CN216648256U

CN216648256U - Conveying device for wafer processing

Info

Publication number: CN216648256U
Application number: CN202123301096.XU
Authority: CN
Inventors: 胡建军
Original assignee: Suzhou Yingerjie Semiconductor Co ltd
Current assignee: Suzhou Yingerjie Semiconductor Co ltd
Priority date: 2021-12-23
Filing date: 2021-12-23
Publication date: 2022-05-31
Anticipated expiration: 2031-12-23

Abstract

The utility model discloses a conveying device for wafer processing, which is technically characterized in that: the conveying device comprises a conveying table, wherein a first mounting groove is formed in the surface of the conveying table, a conveying belt is mounted in the first mounting groove, two symmetrical second mounting grooves are formed in the surface of one side of the conveying table, a moving mechanism is mounted in the second mounting groove, two first servo electric cylinders are mounted on the moving mechanism, an arch-shaped plate is mounted on the first servo electric cylinders, and a rodless cylinder is mounted on the arch-shaped plate; install first mounting panel on the output of rodless cylinder, fixed mounting has angle adjustment mechanism on the first mounting panel, conveniently adjusts vacuum chuck's turned angle through angle adjustment mechanism to the conveying angle of wafer has been adjusted, keeps the transport angle of wafer unanimous, improves the machining efficiency of process on next step, improves the precision of wafer angular adjustment greatly through vision sensor.

Description

Conveying device for wafer processing

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a conveying device for wafer processing.

Background

Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed.

The existing conveying device for wafer processing is inconvenient to adjust the position where a wafer is placed when in use and the placing angle of the wafer, so that the angle adjustment is needed in the next procedure, and the wafer processing efficiency is greatly reduced.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a wafer processing transport apparatus to solve the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme: a conveying device for wafer processing comprises a conveying table, wherein a first mounting groove is formed in the surface of the conveying table, a conveying belt is installed in the first mounting groove, two symmetrical second mounting grooves are formed in the surface of one side of the conveying table, a moving mechanism is installed in the second mounting groove, two first servo electric cylinders are installed on the moving mechanism, a bow-shaped plate is installed on each first servo electric cylinder, and a rodless air cylinder is installed on each bow-shaped plate;

install first mounting panel on the output of rodless cylinder, fixed mounting has angle adjustment mechanism on the first mounting panel, the last servo electric jar of second of installing of angle adjustment mechanism, install vacuum chuck on the servo electric jar of second, install visual sensor in the vacuum chuck, install negative pressure mechanism on the lower surface of conveying platform, negative pressure mechanism's one end with vacuum chuck is connected.

Preferably, moving mechanism includes lead screw, guide arm, first servo motor and two and removes the slider, the both ends of lead screw are all installed through the bearing rotation in the second mounting groove, the both ends of guide arm are all fixed in the second mounting groove, first servo motor pass through the shaft coupling with the lead screw transmission is connected, first servo motor fixed mounting be in conveying bench, one of them remove slider threaded connection on the lead screw, another remove slider slidable mounting be in on the guide arm, first servo electric cylinder is installed remove on the slider.

Preferably, the angle adjusting mechanism comprises a second servo motor and a second mounting plate, the second servo motor is fixedly mounted on the first mounting plate, the second mounting plate is mounted on an output shaft of the second servo motor, and the second servo cylinder is mounted on the second mounting plate.

Preferably, the negative pressure mechanism comprises a negative pressure air pump and a telescopic pipe, the negative pressure air pump is fixedly installed on the conveying table, and two ends of the telescopic pipe are respectively installed on the negative pressure air pump and the vacuum chuck.

Preferably, the conveying table is provided with two symmetrical L-shaped plates, the L-shaped plates are provided with third servo electric cylinders, and output shafts of the third servo electric cylinders are provided with strip-shaped plates.

Preferably, the strip-shaped plate is provided with a baffle plate, and a Teflon layer is adhered to the baffle plate.

Preferably, a plurality of supporting legs which are symmetrically distributed are mounted on the lower surface of the conveying table, and anti-slip pads are mounted on the lower surfaces of the supporting legs.

Compared with the prior art, the utility model has the beneficial effects that:

firstly, in the conveying device for wafer processing, the conveying speed and efficiency of a wafer can be increased by the aid of the conveying belt, the horizontal moving position of the first servo electric cylinder can be conveniently adjusted by the aid of the moving mechanism, the fixing of the rodless cylinder is facilitated by the aid of the arched plate, and the horizontal moving position of the vacuum chuck is conveniently adjusted by the aid of the rodless cylinder;

secondly, among this conveyer for wafer processing, adsorb the wafer through vacuum chuck is convenient, reduce the damage on wafer surface, conveniently adjust vacuum chuck's turned angle through angle adjustment mechanism to the conveying angle of wafer has been adjusted, keeps the transport angle of wafer unanimous, improves the machining efficiency of process on next step, improves the precision of wafer angular adjustment greatly through visual sensor.

