CN216747829U - Electromagnetic shielding box for wafer test - Google Patents

Abstract

The application relates to an electromagnetic shielding box for wafer testing, which comprises a box body subjected to conductive treatment, a wafer carrying disc and a driving mechanism, wherein the box body is provided with an accommodating cavity, and the inner wall of the upper side of the accommodating cavity is provided with a communication hole for a probe to penetrate into the accommodating cavity; a feeding window communicated with the accommodating cavity is arranged on the outer wall of one side of the box body, and an opening and closing door is arranged at the feeding window; the crystal carrying disc is horizontally and movably arranged in the accommodating cavity; the driving mechanism is arranged in the accommodating cavity and used for enabling the wafer carrying disc to do horizontal movement. The method and the device have the effect of reducing the interference of the external environment to the wafer when the wafer is tested.

Description

Electromagnetic shielding box for wafer test

Technical Field

The application relates to the field of wafer testing, in particular to an electromagnetic shielding box for wafer testing.

Background

The wafer test is to perform a probe test on each die on the chip, and to mount a probe made of beryllium copper/tungsten and made into fine hair on the detection head, and to make the probe contact with the pad point on the die, so as to test the electrical characteristics of the wafer.

In the related art, the wafer testing device comprises a rack, a wafer carrying disc, a driving mechanism, a probe and a microscope platform, wherein the wafer carrying disc is horizontally and movably arranged on the rack, a wafer can be fixedly placed on the upper surface of the wafer carrying disc, and the wafer carrying disc is completely exposed outside so as to be convenient for replacement of the wafer; the driving mechanism is arranged on the rack and used for driving the wafer carrying disc to do horizontal movement; the probe is fixedly arranged on the rack and can be in point contact with the pad on the wafer to perform testing work; the microscope platform is arranged on the rack and positioned above the wafer carrying disc, and the microscope platform is used for observing whether the probe is in contact with the wiring of the wafer or not, so that when the wafer carrying disc is tested, the driving mechanism can enable the wafer carrying disc to move horizontally, different pads on the wafer are in contact with the probe, and the purpose of testing the wafer is achieved.

In view of the above related technologies, there is a defect that the wafer test is inaccurate because the wafer-carrying disk is completely exposed in the external environment, which may cause certain interference to the wafer test.

SUMMERY OF THE UTILITY MODEL

In order to reduce the interference of the external environment to the wafer test, the application provides an electromagnetic shielding box for the wafer test.

The application provides an electromagnetic shielding box is used in wafer test adopts following technical scheme:

an electromagnetic shielding box for wafer testing comprises a box body subjected to conductive treatment, a wafer carrying disc and a driving mechanism, wherein the box body is provided with an accommodating cavity, and a communication hole is formed in the inner wall of the upper side of the accommodating cavity and used for a probe to penetrate into the accommodating cavity; a loading window communicated with the accommodating cavity is formed in the outer wall of one side of the box body, and an opening and closing door is arranged at the loading window; the crystal carrying disc is horizontally and movably arranged in the accommodating cavity; the driving mechanism is arranged in the accommodating cavity and is used for enabling the crystal carrying disc to move horizontally.

Through adopting above-mentioned technical scheme, because of the setting of the box and the intercommunicating pore that pass through conductive treatment, then make the intercommunication department of carrying wafer on the brilliant dish and external environment only have the intercommunicating pore, and because of intercommunicating pore department still has microscopical camera lens and probe, then the box that passes through conductive treatment can shield down electromagnetic interference, so the interference of external environment to the wafer test can reduce by a wide margin, thereby be difficult for influencing the accuracy of wafer test, in addition the setting of material loading window and opening and closing door, then the staff can open the material loading window through opening and closing the door, in order to change the wafer on carrying the brilliant dish.

