CN117318625A - Temperature constant device and method of crystal oscillator and chip - Google Patents

Temperature constant device and method of crystal oscillator and chip Download PDF

Info

Publication number
CN117318625A
CN117318625A CN202311230305.7A CN202311230305A CN117318625A CN 117318625 A CN117318625 A CN 117318625A CN 202311230305 A CN202311230305 A CN 202311230305A CN 117318625 A CN117318625 A CN 117318625A
Authority
CN
China
Prior art keywords
temperature
crystal oscillator
control chip
chip
constant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311230305.7A
Other languages
Chinese (zh)
Inventor
陈定文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Xingweifan Electronic Technology Co ltd
Original Assignee
Shenzhen Xingweifan Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Xingweifan Electronic Technology Co ltd filed Critical Shenzhen Xingweifan Electronic Technology Co ltd
Priority to CN202311230305.7A priority Critical patent/CN117318625A/en
Publication of CN117318625A publication Critical patent/CN117318625A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03BGENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03BGENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/02Details
    • H03B5/04Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature

Landscapes

  • Oscillators With Electromechanical Resonators (AREA)

Abstract

The invention discloses a temperature constant device, a method and a chip of a crystal oscillator, belonging to the technical field of crystal oscillators, wherein the device comprises: a crystal oscillator; the first control chip is attached to the bottom surface of the crystal oscillator and is integrated with a first heating device, a first temperature sensor and a first control circuit; and the second control chip is attached to the top surface of the crystal oscillator and is integrated with a second heating device, a second temperature sensor and a second control circuit. The invention realizes the technical effect of improving the temperature stability of the crystal oscillator by establishing a constant temperature field and placing the crystal oscillator in the temperature field.

