8 are not fixed perform the function of keeping warm.

In the case that the number of the second housings 7 is multiple, at least one fourth heater 8 may be fixed to each of the multiple second housings 7, so that the multiple second housings 7 have the heat preservation and heating functions.

In this embodiment, no limitation is made on which of the fourth heaters 8 are fixed on the outer surface of the second housing 7, and the fourth heaters 8 are fixed, so that the fourth heaters can be flexibly selected according to actual situations.

In order to accelerate the rapid and uniform heat conduction of the fourth heater 8 to the second housing 7, correspondingly, a heat conducting layer 6 may also be laid between the fourth heater 8 and the fixed second housing 7 to ensure that the heat generated by the fourth heater 8 can be rapidly and uniformly conducted to the fixed second housing 7.

In order to enhance the effect of the second housing 7 for heating the first housing 1, correspondingly, as shown in fig. 7, the inner surface of at least one second housing 7 is laid with a heat radiation layer 701.

The material of the heat radiation layer 701 may be an aqueous carbon nanotube heat radiation coating, a metal oxide mixed coating such as titanium dioxide or zirconium dioxide, or the like.

For example, if the number of the second housing 7 is one, the heat radiation layer 701 may be laid on the inner surface of the second housing 7. For another example, if the number of the second housings 7 is plural, the heat radiation layer 701 may be laid on the inner surface of all the second housings 7, or the heat radiation layer 701 may be laid on the inner surface of a part of the second housings 7.

The heat radiation layer 701 is used to accelerate the temperature on the wall of the second casing 7 to be transferred to the cavity of the second casing 7, so as to increase the temperature inside the second casing 7, reduce the temperature difference between the second casing 7 and the first casing 1, and reduce the excessive heat absorption of the first casing 1 by the second casing 7. So that the first casing 1 is maintained in a constant temperature state as much as possible. Once the first housing 1 is maintained in a constant temperature state, it is also advantageous to maintain the resonator 2 in a constant temperature state.

Wherein, the heating temperature of the fourth heater 8 fixed on the outer surface of at least one second shell 7 increases from the outer layer to the inner layer and is lower than the heating temperature of the second heater 4, in particular lower than the heating temperature of the third heater 4. For example, the heating temperature of the fourth heater 8 fixed on the second housing 7 of the outer layer shown in fig. 10 is lower than the heating temperature of the fourth heater 8 fixed on the second housing 7 of the adjacent inner layer, and is lower than the heating temperature of the third heater 5, so as to reduce or even avoid the situation that the temperature of the resonator 2 exceeds the target temperature.

For example, the heating temperatures of the fourth heaters 8 fixed on different second shells 7 are different, and the heating temperature relationship between the fourth heaters is gradually increased from the outer layer to the inner layer, and the heating temperatures are lower than the heating temperature of the third heater 8.

It should be noted that two or more fourth heaters 8 are fixed to the same second casing 7, and then the heating temperatures of the plurality of fourth heaters 8 fixed to the same second casing 7 may be the same.

In this way, the resonator package heats the resonator 2 through the combination of the first heater 3, the second heater 4, the third heater 5 and the fourth heater 8, so that the influence of the external environment temperature on the resonator 2 can be reduced, the resonator 2 can approach or reach the target temperature, and the target temperature can be approached or reached more quickly.

As mentioned above, the temperature of the plurality of heaters of the resonator package may be monitored by temperature sensors, and accordingly, as shown in fig. 11, the resonator package further includes at least one first temperature sensor 10, and the at least one first temperature sensor 10 is located in the first housing 1.

In order to monitor the temperature at the resonator 2, the first temperature sensor 10 may be close to or in contact with the resonator 2 to accurately monitor the temperature of the resonator 2.

Since the temperature may not be uniformly distributed on the resonator 2, in order to more accurately know the temperature of the resonator 2, the number of the first temperature sensors 10 may be plural, for example, two, and the two first temperature sensors 10 may be located on two opposite sides of the resonator 2. For another example, the number of the first temperature sensors 10 is two or more, and the two or more first temperature sensors 10 are uniformly distributed around the resonator 2.

In one example, the first temperature sensor 10 located in the first housing 1 can be used not only to monitor the temperature of the resonator 2, but also to fix the resonator 2, and accordingly, as shown in fig. 11, the first temperature sensor 10 and the first heater 3 are both fixed to the wall of the first housing 1, and the side portions of the resonator 2 are fixed to the first temperature sensor 10 and the first heater 3, respectively, so that the resonator 2 is suspended in the cavity of the first housing 1 by the support of the first temperature sensor 10 and the first heater 3.