Preferably, the air spring shock absorber further comprises a bottom plate and an air spring shock absorber, wherein the bottom plate is positioned below the box body; the air spring shock absorber is arranged between the bottom plate and the box body, the air spring shock absorber is connected with the bottom plate and the box body, and the air spring shock absorber is used for preventing a microscope for observing the wafer from being vibrated.

By adopting the technical scheme, the vibration in the external environment can not influence the microscope for observing the wafer due to the arrangement of the air spring shock absorber, so that a stable environment can be provided for the test of the wafer.

Preferably, the outer wall of the box body is provided with an electromagnetic shielding strip in a fitting manner.

Through adopting above-mentioned technical scheme, because of the box forms through the concatenation of a plurality of panels, so the gap can appear in concatenation department between a plurality of panels, so the setting of electromagnetic shield strip, on the one hand, make the box physical stamina shield external interference more effectively, thereby can provide the test environment of a preferred for the test of weak signal of telecommunication, help promoting the accuracy of wafer test, on the other hand, can prevent that the vapor among the external environment from getting into in the box, then the condition that frosts can not appear in the wafer that is in the box under low temperature environment, thereby can not influence normal wafer test work.

Preferably, the crystal carrying tray comprises a base seat and a carrying seat, and the base seat is connected with the driving mechanism; the object carrying seat is connected to the upper surface of the base seat in a sliding mode, the sliding direction of the object carrying seat is parallel to the direction of the central line of the feeding window, and the object carrying seat can partially slide out of the base seat; carry the thing seat with be provided with the retaining member between the base actuating mechanism drive during the base motion, the retaining member is used for making carry the thing seat with base fixed connection.

Through adopting above-mentioned technical scheme, when the wafer on the year wafer is changed, earlier open the material loading window through opening and closing the door, make basic seat to the direction motion that is close to the material loading window through actuating mechanism after that, when treating basic seat motion to suitable position, then make through the retaining member and carry a thing seat and remove being connected with basic seat, meanwhile alright take out carrying the thing seat from material loading window department, with lay new wafer again on carrying the thing seat, at last will carry the thing seat to reset to move back to the box again, then just accomplish the change of wafer, rethread retaining member makes and carries thing seat and basic seat fixed connection simultaneously, thereby follow-up basic seat is when horizontal migration, there can not be the deviation in the position between base seat and the thing seat of carrying, and then the contact of probe and the pad point when difficult influence is tested.

Preferably, the locking member comprises a first baffle, a stop block, a rotary cylinder and a connecting block, the first baffle is arranged at one end, close to the loading window, of the loading seat, and the surface of one side, far away from the loading window, of the first baffle can be abutted to the base seat; the stop block is fixedly arranged on the object carrying seat; the rotary cylinder is fixedly arranged on the foundation base; one end of the connecting block is fixedly connected with a piston rod of the rotary air cylinder, and the other end of the connecting block can be abutted to one end, close to the feeding window, of the stop block.

Through adopting the above technical scheme, when will making and carrying a thing seat part roll-off foundatin seat, let the connecting block rotate through revolving cylinder earlier, so that the connecting block is kept away from revolving cylinder one end and dog and is broken away from the butt, make and carry the thing seat to the direction that is close to the material loading window and slide after that, so that will carry the thing seat and take out from the material loading window, when waiting to carry the thing seat to reach suitable position, this moment alright install new wafer on carrying the thing seat, then make and carry the thing seat to do the motion that resets in the box, when waiting that first baffle and foundatin seat are close to material loading window one end butt, carry the thing seat and just reset to the initial position, at last rethread revolving cylinder lets the connecting block rotate, so that the connecting block keep away from revolving cylinder's one end and dog butt can, thereby just accomplished the operation flow of a complete change wafer.

Preferably, a second baffle is fixedly arranged on the base, and the second baffle is positioned at one end of the base close to the feeding window; the anti-falling block is located at one end, far away from the loading window, of the loading seat, and the end, close to the loading window, of the anti-falling block can be abutted to the second baffle.

