CN216745971U - Light path structure for three-dimensional shape measurement - Google Patents
Light path structure for three-dimensional shape measurement Download PDFInfo
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- CN216745971U CN216745971U CN202122485982.6U CN202122485982U CN216745971U CN 216745971 U CN216745971 U CN 216745971U CN 202122485982 U CN202122485982 U CN 202122485982U CN 216745971 U CN216745971 U CN 216745971U
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Abstract
The utility model discloses a three-dimensional topography measuring optical path structure, which comprises a semiconductor laser, a beam splitter, a first imaging objective, a second imaging objective, a first position detector and a second position detector, wherein the first imaging objective is arranged on the beam splitter; splitting a laser beam emitted by the semiconductor laser by a beam splitter to form a first laser beam and a second laser beam; the first laser beam and the second laser beam meet the requirement of spatial orthogonality, and the two laser beams are incident to the same point on the surface to be measured; the surface to be measured reflects two beams of light to the first imaging objective lens and the second imaging objective lens respectively, and the two beams of light are focused and then enter the first position detector and the second position detector respectively. The utility model forms two laser beams by a semiconductor laser, the two laser beams are incident to the same point of the surface to be measured, the position information in two directions of the same point is obtained by two position sensitive detectors, and then the data is decomposed into the relative height of the measuring area and the spatial inclination direction of the measuring surface, thus the utility model has higher measuring precision, low cost and easy popularization.
Description
Technical Field
The utility model relates to the field of three-dimensional shape detection, in particular to a light path structure for three-dimensional shape measurement.
Background
With the development of semiconductor technology and high-precision instruments and equipment, the requirement for detecting the 3d shape of the surface of a semiconductor device in the production process is greatly improved.
The PSD is a position-sensing photoelectric device, has the characteristics of high sensitivity and high response, and is commonly used for detecting the target space position. In the optical measurement apparatus in the prior art, a PSD detector is usually used to obtain the light spot condition of a point to be measured on a measurement surface, and height information of the surface is obtained according to the light spot condition. However, the surface topography of the semiconductor device is extremely high, and the detection requirements of the semiconductor device cannot be met only by height detection.
Therefore, it is necessary to improve the accuracy of the measuring device to solve the above problems.
SUMMERY OF THE UTILITY MODEL
In order to overcome the problems of the dust filtering method, the utility model provides an object three-dimensional shape measuring device, which solves the technical problem of inaccurate object three-dimensional measurement in the traditional method.
The utility model provides an optical path structure for measuring three-dimensional morphology, which solves the technical problem and comprises a semiconductor laser, a beam splitter, a first imaging objective, a second imaging objective, a first position detector and a second position detector;
the laser beam emitted by the semiconductor laser is split by the beam splitter to form a first laser beam and a second laser beam; the first laser beam and the second laser beam meet the requirement of spatial orthogonality, and the two beams of laser are incident to the same point on the surface to be measured;
the surface to be measured reflects the first laser beam and the second laser beam to the first imaging objective lens and the second imaging objective lens respectively, and the first laser beam and the second laser beam are focused and then enter the first position detector and the second position detector respectively.
Further, the device also comprises a collimating lens;
the laser emitted by the semiconductor laser firstly passes through the collimating lens for collimation and then enters the beam splitter.
Further, a first focusing lens is also included;
and a first laser beam formed after beam splitting by the beam splitter is collimated by the first focusing lens and then enters the surface to be measured.
Further, a second focusing lens is also included;
and a second laser beam formed after beam splitting by the beam splitter is collimated by the second focusing lens and then enters the surface to be measured.
Further, the device also comprises at least one reflecting mirror;
and the second laser beam formed after beam splitting by the beam splitter is reflected by a second laser beam reflector and then enters a second focusing lens.
Furthermore, the reflecting mirror comprises a first reflecting mirror and a second reflecting mirror, and the second laser beam is reflected by the first reflecting mirror and the second reflecting mirror in sequence and then enters the second focusing lens.
Further, the incident angles of the first laser beam and the second laser beam on the surface to be measured are the same, and the incident angle is 60 degrees.
One of the above technical solutions has the following advantages or beneficial effects: the utility model forms two laser beams by a semiconductor laser, the two laser beams are incident to the same point of the surface to be measured, the position information of the same point in two directions is obtained by two position sensitive detectors, and then the data is decomposed into the relative height of the measuring area and the spatial inclination direction of the measuring surface. Compared with the traditional measuring device which can only measure the height information of the three-dimensional topography, the measuring device has higher measuring precision. And only one semiconductor laser is used, so that the cost is low and the popularization is easy.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings of the embodiments will be briefly described below, and it is apparent that the drawings in the following description relate only to some embodiments of the present invention and are not limiting thereof, wherein:
FIG. 1 is a schematic structural diagram of an optical path structure for three-dimensional topography measurement according to the present invention;
FIG. 2 is a three-dimensional schematic view of measurement data fitting of an optical path structure for three-dimensional topography measurement according to the present invention.