Description

Temperature constant device and method of crystal oscillator and chip
Technical Field
The present invention relates to the field of crystal oscillators, and in particular, to a device, a method and a chip for maintaining a constant temperature of a crystal oscillator.
Background
Accurate clock sources are important in people's life. In a communication system, it affects the transmission rate and reception quality of data; in a timing system, it affects the accuracy of the timing time. Quartz crystal oscillators are often used to provide stable clock signals because of their high quality and low cost, but the frequency of the quartz crystal oscillator is affected by temperature, resulting in frequency drift. Such frequency drift may lead to signal distortion, transmission errors, timing inaccuracies.
A common type of thermostatically controlled crystal oscillator uses a thermostat to maintain the temperature of the crystal oscillator or the crystal oscillator constant, and the thermostat is heated by a heating pipe mounted on the thermostat, and then indirectly transfers heat to the crystal oscillator. Such secondary heat transfer has hysteresis, and the crystal oscillator is in a constantly changing temperature field, which causes difficulty in thermostatic control, and the temperature stability of the crystal oscillator is poor.
Disclosure of Invention
The invention mainly aims to provide a device, a method and a chip for keeping the temperature constant of a crystal oscillator, and aims to solve the problem that the temperature stability of the conventional constant temperature control crystal oscillator is poor in the constant temperature control process.
In order to achieve the above object, the present invention provides a temperature constant apparatus of a crystal oscillator, the apparatus comprising:
a crystal oscillator;
the first control chip is attached to the bottom surface of the crystal oscillator and is integrated with a first heating device, a first temperature sensor and a first control circuit;
and the second control chip is attached to the top surface of the crystal oscillator and is integrated with a second heating device, a second temperature sensor and a second control circuit.
Optionally, the crystal oscillator is attached to the first control chip through an adhesive, and the crystal oscillator is attached to the second control chip through an adhesive.
Optionally, the adhesive comprises a heat conductive glue.
Optionally, the first control chip and the second control chip are in communication connection.
Optionally, the crystal oscillator is connected to a lead.
In addition, to achieve the above object, the present invention also provides a temperature constant method of a crystal oscillator, which is applied to a temperature constant apparatus of a crystal oscillator as described above, the temperature constant method of a crystal oscillator comprising the steps of:
a first control chip acquires a first temperature value measured by the first temperature sensor and judges whether the first temperature value is within a preset temperature range;
if the first temperature value is not in the temperature range, controlling the first heating device to be heated or turned off through the first control circuit;
a second control chip acquires a second temperature value measured by the second temperature sensor and judges whether the second temperature value is within the temperature range;
and if the second temperature value is not in the temperature range, controlling the second heating device to be heated or turned off through the second control circuit.
Optionally, a temperature vertex of the crystal oscillator is within the temperature range.
In addition, in order to achieve the above object, the present invention also provides a chip, which is applied to the temperature constant device of the crystal oscillator as described above, and in which a heating device, a temperature sensor and a control circuit are integrated.
The temperature constant device of the crystal oscillator provided by the embodiment of the invention comprises: a crystal oscillator; the first control chip is attached to the bottom surface of the crystal oscillator and is integrated with a first heating device, a first temperature sensor and a first control circuit; and the second control chip is attached to the top surface of the crystal oscillator and is integrated with a second heating device, a second temperature sensor and a second control circuit. The top surface and the bottom surface of the crystal oscillator are respectively provided with a first control chip and a second control chip, the control chips have the functions of heating, temperature measurement and temperature control because of integrating various devices, the temperatures of the first control chip and the second control chip are arranged in a proper range, the temperatures of the first control chip and the second control chip cannot change along with the external environment, the stable temperature field is equivalent to being established, the crystal oscillator is positioned in the stable temperature field, the constant temperature control is easier, and the temperature stability is enhanced.
Drawings
FIG. 1 is a graph of oscillation frequency error versus temperature for a quartz crystal oscillator;
FIG. 2 is a schematic diagram of a structure of a conventional constant temperature crystal oscillator on the market;
FIG. 3 is a schematic diagram of a temperature field structure of the conventional constant temperature crystal oscillator in FIG. 2;
FIG. 4 is a schematic diagram of a temperature-constant device of a crystal oscillator according to an embodiment of the present invention;
FIG. 5 is a schematic diagram showing a temperature field structure of a temperature constant device of the crystal oscillator in FIG. 4;
FIG. 6 is a schematic cross-sectional view of a temperature-constant device of a crystal oscillator according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a chip according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of another chip according to an embodiment of the invention.
Description of the reference numerals
01 Crystal oscillator 02 First control chip
03 Second control chip 04 Outer casing
05 Adhesive agent 06 Lead wire
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Fig. 1 is a graph showing the relationship between the oscillation frequency error and the temperature of a quartz crystal oscillator, wherein the graph in fig. 1 can be approximated by a parabola, and the oscillation frequency of the quartz crystal oscillator changes little with the temperature near a certain temperature point, and changes with the temperature become great away from the temperature point. This temperature point may be generally referred to as the temperature vertex of a quartz crystal oscillator, which depends on the nature and materials of the quartz crystal used in its design and fabrication.
Obviously, if the temperature of the quartz crystal oscillator is controlled to be always near the temperature peak thereof, a highly accurate and stable clock source can be obtained. A constant temperature crystal oscillator is a device which generally consists of a quartz crystal oscillator with a high temperature peak, a heating element and a control circuit. When the ambient temperature is lower than the set temperature of the quartz crystal oscillator, the control circuit controls the heating element to change the ambient working temperature of the quartz crystal oscillator through the internal temperature compensation circuit, so that the working temperature of the quartz crystal oscillator reaches the set temperature, and an accurate clock source is obtained.
