CN212316232U - Sputtering coating equipment compatible with substrates of different shapes - Google Patents

Sputtering coating equipment compatible with substrates of different shapes Download PDF

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Publication number
CN212316232U
CN212316232U CN202021776793.3U CN202021776793U CN212316232U CN 212316232 U CN212316232 U CN 212316232U CN 202021776793 U CN202021776793 U CN 202021776793U CN 212316232 U CN212316232 U CN 212316232U
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substrate
chamber
substrates
moving
different shapes
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CN202021776793.3U
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马淑莹
余海春
戴晓东
陈韶华
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Optorun Shanghai Co Ltd
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Optorun Shanghai Co Ltd
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Abstract

The utility model belongs to the technical field of the film preparation technique and specifically relates to a sputtering coating equipment that can compatible different shape base plate, its characterized in that: the moving-in chamber is provided with a plurality of placing positions of the substrate, the placing positions are annularly arranged, the placing positions are movable at the moving-in chamber and meet the requirement that each placing position can correspond to the lifting chamber one by one and the substrate interaction is carried out between the lifting chamber and the vacuum coating chamber. The utility model has the advantages that: the plate-shaped substrate, the tube-shaped substrate and even various special-shaped substrates can be well compatible, the utilization rate of equipment is greatly improved, and a novel substrate caching mode is provided; simple and reasonable structure, strong universality, convenient assembly and disassembly and suitability for popularization.