Through adopting above-mentioned technical scheme, because of the setting of second baffle and anticreep piece, then will carry the in-process that thing seat taken out from material loading window department, the anticreep piece can be close to the second baffle gradually, when treating that the anticreep piece is close to material loading window one end and second baffle butt, the part of carrying thing seat roll-off basis seat just reaches maximum limit value to the condition that thing seat and complete basis seat break away from the connection can not appear carrying, and then the staff of being convenient for carries out the change work of wafer more.

Preferably, the driving mechanism comprises an X-direction lead screw sliding table and a Y-direction lead screw sliding table, and the X-direction lead screw sliding table is fixedly arranged on the bottom wall of the accommodating cavity; the Y-direction screw rod sliding table is fixedly arranged on the X-direction screw rod sliding table, the length direction of the Y-direction screw rod sliding table is perpendicular to the length direction of the X-direction screw rod sliding table, and the Y-direction screw rod sliding table is connected with the base seat.

Through adopting above-mentioned technical scheme, because of X to lead screw slip table and Y to the setting of lead screw slip table, then make carry the brilliant dish can follow X to being linear motion, also can follow Y to being linear motion to just reach and make and carry the brilliant dish and do the purpose of horizontal motion, carry the mode of brilliant dish motion at the drive through the lead screw slip table in addition, still make the motion of carrying the thing dish accurate more, thereby the probe can more accurately contact with the pad point on the wafer when carrying out wafer test.

Preferably, a lifting sliding table is arranged between the Y-direction screw rod sliding table and the foundation base, the lifting sliding table is fixedly arranged on the sliding table of the Y-direction screw rod sliding table, and the lifting sliding table is connected with the foundation base so as to enable the foundation base to move vertically; the lifting sliding table and the rotating part are arranged between the foundation bases, and the rotating part is used for enabling the foundation bases to rotate in a reciprocating mode within a preset central angle range.

Through adopting above-mentioned technical scheme, the setting of lift slip table, then when needs make new wafer contact with the probe again, can move to the below of intercommunicating pore through actuating mechanism earlier, make basic seat upward movement through lift slip table after that, thereby the side that carries crystal plate and probe can not appear and bump so that the probe is crooked by a wide margin, and then just can not lead to the probe to be damaged because of changing the wafer, in addition because of the setting that rotates, make carry crystal plate can at predetermined central angle within range internal rotation, thereby carry the required operating condition of crystal plate when can satisfying the test.

In summary, the present application includes at least one of the following beneficial technical effects:

1. through the arrangement of the box body and the communication holes, only the communication holes are arranged at the communication positions of the wafers on the wafer carrying disc and the external environment, and the interference of the external environment on the wafer test can be greatly reduced because the communication holes are also provided with the lens and the probe of the microscope, so that the accuracy of the wafer test is not easily influenced;

2. through the arrangement of the bottom plate and the air spring shock absorber, in the process that vibration in the external environment is transmitted to the box body from the bottom plate, the air spring shock absorber can absorb part of the vibration transmitted to the box body from the bottom plate, so that the box body is not influenced by the vibration in the external environment, and the box body can provide a relatively stable environment for testing wafers;

3. the outer wall through the box is provided with the mode that electromagnetic shield strip and box intussuseption were filled with inert gas, makes the box physical stamina shield external interference more effectively to can provide the test environment of a preferred for the test of weak signal of telecommunication, help promoting the accuracy of wafer test.

Drawings

Fig. 1 is a schematic view of an electromagnetic shielding box in an embodiment of the present application.

Fig. 2 is a schematic diagram illustrating a connection manner between a wafer carrier and a driving mechanism in an embodiment of the present application.

Fig. 3 is a schematic view showing a specific structure of the locking member in the embodiment of the present application.

Fig. 4 is a schematic diagram illustrating a specific structure of the rotating member in the embodiment of the present application.

