CN216585200U - Two-sided coating film auxiliary device of solar wafer - Google Patents
Two-sided coating film auxiliary device of solar wafer Download PDFInfo
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- CN216585200U CN216585200U CN202122841391.8U CN202122841391U CN216585200U CN 216585200 U CN216585200 U CN 216585200U CN 202122841391 U CN202122841391 U CN 202122841391U CN 216585200 U CN216585200 U CN 216585200U
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Abstract
The utility model discloses a double-sided film coating auxiliary device for a solar cell, which comprises a device body and a film coating quartz table, wherein the film coating quartz table is provided with a silicon wafer carrier plate for placing a cell, the film coating quartz table is provided with a turnover driving mechanism for driving double-sided film coating of the cell, the turnover driving mechanism comprises a transmission base rod, a limiting groove for limiting the silicon wafer carrier plate is arranged in the transmission base rod, the silicon wafer carrier plate is embedded in the limiting groove, the film coating quartz table is provided with a positioning mechanism for turnover positioning of the carrier plate, and the positioning mechanism comprises a positioning tray; the silicon chip support plate can simultaneously bear two solar silicon chips, the overturning driving mechanism can simultaneously overturn and coat a film on the two silicon chips, and the positioning mechanism can position the overturned silicon chip support plate to realize the accuracy of the film coating of the silicon chips.
Description
Technical Field
The utility model relates to the field of battery coating, in particular to a double-sided coating auxiliary device for a solar cell.
Background
The solar cell is used for realizing a photoelectric conversion process, an important aspect for limiting the conversion efficiency of the process is photon utilization rate, the light reflectivity is reduced when the photon utilization rate is improved, the reflectivity of single crystal and polycrystal can be reduced to be below 13 percent and 23 percent by a silicon wafer surface texturing mode, and the reflectivity is still high. The value can be effectively reduced by an optical coating method, and the number of photon-generated carriers is increased; h generated by reaction gas can effectively passivate dangling bonds on the surface of the silicon wafer during film coating, so that surface traps are reduced, and the service life of minority carriers is prolonged.
PECVD is a process in which a gas containing atoms of a film component is ionized by means of microwaves or radio frequencies to locally form plasma, which is chemically very reactive and is easily reacted to deposit a desired film on a substrate. In order to allow chemical reactions to proceed at lower temperatures, the activity of the plasma is used to promote the reactions, and thus such CVD is called plasma-enhanced chemical vapor deposition. In the reaction process, the reaction gas enters the furnace chamber from the gas inlet and gradually diffuses to the surface of the sample, and under the action of an electric field excited by the radio frequency source, the reaction gas is decomposed into electrons, ions, active groups and the like. The decomposition products are subjected to chemical reaction to generate initial components and side reactants for forming a film, the products are adsorbed to the surface of a sample in the form of chemical bonds to generate crystal nuclei of a solid film, the crystal nuclei gradually grow into islands, and the islands continuously grow into a continuous film. During the film growth process, various byproducts are gradually separated from the surface of the film and are discharged from the outlet under the action of a vacuum pump.
At present, the film coating of a solar cell is mostly performed with single-sided film coating, but the light conversion efficiency of the single-sided film coating is lower than that of double-sided film coating, but the film coating of a silicon wafer can only be performed on the same surface of the cell, the silicon wafer is easy to damage in the process of manual overturning, and only any silicon wafer can be overturned during manual overturning.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an auxiliary device for double-sided coating of a solar cell, which aims to solve the problems in the prior art.
In order to achieve the purpose, the utility model provides the following technical scheme:
the utility model provides a two-sided coating film auxiliary device of solar wafer, the device body includes the coating film quartz platform, the coating film quartz bench is equipped with the silicon chip support plate that is used for placing the battery piece, the coating film quartz bench is equipped with the upset actuating mechanism who drives the two-sided coating film of battery piece, upset actuating mechanism includes the transmission basic pole, transmission basic pole inside is equipped with and is used for carrying out spacing groove to the silicon chip support plate, the silicon chip support plate inlays to be established at spacing inslot portion, the coating film quartz bench is equipped with the positioning mechanism who is used for the support plate upset location, positioning mechanism includes the location tray.
By adopting the technical scheme: the silicon chip support plate can simultaneously bear two solar silicon chips, the overturning driving mechanism can simultaneously overturn and coat a film on the two silicon chips, and the positioning mechanism can position the overturned silicon chip support plate to realize the precision of the film coating of the silicon chips.