Drawings

FIG. 1 is a schematic view of the present invention;

FIG. 2 is a second schematic structural diagram of the present invention;

FIG. 3 is a third schematic structural diagram of the present invention;

fig. 4 is a partially enlarged view of a portion a in fig. 2.

In the figure: 1. a transfer table; 2. a first mounting groove; 3. a conveyor belt; 4. a second mounting groove; 5. a moving mechanism; 51. a screw rod; 52. a guide bar; 53. a first servo motor; 54. moving the slide block; 6. a first servo electric cylinder; 7. a bow-shaped plate; 8. a rodless cylinder; 9. a first mounting plate; 10. an angle adjusting mechanism; 101. a second servo motor; 102. a second mounting plate; 11. a second servo electric cylinder; 12. a vacuum chuck; 13. a vision sensor; 14. a negative pressure mechanism; 141. a negative pressure air pump; 142. a telescopic pipe; 15. an L-shaped plate; 16. a third servo electric cylinder; 17. a strip plate; 18. a baffle plate; 19. a layer of Teflon; 20. supporting legs; 21. a non-slip mat.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a conveyer is used in wafer processing, including conveying platform 1, conveying platform 1 has seted up first mounting groove 2 on the surface, install conveyer belt 3 in first mounting groove 2, conveying platform 1's a side sets up the second mounting groove 4 of two symmetries on the surface, install moving mechanism 5 in the second mounting groove 4, moving mechanism 5 is last to install two first servo electric jar 6, install bow template 7 on the first servo electric jar 6, install rodless cylinder 8 on the bow template 7, be favorable to accelerating the speed and the efficiency of wafer conveying through conveyer belt 3, conveniently adjust the horizontal migration's of first servo electric jar 6 position through moving mechanism 5, make things convenient for rodless cylinder 8's fixed through bow template 7, conveniently adjust the horizontal migration position of vacuum chuck 12 through rodless cylinder 8.

The output end of the rodless cylinder 8 is provided with a first mounting plate 9, the first mounting plate 9 is fixedly provided with an angle adjusting mechanism 10, the angle adjusting mechanism 10 is provided with a second servo electric cylinder 11, the second servo electric cylinder 11 is provided with a vacuum chuck 12, a vision sensor 13 is arranged in the vacuum chuck 12, the lower surface of the conveying table 1 is provided with a negative pressure mechanism 14, one end of the negative pressure mechanism 14 is connected with the vacuum chuck 12, the conveying speed and the efficiency of the wafer are favorably accelerated through a conveying belt 3, the horizontal moving position of the first servo electric cylinder 6 is conveniently adjusted through a moving mechanism 5, the rodless cylinder 8 is conveniently fixed through an arch-shaped plate 7, the horizontal moving position of the vacuum chuck 12 is conveniently adjusted through the rodless cylinder 8, the wafer is conveniently adsorbed through the vacuum chuck 12, the damage to the surface of the wafer is reduced, the rotating angle of the vacuum chuck 12 is conveniently adjusted through the angle adjusting mechanism 10, therefore, the transmission angle of the wafer is adjusted, the conveying angle of the wafer is kept consistent, the processing efficiency of the next procedure is improved, the precision of the angle adjustment of the wafer is greatly improved through the vision sensor 13, the vision sensor 13 is in the prior art, and the vision sensor with the model number of SC2135 is adopted.

In this embodiment, preferably, the moving mechanism 5 includes a screw rod 51, a guide rod 52, a first servo motor 53 and two moving sliders 54, two ends of the screw rod 51 are rotatably installed in the second installation groove 4 through bearings, two ends of the guide rod 52 are fixed in the second installation groove 4, the first servo motor 53 is in transmission connection with the screw rod 51 through a coupling, the first servo motor 53 is fixedly installed on the transmission table 1, one of the moving sliders 54 is in threaded connection with the screw rod 51, the other moving slider 54 is slidably installed on the guide rod 52, the first servo electric cylinder 6 is installed on the moving slider 54, the first servo motor 53 drives the screw rod 51 to rotate, one of the moving sliders 54 moves on the screw rod 51, and drives the other moving slider 54 to slide on the guide rod 52, so as to conveniently adjust the horizontal moving position of the first servo electric cylinder 6.

In this embodiment, preferably, the angle adjusting mechanism 10 includes a second servo motor 101 and a second mounting plate 102, the second servo motor 101 is fixedly mounted on the first mounting plate 9, the second mounting plate 102 is mounted on an output shaft of the second servo motor 101, the second servo electric cylinder 11 is mounted on the second mounting plate 102, the output shaft of the second servo motor 101 drives the second mounting plate 102 to rotate, and the rotation angle of the vacuum chuck 12 is conveniently adjusted.

In this embodiment, preferably, the negative pressure mechanism 14 includes a negative pressure air pump 141 and a telescopic tube 142, the negative pressure air pump 141 is fixedly installed on the conveying table 1, two ends of the telescopic tube 142 are respectively installed on the negative pressure air pump 141 and the vacuum chuck 12, and the negative pressure generated by the negative pressure air pump 141 is transmitted to the vacuum chuck 12 through the telescopic tube 142, so as to facilitate the adsorption of the wafer.