For example, if the number of the first heaters 3 is one and the number of the first temperature sensors 10 is one, the resonator 2 may be located between the first heaters 3 and the first temperature sensors 10, the connection post 22 of one side of the resonator 2 is fixed to the first heater 3, and the connection post 22 of the other side of the resonator 2 is fixed to the first temperature sensors 10.

For another example, the number of the first heaters 3 is one, the number of the first temperature sensors 10 is multiple, or the number of the first heaters 3 is multiple, or both the first heaters 3 and the first temperature sensors 10 are multiple, the number of the first temperature sensors 10 is one, and the resonator 2 may be located in a space surrounded by the first heaters 3 and the first temperature sensors 10, and suspended in the cavity of the first housing 1 via the first heaters 3 and the first temperature sensors 10, as shown in fig. 11.

As can be seen from the above, the temperature inside the first casing 1 can be monitored by the first temperature sensor 10, and the temperature outside the first casing 1 can be monitored by the second temperature sensor located outside the first casing 1. For example, as shown in fig. 12, the resonator package further includes at least one second temperature sensor 11, and the at least one second temperature sensor 11 is fixed to an outer surface of the first case 1. For example, as shown in fig. 12, the second temperature sensor 11 may be close to or in contact with the third heater 5 in order to accurately monitor the temperature of the third heater 5.

While the temperature of the fourth heater 8 may be monitored by a temperature sensor, for example, as shown in fig. 12, the resonator package further includes at least one third temperature sensor 12, and at least one third temperature sensor 12 may be fixed to the outer surface of the second housing 7 to which the fourth heater 8 is fixed. As shown in fig. 12, both the third temperature sensor 12 and the fourth heater 8 located in the same second casing 7 may be close to or in contact with each other.

Based on the above, one solution of the resonator package may be that the resonator package includes a first heater 3 and a second heater 4, the first heater 3 heats the resonator 2, the second heater 4 heats the joint between the first heater 3 and the first housing 1 and also heats the entire first housing 1, and the heating temperature of the first heater 3 is higher than the heating temperature of the second heater 4.

Another embodiment of the resonator package may be that the resonator package includes a first heater 3, a second heater 4, and a third heater 5, the first heater 3 heats the resonator 2, the second heater 4 heats the joint between the first heater 3 and the first housing 1 and also heats the entire first housing 1, and the third heater 5 heats the entire first housing 1.

Both of the above solutions are to reduce the temperature difference between the resonator 2 and the first housing 1, so as to reduce the heat transfer between the first housing 1 and the resonator 2, so that the resonator 2 can approach or reach the target temperature, and can be rapidly heated to the target temperature and maintained at the target temperature.

Another aspect of the resonator package may be that the resonator package includes a first heater 3, a second heater 4, a third heater 5, and a fourth heater 8, and the resonator package includes a first case 1 and a second case 7. The resonator 2, the first heater 3 and the second heater 4 are all enclosed in the first case 1, while the first case 1 is enclosed in the second case 7, and the fourth heater 8 is fixed to the outer surface of the second case 7. Wherein the fourth heater 8 heats the second housing 7.

In this scheme, the second housing 7 keeps the temperature of the first housing 1, reduces the influence of the ambient temperature on the first housing 1, reduces the heat dissipation of the first housing 1, and once the heat dissipation of the first housing 1 is reduced, can reduce the heat transfer between the first housing 1 and the internal resonator 2, so that the resonator 2 can approach or reach the target temperature, and is also beneficial to maintaining the resonator 2 at the target temperature.

As for the packaging method of the resonator package, a wafer level package (also referred to as a wafer level package) may be adopted, in which a wafer (waf) is used as a processing object, a plurality of resonators are simultaneously packaged, wired, tested, and the like on the wafer, and finally, the wafer is cut into individual devices. For example, the resonator concerned may be a crystal cut compensated (SC) resonator, or a crystal cut AT resonator, or the like.

The packaging mode of the resonator packaging body can also adopt MEMS technology, and the MEMS technology is that hundreds of devices can be simultaneously manufactured on one silicon chip by silicon micromachining technology, so that the production cost can be greatly reduced by batch production. The resonators involved may be, for example, MEMS resonators, such as Si-MEMS resonators, MEMS-BAW resonators, MEMS-SAW resonators, etc.

In this embodiment, the processing method for processing the resonator package is not specifically limited, and may be flexibly selected according to the situation.