Description of reference numerals: 1. a box body; 11. an accommodating cavity; 12. a communicating hole; 13. a feeding window; 14. opening and closing the door; 2. a wafer carrying disc; 21. a base seat; 211. a second baffle; 22. a carrying seat; 221. an anti-drop block; 3. a drive mechanism; 31. an X-direction lead screw sliding table; 32. a Y-direction screw rod sliding table; 4. a base plate; 5. an air spring damper; 6. a locking member; 61. a first baffle plate; 62. a stopper; 63. a rotary cylinder; 64. connecting blocks; 7. a lifting sliding table; 8. a rotating member; 81. a connecting seat; 82. a rotating seat; 83. a first slider; 84. a second slider; 85. connecting columns; 86. a connecting arm.

Detailed Description

The present application is described in further detail below with reference to figures 1-4.

The embodiment of the application discloses wafer test is with electromagnetic shield case. Referring to fig. 1, the electromagnetic shielding box for wafer testing includes a box body 1 subjected to conductive processing, a wafer carrier 2 and a driving mechanism 3, the box body 1 is formed by splicing a plurality of plates, a receiving chamber 11 is formed inside the box body 1, wherein a communication hole 12 is formed in an upper inner wall of the receiving chamber 11, and the communication hole 12 is used for a probe to penetrate into the receiving chamber 11 and a microscope to observe elements in the receiving chamber 11, in this embodiment, since the wafer carrier 2 and the driving mechanism 3 are both disposed in the receiving chamber 11, in order to improve stability of the box body 1, a bottom plate 4 and an air spring damper 5 are disposed below the box body 1, wherein the air spring damper 5 is located between the bottom plate 4 and the box body 1, and the air spring damper 5 is connected with the bottom plate 4 and the box body 1, and the air spring damper 5 is located at a corner of the box body 1, wherein the microscope for observing the wafer is not directly fixedly connected with the box body 1, therefore, the microscope is not affected by the vibration in the external environment, and a stable environment can be provided for the testing of the wafer.

Referring to fig. 1 and 2, the wafer carrier 2 is horizontally and movably disposed in the accommodating cavity 11 through the driving mechanism 3, and the wafer carrier 2 fixes the wafer to be tested in a vacuum adsorption manner, in this embodiment, the driving mechanism 3 includes an X-direction lead screw sliding table 31 and a Y-direction lead screw sliding table 32, specifically, the X-direction lead screw sliding table 31 is fixedly disposed on the bottom wall of the accommodating cavity 11, the sliding table of the X-direction lead screw sliding table 31 is fixedly connected with the Y-direction lead screw sliding table 32, the length direction of the X-direction lead screw sliding table 31 is perpendicular to the length direction of the Y-direction lead screw sliding table 32, and the sliding table of the Y-direction lead screw sliding table 32 is fixedly connected with the wafer carrier 2, so that the wafer carrier 2 can horizontally move, wherein different pad points on the wafer can contact with probes during the horizontal movement of the wafer carrier 2, so as to achieve the purpose of testing the wafer, and in the whole testing process, the conductive box 1 can shield external electromagnetic interference, and the wafer is only contacted with the external environment at the communication hole 12, but the communication hole 12 is also provided with equipment required by tests such as a probe and a microscope, so that the interference of the external environment on the wafer test can be greatly reduced, and the accuracy of the wafer test is not easily influenced.

Referring to fig. 1 and 2, in the present embodiment, since the wafer replacement operation is required, the corresponding structures are provided on the box 1 and the wafer carrier 2, firstly, one side of the box body 1 is provided with a feeding window 13 communicated with the containing cavity 11, and the feeding window 13 is provided with an opening and closing door 14, secondly, the crystal carrying plate 2 comprises a base seat 21 and a carrying seat 22, specifically, the base seat 21 is fixedly connected with a sliding table of a Y-direction screw sliding table 32, the carrying seat 22 is connected on the upper side of the base seat 21 in a sliding way, and the sliding direction of the object carrying seat 22 is parallel to the central line direction of the loading window 13, and the object carrying seat 22 can partially slide out of the base seat 21 towards the direction close to the loading window 13, wherein, when the driving mechanism 3 is to move the whole wafer carrying tray 2, the base seat 21 and the carrying seat 22 need to be fixedly connected, so that the locking member 6 is arranged between the base seat 21 and the carrying seat 22.

