CN216599700U - High-frequency multilayer circuit board based on mobile phone communication - Google Patents
High-frequency multilayer circuit board based on mobile phone communication Download PDFInfo
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- CN216599700U CN216599700U CN202220051084.1U CN202220051084U CN216599700U CN 216599700 U CN216599700 U CN 216599700U CN 202220051084 U CN202220051084 U CN 202220051084U CN 216599700 U CN216599700 U CN 216599700U
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Abstract
The utility model relates to the technical field of circuit boards, in particular to a high-frequency multilayer circuit board based on mobile phone communication, the inside of the multilayer circuit board body is provided with a plurality of conductive pattern layers from top to bottom, the upper part and the lower part are adjacent to each other, an insulating layer is arranged between the conductive pattern layers, a sealant is arranged between the conductive pattern layers and the insulating layer, a first groove is arranged at the middle position on the right side of the upper surface of the multilayer circuit board body, a metal patch is closely attached to the bottom of the first groove, a cover plate is arranged above the first groove, a rotating shaft is arranged on the left side of the cover plate, the front end and the rear end of the rotating shaft are both inserted into the first groove, and the metal patch is closely attached with a flat cable; the utility model discloses in the memory process of multilayer circuit board body, lift the apron, take off the winding displacement from the metal patch for multilayer circuit board body deposits alone with the winding displacement, has prolonged the life of multilayer circuit board body.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a based on cell-phone communication high frequency multilayer circuit board.
Background
The name of the circuit board is circuit board, PCB board, etc., which is miniaturized and visualized, and plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances. Has the characteristics of high wiring density, light weight, thin thickness, good bending property and the like. The circuit board divides according to the number of layers: the multilayer circuit board is formed by laminating more than three conductive pattern layers and insulating materials between the conductive pattern layers at intervals.
The high frequency multilayer circuit board for communication that prior art developed, high frequency multilayer circuit board for communication like CN206775814U, this utility model adopts epoxy glass cloth plate layer can strengthen the hardness and the thickness of circuit board body as the bottom, it can accord with the requirement of present communication to the high frequency to be provided with the polyimide copper-clad plate in the outside of circuit board body, but it has following weak point in the use, the multilayer circuit board is external generally has the winding displacement, at the in-process of depositing, the winding displacement intertwine is in the same place, lead to the winding displacement to take place the fracture, can influence the use of multilayer circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a based on cell-phone communication high frequency multilayer circuit board to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a high frequency multilayer circuit board based on cell-phone communication, includes multilayer circuit board body, conductive pattern layer and insulating layer, the inside of multilayer circuit board body is from last down being provided with a plurality of conductive pattern layers, and is adjacent from top to bottom be provided with the insulating layer between the conductive pattern layer, be provided with sealed glue between conductive pattern layer and the insulating layer, first recess has been seted up to the intermediate position on multilayer circuit board body upper surface right side, and hugs closely in the bottom of first recess and be provided with the metal paster, the top of first recess is provided with the apron, the left side of apron is provided with the pivot, both ends are all pegged graft on first recess around the pivot, the metal paster is provided with the winding displacement on last the subsides.
As the utility model discloses scheme further again, both ends all are provided with the joint piece around the apron right side, the second recess has been seted up for the position of joint piece on the first recess, the left and right sides of second recess all is provided with the arch, bellied inboard is provided with the spring, the end of spring is hugged closely on the wall body of second recess.
As the utility model discloses scheme further again, be provided with the third recess for bellied position on the joint piece, arch and third recess phase-match, the fourth recess has been seted up to the intermediate position of apron right side wall body, the left side of apron is provided with signal indication lamp.
As the utility model discloses further scheme again, the outside of multilayer circuit board body is provided with the fixed block, four corners of fixed block bottom all are provided with the supporting legs, the bottom of supporting legs is hugged closely and is provided with the shock pad.
As the utility model discloses scheme further again, the upper and lower both ends of multilayer circuit board body are all hugged closely and are provided with the polyimide copper-clad plate, and hug closely in the outside of polyimide copper-clad plate and be provided with the nickel coating.