Description

Sputtering coating equipment compatible with substrates of different shapes
Technical Field
The utility model belongs to the technical field of the film preparation technique and specifically relates to a sputtering coating equipment that can compatible different shape base plates.
Background
In recent years, electronic products such as smart phones, tablet computers, AR/VR glasses and the like have been developed in a vigorous way in the market; accordingly, the quality improvement of the intelligent terminals also puts higher requirements on the coating technology of parts such as touch screens required by the products. For example, the current market puts forward coating requirements on products with different shapes such as curved surfaces, cambered surfaces, planes and cylinders, so that the number of special-shaped coating substrates is increased, and coating equipment which is only suitable for coating a single plane carrier substrate cannot meet the coating requirements of diversified products. In addition, in order to improve the compatibility of the coating equipment while diversifying the shape of the coated substrate, it is one of the important technical issues in the field of manufacturing vacuum coating equipment to realize coating of substrates having various shapes in the same equipment.
Disclosure of Invention
The utility model aims at providing a can compatible sputter coating equipment of different shape base plates according to above-mentioned prior art not enough, through the compatible structural design of annular pipelined's base plate buffer memory mode cooperation, realize the function of compatible different shape base plates on a sputter coating equipment.
The utility model discloses the purpose is realized accomplishing by following technical scheme:
a sputtering coating device compatible with substrates of different shapes comprises a vacuum coating chamber, a lifting chamber and a moving-in chamber, wherein the moving-in chamber is communicated with the vacuum coating chamber through the lifting chamber, the lifting chamber is used for realizing substrate interaction, the substrate interaction refers to moving the substrate loaded with a product to be film-formed in the moving-in chamber into the vacuum coating chamber for film formation and moving the substrate loaded with the product to be film-formed in the vacuum coating chamber out of the moving-in chamber, and the sputtering coating device is characterized in that: the moving-in chamber is provided with a plurality of placing positions of the substrate, the placing positions are annularly arranged, the placing positions are movable at the moving-in chamber and meet the requirement that each placing position can correspond to the lifting chamber one by one and the substrate interaction is carried out between the lifting chamber and the vacuum coating chamber.
The placing positions are arranged on an annular track line, the annular track line is connected with a driving device, and the driving device is connected with and drives the annular track line to move so as to realize the switching of the placing positions on the annular track line compared with the lifting chamber.
The substrate comprises a plane substrate, a curved surface substrate or a special-shaped substrate, and the placement position meets the requirements for mounting the plane substrate, the curved surface substrate or the special-shaped substrate.
The lifting chamber is internally provided with a clamping jaw and a clamping jaw driving mechanism, the clamping jaw driving mechanism is connected with and drives the clamping jaw to move to realize the interaction of the substrate, and the clamping jaw can clamp the substrate.
The upper side and the lower side of the plate body of the substrate are respectively provided with a connecting part for realizing substrate interaction.
And a film forming rotating frame is arranged in the vacuum coating chamber, and the substrate is arranged on the film forming rotating frame and can revolve in the vacuum coating chamber under the driving of the film forming rotating frame.
And the film forming rotating frame is detachably provided with a three-stage gear mechanism, and the three-stage gear mechanism is connected with and drives the substrate to rotate on the film forming rotating frame.
The utility model has the advantages that: the plate-shaped substrate, the tube-shaped substrate and even various special-shaped substrates can be well compatible, the utilization rate of equipment is greatly improved, and a novel substrate caching mode is provided for the market; simple and reasonable structure, strong universality, convenient assembly and disassembly and suitability for popularization.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the carrying-in chamber of the present invention (when applied to curved or irregular products);
FIG. 3 is a front view of FIG. 2;
FIG. 4 is a schematic view of the structure of the loading chamber (when applied to a flat product);
FIG. 5 is a front view of FIG. 4;
fig. 6 is a schematic structural view of a conveying jaw of the present invention;
fig. 7 is a schematic structural view of the transfer rack of the present invention.
Detailed Description
The features of the present invention and other related features are described in further detail below by way of example in conjunction with the accompanying drawings to facilitate understanding by those skilled in the art:
as shown in fig. 1-7, the symbols 1-13 in the figures are respectively represented as: the device comprises a vacuum coating chamber 1, a lifting chamber 2, a carrying-in chamber 3, a film forming rotary frame 4, a clamping jaw 5, a lifting mechanism 6, a pushing mechanism 7, an annular track line 8, a curved or special-shaped substrate 9, a planar substrate 10, a connecting part 11, a connecting part 12 and a three-stage gear mechanism 13.
Example (b): as shown in fig. 1, the sputter coating apparatus compatible with substrates of different shapes in this embodiment includes a vacuum coating chamber 1, a lift chamber 2 and a loading chamber 3, wherein the vacuum coating chamber 1 and the lift chamber 2 are located above the loading chamber 3, and the lift chamber 2 is respectively connected to the vacuum coating chamber 1 and the loading chamber 3 to form an internal communication, so that the lift chamber 2 can complete the substrate interaction between the vacuum coating chamber 1 and the loading chamber 3. Specifically, when a film forming process is performed by using a sputtering coating apparatus, a substrate loaded with a product to be film-formed is placed into the carry-in chamber 3 from the outside, and the substrate is carried into the vacuum coating chamber 1 from the carry-in chamber 3 by the lifting chamber 2; then, carrying out a film forming process on the substrate loaded with the product to be formed into a film in the vacuum coating chamber 1, namely forming the film on the product to be formed into the film; after the film formation is completed, the elevating chamber 2 carries the film-formed product loaded therein out of the vacuum film plating chamber 1 into the carrying-in chamber 3, and then carries the film-formed product from the carrying-in chamber 3 to the outside, thereby completing the whole film-forming process.
As shown in fig. 1, an annular track line 8 is disposed inside the lift chamber 2, and a driving device is connected to one side of the annular track line 8 and drives the annular track line 8 to move. In some embodiments, the driving device may be disposed outside the lift chamber 2 to ensure that the environment inside the lift chamber 2 meets the requirements of the film forming process. A plurality of base plate placing positions are arranged on the annular track line 8, and each base plate placing position can correspondingly place a base plate loaded with a product; the distance between the plurality of substrate placing positions meets the requirement that the positions of the substrates placed on each substrate placing position are independent from each other and cannot influence each other.
As shown in fig. 2, one position on the circular orbit line 8 corresponds to the position of the lift chamber 2 to realize the substrate interaction between the lift chamber 2 and the carry-in chamber 3 through the position. In particular, when the circular track line 8 is driven by the driving device to move, each substrate arranged on the circular track line 8 passes through a position corresponding to the position of the lifting chamber 2 one by one, and then the lifting chamber 2 can realize the substrate interaction with the carrying-in chamber 3 from the position.
In the present embodiment, substrates of different shapes can be compatibly placed on the circular track line 8, so that the sputter coating apparatus in the present embodiment has a very strong compatibility.
Specifically, as shown in fig. 2 and 3, a plurality of curved or irregular base plates 9 are disposed on the annular track line 8, and the bottom of each curved or irregular base plate 9 is supported on the annular track line 8. Similarly, as shown in fig. 4 and 5, a planar substrate 10 may be disposed on the circular track line 8. In some embodiments, as shown in fig. 3, 5 and 6, in order to make the circular track line 8 compatible with substrates of different shapes, the lower connecting portions 12 of the substrates of different shapes may all adopt the same structural design, and at the same time, a supporting and positioning mechanism adapted to the connecting portions 12 is disposed at each substrate placement position of the circular track line 8, so as to complete the installation and positioning between the substrate and the circular track line 8.
As shown in fig. 1, a chuck 5 is provided in the lift chamber 2, and the chuck 5 is used as an actuator for substrate exchange and for clamping the substrate. The clamping jaw 5 is respectively connected with a lifting mechanism 6 and a pushing mechanism 7 which are used as clamping jaw driving mechanisms, wherein the lifting mechanism 6 is used for connecting and driving the clamping jaw 5 to lift in the height direction so as to correspondingly realize the interaction of the substrate between the lifting chamber 2 and the carrying-in chamber 3, and the pushing mechanism 7 is used for connecting and driving the clamping jaw 5 to translate in the horizontal direction so as to correspondingly realize the interaction of the substrate between the lifting chamber 2 and the vacuum coating chamber 1.
As shown in fig. 6, in the present embodiment, in order to make the sputter coating apparatus in the present embodiment have extremely strong compatibility, the structure of the clamping jaw 5 adopts a compatible design; that is, the clamping jaws 5 in this embodiment can clamp both the planar substrate 10 shown in fig. 6 (a) and the curved or irregular substrate 9 shown in fig. 6 (b), and can be compatible with the conveyance of substrates of different shapes by matching with the lifting mechanism 6 and the pushing mechanism 7.
In some embodiments, in order to facilitate compatible design of the clamping jaws 5, the planar substrate 10 and the curved or irregular substrate 9 are provided with connecting portions 11 and 12 on upper and lower sides for clamping the clamping jaws 5, and the structures of the two connecting portions 11 and 12 of substrates with different shapes can adopt the same design for clamping the clamping jaws 5. As shown in fig. 6, the connecting portion 11 and the connecting portion 12 in this embodiment are shaft connecting portions, which can be disposed on one side of the planar substrate 10 and at the rotation center of the curved or irregular substrate 9.
As shown in fig. 1, a film formation turret 4 is provided inside a vacuum deposition chamber 1, and a substrate is suspended from the film formation turret 4. The film forming turret 4 is rotatable in the vacuum film plating chamber 1, and the substrate mounted on the film forming turret 4 revolves in the vacuum film plating chamber 1 along with the film forming turret 4, thereby improving the film forming uniformity of the product loaded on the substrate.
As shown in fig. 7 (a), when the product is a flat product, it can be attached to the flat substrate 10, so that the flat substrate 10 is directly suspended from the film-forming turret 4 and revolves with the film-forming turret 4 in the vacuum deposition chamber 1 to form a film. However, when the product is a curved surface or a special-shaped product, it is difficult to achieve the requirement of film forming uniformity under the same environment, so as shown in fig. 7 (b), a detachable three-stage gear mechanism 13 is installed at the bottom of the film forming rotating frame 4, and the three-stage gear mechanism 13 is used for transmitting the driving force of the film forming rotating frame 4 during revolution to each curved surface or special-shaped substrate 9 through gear engagement transmission, so that each curved surface or special-shaped substrate 9 can rotate at high speed by using the connecting part 11 and the connecting part 12 thereof as a rotating shaft, thereby effectively ensuring the film forming uniformity of the curved surface or special-shaped product. At this time, the film formation turret 4 in the present embodiment can realize compatibility of revolution with respect to the planar substrate 10 and revolution and rotation with respect to the curved or irregular substrate 9 by cooperating with the detachable three-stage gear mechanism 13. Meanwhile, in some embodiments, since the connecting portions 11 and 12 having the same structure can be disposed on substrates of different shapes, the film forming turret 4 is also provided with a mounting and positioning mechanism matching with the connecting portions 11 and 12 to meet the design requirements.
In the embodiment, in specific implementation: in order to facilitate the storage or removal of the substrates from the loading chamber 3, the circular track line 8 in the loading chamber 3 may be disposed on a bottom plate, and a sliding structure is disposed between the bottom plate and the bottom of the loading chamber 3, so that the circular track line 8 can be drawn out from the loading chamber 3 by a certain distance, thereby realizing the placement or removal of the substrates on the circular track line 8.
Although the conception and the embodiments of the present invention have been described in detail with reference to the drawings, those skilled in the art will recognize that various changes and modifications can be made therein without departing from the scope of the appended claims, and therefore, the description thereof is not repeated herein.

Claims (7)

1. A sputtering coating device compatible with substrates of different shapes comprises a vacuum coating chamber, a lifting chamber and a moving-in chamber, wherein the moving-in chamber is communicated with the vacuum coating chamber through the lifting chamber, the lifting chamber is used for realizing substrate interaction, the substrate interaction refers to moving the substrate loaded with a product to be film-formed in the moving-in chamber into the vacuum coating chamber for film formation and moving the substrate loaded with the product to be film-formed in the vacuum coating chamber out of the moving-in chamber, and the sputtering coating device is characterized in that: the moving-in chamber is provided with a plurality of placing positions of the substrate, the placing positions are annularly arranged, the placing positions are movable at the moving-in chamber and meet the requirement that each placing position can correspond to the lifting chamber one by one and the substrate interaction is carried out between the lifting chamber and the vacuum coating chamber.
2. The sputtering coating device compatible with substrates of different shapes according to claim 1, wherein: the placing positions are arranged on an annular track line, the annular track line is connected with a driving device, and the driving device is connected with and drives the annular track line to move so as to realize the switching of the placing positions on the annular track line compared with the lifting chamber.
3. The sputtering coating apparatus compatible with substrates of different shapes according to claim 1 or 2, characterized in that: the substrate comprises a plane substrate, a curved surface substrate or a special-shaped substrate, and the placement position meets the requirements for mounting the plane substrate, the curved surface substrate or the special-shaped substrate.
4. The sputtering coating device compatible with substrates of different shapes according to claim 1, wherein: the lifting chamber is internally provided with a clamping jaw and a clamping jaw driving mechanism, the clamping jaw driving mechanism is connected with and drives the clamping jaw to move to realize the interaction of the substrate, and the clamping jaw can clamp the substrate.
5. The sputtering coating device compatible with substrates of different shapes according to claim 4, wherein: the upper side and the lower side of the plate body of the substrate are respectively provided with a connecting part for realizing substrate interaction.
6. The sputtering coating device compatible with substrates of different shapes according to claim 1, wherein: and a film forming rotating frame is arranged in the vacuum coating chamber, and the substrate is arranged on the film forming rotating frame and can revolve in the vacuum coating chamber under the driving of the film forming rotating frame.
7. The sputtering coating device compatible with substrates of different shapes according to claim 6, wherein: and the film forming rotating frame is detachably provided with a three-stage gear mechanism, and the three-stage gear mechanism is connected with and drives the substrate to rotate on the film forming rotating frame.
CN202021776793.3U 2020-08-24 2020-08-24 Sputtering coating equipment compatible with substrates of different shapes Active CN212316232U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111778488A (en) * 2020-08-24 2020-10-16 光驰科技(上海)有限公司 Sputtering coating equipment compatible with substrates of different shapes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111778488A (en) * 2020-08-24 2020-10-16 光驰科技(上海)有限公司 Sputtering coating equipment compatible with substrates of different shapes

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