Referring to fig. 1 and 2, the locking member 6 includes a first baffle 61, a stopper 62, a rotary cylinder 63 and a connecting block 64, the first baffle 61 is fixedly connected to one end of the object carrying seat 22 close to the loading window 13, and a surface of one side of the first baffle 61 away from the loading window 13 can be abutted to one end of the base 21 close to the loading window 13, and is a position state required by the test operation of the object carrying seat 22 and the base 21 during abutment, and meanwhile, the object carrying seat 22 cannot slide in a direction away from the loading window 13; the stop block 62 is fixedly connected to the carrying seat 22, the rotary cylinder 63 is fixedly connected to the base seat 21, and the rotary cylinder 63 and the stop block 62 are positioned on the same side; connecting block 64 one end and the piston rod fixed connection of gyration cylinder 63, the other end rotates around self and the junction of gyration cylinder 63 to connecting block 64 can be close to the one end butt of material loading window 13 with dog 62, carries thing seat 22 and can not slide to the direction of material loading window 13 during the butt moreover, thereby just reaches the purpose that makes basic seat 21 and year thing seat 22 fixed connection.

Referring to fig. 1 and 2, when a wafer needs to be replaced, the wafer carrying tray 2 is moved in a direction close to the feeding window 13 through the driving mechanism 3, when the wafer carrying tray 2 moves to a proper position, the connecting block 64 is rotated through the rotary cylinder 63 to enable the connecting block 64 to be separated from the stop block 62 in an abutting mode, the carrying seat 22 can be pulled out from the feeding window 13 to replace the wafer, after the wafer is replaced, the carrying seat 22 is slid into the box body 1, when the first baffle 61 abuts against the base seat 21, the connecting block 64 is rotated through the rotary cylinder 63 again to enable the connecting block 64 to abut against one end, close to the feeding window 13, of the stop block 62, and therefore complete wafer replacement operation is completed.

Referring to fig. 1 and 3, a second baffle 211 is fixedly connected to one end of the base 21 close to the feeding window 13, the second baffle 211 and the revolving cylinder 63 are respectively located on two opposite sides of the base 21, in order to be matched with the second baffle 211, an anti-falling block 221 is fixedly connected to one end of the carrying seat 22 far away from the feeding window 13, and one side surface of the anti-falling block 221 close to the feeding window 13 can abut against the second baffle 211, and a part of the carrying seat 22 slipping out of the base 21 is at a maximum limit value during abutting, so that when the carrying seat 22 is drawn out from the feeding window 13 by a worker, the situation that the carrying seat 22 completely slips out of the base 21 does not occur, and thus the worker can use the wafer carrying tray 2 to replace wafers conveniently.

Referring to fig. 1 and 2, in the embodiment, a lifting slide table 7 is disposed between a base seat 21 and a Y-direction screw slide table 32, wherein the lifting slide table 7 is fixedly connected to the slide table of the Y-direction screw slide table 32, and the lifting slide table 7 enables the base seat 21 to move vertically, on one hand, when a wafer needs to be replaced, the lifting slide table 7 can firstly enable a wafer carrying disk 2 to move downwards so as to enable the wafer carrying disk 2 to be far away from the upper inner wall of an accommodating chamber 11, so that a wafer on the wafer carrying disk 2 cannot touch the upper inner wall of the accommodating chamber 11 in a subsequent process that a carrying seat 22 is drawn out from a loading window 13, and thus the wafer after a test operation cannot be damaged in a replacement link, on the other hand, when a new wafer needs to be brought into contact with a probe again, the new wafer can firstly move to a lower portion of a communication hole 12 through a driving mechanism 3, and then the lifting slide table 7 enables the base seat 21 to move upwards, therefore, the wafer carrying disc 2 does not collide with the side surface of the probe to greatly bend the probe, and the probe is not damaged due to wafer replacement.