Fig. 2 is a schematic diagram of a structure of a common constant temperature crystal oscillator in the market, as shown in fig. 2, a quartz crystal, a heating element and a temperature sensing unit are put together, and a control circuit monitors the ambient temperature around the crystal oscillator. If the ambient temperature is lower than the set temperature value, the control circuit electrifies and heats the heating element to enable the ambient temperature to rise to the set value; if the ambient temperature is greater than the set temperature value, the control circuit does not heat the heating element. Obviously, the device requires that the working environment temperature is lower than the set temperature of the crystal oscillator.
In three-dimensional space, the substances between two different temperature points have heat exchange in radiation, convection and conduction modes, while the substances between two same temperature points have no heat exchange. Fig. 3 is a schematic diagram of a temperature field structure of the common constant temperature crystal oscillator in fig. 2, in fig. 3, T1 is a temperature of a heating element, T4 is a temperature of a natural environment, and T2 is a temperature of a quartz crystal. If the temperatures T1, T2 and T4 are different, heat exchange exists between the two. Since the temperature of the natural environment varies greatly and is not controlled by the circuit, the temperature of T1 will be caused to vary with the temperature of T4.
The constant temperature crystal oscillator circuit is controlled to obtain a stable quartz crystal temperature T2, if the temperature of T4 is reduced, the temperature of T1 is increased, and thus the temperature difference between T1 and T4 is increased; conversely, if the temperature of T4 increases, then the temperature of T1 decreases, and thus the temperature difference between T1 and T4 decreases. For a constant temperature crystal oscillator, the positions of a heating element, a quartz crystal and an external environment are determined, so that the quartz crystal is in temperature fields with different changing speeds, and the constant temperature control is difficult.
In addition, the common constant temperature crystal oscillator is formed by different materials of the quartz crystal, the heating element and the control circuit, and can not be placed together, three components occupy a large physical space, a stable temperature field is difficult to build around the quartz crystal, and the quartz crystal can reach a set value of temperature after a long time after the constant temperature crystal oscillator is electrified. The large physical space also requires a large current to heat and maintain the temperature, resulting in a large power consumption of Wen Jingzhen. In addition, the packaging process is not compatible with the currently mainstream chip packaging process, and the packaging cost is relatively high.
An embodiment of the present invention provides a temperature constant apparatus for a crystal oscillator, referring to fig. 4, the temperature constant apparatus for a crystal oscillator includes: a crystal oscillator 01; a first control chip 02 attached to the bottom surface of the crystal oscillator 01, wherein the first control chip 02 is integrated with a first heating device, a first temperature sensor and a first control circuit; and a second control chip 03 attached to the top surface of the crystal oscillator 01, wherein the second control chip 03 is integrated with a second heating device, a second temperature sensor and a second control circuit. The temperature-constant device shown in the embodiment is compatible with the mainstream chip packaging technology, can be packaged in the shell 04, and reduces packaging cost.
Fig. 5 is a schematic diagram of a temperature field structure of the temperature-constant device of the crystal oscillator in fig. 4, as shown in fig. 5, the embodiment can be regarded as adding a heating element between T2 and T4, and creating a temperature point of T3, so that the temperature values of T1 and T3 do not change with the change of T4, and then the temperature point of T2 is in a constant temperature field, so that the temperature of the crystal oscillator can be easily controlled.
Fig. 6 is a schematic cross-sectional view of a temperature-constant device of a crystal oscillator, and as shown in fig. 6, the crystal oscillator 01 and the first control chip 02 may be bonded by an adhesive, and the crystal oscillator 01 and the second control chip 03 may be bonded by an adhesive 05. The adhesive 05 may include a heat conductive glue. In one possible embodiment, the area of the first control chip 02 is larger than the area of the bottom surface of the crystal oscillator 01, the area of the second control chip 03 is smaller than the area of the top surface of the crystal oscillator 01, and the area of the non-overlapping portion can be used for wiring. In another possible embodiment, the area of the first control chip 02, the area of the crystal oscillator 01, and the area of the second control chip 03 may be the same, and may be packaged in other manners, which is not particularly limited in this embodiment. The first control chip 02 and the second control chip 03 are in communication connection. The crystal oscillator is connected to lead 06. The communication connection between the first control chip 02 and the second control chip 03 can also be made via the access line 06. The crystal oscillator 01 is connected with a lead 06 and can be connected with other components in the device to realize various functions.
The heat-conducting adhesive can bond the crystal oscillator and the control chip together, has high heat conductivity, can rapidly transfer heat generated by the control chip to the crystal oscillator, and can transfer the heat of the crystal oscillator to the control chip for heat dissipation under the condition that the control chip stops heating, so that the heat transfer is little in obstruction to heat transfer. The heat conductive paste may contain metal ions, such as silver ions, to enhance thermal conductivity.
The temperature constant device of the crystal oscillator heats the crystal oscillator by adopting a sandwich structure, and a stable temperature field can be obtained in the vertical direction to ensure that the working environment temperature of the quartz crystal is constant, so that the performance of the product is improved; the volume of the constant-temperature crystal oscillator is reduced, the power consumption is reduced, and the starting process is quickened; the production process of the product is compatible with the modern mainstream packaging technology, and the production cost is greatly reduced.
The temperature constant device of the crystal oscillator provided by the embodiment of the invention comprises: a crystal oscillator; the first control chip is attached to the bottom surface of the crystal oscillator and is integrated with a first heating device, a first temperature sensor and a first control circuit; and the second control chip is attached to the top surface of the crystal oscillator and is integrated with a second heating device, a second temperature sensor and a second control circuit. The top surface and the bottom surface of the crystal oscillator are respectively provided with a first control chip and a second control chip, the control chips have the functions of heating, temperature measurement and temperature control because of integrating various devices, the temperatures of the first control chip and the second control chip are arranged in a proper range, the temperatures of the first control chip and the second control chip cannot change along with the external environment, the stable temperature field is equivalent to being established, the crystal oscillator is positioned in the stable temperature field, the constant temperature control is easier, and the temperature stability is enhanced.
The embodiment of the invention provides a temperature constant method of a crystal oscillator, which comprises the following steps:
step S10, a first control chip acquires a first temperature value measured by the first temperature sensor and judges whether the first temperature value is within a preset temperature range;