As the utility model discloses scheme further again, a plurality of heat dissipation holes have been seted up on the wall body of fixed block, and are a plurality of on the equal multilayer circuit board body of heat dissipation hole, it is provided with the conducting strip to hug closely on the inner wall of heat dissipation hole.
As the utility model discloses scheme further again, the outside of conducting strip and the outside of nickel coating are all hugged closely and are provided with waterproof coating, four corners of fixed block upper surface all are provided with the bracing piece.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses first recess has been seted up at the intermediate position on multilayer circuit board body upper surface right side, and hug closely in the bottom of first recess and be provided with the metal paster, be provided with the apron in the top of first recess, it is provided with the winding displacement to go up to paste at the metal paster, in the memory process of multilayer circuit board body, lift the apron, take off the winding displacement from the metal paster, make multilayer circuit board body and winding displacement deposit alone, ensure carrying out the in-process of storage to multilayer circuit board body, the winding displacement can not twine together, lead to not breaking occur between multilayer circuit board body and the winding displacement, thereby can not influence the follow-up use of multilayer circuit board body.
Drawings
FIG. 1 is a schematic structural diagram of a high-frequency multilayer circuit board based on mobile phone communication;
FIG. 2 is a schematic diagram of an internal structure of a high-frequency multilayer circuit board based on mobile phone communication;
FIG. 3 is an enlarged view of a portion of the structure at A in FIG. 2;
fig. 4 is a schematic structural view of the installation of the clamping block.
In the figure: 1. a multilayer wiring board body; 101. a first groove; 102. a metal patch; 103. a cover plate; 104. a rotating shaft; 105. arranging wires; 106. a signal indicator light; 2. a conductive pattern layer; 3. an insulating layer; 301. sealing glue; 4. a clamping block; 401. a second groove; 402. a protrusion; 403. a spring; 5. a third groove; 6. a fourth groove; 7. a fixed block; 701. supporting legs; 702. a shock pad; 8. a polyimide copper clad laminate; 9. plating a nickel layer; 10. a heat dissipation hole; 11. a heat conductive sheet; 12. a water-resistant coating; 13. a support rod.
Detailed Description
Referring to fig. 1-4, in an embodiment of the present invention, a high frequency multilayer circuit board based on mobile phone communication includes a multilayer circuit board body 1, conductive pattern layers 2 and insulating layers 3, the multilayer circuit board body 1 is provided with a plurality of conductive pattern layers 2 from top to bottom, the insulating layers 3 are disposed between the adjacent conductive pattern layers 2, a sealant 301 is disposed between the conductive pattern layers 2 and the insulating layers 3, a first groove 101 is disposed at a middle position on a right side of an upper surface of the multilayer circuit board body 1, a metal patch 102 is closely disposed at a bottom of the first groove 101, a cover plate 103 is disposed above the first groove 101, a rotating shaft 104 is disposed at a left side of the cover plate 103, front and rear ends of the rotating shaft 104 are inserted into the first groove 101, a flat cable 105 is closely disposed on the metal patch 102, the cover plate 103 is lifted during storage of the multilayer circuit board body 1, the flat cable 105 is taken off from the metal patch 102, so that the multilayer circuit board body 1 and the flat cable 105 are independently stored, the flat cable 105 is prevented from being wound together in the process of storing the multilayer circuit board body 1, the multilayer circuit board body 1 and the flat cable 105 are prevented from being broken, and the subsequent use of the multilayer circuit board body 1 is prevented from being influenced.
In fig. 4, the front end and the rear end on the right side of the cover plate 103 are both provided with the clamping blocks 4, the first groove 101 is provided with a second groove 401 relative to the clamping blocks 4, the left side and the right side of the second groove 401 are both provided with protrusions 402, the inner side of the protrusions 402 is provided with springs 403, the tail ends of the springs 403 are tightly attached to the wall body of the second groove 401, the flat cable 105 is installed and detached, a worker inserts the fixing piece into the fourth groove 6 and applies upward thrust to the fixing piece, the protrusions 402 are pulled out from the third groove 5 under the matching of the springs 403, the clamping blocks 4 are separated from the second groove 401, the cover plate 103 is separated from the first groove 101, and the cover plate 103 is lifted.