In the aspect of the present invention, the resonator package has the first heater and the second heater for heating the environment in which the resonator is located, so that the temperature of the resonator can be maintained at the target temperature as much as possible, and the stability of the frequency of the electrical signal output to the outside from the oscillator in which the resonator package is located can be improved.

Further, since the first heater is in contact with the resonator, most of the heat can be transferred to the resonator, and the second heater is in contact with the first housing, thereby heating the resonator. Thus, the difference between the temperature of the resonator and the temperature of the first housing can be reduced, the amount of heat absorbed by the first housing from the first heater or the resonator can be reduced, and the efficiency of heating the resonator can be improved, so that the temperature of the resonator can be rapidly increased to a target temperature.

The embodiment of the present application further provides an oscillator, as shown in fig. 1, which includes a housing 100, a chip 200, and the resonator package 300 described above. Wherein, the chip 200 and the resonator package 300 are both located in the first housing 100, and the chip 200 is electrically connected to the resonator 2, the first heater 3 and the second heater 4, respectively.

In one example, the chip 200 and the resonator 2, the first heater 3 and the second heater 4 may be electrically connected in such a manner that, as shown in fig. 1, the first case 1 of the resonator package 300 may be provided with a through hole in a thickness direction, in which a conductive medium is deposited. The first end of the through hole deposited with the conductive medium is electrically connected with the component inside the first housing 1 through a gold wire, and the second end of the through hole deposited with the conductive medium is electrically connected with the chip 200 outside the first housing 1 through a gold wire. Further, the components inside the first casing 1 and the chip 200 outside the first casing 1 are electrically connected. The number of through holes of the first housing 1 may correspond to the number of components inside the first housing 1 that need to be electrically connected to the chip 200, and the component may be any one of the resonator 2, the first heater 3, and the second heater 4.

Another way to achieve electrical connection may also be that the inner surface of the bottom of the first casing 1 has a circuit, the outer surface of the bottom has a pad, the component inside the first casing 1 is connected to the circuit on the inner surface of the bottom of the first casing 1, and the pad on the outer surface of the bottom is welded to the chip 200 outside the first casing 1, or the component inside the first casing 1 and the chip 200 outside the first casing 1 are electrically connected through a gold wire.

In the present embodiment, a specific embodiment of the electrical connection between the chip 200 and the components inside the first housing 1 is not particularly limited.

For example, the package 100 may include a substrate and a package, and after the chip 200 and the resonator package 300 are fixed on the substrate, the chip 200 and the resonator package 300 are packaged in the package such that the chip 200 and the resonator package 300 are located in the package 100 formed by the substrate and the package.

In one example, an oscillator circuit 201 and a Fractional Phase Locked Loop (FPLL) circuit 202 are integrated in the chip 200. As shown in fig. 13, the resonator 2 is electrically connected to the oscillation circuit 201, and the oscillation circuit 201 is electrically connected to the FPLL circuit 202, so that the resonator 2 transmits an electric signal to the oscillation circuit 201, the oscillation circuit 201 transmits a processed electric signal to the FPLL circuit 202, and the FPLL circuit 202 outputs the electric signal.

The oscillation circuit 201 is configured to receive the electric signal transmitted by the resonator 2 and process the electric signal, for example, amplify the electric signal and perform noise reduction processing.

The FPLL circuit 202 is a phase-locked loop circuit, and belongs to a phase error control circuit, and compares a phase difference between an input electrical signal and an electrical signal output by the oscillation circuit 201 to generate an error voltage corresponding to the phase difference between the two electrical signals, and the error voltage is processed to adjust the frequency or phase of the oscillation circuit, so that the oscillator locks a frequency and outputs the frequency, thereby improving the stability of the frequency of the electrical signal output by the oscillator.

In one example, not only the oscillation circuit 201 and the FPLL circuit 202 necessary for the oscillator but also the temperature control circuit 203 can be integrated in the chip 200. As shown in fig. 13, the temperature control circuit 203 may further include a first temperature control circuit 2031 and a second temperature control circuit 2032, the first temperature control circuit 2031 being electrically connected to the first heater 3, and the second temperature control circuit 2032 being electrically connected to the second heater 4. In this way, the first temperature control circuit 2031 can acquire the temperature from the first temperature sensor 10, generate a control signal, and control the heating temperature of the first heater 3. The second temperature control circuit 2032 may acquire a temperature from the first temperature sensor 10, generate a control signal, and control the heating temperature of the second heater 4.