The figure is marked with: 111. a semiconductor laser; 10. a first position detector; 121. a collimating lens; 13. a beam splitter; 14. a first focusing lens; 15. a first reflector; 16. a second reflector; 17. a second focusing lens; 18. a second imaging objective lens; 19. a first imaging objective lens; 20. a second position detector; 30. and (6) a surface to be measured.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments of the present invention, belong to the protection scope of the present invention.
In the drawings, the shape and size may be exaggerated for clarity, and the same reference numerals will be used throughout the drawings to designate the same or similar components.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the description and claims of the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Also, the use of the terms "a," "an," or "the" and similar referents do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprise" or "comprises", and the like, means that the element or item listed before "comprises" or "comprising" covers the element or item listed after "comprising" or "comprises" and its equivalents, and does not exclude other elements or items. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
In the following description, terms such as center, thickness, height, length, front, back, rear, left, right, top, bottom, upper, lower, etc., are defined with respect to the configurations shown in the respective drawings, and in particular, "height" corresponds to a dimension from top to bottom, "width" corresponds to a dimension from left to right, "depth" corresponds to a dimension from front to rear, which are relative concepts, and thus may be varied accordingly depending on the position in which it is used, and thus these or other orientations should not be construed as limiting terms.
Terms concerning attachments, coupling and the like (e.g., "connected" and "attached") refer to a relationship wherein structures are secured or attached, either directly or indirectly, to one another through intervening structures, as well as both movable or rigid attachments or relationships, unless expressly described otherwise.
As shown in fig. 1-2, an optical path structure for three-dimensional topography measurement includes a semiconductor laser 111, a beam splitter 13, a first imaging objective 19, a second imaging objective 18, a first position detector 10, and a second position detector 20; the laser beam emitted by the semiconductor laser 111 is split by the beam splitter 13 to form a first laser beam and a second laser beam; the first laser beam and the second laser beam meet the requirement of spatial orthogonality, and the two laser beams are incident to the same point on the surface to be measured 30; the two beams of light are reflected by the surface to be measured 30 to the first imaging objective lens 19 and the second imaging objective lens 18, and are focused and then respectively incident on the first position detector 10 and the second position detector 20.
Also included are a collimating lens 121, a first focusing lens 14, a second focusing lens 17, and at least one mirror.
The laser light emitted from the semiconductor laser 111 is collimated by the collimator lens 121 and then enters the beam splitter 13. The first laser beam formed by beam splitting by the beam splitter 13 is collimated by the first focusing lens 14 and then enters the surface to be measured 30. The second laser beam formed after beam splitting by the beam splitter 13 is collimated by the second focusing lens 17 and then enters the surface to be measured 30.
Specifically, the second laser beam reflected by the beam splitter 13 is incident on the second focusing lens 17. The reflecting mirror comprises a first reflecting mirror 15 and a second reflecting mirror 16, and the second laser beam is reflected by the first reflecting mirror 15 and the second reflecting mirror 16 in sequence and then enters a second focusing lens 17.
To improve the detection accuracy, the center wavelength of the semiconductor laser 111 is 488-535 nm. Preferably, the center wavelength of the semiconductor laser 111 is 488 nm. In other embodiments, the incident angles of the first laser beam and the second laser beam on the surface to be measured are the same and are 25-75 degrees. Preferably, the spot quality is better at an incidence angle of 60 degrees. The diameter of the laser beam emitted by the semiconductor laser 111 was 0.45 mm. The laser beam emitted from the semiconductor laser 111 measured the spot diameter of the laser light at 2 μm on the surface to be measured.
The feature on the surface 30 to be measured can be decomposed into the relative height of the region to be measured and the spatial tilt direction of the measurement surface, the change of the two features can cause the change of the gravity center position of the light spot on the PSD of the position sensitive detector, but the change of the light spot position on the PSD is the result of the combined action of the two features, two orthogonal lasers are used for simultaneously measuring the feature information of the same position, and two feature parameters in the height of the feature and the tilt direction of the measurement surface can be separated through calculation. And the three-dimensional morphology can be more accurately restored, represented and fitted according to the obtained height information matrix and the inclination information matrix.