In fig. 4, a third groove 5 is arranged on the clamping block 4 opposite to the protrusion 402, the protrusion 402 is matched with the third groove 5, in the process of pressing the flat cable 105, the protrusion 402 is clamped in the third groove 5 to ensure that the cover plate 103 is always clamped in the first groove 101 and is kept stable, so that the flat cable 105 is always tightly attached to the metal patch 102, a fourth groove 6 is arranged in the middle of the right side wall of the cover plate 103, the cover plate 103 is convenient for a worker to operate and control through the fourth groove 6, so that the cover plate 103 rotates, thereby realizing the installation and disassembly of the flat cable 105, a signal indicator lamp 106 is arranged on the left side of the cover plate 103, in the use process of the multilayer circuit board body 1, the flat cable 105 is tightly attached to the metal patch 102, the flat cable 105 is pressed through the cover plate 103, the plugging condition of the flat cable 105 is judged through the color displayed by the signal indicator lamp 106, when the signal indicator lamp 106 is bright green, the contact between the flat cable 105 and the metal patch 102 is good, the multilayer circuit board body 1 can be used normally, when the signal indicator lamp 106 is bright red, the contact between the flat cable 105 and the metal patch 102 is poor, the flat cable 105 needs to be pulled out and reconnected, and the problem that the multilayer circuit board body 1 is burnt due to poor contact between the flat cable 105 and the metal patch 102, and the normal use of the multilayer circuit board body 1 is affected is avoided.
In fig. 1, fig. 2 and fig. 4, the outside of multilayer circuit board body 1 is provided with fixed block 7, four corners of fixed block 7 bottom all are provided with supporting legs 701, the bottom of supporting legs 701 is hugged closely and is provided with shock pad 702, in the installation use of multilayer circuit board body 1, can support multilayer circuit board body 1 through supporting legs 701, under the cooperation of shock pad 702, make multilayer circuit board body 1 have certain shock attenuation cushioning effect, ensure that laminating between metal paster 102 and winding displacement 105 is inseparabler, relative slip can not take place, lead to winding displacement 105 to take place to drop, the installation use of multilayer circuit board body 1 can not be influenced from the oneself.
In fig. 2 and fig. 4, the polyimide copper clad plate 8 is tightly attached to the upper end and the lower end of the multilayer circuit board body 1, the requirement of the current mobile phone communication on the high frequency can be met through the polyimide copper clad plate 8, the nickel plating layer 9 is tightly attached to the outer side of the polyimide copper clad plate 8, the abrasion consumption of the multilayer circuit board body 1 can be avoided through the nickel plating layer 9, and therefore the service life of the multilayer circuit board body 1 is further prolonged.
In fig. 1 and fig. 2, a plurality of heat dissipation holes 10 have been seted up on the wall body of fixed block 7, on the equal multilayer circuit board body 1 of a plurality of heat dissipation holes 10, it is provided with conducting strip 11 to paste on the inner wall of heat dissipation hole 10, multilayer circuit board body 1 is in the use, can produce a large amount of steam, if not discharge in time, multilayer circuit board body 1 can be burnt out, it dispels multilayer circuit board body 1 production heat through heat dissipation hole 10, conducting strip 11 can improve the speed of cold and hot exchange between heat dissipation hole 10 and multilayer circuit board body 1, thereby further accelerated the radiating efficiency of heat dissipation hole 10.
In fig. 2 and 4, the outside of conducting strip 11 and the outside of nickel coating 9 are all hugged closely and are provided with waterproof coating 12, can ensure through waterproof coating 12 that the steam in the outside air can not permeate the inside of multilayer circuit board body 1, thereby can not cause the damage of 1 internal circuit of multilayer circuit board, the life of multilayer circuit board body 1 has further been prolonged, four corners of fixed block 7 upper surface all are provided with bracing piece 13, in the use of multilayer circuit board body 1, under supporting legs 701 and bracing piece 13 mutually support, ensure that the upper and lower both ends of radiating hole 10 can not be sheltered from, thereby can not influence the radiating effect of radiating hole 10.