Referring to fig. 2 and 4, a rotating member 8 is disposed between the lifting sliding table 7 and the base seat 21, specifically, the rotating member 8 includes a connecting seat 81, a rotating seat 82, a first slider 83, a second slider 84, a connecting post 85 and a connecting arm 86, wherein the lower surface of the connecting seat 81 is fixedly connected with the lifting sliding table 7, and the lifting sliding table 7 enables the connecting seat 81 to move vertically; the upper surface of the rotating seat 82 is fixedly connected with the base seat 21, and the lower surface of the rotating seat 82 is rotatably connected with the connecting seat 81 through a bearing; the first sliding block 83 is connected to the connecting seat 81 in a sliding manner, and the sliding direction of the first sliding block 83 is perpendicular to the diameter direction of the rotary motion of the rotating seat 82; the second slider 84 is slidably connected to the first slider 83, and the sliding direction of the second slider 84 is perpendicular to the sliding direction of the first slider 83, and the sliding direction of the second slider 84 is parallel to the diameter direction of the rotary motion of the rotary seat 82; the connecting column 85 is fixedly arranged on the second slider 84; one end of the connecting arm 86 is fixedly connected with the peripheral side of the rotating seat 82, and the other end is rotatably sleeved on the connecting column 85 through a bearing, so that the second slider 84, the connecting column 85 and the connecting arm 86 can enable the rotating seat 82 to rotate in a reciprocating manner within a preset central angle range in the reciprocating linear motion process of the first slider 83, and the purpose of enabling the wafer carrying disc 2 to rotate in a reciprocating manner within the preset central angle range is achieved.

Referring to fig. 1, in this embodiment, because of box 1 is formed through the panel concatenation, so in order to further optimize the test environment in the box 1, the outer wall of box 1 is pasted and is had the electromagnetic shield strip, then box 1 can shield external interference more effectively, thereby the test that can weak signal of telecommunication provides better test environment, in addition the electromagnetic shield strip can also prevent outside vapor to get into the box, so the condition of frosting can not appear in the wafer that is in the box under low temperature environment, thereby can not influence normal wafer test work, in addition the outside of box 1 still has the one deck protection shield, in order to strengthen the protection to box 1.

The implementation principle of the electromagnetic shielding box for wafer test in the embodiment of the application is as follows: due to the arrangement of the box body 1 subjected to the conductive treatment and the communication hole 12, in the whole wafer testing process, the box body 1 subjected to the conductive treatment can shield external electromagnetic interference, the wafer is in contact with the external environment only at the communication hole 12, but equipment required by testing such as a probe and a microscope is arranged at the communication hole 12, so that the interference of the external environment on the wafer testing can be greatly reduced, and the accuracy of the wafer testing is not easily influenced.

The above are preferred embodiments of the present application, and the scope of protection of the present application is not limited thereto, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (8)

1. The utility model provides an electromagnetic shield case is used in wafer test which characterized in that: the probe box comprises a box body (1) subjected to conductive treatment, a crystal carrying disc (2) and a driving mechanism (3), wherein the box body (1) is provided with an accommodating cavity (11), a communication hole (12) is formed in the inner wall of the upper side of the accommodating cavity (11), and a probe can penetrate into the accommodating cavity (11) through the communication hole (12); a feeding window (13) communicated with the accommodating cavity (11) is formed in the outer wall of one side of the box body (1), and an opening and closing door (14) is arranged at the feeding window (13); the crystal carrying disc (2) is horizontally and movably arranged in the accommodating cavity (11); the driving mechanism (3) is arranged in the accommodating cavity (11), and the driving mechanism (3) is used for enabling the crystal carrying disc (2) to horizontally move.