Specifically, the first laser beam and the second laser beam respectively pass through the first focusing lens 14 and the second focusing lens 17, meet the spatial orthogonality, and are incident to the same point on the surface to be measured;
a measured point on the surface to be measured reflects a first laser beam and a second laser beam to a first imaging objective lens 19 and a second imaging objective lens 18 respectively, and the first laser beam and the second laser beam are incident on a first position detector 10 and a second position detector 20 respectively;
based on the point coordinates P obtained by the first position detector 101Point coordinates P obtained by the second position detector 202An object image transformation matrix of the imaging lens is M and a displacement matrix H1、H2To obtain a displacement matrix H1、H2And the slope information matrix S1、S2Obtained from a first position detectorPoint coordinate P1Point coordinate P obtained by the second position detector2A relation model (12) and a relation model (13) between the object image transformation matrix of the imaging lens M and the coordinates W of the measured point on the measured surface:
P1＝M·(S1·W+H1) (12)
P2＝M·(S2·W+H2) (13)
H1and H2The same; the object image transformation matrix of the imaging lens is:
f is focal length, d is lens thickness, h1For the distance of the detection point from the front surface of the imaging lens, h2Is the distance of the imaging lens from the position detector;
wherein,
in (C) XW,YW,ZWIs the coordinate of the measured point on the measured surface, XWAnd YWIs known;
solving S based on the relation model (12) and the relation model (13)1、S2W; the inclination information matrixes S1 and S2 comprise an angle phi of the rotation of a measured point around an X axis, an angle beta of the rotation of the measured point around a Y axis and an angle theta around a Z axis; z in WWRepresenting height information of a measured point;
according to height information and inclination information S of a plurality of measured points1、S2And reducing the three-dimensional appearance of the surface to be detected.
The two beams of laser are simultaneously incident to the same point of the surface to be measured, the position information of the same point in two directions is obtained through the two position sensitive detectors, the data on the two position sensitive detectors are decomposed into the relative height of a measuring area and the spatial inclination direction of a measuring surface, and the two data of the height of the feature and the two data of the inclination direction of the measuring surface can be separated after calculation. Compared with the traditional measuring device which can only measure the height information of the three-dimensional topography, the measuring device has higher measuring precision.
The number of apparatuses and the scale of the process described herein are intended to simplify the description of the present invention. Applications, modifications and variations of the present invention will be apparent to those skilled in the art.
The features of the different implementations described herein may be combined to form other embodiments not specifically set forth above. The components may be omitted from the structures described herein without adversely affecting their operation. Further, various individual components may be combined into one or more individual components to perform the functions described herein.
Furthermore, while embodiments of the utility model have been described above, it is not limited to the applications set forth in the description and the embodiments, which are fully applicable in a variety of fields of endeavor to which the utility model pertains, and further modifications may readily be made by those skilled in the art, it being understood that the utility model is not limited to the details shown and described herein without departing from the general concept defined by the appended claims and their equivalents.
Claims (7)
1. An optical path structure for three-dimensional topography measurement is characterized by comprising a semiconductor laser (111), a beam splitter (13), a first imaging objective (19), a second imaging objective (18), a first position detector (10) and a second position detector (20);
laser beams emitted by the semiconductor laser (111) are split by the beam splitter (13) to form a first laser beam and a second laser beam; the first laser beam and the second laser beam meet the requirement of spatial orthogonality, and the two laser beams are incident to the same point on the surface to be measured (30);
the surface to be measured (30) reflects the first laser beam and the second laser beam to the first imaging objective lens (19) and the second imaging objective lens (18) respectively, and the first laser beam and the second laser beam are focused and then enter the first position detector (10) and the second position detector (20) respectively.
2. The optical path structure for three-dimensional topography measurement according to claim 1, further comprising a collimating lens (121);
laser emitted by the semiconductor laser (111) enters the beam splitter (13) after being collimated by the collimating lens (121).
3. The optical path structure for three-dimensional topography measurement according to claim 1, further comprising a first focusing lens (14);
and a first laser beam formed after beam splitting by the beam splitter (13) is collimated by the first focusing lens (14) and then enters the surface to be measured (30).
4. The optical path structure for three-dimensional topography measurement according to claim 1, further comprising a second focusing lens (17);
and a second laser beam formed after beam splitting by the beam splitter (13) is collimated by the second focusing lens (17) and then enters the surface to be measured (30).
5. The optical circuit structure for three-dimensional topographic measurement as set forth in claim 4, further comprising at least one mirror;
and a second laser beam reflector formed after beam splitting by the beam splitter (13) reflects the laser beam and then enters a second focusing lens (17).
6. The optical path structure for three-dimensional topography measurement according to claim 5, wherein said reflector comprises a first reflector (15) and a second reflector (16), and the second laser beam is incident to the second focusing lens (17) after being reflected by the first reflector (15) and the second reflector (16) in sequence.
7. The optical path structure for three-dimensional topography measurement according to claim 1, wherein the first laser beam and the second laser beam have the same incident angle on the surface to be measured, and the incident angle is 60 degrees.
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Address after: 215000 building 11, No. 198, Jialingjiang Road, high tech Zone, Suzhou, Jiangsu Patentee after: Gaoshi Technology (Suzhou) Co.,Ltd. Address before: 215000 building 11, No. 198, Jialingjiang Road, high tech Zone, Suzhou, Jiangsu Patentee before: Gaoshi Technology (Suzhou) Co.,Ltd. |