CN216671677U

CN216671677U - LED chip packaging structure

Info

Publication number: CN216671677U
Application number: CN202123243374.0U
Authority: CN
Inventors: 倪亚申
Original assignee: Shenzhen Baohelin Semiconductor Technology Co ltd
Current assignee: Shenzhen Baohelin Semiconductor Technology Co ltd
Priority date: 2021-12-22
Filing date: 2021-12-22
Publication date: 2022-06-03
Anticipated expiration: 2031-12-22

Abstract

The utility model relates to an LED chip packaging structure which comprises a substrate, wherein two conducting layers are fixedly arranged inside the substrate, the two conducting layers are respectively positioned on the left side and the right side inside the substrate, a diffusion layer is fixedly arranged inside the substrate, a lens is fixedly arranged on the top of the substrate, a heat dissipation system is fixedly arranged at the bottom of the substrate, and the heat dissipation system comprises an adhesive plate, a heat conduction column, a heat dissipation sheet, a chip, a metal wire and a packaging adhesive layer. This LED chip packaging structure through the base plate that sets up, plays the effect of supporting and fixed components and parts, and the conducting layer of setting plays the effect that provides the passageway for the electric current, and the diffusion layer of setting plays the effect of the light diffusion that will send, and the lens of setting plays the effect with light further diffusion, and the cooling system of setting plays the heat that the conduction chip produced to the effect of going out the heat diffusion that will produce.

Description

LED chip packaging structure

Technical Field

The utility model relates to the technical field of LEDs, in particular to an LED chip packaging structure.

Background

The LED chip is a solid semiconductor device, the heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support, the other end of the wafer is a cathode, the other end of the wafer is connected with an anode of a power supply, the whole wafer is packaged by epoxy resin, the wafer is a core component of an LED lamp, namely a P-N junction, the core component has the main function of converting electric energy into light energy, the main material of the chip is monocrystalline silicon, the semiconductor wafer is composed of two parts, one part is a P-type semiconductor, and the other part is an N-type semiconductor.

The LED is a potential light source for replacing incandescent lamps, tungsten lamps and fluorescent lamps, has the characteristics of high efficiency, energy conservation and good luminous stability, but the LED chip is packaged by glue, so that heat generated by the LED chip is difficult to dissipate, and the gathered heat can damage internal components, so that the service life of the LED lamp is shortened, and the LED chip packaging structure is provided for solving the problems.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects of the prior art, the utility model provides an LED chip packaging structure which has the advantages of high-efficiency heat dissipation and the like, and solves the problems that the heat generated by an LED chip is difficult to dissipate, the gathered heat can damage internal components and parts and the service life of an LED lamp is shortened due to the fact that the LED chip is packaged by glue.

In order to achieve the purpose, the utility model provides the following technical scheme: an LED chip packaging structure comprises a substrate, wherein a conductive layer is fixedly arranged inside the substrate, a diffusion layer is fixedly arranged inside the substrate, a lens is fixedly arranged at the top of the substrate, and a heat dissipation system is fixedly arranged at the bottom of the substrate;

the heat dissipation system comprises a bonding plate, a heat conduction column, a cooling fin, a chip, a metal wire and a packaging adhesive layer, wherein the cooling fin is fixedly mounted at the bottom of the substrate, the heat conduction column is fixedly mounted at the top of the cooling fin, the bonding plate is fixedly mounted at the top of the heat conduction column, the chip is fixedly mounted at the top of the bonding plate, the metal wire is fixedly mounted on the left side and the right side of the chip, and the packaging adhesive layer is fixedly mounted at the top of the chip.

Furthermore, the number of conducting layers is two, and two conducting layers are located the inside left and right sides of base plate respectively, the diffusion layer is located the middle part at the inside top of base plate.

Furthermore, the number of the heat conduction columns is four, one end of each of the four heat conduction columns is located in the middle of the top of the radiating fin, and one end, far away from the radiating fin, of each of the four heat conduction columns surrounds the upper side, the lower side, the left side and the right side of the bonding plate.

Furthermore, the number of the metal wires is two, one ends of the two metal wires are respectively connected with the left side and the right side of the chip, and the ends, far away from the chip, of the two metal wires are respectively connected with the two conducting layers.