with the continuous progress of Semiconductor manufacturing processes, more and more basic electronic devices are integrated into a chip, such as various MOS (Metal-Oxide-Semiconductor) transistors, resistors, capacitors, diodes, triodes, etc., and the chip has more and more realistic functions, and the heating function and temperature measurement can be implemented in a single chip. The first control chip and the second control chip used in this embodiment belong to chips integrating multiple functions. It is understood that the first control chip and the second control chip may be chips that are identical in configuration except for size.
At least a first temperature sensor, a first heating device and a first control circuit are integrated in the first control chip. The first control chip is small in thickness, the first temperature sensor can detect the temperature of the chip or the crystal oscillator, the first heating device generates heat to heat the crystal oscillator, and the first control circuit controls the first heating device. The first temperature sensor can monitor the temperature, and the processing unit in the first control chip can periodically acquire a first temperature value measured by the first temperature sensor and judge whether the first temperature value is in a preset temperature range. The preset temperature range can be set according to the temperature peak of the crystal oscillator, so that the temperature peak is ensured to be within the temperature range, and the frequency error of the crystal oscillator is controlled within a very small range.
Step S20, if the first temperature value is not within the temperature range, controlling the first heating device to be heated or turned off by the first control circuit;
when the first temperature value is not in the temperature range, the difference between the temperature of the crystal oscillator and the temperature vertex is large, and the first heating device can be controlled by the first control circuit to heat so as to raise the temperature or turn off the first heating device so as to lower the temperature, so that the temperature of the crystal oscillator is restored to be in the temperature range. And under the condition that the first temperature value is in the temperature range, the difference between the temperature of the crystal oscillator and the temperature vertex is smaller, the frequency error is smaller, and the first temperature value can be continuously monitored.
Step S30, a second control chip acquires a second temperature value measured by the second temperature sensor, and judges whether the second temperature value is within the temperature range;
the first control chip is attached to the bottom surface of the crystal oscillator, the second control chip is attached to the top surface of the crystal oscillator, the temperature range set by the second control chip is the same as that set by the first control chip, a relatively stable temperature field can be established between the first control chip and the second control chip, the crystal oscillator is in the temperature field, and the temperature change is very small.
At least a second temperature sensor, a second heating device and a second control circuit are integrated in the second control chip. The second control chip is smaller in thickness, the second temperature sensor can detect the temperature of the chip or the crystal oscillator, the second heating device generates heat to heat the crystal oscillator, and the second control circuit controls the second heating device. The second temperature sensor can monitor the temperature, and the processing unit in the second control chip can periodically acquire a second temperature value measured by the second temperature sensor and judge whether the second temperature value is in a preset temperature range. The preset temperature range can be set according to the temperature peak of the crystal oscillator, so that the temperature peak is ensured to be within the temperature range, and the frequency error of the crystal oscillator is controlled within a very small range.
And step S40, if the second temperature value is not in the temperature range, controlling the second heating device to be heated or turned off through the second control circuit.
When the second temperature value is not in the temperature range, the difference between the temperature of the crystal oscillator and the temperature vertex is large, and the second heating device can be controlled by the second control circuit to heat so as to raise the temperature or turn off the second heating device so as to lower the temperature, so that the temperature of the crystal oscillator is restored to be in the temperature range. And under the condition that the second temperature value is in the temperature range, the difference between the temperature of the crystal oscillator and the temperature vertex is smaller, the frequency error is smaller, and the second temperature value can be continuously monitored.
The first control chip and the second control chip maintain the same temperature stability, and have synchronism in time. Generally, the step S10 is performed first, and the step S20 is performed later. Generally, the step S30 is performed first, and the step S40 is performed later. The steps S10 and S20 and the steps S30 and S40 are not in a fixed order.
In some possible embodiments, the first control chip and the second control chip are in communication with each other, and the first control chip and the second control chip can be set with the same fixed temperature point, namely the temperature vertex of the crystal oscillator, so that the first control chip and the second control chip respectively obtain the fixed temperature point by controlling the heating device, and the temperature difference between the first control chip and the second control chip is kept unchanged, and the difference can be set to zero, so that a uniform temperature field can be obtained in the vertical direction, and the quartz crystal oscillator is in the temperature field, so that the temperature of the crystal can be easily kept constant, and a stable clock source can be obtained.
In the embodiment, a uniform temperature field is established in the vertical direction through the first control chip and the second control chip with integrated functions, and the crystal oscillator is placed in the temperature field, so that the temperature stability of the crystal oscillator is kept, and the performance of a product is improved; the volume of the constant-temperature crystal oscillator is reduced, the power consumption is reduced, and the starting process is quickened; the production process of the product is compatible with the modern mainstream packaging technology, and the production cost is greatly reduced.
The embodiment of the invention also provides a chip, which is applied to the temperature constant device of the crystal oscillator, and a heating device, a temperature sensor and a control circuit are integrated in the chip.
Fig. 7 is a schematic diagram of a chip structure, in which a temperature sensor is located in the center of the chip, a heating device surrounds the temperature sensor, and other circuits are provided in the rest of the chip, and the other circuits include a control circuit.
Fig. 8 is a schematic diagram of another chip, in which temperature sensors are respectively disposed at four corners of the chip, a heating device surrounds the temperature sensors, and other circuits are disposed at the rest positions, and the other circuits include a control circuit.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The foregoing embodiment numbers of the present invention are merely for the purpose of description, and do not represent the advantages or disadvantages of the embodiments.
The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein or in the alternative, which may be employed directly or indirectly in other related arts.