Although the resonator package 300 heats the resonator 2 by the first heater 3 and the second heater 4 to maintain the resonator 2 at the target temperature as much as possible, the temperature of the resonator 2 is not completely equal to the target temperature, and the frequency output from the oscillator can be further adjusted by the compensation circuit to output a relatively stable frequency signal to the outside.

Accordingly, as shown in fig. 13, the chip 200 further includes a temperature compensation circuit 204, the temperature compensation circuit 204 may be electrically connected to the oscillation circuit 201, and the temperature compensation circuit 204 adjusts parameters in the oscillation circuit 201 based on a deviation between the temperature of the resonator 2 and the target temperature, so that the oscillator outputs an electrical signal with a relatively stable frequency to the outside.

Alternatively, the temperature compensation circuit 204 may be electrically connected to the FPLL circuit 202, and the temperature compensation circuit 204 may adjust parameters in the FPLL circuit 202 based on a deviation between the temperature of the resonator 2 and a target temperature, so that the oscillator outputs an electrical signal with a relatively stable frequency to the outside.

As described above, the third heater 5 may be fixed to the outer surface of the first housing 1, and accordingly, as shown in fig. 14, the temperature control circuit 203 may further include a third temperature control circuit 2033, and the third temperature control circuit 2033 is electrically connected to the third heater 5.

In one example, the third temperature control circuit 2033 may control the heating temperature of the third heater 5 in accordance with a control signal generated by the first temperature control circuit 2031 or the second temperature control circuit 2032. In another example, as shown in fig. 11, the temperature of the third heater 5 may be monitored by the second temperature sensor 11, and then the third temperature control circuit 2033 may acquire the temperature from the second temperature sensor 11 and generate a control signal to control the heating temperature of the third heater 5.

As described above, the resonator package may further include the fourth heater 8, and accordingly, as shown in fig. 15, the temperature control circuit 203 may further include a fourth temperature control circuit 2034, and the fourth temperature control circuit 2034 is electrically connected to the fourth heater 8.

In one example, the fourth temperature control circuit 2034 may control the heating temperature of the fourth heater 8 according to a control signal generated by the first temperature control circuit 2031, the second temperature control circuit 2032, or the third temperature control circuit 2033. In another example, as shown in fig. 12, the temperature of the fourth heater 8 may be monitored by the third temperature sensor 12, and then the fourth temperature control circuit 2034 may acquire the temperature from the third temperature sensor 12 and generate a control signal to control the heating temperature of the fourth heater 8.

It should be noted that the first temperature control circuit 2031, the second temperature control circuit 2032, the third temperature control circuit 2033, and the fourth temperature control circuit 2034 may control the temperature of the corresponding heaters by using a table look-up control method, or may also control the temperature of the corresponding heaters by using a proportional-integral-derivative (PID) control method. The PID control method is to constitute control deviation based on the given value and the actual output value, and to linearly combine the deviation in proportion, integral and derivative to constitute control amount for controlling the controlled object, such as the temperature of the heater.

In an example, in a case where the resonator package includes the second housing 7, considering that devices located inside the second housing 7, such as the resonator 2, the first heater 3, the second heater 4, the third heater 5, the first temperature sensor 10, and the second temperature sensor 11, need to be electrically connected to the chip 200, and that the fourth heater 8 and the third temperature sensor 12 located outside the second housing 7 also need to be electrically connected to the chip 200, whether the chip 200 is located outside the second housing 7 or inside the second housing 7, the second housing 7 needs to be perforated to enable the devices inside and outside the second housing 7 to be electrically connected to the chip 200, and specific electrical connection schemes can refer to the above description.

If the material of the second casing 7 is silicon, the electrical connection may be achieved by means of through silicon vias, and if the material of the second casing 7 is a material that is difficult to be perforated, or if the perforation process of the second casing 7 is complicated, as shown in fig. 16, the number of the chips 200 may be two, one chip 200 is located inside the second casing 7 and is used for controlling the operation of devices inside the second casing 7, and the other chip 200 is located outside the second casing 7 and is used for controlling the operation of devices outside the second casing 7, and the specific electrical connection scheme may refer to the above description.

As shown in fig. 16, the second case 7 of the resonator package 300 includes a first substrate 703 and a first package 704, and one chip 200 and the first case 1 are fixed to a surface of the first substrate 703, and then the first package 704 encloses the first case 1 and the chip 200 therein. Also, the case 100 includes a second substrate 110 and a second package 120, the second case 7 and one chip 200 are fixed to a surface of the second substrate 110, and then the second package 120 encloses the second case 7 and the chip 200 therein. The outer surface of the first substrate 703 has a pad that can be electrically connected to the chip 200 outside the second housing 7, and the outer surface of the second substrate 110 also has a pad that can be electrically connected to the motherboard on which the oscillator is located.