The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. A high-frequency multilayer circuit board based on mobile phone communication comprises a multilayer circuit board body (1), conductive pattern layers (2) and insulating layers (3), wherein the multilayer circuit board body (1) is internally provided with a plurality of conductive pattern layers (2) from top to bottom, the insulating layers (3) are arranged between the adjacent conductive pattern layers (2) up and down, and a sealant (301) is arranged between the conductive pattern layers (2) and the insulating layers (3), the high-frequency multilayer circuit board is characterized in that a first groove (101) is formed in the middle of the right side of the upper surface of the multilayer circuit board body (1), a metal patch (102) is arranged at the bottom of the first groove (101) in a clinging manner, a cover plate (103) is arranged above the first groove (101), a rotating shaft (104) is arranged at the left side of the cover plate (103), and the front end and the rear end of the rotating shaft (104) are both plugged in the first groove (101), the flat cable (105) is closely arranged on the metal patch (102).
2. The high-frequency multilayer circuit board based on mobile phone communication according to claim 1, wherein the front end and the rear end of the right side of the cover plate (103) are provided with the clamping blocks (4), the first groove (101) is provided with a second groove (401) corresponding to the clamping blocks (4), the left side and the right side of the second groove (401) are provided with protrusions (402), the inner side of each protrusion (402) is provided with a spring (403), and the tail end of each spring (403) is tightly attached to the wall body of the second groove (401).
3. The high-frequency multilayer circuit board based on mobile phone communication according to claim 2, wherein a third groove (5) is formed in the position, opposite to the protrusion (402), of the clamping block (4), the protrusion (402) is matched with the third groove (5), a fourth groove (6) is formed in the middle of the wall body on the right side of the cover plate (103), and a signal indicator lamp (106) is arranged on the left side of the cover plate (103).
4. The high-frequency multilayer circuit board based on mobile phone communication of claim 1, wherein the outer side of the multilayer circuit board body (1) is provided with a fixing block (7), four corners of the bottom of the fixing block (7) are provided with supporting feet (701), and the bottoms of the supporting feet (701) are closely provided with shock pads (702).
5. The high-frequency multilayer circuit board based on mobile phone communication of claim 1 is characterized in that the upper and lower ends of the multilayer circuit board body (1) are respectively provided with a polyimide copper-clad plate (8) in a close fit manner, and the outer side of the polyimide copper-clad plate (8) is provided with a nickel-plated layer (9) in a close fit manner.
6. The high-frequency multilayer circuit board based on mobile phone communication according to claim 4, wherein a plurality of heat dissipation holes (10) are formed on a wall body of the fixing block (7), the plurality of heat dissipation holes (10) are formed in the multilayer circuit board body (1), and heat conduction fins (11) are tightly attached to inner walls of the heat dissipation holes (10).
7. The high-frequency multilayer circuit board based on mobile phone communication of claim 6, wherein the outer side of the heat conducting fin (11) and the outer side of the nickel-plated layer (9) are both closely provided with waterproof coatings (12), and four corners of the upper surface of the fixing block (7) are provided with support rods (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220051084.1U CN216599700U (en) | 2022-01-10 | 2022-01-10 | High-frequency multilayer circuit board based on mobile phone communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220051084.1U CN216599700U (en) | 2022-01-10 | 2022-01-10 | High-frequency multilayer circuit board based on mobile phone communication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216599700U true CN216599700U (en) | 2022-05-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220051084.1U Active CN216599700U (en) | 2022-01-10 | 2022-01-10 | High-frequency multilayer circuit board based on mobile phone communication |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216599700U (en) |
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- 2022-01-10 CN CN202220051084.1U patent/CN216599700U/en active Active
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