In this embodiment, preferably, two symmetrical L-shaped plates 15 are installed on the conveying table 1, a third servo electric cylinder 16 is installed on the L-shaped plate 15, a strip-shaped plate 17 is installed on an output shaft of the third servo electric cylinder 16, and the horizontal displacement of the strip-shaped plate 17 is conveniently adjusted through the third servo electric cylinder 16 installed on the L-shaped plate 15.

In this embodiment, preferably, the strip-shaped plate 17 is provided with the baffle 18, the baffle 18 is provided with the teflon layer 19 in an adhering manner, and the baffle 18 arranged on the strip-shaped plate 17 facilitates adjusting the position of the baffle 18 and the adhered teflon layer 19, so that the surface of the baffle 18 is prevented from being scratched on the surface of the wafer.

In this embodiment, preferably, a plurality of symmetrically distributed supporting legs 20 are installed on the lower surface of the conveying table 1, and non-slip mats 21 are installed on the lower surfaces of the supporting legs 20, so that the stability of the device contacting with the ground is improved by the non-slip mats 21 installed on the supporting legs 20.

The working principle is as follows: this conveyer for wafer processing when using, carry vacuum chuck 12 through the negative pressure that negative pressure mechanism 14 will produce, adjust the height of vacuum chuck 12 through second servo electric jar 11, make things convenient for vacuum chuck 12 to adsorb on the wafer, visual sensor 13 detects the angle of placing of wafer, and adjust the proofreading through the angle adjustment mechanism 10 to the angle of wafer, second servo electric jar 11 drives the wafer rebound, it is close to one side of conveyer belt 3 to drive the wafer through moving mechanism 5, adjust the position of wafer through rodless cylinder 8, place the wafer on conveyer belt 3.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A conveyer for wafer processing, includes conveying platform (1), its characterized in that: the conveying device is characterized in that a first mounting groove (2) is formed in the surface of the conveying table (1), a conveying belt (3) is installed in the first mounting groove (2), two symmetrical second mounting grooves (4) are formed in the surface of one side of the conveying table (1), a moving mechanism (5) is installed in the second mounting groove (4), two first servo electric cylinders (6) are installed on the moving mechanism (5), a bow-shaped plate (7) is installed on the first servo electric cylinders (6), and a rodless air cylinder (8) is installed on the bow-shaped plate (7);

install first mounting panel (9) on the output of rodless cylinder (8), fixed mounting has angle adjustment mechanism (10) on first mounting panel (9), install second servo electric jar (11) on angle adjustment mechanism (10), install vacuum chuck (12) on second servo electric jar (11), install visual sensor (13) in vacuum chuck (12), install negative pressure mechanism (14) on the lower surface of conveying platform (1), the one end of negative pressure mechanism (14) with vacuum chuck (12) are connected.

2. The wafer processing conveyor of claim 1, wherein: the moving mechanism (5) comprises a screw rod (51), a guide rod (52), a first servo motor (53) and two moving sliding blocks (54), two ends of the screw rod (51) are rotatably installed in the second installation groove (4) through bearings, two ends of the guide rod (52) are fixed in the second installation groove (4), the first servo motor (53) is in transmission connection with the screw rod (51) through a coupler, the first servo motor (53) is fixedly installed on the conveying table (1), one of the moving sliding blocks (54) is in threaded connection with the screw rod (51), the other moving sliding block (54) is in sliding installation on the guide rod (52), and the first servo electric cylinder (6) is installed on the moving sliding block (54).

3. The wafer processing conveyor of claim 1, wherein: the angle adjusting mechanism (10) comprises a second servo motor (101) and a second mounting plate (102), the second servo motor (101) is fixedly mounted on the first mounting plate (9), the second mounting plate (102) is mounted on an output shaft of the second servo motor (101), and a second servo electric cylinder (11) is mounted on the second mounting plate (102).

4. The wafer processing conveyor of claim 1, wherein: the negative pressure mechanism (14) comprises a negative pressure air pump (141) and a telescopic pipe (142), the negative pressure air pump (141) is fixedly installed on the conveying table (1), and two ends of the telescopic pipe (142) are respectively installed on the negative pressure air pump (141) and the vacuum sucker (12).

5. The wafer processing conveyor of claim 1, wherein: the conveying platform is characterized in that two symmetrical L-shaped plates (15) are installed on the conveying platform (1), a third servo electric cylinder (16) is installed on each L-shaped plate (15), and a strip-shaped plate (17) is installed on an output shaft of each third servo electric cylinder (16).

6. The wafer processing transfer apparatus of claim 5, wherein: the strip-shaped plates (17) are provided with baffle plates (18), and the baffle plates (18) are adhered with Teflon layers (19).

7. The wafer processing conveyor of claim 1, wherein: the conveying table is characterized in that a plurality of symmetrically distributed supporting legs (20) are mounted on the lower surface of the conveying table (1), and anti-slip pads (21) are mounted on the lower surfaces of the supporting legs (20).