In one example, the packaging of the oscillator may take the form of a vacuum package, e.g., the interior of the housing 100 is a vacuum. The package size of the oscillator may support surface mount technology (SMD) 2520, SMD3225, SMD5030, SMD7050, and the like.

In an embodiment of the present invention, the oscillator includes the resonator package, and the first heater and the second heater in the resonator package heat an environment in which the resonator is located, so that the temperature of the resonator can be maintained as high as possible at a target temperature, and the stability of the frequency of an electrical signal output from the oscillator in which the resonator package is located can be improved.

The above description is only one embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the principle of the present application should be included in the protection scope of the present application.

Claims

1. A resonator package, characterized in that it comprises a first case (1), a resonator (2), at least one first heater (3) and at least one second heater (4);

the resonator (2), the at least one first heater (3) and the at least one second heater (4) are all located in the first housing (1);

the at least one first heater (3) is fixed to the resonator (2) and the at least one second heater (4) is fixed to the first housing (1).

2. The resonator package according to claim 1, characterized in that the at least one second heater (4) is located at an inner surface of the first housing (1).

3. The resonator package according to claim 1, characterized in that the at least one second heater (4) is embedded in a wall of the first housing (1).

4. The resonator package according to any of claims 1 to 3, characterized in that the first heater (3) comprises a support beam (31) and a heating portion (32), one end of the support beam (31) is fixed to the first housing (1) and the other end is fixed to the heating portion (32), the heating portion (32) is fixed to the resonator (2);

the second heater (4) is close to or in contact with the connection between the support beam (31) and the first housing (1).

5. The resonator package according to any of claims 1 to 4, characterized in that the second heater (4) is heated to a lower temperature than the first heater (3).

6. The resonator package according to any of claims 1 to 5, characterized in that it further comprises at least one third heater (5);

the at least one third heater (5) is positioned outside the first shell (1) and fixed on the outer surface of the first shell (1).

7. The resonator package according to claim 6, characterized in that a heat conducting layer (6) is laid between the third heater (5) and the first housing (1).

8. The resonator package according to claim 6 or 7, characterized in that the third heater (5) is heated to a lower temperature than the second heater (4).

9. The resonator package according to any of claims 1 to 8, characterized in that it further comprises at least one second casing (7);

the at least one second shell (7) and the first shell (1) are sequentially arranged from an outer layer to an inner layer, and the first shell (1) is located at the innermost layer.

10. The resonator package according to claim 9, characterized in that it further comprises at least one fourth heater (8);

the fourth heater (8) is fixed on the outer surface of at least one second shell (7).

11. The resonator package according to claim 10, characterized in that the inner surface of at least one of the second shells (7) is coated with a heat radiating layer (701).

12. The resonator package according to any of claims 9 to 11, characterized in that at least one of the second shells (7) has a heat resistant pad (9) on the inside, the heat resistant pad (9) being located at the junction of the second shell (7) and the first shell (1) or at the junction of two second shells (7).

13. The resonator package according to any of claims 10 to 12, characterized in that the heating temperature of the fourth heater (8) fixed to the outer surface of the at least one second housing (7) increases from the outer layer to the inner layer and is lower than the heating temperature of the second heater (4).

14. The resonator package according to any of claims 1 to 13, characterized in that it further comprises a first temperature sensor (10), said first temperature sensor (10) being fixed in said first casing (1);

the side parts of the resonator (2) are respectively fixed with the first temperature sensor (10) and the first heater (3), so that the resonator (2) is suspended in the cavity of the first shell (1) through the support of the first temperature sensor (10) and the first heater (3).

15. An oscillator, characterized in that the oscillator comprises a housing (100), a chip (200) and a resonator package (300) according to any of claims 1 to 14;

-the chip (200) and the resonator package (300) are both located in the housing (100);

the chip (200) is electrically connected to the resonator (2), the first heater (3) and the second heater (4), respectively.

16. The oscillator according to claim 15, characterized in that the chip (200) comprises an oscillation circuit (201), a fractional pll FPLL circuit (202), a temperature control circuit (203) and a temperature compensation circuit (204);

the oscillation circuit (201) is electrically connected with the resonator (2) and the FPLL circuit (202), respectively;

the temperature control circuit (203) is electrically connected with the first heater (3) and the second heater (4) respectively;

the temperature compensation circuit (204) is electrically connected to the oscillation circuit (201) or the FPLL circuit (202).