Further setting: the inside silicon chip that is equipped with of silicon chip support plate places the opening, the quantity that the opening was placed to the silicon chip is two, the silicon chip support plate is close to the position inboard that the opening was placed to the silicon chip and is equipped with the first supporting groove that is used for supporting the silicon chip, one side that the transmission base rod was kept away from to the silicon chip support plate is equipped with the groove of sliding, the inslot portion that slides is equipped with and is used for fixing spacing extension rod to the silicon chip, the extension rod bottom is equipped with the second and supports the groove, be equipped with a plurality of connecting rods that are used for fixing the silicon chip both sides on the silicon chip support plate, be fixed with the round bar on the connecting rod, the round bar passes through the bearing with the silicon chip support plate and is connected.
By adopting the technical scheme: the battery piece is spacing in first support inslot portion in first support groove, the extension rod can be fixed the battery piece not spacing one side, the second supports the groove and can carry out dual spacing to the battery piece, fix the battery piece more firm inside the silicon chip support plate, the connecting rod can be fixed with the extension rod, form the slope in battery piece both sides and support, can support the silicon chip surface simultaneously spacingly, avoid the silicon chip to take place to shift at the in-process of upset, cause the damage of silicon chip.
Further setting: the turnover driving mechanism comprises a rotating roller, the rotating roller is embedded in the transmission substrate, a guide rail is arranged at the position, close to the rotating roller, of the film coating quartz platform, a guide rod used for driving the rotating roller to turn over is arranged on the guide rail, a buckle used for limiting the guide rod is arranged in the guide rail, a tooth groove is formed in the guide rod, a turnover gear is arranged at the position, close to the guide rod, of the rotating roller, the rotating roller is embedded in the center of the turnover gear, and the turnover gear is meshed in the tooth groove.
By adopting the technical scheme: the guide arm can drive the upset gear and rotate, and operating personnel can drive the transmission base plate and overturn at the inside guide arm that promotes of guide rail to drive the silicon chip and overturn the coating film, promote the buckle position with the guide arm, realize the upset of two silicon chips simultaneously, improved the efficiency of the two-sided coating film of silicon chip.
Further setting: the positioning mechanism comprises fixing blocks for supporting and positioning the trays, the number of the positioning trays is two, the positioning trays are arranged on two sides of the transmission base rod, positioning openings used for positioning the silicon wafer carrier plate are arranged inside the positioning trays, the positioning openings are arranged at positions close to the extension rod, a first positioning block and a second positioning block used for positioning the silicon wafer carrier plate are arranged at positions close to the positioning openings of the positioning trays, the first positioning block is fixedly connected to the positioning trays, the second positioning block is a telescopic block, and the sliding connection is carried out on the positioning trays.
By adopting the technical scheme: the positioning tray can be used for positioning the film coating position of the silicon wafer support plate and supporting the silicon wafer support plate, the displacement and the inclination of the silicon wafer support plate are avoided, the film coating is not uniform, the extending rod on the silicon wafer support plate can be positioned by the positioning through opening, the first positioning block and the second positioning block can clamp and fix the two sides of the extending rod simultaneously, and the positioning of the silicon wafer support plate is realized.
Further setting: one side that connecting rod and extension rod are relative all is equipped with and is used for carrying out the magnet fixed with connecting rod and extension rod.
By adopting the technical scheme: magnet can be fixed connecting rod and extension rod, realizes being connected the silicon chip surface.
Further setting: the positioning tray is of a hollow structure.
Compared with the prior art, the utility model has the beneficial effects that: the utility model can realize double-sided film coating on different silicon wafers simultaneously, avoids manual turnover of the silicon wafers, and realizes automatic positioning and double-sided film coating of the silicon wafers.
Drawings
In order that the present invention may be more readily and clearly understood, a more particular description of the utility model briefly described above will be rendered by reference to specific embodiments that are illustrated in the appended drawings.
FIG. 1 is a schematic structural diagram of an auxiliary device for double-sided coating of a solar cell according to the present invention;
FIG. 2 is a schematic view of a portion A of a double-sided coating auxiliary device for a solar cell according to the present invention;
FIG. 3 is a schematic view of a portion B of the auxiliary device for double-sided coating of a solar cell according to the present invention;
fig. 4 is a partial schematic view C of an auxiliary device for double-sided coating of a solar cell according to the present invention.
In the figure, 1, a film-coated quartz table; 2. a silicon wafer carrier plate; 3. a transmission base rod; 4. a silicon wafer placing port; 5. a first support groove; 6. an extension rod; 7. a connecting rod; 8. a magnet; 9. rotating the roller; 10. a guide rail; 11. buckling; 12. a guide bar; 13. turning over the gear; 14. positioning the tray; 15. positioning the through opening; 16. a first positioning block; 17. and a second positioning block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 4, in an embodiment of the present invention, an auxiliary device for double-sided film coating of a solar cell includes a device body, the device body includes a film-coated quartz platform 1, a silicon wafer support plate 2 for placing the solar cell is disposed on the film-coated quartz platform 1, a turning driving mechanism for driving the double-sided film coating of the solar cell is disposed on the film-coated quartz platform 1, the turning driving mechanism includes a transmission base rod 3, a limiting groove for limiting the silicon wafer support plate 2 is disposed inside the transmission base rod 3, the silicon wafer support plate 2 is embedded inside the limiting groove, a positioning mechanism for turning and positioning the support plate is disposed on the film-coated quartz platform 1, the positioning mechanism includes a positioning tray 14, and the positioning tray 14 is a hollow structure.
The silicon wafer support plate 2 can simultaneously bear two solar silicon wafers, the overturning driving mechanism can simultaneously overturn and coat the film on the two silicon wafers, and the positioning mechanism can position the overturned silicon wafer support plate 2 to realize the accuracy of the film coating of the silicon wafers.
The inside silicon chip that is equipped with of silicon chip support plate 2 places opening 4, the quantity that opening 4 was placed to the silicon chip is two, silicon chip support plate 2 is close to the position inboard that the silicon chip placed opening 4 and is equipped with the first supporting slot 5 that is used for supporting the silicon chip, silicon chip support plate 2 keeps away from one side of transmission base rod 3 and is equipped with the groove of sliding, the inslot portion of sliding is equipped with and is used for fixing spacing extension rod 6 to the silicon chip, extension rod 6 bottom is equipped with the second and supports the groove, be equipped with a plurality of connecting rods 7 that are used for fixing silicon chip both sides on silicon chip support plate 2, be fixed with the round bar on connecting rod 7, the round bar passes through the bearing with silicon chip support plate 2 and is connected, connecting rod 7 and extension rod 6 relative one side all are equipped with and are used for carrying out fixed magnet 8 with connecting rod 7 and extension rod 6, magnet 8 can fix connecting rod 7 and extension rod 6, the realization is to the connection on silicon chip surface.
The turnover driving mechanism comprises a rotating roller 9, the rotating roller 9 is embedded in a transmission substrate, a guide rail 10 is arranged at a position, close to the rotating roller 9, of the coated quartz platform 1, a guide rod 12 used for driving the rotating roller 9 to turn over is arranged on the guide rail 10, a buckle 11 used for limiting the guide rod 12 is arranged inside the guide rail 10, a tooth groove is formed in the guide rod 12, a turnover gear 13 is arranged at a position, close to the guide rod 12, of the rotating roller 9, the rotating roller 9 is embedded in the center of the turnover gear 13, the turnover gear 13 is meshed inside the tooth groove, a supporting block is arranged at a position, close to the rotating roller 9, of the coated quartz platform 1, and the rotating roller 9 is connected with the supporting block through a bearing.
Positioning mechanism is including the fixed block that is used for supporting positioning tray 14, positioning tray 14's quantity is two, and set up in 3 both sides of transmission base rod, positioning tray 14 is inside to be equipped with and to be used for carrying out the location opening 15 of fixing a position to silicon chip support plate 2, location opening 15 sets up the position near extension rod 6, positioning tray 14 is equipped with first locating piece 16 and the second locating piece 17 that is used for carrying out the location to silicon chip support plate 2 near the position of location opening 15, first locating piece 16 fixed connection is on positioning tray 14, second locating piece 17 is flexible piece, and the connection of sliding is on positioning tray 14.
The positioning tray 14 can position the silicon wafer carrier plate 2 at a coating position and support the silicon wafer carrier plate 2, so that the silicon wafer carrier plate 2 is prevented from shifting and inclining, the coating is not uniform, the positioning through hole 15 can position the extension rod 6 on the silicon wafer carrier plate 2, the first positioning block 16 and the second positioning block 17 can clamp and fix the two sides of the extension rod 6 at the same time, and the positioning of the silicon wafer carrier plate 2 is realized.
The working principle of the utility model is as follows: an operator places two silicon wafers inside two through holes of the silicon wafer carrier plate 2 respectively, clamps the edges of the silicon wafers inside the first support groove 5, pushes the extension rod 6 to slide inside the sliding groove, slides to one side of the silicon wafer which is not limited on the first support groove 5, clamps the silicon wafers inside the second support groove of the extension rod 6, rotates the connecting rod, corresponds the magnets 8 on the connecting rod on two sides of the silicon wafer carrier plate 2 to the extension rod, and fixes and limits two sides of the silicon wafers;
after the silicon wafers are mounted and limited, the guide rod 12 is pushed, the guide rod 12 can drive the turning gear 13 to rotate, the turning gear 13 can drive the rotating roller 9 in the transmission base rod 3 to rotate, so that the transmission base rod 3 is driven to drive the silicon wafer support plate 2 to turn over, the guide rod 12 is pushed to the position of the buckle 11, and meanwhile, the turning of two silicon wafers on the silicon wafer support plate 2 is realized;
on silicon chip support plate 2 overturned location tray 14, promote the extension rod 6 of silicon chip support plate 2 both sides, with extension rod 6 push into inside both sides location opening 15, first locating piece 16 and second locating piece 17 press from both sides tight fixedly to extension rod 6 both sides, realize the location of silicon chip support plate 2, after the location, realize two-sided coating to two silicon chips.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides a two-sided coating film auxiliary device of solar wafer which characterized in that: the device body, the device body includes coating film quartz platform (1), be equipped with silicon chip support plate (2) that are used for placing the battery piece on coating film quartz platform (1), be equipped with the upset actuating mechanism who drives the two-sided coating film of battery piece on coating film quartz platform (1), upset actuating mechanism includes transmission base pole (3), transmission base pole (3) inside is equipped with and is used for carrying out spacing groove to silicon chip support plate (2), silicon chip support plate (2) are inlayed and are established at spacing inslot portion, be equipped with the positioning mechanism who is used for the support plate upset location on coating film quartz platform (1), positioning mechanism includes location tray (14).
2. The auxiliary device for double-sided coating of the solar cell according to claim 1, wherein the silicon wafer support plate (2) is internally provided with two silicon wafer placing through holes (4), a first support groove (5) for supporting the silicon wafer is arranged on the inner side of the position of the silicon wafer support plate (2) close to the silicon wafer placing through holes (4), a sliding groove is arranged on one side of the silicon wafer support plate (2) far away from the transmission base rod (3), an extension rod (6) for fixing and limiting the silicon wafer is arranged inside the sliding groove, a second support groove is arranged at the bottom of the extension rod (6), the silicon wafer support plate (2) is provided with a plurality of connecting rods (7) for fixing two sides of the silicon wafer, round rods are fixed on the connecting rods (7), and the round rods are connected with the silicon wafer support plate (2) through bearings.
3. The double-sided coating auxiliary device of the solar cell is characterized in that the turnover driving mechanism comprises a rotating roller (9), the rotating roller (9) is embedded in a transmission substrate, a guide rail (10) is arranged at a position, close to the rotating roller (9), of the coated quartz platform (1), a guide rod (12) used for driving the rotating roller (9) to turn is arranged on the guide rail (10), a buckle (11) used for limiting the guide rod (12) is arranged inside the guide rail (10), a tooth groove is formed in the guide rod (12), a turnover gear (13) is arranged at a position, close to the guide rod (12), of the rotating roller (9), the rotating roller (9) is embedded in the center of the turnover gear (13), and the turnover gear (13) is meshed inside the tooth groove.
4. The double-sided coating auxiliary device of the solar cell according to claim 1, wherein the positioning mechanism comprises two fixing blocks for supporting the positioning trays (14), the two positioning trays (14) are arranged on two sides of the transmission base rod (3), positioning through holes (15) for positioning the silicon wafer carrier plate (2) are formed in the positioning trays (14), the positioning through holes (15) are arranged at positions close to the extension rod (6), first positioning blocks (16) and second positioning blocks (17) for positioning the silicon wafer carrier plate (2) are arranged at positions, close to the positioning through holes (15), of the positioning trays (14), the first positioning blocks (16) are fixedly connected to the positioning trays (14), and the second positioning blocks (17) are telescopic blocks and are connected to the positioning trays (14) in a sliding manner.
5. The double-sided coating auxiliary device for the solar cell pieces as claimed in claim 2, wherein the magnets (8) for fixing the connecting rod (7) and the extension rod (6) are arranged on the opposite sides of the connecting rod (7) and the extension rod (6).
6. The auxiliary device for double-sided coating of the solar cell piece according to claim 1 is characterized in that the positioning tray (14) is of a hollow structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122841391.8U CN216585200U (en) | 2021-11-19 | 2021-11-19 | Two-sided coating film auxiliary device of solar wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122841391.8U CN216585200U (en) | 2021-11-19 | 2021-11-19 | Two-sided coating film auxiliary device of solar wafer |
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| Publication Number | Publication Date |
|---|---|
| CN216585200U true CN216585200U (en) | 2022-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122841391.8U Active CN216585200U (en) | 2021-11-19 | 2021-11-19 | Two-sided coating film auxiliary device of solar wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115123608A (en) * | 2022-07-29 | 2022-09-30 | 苏州富强科技有限公司 | Double-manipulator film pasting assembly line |
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2021
- 2021-11-19 CN CN202122841391.8U patent/CN216585200U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115123608A (en) * | 2022-07-29 | 2022-09-30 | 苏州富强科技有限公司 | Double-manipulator film pasting assembly line |
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