Claims (8)

1. A temperature-constant device of a crystal oscillator, characterized in that the temperature-constant device of the crystal oscillator comprises:
a crystal oscillator;
the first control chip is attached to the bottom surface of the crystal oscillator and is integrated with a first heating device, a first temperature sensor and a first control circuit;
and the second control chip is attached to the top surface of the crystal oscillator and is integrated with a second heating device, a second temperature sensor and a second control circuit.
2. The crystal oscillator temperature-constant apparatus according to claim 1, wherein the crystal oscillator and the first control chip are bonded to each other by an adhesive, and the crystal oscillator and the second control chip are bonded to each other by an adhesive.
3. The crystal oscillator temperature-invariant apparatus of claim 2, wherein said adhesive comprises a thermally conductive adhesive.
4. The crystal oscillator temperature-invariant apparatus of claim 1, wherein said first control chip and said second control chip are communicatively coupled.
5. The crystal oscillator temperature-invariant apparatus of claim 1, wherein said crystal oscillator is connected to a lead.
6. A method for temperature constancy of a crystal oscillator, characterized in that it is applied to a temperature constancy apparatus of a crystal oscillator according to any one of claims 1 to 5, comprising the steps of:
a first control chip acquires a first temperature value measured by the first temperature sensor and judges whether the first temperature value is within a preset temperature range;
if the first temperature value is not in the temperature range, controlling the first heating device to be heated or turned off through the first control circuit;
a second control chip acquires a second temperature value measured by the second temperature sensor and judges whether the second temperature value is within the temperature range;
and if the second temperature value is not in the temperature range, controlling the second heating device to be heated or turned off through the second control circuit.
7. The method of claim 6, wherein a temperature peak of the crystal oscillator is within the temperature range.
8. A chip, characterized in that it is applied to a temperature-constant device of a crystal oscillator according to any one of claims 1-5, in which a heating device, a temperature sensor and a control circuit are integrated.
CN202311230305.7A 2023-09-22 2023-09-22 Temperature constant device and method of crystal oscillator and chip Pending CN117318625A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311230305.7A CN117318625A (en) 2023-09-22 2023-09-22 Temperature constant device and method of crystal oscillator and chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311230305.7A CN117318625A (en) 2023-09-22 2023-09-22 Temperature constant device and method of crystal oscillator and chip