2. The electromagnetic shielding box for wafer testing according to claim 1, wherein: the air spring shock absorber is characterized by further comprising a bottom plate (4) and an air spring shock absorber (5), wherein the bottom plate (4) is located below the box body (1); the air spring shock absorber (5) is arranged between the bottom plate (4) and the box body (1), the air spring shock absorber (5) is connected with the bottom plate (4) and the box body (1), and the air spring shock absorber (5) is used for preventing a microscope for observing a wafer from being vibrated.

3. The electromagnetic shielding box for wafer testing according to claim 1, wherein: the outer wall laminating of box (1) is provided with the electromagnetic shield strip.

4. The electromagnetic shielding box for wafer testing according to claim 1, wherein: the crystal carrying disc (2) comprises a base seat (21) and a carrying seat (22), and the base seat (21) is connected with the driving mechanism (3); the object carrying seat (22) is connected to the upper surface of the base seat (21) in a sliding mode, the sliding direction of the object carrying seat (22) is parallel to the direction of the central line of the feeding window (13), and the object carrying seat (22) can partially slide out of the base seat (21); carry thing seat (22) with be provided with retaining member (6) between basic foundation (21) actuating mechanism (3) drive during basic foundation (21) motion, retaining member (6) are used for making carry thing seat (22) with basic foundation (21) fixed connection.

5. The electromagnetic shielding box for wafer testing according to claim 4, wherein: the locking piece (6) comprises a first baffle (61), a stop block (62), a rotary cylinder (63) and a connecting block (64), the first baffle (61) is arranged at one end, close to the loading window (13), of the loading seat (22), and one side surface, far away from the loading window (13), of the first baffle (61) can be abutted to the base seat (21); the stop block (62) is fixedly arranged on the object carrying seat (22); the rotary cylinder (63) is fixedly arranged on the foundation base (21); one end of the connecting block (64) is fixedly connected with a piston rod of the rotary cylinder (63), and the other end of the connecting block can be abutted to one end, close to the feeding window (13), of the stop block (62).

6. The electromagnetic shielding box for wafer testing according to claim 5, wherein: a second baffle (211) is fixedly arranged on the base (21), and the second baffle (211) is positioned at one end, close to the feeding window (13), of the base (21); the fixed anticreep piece (221) that is provided with of year thing seat (22), anticreep piece (221) are located it keeps away from to carry thing seat (22) one of material loading window (13) is served, anticreep piece (221) are close to the one end of material loading window (13) can with second baffle (211) butt.

7. The electromagnetic shielding box for wafer testing according to claim 4, wherein: the driving mechanism (3) comprises an X-direction lead screw sliding table (31) and a Y-direction lead screw sliding table (32), and the X-direction lead screw sliding table (31) is fixedly arranged on the bottom wall of the accommodating cavity (11); y is in to lead screw slip table (32) fixed setting X is to on the slip table of lead screw slip table (31), Y is perpendicular to the length direction of lead screw slip table (32) X is to the length direction of lead screw slip table (31), Y to the slip table of lead screw slip table (32) with base (21) are connected.

8. The electromagnetic shielding box for wafer testing according to claim 7, wherein: a lifting sliding table (7) is arranged between the Y-direction screw sliding table (32) and the foundation base (21), the lifting sliding table (7) is fixedly arranged on the sliding table of the Y-direction screw sliding table (32), and the lifting sliding table (7) is connected with the foundation base (21) so as to enable the foundation base (21) to move vertically; lifting sliding table (7) with be provided with between basic foundation (21) and rotate piece (8), it is used for making to rotate piece (8) basic foundation (21) reciprocating rotation in predetermined central angle scope.

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