Further, the encapsulation glue film is located the inside of diffusion barrier, the encapsulation glue film parcel is in the outside of two metal wire, and lens are located the top of encapsulation glue film.

Further, the chip is located in the middle of the top of the bonding plate, the bottom of the bonding plate is fixedly connected with the substrate, and the chip is fixedly connected with the substrate through the bonding plate.

Compared with the prior art, the technical scheme of the application has the following beneficial effects:

1. this LED chip packaging structure through the base plate that sets up, plays the effect of supporting and fixed components and parts, and the conducting layer of setting plays the effect that provides the passageway for the electric current, and the diffusion layer of setting plays the effect of the light diffusion that will send, and the lens of setting plays the effect with light further diffusion, and the cooling system of setting plays the heat that the conduction chip produced to the effect of going out the heat diffusion that will produce.

2. The LED chip packaging structure plays a role in bonding the chip and the substrate through the arranged bonding plate, the heat generated by the chip is conducted to the heat-conducting column, the arranged heat-conducting column further conducts the heat conducted by the bonding plate to the heat-radiating fin, the arranged heat-radiating fin collects the heat generated by the chip, the chip plays a role in dissipating heat, the arranged chip plays a role in controlling light emission, the arranged metal lead plays a role in transferring electric energy in the conductive layer to the chip, the arranged packaging adhesive layer plays a role in protecting the chip from being influenced when the chip works in various environments, the LED lamp has the advantages that the working stability of the chip is improved, and the problems that the heat generated by the LED chip is difficult to dissipate due to the fact that the LED chip is packaged by glue, and the gathered heat can damage internal components, so that the service life of the LED lamp is shortened are solved.

Drawings

FIG. 1 is a front side cutaway view of the present invention;

FIG. 2 is a schematic top view of the present invention;

FIG. 3 is a schematic front view of the present invention.

In the figure: 1 substrate, 2 conductive layers, 3 diffusion layers, 4 lenses, 5 heat dissipation systems, 501 adhesive plates, 502 heat conduction columns, 503 heat dissipation fins, 504 chips, 505 metal wires and 506 packaging adhesive layers.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, an LED chip package structure includes a substrate 1, a substrate 1 is disposed to support and fix components, a conductive layer 2 is fixedly mounted inside the substrate 1, the conductive layer 2 is disposed to provide a channel for current, a diffusion layer 3 is fixedly mounted inside the substrate 1, the diffusion layer 3 is disposed to diffuse light, a lens 4 is fixedly mounted on the top of the substrate 1, the lens 4 is disposed to further diffuse light, a heat dissipation system 5 is fixedly mounted at the bottom of the substrate 1, and the heat dissipation system 5 is disposed to conduct heat generated by a chip 504 and diffuse the generated heat;

referring to fig. 1-3, the heat dissipation system 5 includes an adhesive plate 501, a heat conducting pillar 502, a heat sink 503, a chip 504, a metal wire 505 and a packaging adhesive layer 506, the bottom of the substrate 1 is fixedly mounted with the heat sink 503, the heat sink 503 is arranged to collect heat generated by the chip 504 and disperse the heat, the top of the heat sink 503 is fixedly mounted with the heat conducting pillar 502, the heat conducting pillar 502 is arranged to conduct the heat conducted by the adhesive plate 501 to the heat sink 503, the top of the heat conducting pillar 502 is fixedly mounted with the adhesive plate 501, the adhesive plate 501 is arranged to adhere the chip 504 and the substrate 1 via the adhesive plate 501 and conduct the heat generated by the chip 504 to the heat conducting pillar 502, the top of the adhesive plate 501 is fixedly mounted with the chip 504, the chip 504 is arranged to control light emission, the metal wire 505 is fixedly mounted on both left and right sides of the chip 504, the metal wire 505 that sets up plays the effect of transmitting the electric energy in the conducting layer 2 for chip 504, and the top fixed mounting of chip 504 has encapsulation glue film 506, and the encapsulation glue film 506 that sets up plays the not influenced effect of protection chip 504 work under various environment to play the effect that improves chip 504 job stabilization nature.

When in implementation, the method comprises the following steps:

1) the current is transmitted to the chip 504 through the metal wire 505;

2) the chip 504 controls light emission under the action of current;

3) heat generated by the chip 504 is conducted to the heat sink 503 through the adhesive plate 501 and the heat-conducting column 502;

4) the heat sink 503 collects heat generated by the chip 504 and dissipates the heat.

To sum up, this LED chip packaging structure through the base plate 1 that sets up, plays the effect of supporting and fixed components and parts, and the conducting layer 2 of setting plays the effect of providing the passageway for the electric current, and the diffusion layer 3 of setting plays the effect of the light diffusion that will send, and the lens 4 of setting plays the effect with light further diffusion, and the cooling system 5 of setting plays the heat that the conduction chip 504 produced to the effect of going out the heat diffusion that will produce.

Moreover, the bonding plate 501 is arranged to bond the chip 504 and the substrate 1 and conduct heat generated by the chip 504 to the heat-conducting column 502, the heat-conducting column 502 is arranged to conduct heat conducted by the bonding plate 501 to the heat-radiating fin 503, the heat-radiating fin 503 is arranged to gather heat generated by the chip 504 and disperse the heat, the chip 504 is arranged to control light emission, the metal wire 505 is arranged to conduct electric energy in the conductive layer 2 to the chip 504, the packaging adhesive layer 506 is arranged to protect the chip 504 from being affected when the chip 504 works in various environments and improve the working stability of the chip 504, so that the problem that the heat generated by the LED chip 504 is difficult to diffuse due to the fact that the LED chip 504 is packaged by glue is solved, and the gathered heat can damage internal components, so that the service life of the LED lamp is shortened.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An LED chip packaging structure comprises a substrate (1), and is characterized in that: a conducting layer (2) is fixedly arranged inside the substrate (1), a diffusion layer (3) is fixedly arranged inside the substrate (1), a lens (4) is fixedly arranged on the top of the substrate (1), and a heat dissipation system (5) is fixedly arranged on the bottom of the substrate (1);

the heat dissipation system (5) comprises a bonding plate (501), a heat conduction column (502), a cooling fin (503), a chip (504), a metal wire (505) and a packaging adhesive layer (506), wherein the cooling fin (503) is fixedly mounted at the bottom of the substrate (1), the heat conduction column (502) is fixedly mounted at the top of the cooling fin (503), the bonding plate (501) is fixedly mounted at the top of the heat conduction column (502), the chip (504) is fixedly mounted at the top of the bonding plate (501), the metal wire (505) is fixedly mounted at the left side and the right side of the chip (504), and the packaging adhesive layer (506) is fixedly mounted at the top of the chip (504).

2. The LED chip package structure of claim 1, wherein: the number of the conducting layers (2) is two, the two conducting layers (2) are respectively located on the left side and the right side of the inner portion of the substrate (1), and the diffusion layer (3) is located in the middle of the top of the inner portion of the substrate (1).

3. The LED chip package structure of claim 1, wherein: the number of the heat conduction columns (502) is four, one ends of the four heat conduction columns (502) are located in the middle of the top of the radiating fin (503), and one ends of the four heat conduction columns (502) far away from the radiating fin (503) are surrounded on the upper side, the lower side, the left side and the right side of the bonding plate (501).

4. The LED chip package structure of claim 2, wherein: the number of the metal wires (505) is two, one ends of the two metal wires (505) are respectively connected with the left side and the right side of the chip (504), and one ends of the two metal wires (505) far away from the chip (504) are respectively connected with the two conducting layers (2).

5. The LED chip package structure of claim 4, wherein: the packaging adhesive layer (506) is located inside the diffusion layer (3), the packaging adhesive layer (506) wraps the two metal wires (505), and the lens (4) is located at the top of the packaging adhesive layer (506).

6. The LED chip package structure of claim 1, wherein: the chip (504) is located in the middle of the top of the bonding plate (501), the bottom of the bonding plate (501) is fixedly connected with the substrate (1), and the chip (504) is fixedly connected with the substrate (1) through the bonding plate (501).