Publications (1)

Publication Number Publication Date
CN117318625A true CN117318625A (en) 2023-12-29

Family

ID=89280453

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311230305.7A Pending CN117318625A (en) 2023-09-22 2023-09-22 Temperature constant device and method of crystal oscillator and chip

Country Status (1)

Country Link
CN (1) CN117318625A (en)

Similar Documents

Publication Publication Date Title
CA2283963C (en) Piezo-oscillator
US8049572B2 (en) Oven-controlled crystal oscillator
US8981260B2 (en) Temperature control circuit of oven-controlled crystal oscillator
JP4855087B2 (en) Constant temperature crystal oscillator
US20050285482A1 (en) Crystal oscillator
EP1746728A3 (en) Oscillator with frequency stabilizing circuit and method of constructing same
TW201504603A (en) Method and system for measuring heat flux
JP2011004382A (en) Temperature-controlled crystal oscillator
US8390390B2 (en) Oven controlled crystal oscillator
US20100085125A1 (en) Constant-temperature type crystal oscillator
US20120306582A1 (en) Oven-controlled crystal oscillator
JPH1093346A (en) Oven assembly for oscillator
US11784071B2 (en) Process temperature measurement device fabrication techniques and methods of calibration and data interpolation of the same
TW200404155A (en) An improved temperature regulator for use with a pressure sensing device
WO2017136282A1 (en) Instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
JP3250285B2 (en) Substrate to be processed provided with information measuring means
CN110926630A (en) Wafer temperature sensing device with flexible circuit board
CN117318625A (en) Temperature constant device and method of crystal oscillator and chip
CN203896310U (en) Temperature control structure of single-slot constant-temperature crystal oscillator
JP5912566B2 (en) Crystal oscillator with temperature chamber
CN210322041U (en) Wafer temperature sensing device with flexible circuit board
CN207504834U (en) Constant-temperature crystal oscillator
CN206905927U (en) A kind of high-precision integrated form thermosensitive circuit that can be responded rapidly to
JP2003258554A (en) Temperature compensation type piezoelectric oscillator
US11828796B1 (en) Integrated heater and temperature measurement

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination